CN114798591B - Air pressure regulating device and method based on wafer cleaning bin - Google Patents
Air pressure regulating device and method based on wafer cleaning bin Download PDFInfo
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- CN114798591B CN114798591B CN202110113769.4A CN202110113769A CN114798591B CN 114798591 B CN114798591 B CN 114798591B CN 202110113769 A CN202110113769 A CN 202110113769A CN 114798591 B CN114798591 B CN 114798591B
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- air pressure
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- cleaning bin
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides an air pressure regulating device and method based on a wafer cleaning bin, wherein the air pressure regulating device based on the wafer cleaning bin comprises: the device comprises a cleaning bin, an exhaust pipeline and a first air pressure feedback adjusting module; the cleaning bin is provided with an exhaust port which is communicated with an exhaust pipeline; the first air pressure feedback adjustment module includes: the system comprises a first pressure measuring unit, a first air pressure regulating unit and a first feedback control unit; the first pressure measuring unit and the first air pressure regulating unit are both in communication connection with the first feedback control unit; the first pressure measuring unit is used for monitoring the air pressure in the exhaust pipeline; the first air pressure regulating and controlling unit is used for regulating and controlling the air pressure in the exhaust pipeline; the first feedback control unit is used for controlling the first air pressure regulating and controlling unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to regulate and control the air pressure in the exhaust pipeline to a preset target value. The application can prevent the gas in the exhaust pipeline from flowing back into the cleaning bin.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to an air pressure regulating device and method based on a wafer cleaning bin.
Background
In the process of cleaning the existing wafer in the cleaning bin, different kinds of gases are generally required to be used for cleaning, and after the cleaning is finished, the gases are discharged from the cleaning bin or other kinds of gases are converted to continuously clean the wafer.
However, when the cleaning bin is exhausted or the gas is converted, the pressure difference between the cleaning bin and the external environment is generally fluctuated, so that the gas in the exhaust pipeline is easy to flow back into the cleaning bin, the wafer in the cleaning bin is damaged, and the cleaning effect of the wafer is reduced.
Disclosure of Invention
In order to solve the problems, the air pressure regulating device and the air pressure regulating method based on the wafer cleaning bin provided by the application can automatically regulate the air pressure in the exhaust pipeline by arranging the first air pressure feedback regulating module, so that the air in the exhaust pipeline can be prevented from flowing back into the cleaning bin, the wafer in the cleaning bin is damaged, and the cleaning effect of the wafer is reduced.
In a first aspect, the present application provides an air pressure regulating device based on a wafer cleaning bin, comprising: the device comprises a cleaning bin, an exhaust pipeline and a first air pressure feedback adjusting module;
the cleaning bin is provided with an exhaust port which is communicated with the exhaust pipeline;
the first air pressure feedback adjustment module includes: the system comprises a first pressure measuring unit, a first air pressure regulating unit and a first feedback control unit;
the first pressure measuring unit and the first air pressure regulating unit are both in communication connection with a first feedback control unit;
the first pressure measuring unit is used for monitoring the air pressure in the exhaust pipeline;
the first air pressure regulating unit is used for regulating the air pressure in the exhaust pipeline;
the first feedback control unit is used for controlling the first air pressure regulating and controlling unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to regulate and control the air pressure in the exhaust pipeline to a preset target value.
Optionally, the air pressure regulating device further comprises: a first control switch unit;
the first air pressure regulating unit and the first feedback control unit are both in communication connection with the first control switch unit;
the first control switch unit is used for controlling the on-off relation between the first air pressure regulating unit and the exhaust pipeline;
the first feedback control unit is also used for controlling the first control switch unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to control whether the first air pressure regulating unit is communicated with the exhaust pipeline.
Optionally, the air pressure regulating device further comprises: a communicating pipe and a control valve;
one end of the communicating pipe is communicated with the exhaust port, the other end of the communicating pipe is communicated with the exhaust pipeline, and the control valve is fixedly arranged on the communicating pipe;
the control valve is used for controlling the on-off of the communicating pipe.
Optionally, the air pressure regulating device further comprises: the second air pressure feedback adjusting module;
the second air pressure feedback adjustment module includes: the second pressure measuring unit, the second air pressure regulating unit and the second feedback control unit;
the second pressure measuring unit and the second air pressure regulating unit are both in communication connection with a second feedback control unit;
the second pressure measuring unit is used for monitoring the air pressure in the cleaning bin;
the second air pressure regulating unit is used for regulating and controlling the size of an effective aperture in the communicating pipe, wherein the effective aperture is the smallest circulation aperture in the communicating pipe;
the second feedback control unit is used for controlling the second air pressure regulating and controlling unit according to the air pressure in the cleaning bin monitored by the second pressure measuring unit so as to regulate and control the size of the effective aperture in the communicating pipe.
Optionally, the second air pressure feedback adjustment module further includes: a third pressure measuring unit;
the third pressure measuring unit is in communication connection with the second feedback control unit;
the third pressure measuring unit is used for monitoring the air pressure of the communicating pipe, which is positioned at one side of the second air pressure regulating unit towards the air outlet;
the second feedback control unit is used for controlling the second air pressure regulating and controlling unit according to the air pressure monitored by the third pressure measuring unit so as to regulate and control the size of the effective aperture in the communicating pipe.
Optionally, the number of the cleaning bins is multiple, and each cleaning bin is connected with one communicating pipe respectively.
Optionally, the number of the exhaust pipes is a plurality;
each exhaust duct is used for exhausting different kinds of gases from the cleaning bin.
Optionally, the communicating pipe comprises a plurality of air outlets, each air outlet is respectively communicated with an exhaust pipeline, and each air outlet is fixedly connected with a control valve;
the control valve is further used for controlling the on-off of the corresponding air outlet.
Optionally, the first air pressure regulating unit includes: a fan assembly;
the fan assembly is fixedly arranged on the exhaust pipeline and used for adjusting the exhaust quantity of the exhaust pipeline.
In a second aspect, the present application provides a method for regulating and controlling air pressure based on a wafer cleaning bin, comprising:
providing a cleaning bin and an exhaust pipeline, wherein an exhaust port of the cleaning bin is communicated with the exhaust pipeline;
acquiring the air pressure in the exhaust pipeline;
and regulating and controlling the air pressure in the exhaust pipeline to a preset target value according to the air pressure in the exhaust pipeline.
Optionally, the method further comprises:
providing a communicating pipe, wherein one end of the communicating pipe is communicated with the exhaust port, and the other end of the communicating pipe is communicated with the exhaust pipeline;
acquiring the air pressure in the cleaning bin;
according to the air pressure in the cleaning bin, the size of the effective aperture in the communicating pipe is regulated and controlled, and the effective aperture is the smallest circulation aperture in the communicating pipe.
Optionally, the air pressure regulating device further comprises: the first control switch unit is used for controlling the on-off relation between the first air pressure regulating unit and the exhaust pipeline, and the first feedback control unit is also used for controlling the first control switch unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to control whether the first air pressure regulating unit is communicated with the exhaust pipeline;
after the obtaining the magnitude of the air pressure in the exhaust duct, the method further comprises:
providing a first air pressure regulating unit, wherein the first air pressure regulating unit is used for regulating the air pressure in the exhaust pipeline;
and controlling the on-off relation between the first air pressure regulating unit and the exhaust pipeline according to the air pressure in the exhaust pipeline.
According to the air pressure regulating device and method based on the wafer cleaning bin, the first air pressure feedback regulating module is arranged, so that the first air pressure regulating unit can be controlled by the first feedback control unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit, the air pressure in the exhaust pipeline can be regulated to a preset target value, the air pressure in the exhaust pipeline can be regulated automatically, the stability of the air pressure in the exhaust pipeline can be ensured, the air in the exhaust pipeline can be prevented from flowing back into the cleaning bin, the wafer in the cleaning bin is damaged, and the cleaning effect of the wafer is reduced.
Drawings
Fig. 1 is a schematic structural view of an air pressure regulating device according to an embodiment of the present application.
Reference numerals
1. Cleaning the bin; 2. an exhaust duct; 21. a first exhaust pipe; 22. a second exhaust pipe; 23. a third exhaust pipe; 3. the first air pressure feedback adjusting module; 31. a first load cell; 32. a first air pressure regulating unit; 33. a first feedback control unit; 4. the second air pressure feedback adjusting module; 41. a second pressure measuring unit; 42. a third pressure measuring unit; 43. a second air pressure regulating unit; 44. a second feedback control unit; 5. a communicating pipe; 51. a control valve; 6. a first control switch unit.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In a first aspect, the present application provides an air pressure regulating device based on a wafer cleaning bin 1, and in combination with fig. 1, the air pressure regulating device includes: the cleaning bin 1, the exhaust pipeline 2, the first air pressure feedback regulating module 3, the second air pressure feedback regulating module 4, the communicating pipe 5 and the control valve 51. The number of the cleaning bin 1, the exhaust pipeline 2, the first air pressure feedback adjustment module 3, the second air pressure feedback adjustment module 4, the communicating pipe 5 and the control valve 51 can be one or more.
In the present embodiment, the number of the cleaning bins 1 is three; the number of the exhaust pipelines 2 is three; the number of the first air pressure feedback adjusting modules 3 is three, the number of the second air pressure feedback adjusting modules 4 is three, the number of the communicating pipes 5 is three, and the number of the control valves 51 is nine. Wherein, each cleaning bin 1 is provided with an exhaust port, and each exhaust port is respectively communicated with a communicating pipe 5; each first air pressure feedback adjusting die is respectively connected with one exhaust pipeline 2, and each communicating pipe 5 is simultaneously communicated with three exhaust pipelines 2; each second air pressure feedback adjusting module 4 is respectively connected with one cleaning bin 1 and a communicating pipe 5 connected with the corresponding cleaning bin 1.
Further, each communicating pipe 5 includes three gas outlets, each gas outlet is respectively communicated with one exhaust pipeline 2, nine control valves 51 are respectively fixedly arranged at nine different gas outlets, so that each control valve 51 can control the on-off of the corresponding gas outlet, and three cleaning bins 1 can be selectively communicated with the corresponding exhaust pipeline 2 for exhausting according to the requirement of an internal wafer cleaning process. Wherein the three exhaust pipes 2 are a first exhaust pipe 21, a second exhaust pipe 22, and a third exhaust pipe 23, respectively; the first exhaust pipe 21 is for discharging alkaline gas; the second exhaust pipe 22 is used for discharging acid gas; the third exhaust pipe 23 is used to exhaust organic gases including IPA (isopropyl alcohol) gas for drying and NMP (N-Methyl pyrrolidone ) gas for photoresist removal.
Further, each first air pressure feedback adjustment module 3 includes: a first load cell 31, a first air pressure regulating cell 32 and a first feedback control cell 33. Wherein, each exhaust pipeline 2 is also fixedly provided with a first control switch unit 6, and the first pressure measuring unit 31 and the first air pressure regulating unit 32 are both in communication connection with a first feedback control unit 33; the first air pressure regulating unit 32 and the first feedback control unit 33 are both in communication connection with the first control switch unit 6; the first pressure measuring unit 31 is configured to monitor the air pressure in the exhaust pipe 2, and the first pressure measuring unit 31 is further configured to monitor the air flow in the exhaust pipe 2, and determine the air pressure in the exhaust pipe 2 according to the air flow and the cross-sectional dimension of the exhaust pipe 2; the first air pressure regulating unit 32 is used for regulating the air pressure in the exhaust pipeline 2; the first feedback control unit 33 is configured to control the first air pressure regulating unit 32 according to the air pressure in the exhaust pipe 2 monitored by the first pressure measuring unit 31, so as to regulate the air pressure in the exhaust pipe 2 to a preset target value; the first control switch unit 6 is used for controlling the on-off relation between the first air pressure regulating unit 32 and the exhaust pipeline 2; the first feedback control unit 33 is further configured to control the first control switch unit 6 according to the air pressure in the exhaust pipe 2 monitored by the first pressure measuring unit 31, so as to control whether the first air pressure regulating unit 32 is in communication with the exhaust pipe 2. In the present embodiment, the first pressure measuring unit 31 is a pressure meter; the first air pressure regulating unit 32 is a fan assembly, and the fan assembly is fixedly arranged on the exhaust pipeline 2 and is used for regulating the exhaust amount of the exhaust pipeline 2.
The preset target value is the exhaust gas reference value of the air pressure regulating device, that is, the exhaust gas required by any exhaust pipe 2 when all the cleaning bins 1 are communicated. Specifically, for example, the exhaust amount of each cleaning bin 1 in the exhaust process is 1000m 3 And/h, the exhaust gas quantity of the corresponding exhaust pipeline 2 is always 3000m through the first air pressure regulating and controlling unit 32 3 And/h, the cleaning bins 1 can be stably exhausted. The air pressure regulating device monitors the pressure or air flow in the exhaust pipe 2 through the first pressure measuring unit 31 and sends the monitoring result to the first feedback control unit 33, so that the first feedback control unit 33 controls the first air pressure regulating unit 32 or the first control switch unit 6 according to the monitoring result, thereby the exhaust amount of the exhaust pipe 2 is always 3000m 3 And/h, so that the cleaning bin 1 is not subjected to stable exhaust, and gas in the exhaust pipeline 2 is prevented from flowing back to the cleaning bin 1 when the gas is converted, thereby affecting the cleaning effect on wafers.
In this embodiment, the exhaust modes of the three cleaning bins 1 include 27 types in total, specifically as shown in table 1:
list one
The cleaning bin 1, the cleaning bin 2 and the cleaning bin 3 in table one correspond to the three cleaning bins 1 from left to right in fig. 1, respectively, and the exhaust pipe 1, the exhaust pipe 2 and the exhaust pipe 3 in table one correspond to the first exhaust pipe 21, the second exhaust pipe 22 and the third exhaust pipe 23 in fig. 1, respectively. Taking the exhaust scheme 6 as an example, referring to fig. 1, when the cleaning bin 1 is selectively communicated with the exhaust pipeline 1, the corresponding control valve 51 is opened, the first control switch unit 6 connected with the first exhaust pipe is opened, the corresponding first air pressure feedback adjustment module 3 is opened, and specifically, the first air pressure adjustment unit 32 connected with the first exhaust pipe 21 is 2000m 3 The amount of exhaust gas per h conveys the gas into the first exhaust pipe 21; the cleaning bin 2 is selectively communicated with the exhaust pipeline 2, then the corresponding control valve 51 is opened, the first control switch unit 6 connected with the second exhaust pipe 22 is opened, and the corresponding first air pressure feedback regulating module 3 is opened, specifically, the first air pressure regulating unit 32 connected with the second exhaust pipe 22 is 2000m 3 The amount of the exhaust gas/h conveys the gas into the second exhaust pipe 22; the cleaning bin 3 is selectively communicated with the exhaust pipeline 3, then the corresponding control valve 51 is opened, the first control switch unit 6 connected with the third exhaust pipe 23 is opened, and the corresponding first air pressure feedback regulating module 3 is opened, specifically, the first air pressure regulating unit 32 connected with the third exhaust pipe 23 is 2000m 3 The amount of the exhaust gas per hour conveys the gas into the third exhaust pipe 23.
Further, the second air pressure feedback adjustment module 4 includes: a second pressure measuring unit 41, a third pressure measuring unit 42, a second air pressure regulating unit 43, and a second feedback control unit 44. Wherein, the second pressure measuring unit 41 and the second air pressure regulating unit 43 are both in communication connection with a second feedback control unit 44; the third pressure measurement unit 42 is communicatively connected to the second feedback control unit 44; the second pressure measuring unit 41 is used for monitoring the air pressure in the cleaning bin 1; the second air pressure regulating unit 43 is configured to regulate an effective aperture in the communicating pipe 5, where the effective aperture is a smallest circulation aperture in the communicating pipe 5; the second feedback control unit 44 is configured to control the second air pressure regulating unit 43 according to the air pressure in the cleaning bin 1 monitored by the second pressure measuring unit 41, so as to regulate the size of the effective aperture in the communicating pipe 5; the third pressure measuring unit 42 is configured to monitor the air pressure in the communication pipe 5 at the side of the second air pressure regulating unit 43 facing the air outlet; the second feedback control unit 44 is further configured to control the second air pressure regulating unit 43 according to the air pressure monitored by the third pressure measuring unit 42, so as to regulate the size of the effective aperture in the communicating pipe 5.
In this embodiment, the second air pressure regulating unit 43 is an air damper, which changes the flow rate of the air in the communicating pipe 5 by changing the size of the effective aperture of the communicating pipe 5. Through setting up the second feedback adjustment module, can make the stable exhaust of cleaning storehouse 1 to further prevent that the gaseous backward flow in the exhaust duct 2 from in the cleaning storehouse 1, thereby reduce the effect of cleaning storehouse 1 to the wafer clearance, cause the damage even to the wafer.
Further, the three first feedback control units 33 and the three second feedback control units 44 may be the same overall feedback control unit, and the overall feedback working medium unit is simultaneously connected in communication with other unit devices in the three first air pressure feedback adjustment modules 3 and the three second air pressure feedback adjustment modules 4 so as to perform corresponding control on the three first air pressure feedback adjustment modules and the three second air pressure feedback adjustment modules.
In a second aspect, the present application provides a method for regulating and controlling air pressure based on a wafer cleaning bin 1, comprising: providing a cleaning bin and an exhaust pipeline 2, wherein an exhaust port of the cleaning bin is communicated with the exhaust pipeline 2; acquiring the air pressure in the exhaust pipeline 2; and regulating and controlling the air pressure in the exhaust pipeline 2 to a preset target value according to the air pressure in the exhaust pipeline 2.
The method further comprises the steps of: providing a communicating pipe 5, wherein one end of the communicating pipe 5 is communicated with the exhaust port, and the other end of the communicating pipe 5 is communicated with the exhaust pipeline 2; acquiring the air pressure in the cleaning bin 1; according to the air pressure in the cleaning bin 1, the size of the effective aperture in the communicating pipe 5 is regulated and controlled, and the effective aperture is the smallest circulation aperture in the communicating pipe 5.
The method further comprises the steps of: according to the pressure intensity in the communicating pipe 5 positioned at one side of the effective aperture towards the cleaning bin 1, the effective aperture in the communicating pipe 5 is regulated.
Further, after the obtaining the magnitude of the air pressure in the exhaust duct 2, the method further includes: providing a first air pressure regulating unit 32, wherein the first air pressure regulating unit 32 is used for regulating the air pressure in the exhaust pipeline 2; the first air pressure regulating unit 32 is controlled to be in on-off relation with the exhaust pipeline 2 according to the air pressure in the exhaust pipeline 2. Specifically, when one exhaust pipe 2 is communicated with all the cleaning bins 1, the exhaust pipe 2 is controlled to be disconnected from the corresponding first air pressure regulating unit 32; when one exhaust pipeline 2 is communicated with a part of the cleaning bins 1 or is not communicated with any cleaning bin 1, the exhaust pipeline 2 is controlled to be communicated with the corresponding first air pressure regulating and controlling unit 32, and the air pressure in the exhaust pipeline 2 is regulated according to the quantity of the cleaning bins 1 connected with the exhaust pipeline 2.
According to the method, the air pressure in the exhaust pipeline 2 can be automatically regulated and controlled to a preset target value, so that the stability of the air pressure in the exhaust pipeline 2 can be ensured by automatically regulating the air pressure in the exhaust pipeline 2, and further, the air in the exhaust pipeline 2 can be prevented from flowing back into the cleaning bin 1, the wafer in the cleaning bin 1 is damaged, and the cleaning effect of the wafer is reduced.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present application should be included in the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims (11)
1. Air pressure regulation and control device based on wafer cleaning storehouse, characterized by, include: the device comprises a cleaning bin, a communicating pipe, a second air pressure feedback regulating module, an exhaust pipeline and a first air pressure feedback regulating module;
the cleaning bin is provided with an exhaust port, one end of the communicating pipe is communicated with the exhaust port, the other end of the communicating pipe is communicated with the exhaust pipeline, and the exhaust port is communicated with the exhaust pipeline through the communicating pipe;
the first air pressure feedback adjustment module includes: the system comprises a first pressure measuring unit, a first air pressure regulating unit and a first feedback control unit;
the first pressure measuring unit and the first air pressure regulating unit are both in communication connection with a first feedback control unit;
the first pressure measuring unit is used for monitoring the air pressure in the exhaust pipeline;
the first air pressure regulating unit is used for regulating the air pressure in the exhaust pipeline;
the first feedback control unit is used for controlling a first air pressure regulating and controlling unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to regulate and control the air pressure in the exhaust pipeline to a preset target value;
the second air pressure feedback adjustment module includes: the second pressure measuring unit, the second air pressure regulating unit and the second feedback control unit;
the second pressure measuring unit and the second air pressure regulating unit are both in communication connection with a second feedback control unit;
the second pressure measuring unit is used for monitoring the air pressure in the cleaning bin;
the second air pressure regulating unit is used for regulating and controlling the size of an effective aperture in the communicating pipe, wherein the effective aperture is the smallest circulation aperture in the communicating pipe;
the second feedback control unit is used for controlling the second air pressure regulating and controlling unit according to the air pressure in the cleaning bin monitored by the second pressure measuring unit so as to regulate and control the size of the effective aperture in the communicating pipe.
2. The wafer cleaning bin-based air pressure regulating device of claim 1, further comprising: a first control switch unit;
the first air pressure regulating unit and the first feedback control unit are both in communication connection with the first control switch unit;
the first control switch unit is used for controlling the on-off relation between the first air pressure regulating unit and the exhaust pipeline;
the first feedback control unit is also used for controlling the first control switch unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to control whether the first air pressure regulating unit is communicated with the exhaust pipeline.
3. The wafer cleaning bin-based air pressure regulating device of claim 1, further comprising: a control valve;
the control valve is fixedly arranged on the communicating pipe;
the control valve is used for controlling the on-off of the communicating pipe.
4. The wafer cleaning bin-based air pressure regulating device of claim 3, wherein the second air pressure feedback regulating module further comprises: a third pressure measuring unit;
the third pressure measuring unit is in communication connection with the second feedback control unit;
the third pressure measuring unit is used for monitoring the air pressure of the communicating pipe, which is positioned at one side of the second air pressure regulating unit towards the air outlet;
the second feedback control unit is used for controlling the second air pressure regulating and controlling unit according to the air pressure monitored by the third pressure measuring unit so as to regulate and control the size of the effective aperture in the communicating pipe.
5. The air pressure regulating device based on the wafer cleaning bin according to claim 3, wherein the number of the cleaning bins is multiple, and each cleaning bin is respectively connected with one communicating pipe.
6. The wafer cleaning bin-based air pressure regulating device of any one of claims 3 to 5, wherein the number of exhaust pipes is a plurality;
each exhaust duct is used for exhausting different kinds of gases from the cleaning bin.
7. The air pressure regulating device based on the wafer cleaning bin according to claim 6, wherein the communicating pipe comprises a plurality of air outlets, each air outlet is respectively communicated with an exhaust pipeline, and each air outlet is fixedly connected with a control valve;
the control valve is used for controlling the on-off of the corresponding air outlet.
8. The wafer cleaning bin-based air pressure regulating device of claim 1, wherein the first air pressure regulating unit comprises: a fan assembly;
the fan assembly is fixedly arranged on the exhaust pipeline and used for adjusting the exhaust quantity of the exhaust pipeline.
9. A method of regulating air pressure based on the air pressure regulating device of the wafer cleaning chamber according to any one of claims 1 to 8, comprising:
providing a cleaning bin and an exhaust pipeline, wherein an exhaust port of the cleaning bin is communicated with the exhaust pipeline;
acquiring the air pressure in the exhaust pipeline;
and regulating and controlling the air pressure in the exhaust pipeline to a preset target value according to the air pressure in the exhaust pipeline.
10. The wafer cleaning bin-based air pressure regulation method of claim 9, further comprising:
providing a communicating pipe, wherein one end of the communicating pipe is communicated with the exhaust port, and the other end of the communicating pipe is communicated with the exhaust pipeline;
acquiring the air pressure in the cleaning bin;
according to the air pressure in the cleaning bin, the size of the effective aperture in the communicating pipe is regulated and controlled, and the effective aperture is the smallest circulation aperture in the communicating pipe.
11. The wafer cleaning bin-based air pressure regulation method of claim 10, wherein after said obtaining the air pressure level in the exhaust duct, the method further comprises:
providing a first air pressure regulating unit, wherein the first air pressure regulating unit is used for regulating the air pressure in the exhaust pipeline;
and controlling the on-off relation between the first air pressure regulating unit and the exhaust pipeline according to the air pressure in the exhaust pipeline.
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| CN202110113769.4A CN114798591B (en) | 2021-01-27 | 2021-01-27 | Air pressure regulating device and method based on wafer cleaning bin |
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| US5616208A (en) * | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
| CN1215764A (en) * | 1997-10-29 | 1999-05-05 | 三星电子株式会社 | Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method |
| CN1630934A (en) * | 2001-08-31 | 2005-06-22 | 株式会社东芝 | Manufacturing apparatus and method for a semiconductor device, and cleaning method for a semiconductor manufacturing device |
| WO2004042487A1 (en) * | 2002-11-08 | 2004-05-21 | Tokyo Electron Limited | Fluid treatment apparatus and fluid treatment method |
| CN1804114A (en) * | 2004-08-25 | 2006-07-19 | 东京毅力科创株式会社 | Thin film forming device and cleaning method thereof |
| CN101268542A (en) * | 2005-09-19 | 2008-09-17 | 美国阿可利技术有限公司 | Method and apparatus for isolative substrate edge area processing |
| CN104882360A (en) * | 2014-02-27 | 2015-09-02 | 东京毅力科创株式会社 | Cleaning method for plasma processing apparatus |
| CN106575602A (en) * | 2014-08-06 | 2017-04-19 | 应用材料公司 | Post-chamber abatement using upstream plasma sources |
| CN109290321A (en) * | 2017-07-25 | 2019-02-01 | 春田科技顾问股份有限公司 | Blowing-out device and blowing-out method for loading port |
| WO2019156317A1 (en) * | 2018-02-08 | 2019-08-15 | 비에스티(주) | Contaminant discharge device |
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| CN114798591A (en) | 2022-07-29 |
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