CN114793393A - Manufacturing method of high-pressure-resistant super-thick copper PCB - Google Patents

Manufacturing method of high-pressure-resistant super-thick copper PCB Download PDF

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Publication number
CN114793393A
CN114793393A CN202210185028.1A CN202210185028A CN114793393A CN 114793393 A CN114793393 A CN 114793393A CN 202210185028 A CN202210185028 A CN 202210185028A CN 114793393 A CN114793393 A CN 114793393A
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China
Prior art keywords
pcb
steps
following
manufacturing
copper
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CN202210185028.1A
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Chinese (zh)
Inventor
张本贤
李志雄
舒志迁
魏和平
陈蓁
邱锡曼
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Chengyi Electronics Jiaxing Co ltd
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Chengyi Electronics Jiaxing Co ltd
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Priority to CN202210185028.1A priority Critical patent/CN114793393A/en
Publication of CN114793393A publication Critical patent/CN114793393A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention discloses a manufacturing method of a high-pressure-resistant super-thick copper PCB, which comprises the following steps: cutting S1, laminating an S2 inner layer circuit, laminating an S3 inner layer, drilling S4, gluing S5 conductive adhesive, electroplating S6VCP, printing an S7 outer layer circuit, printing S8 resin, flattening S9, laminating an S10 outer layer, windowing S11 laser, plating S12 flash, plating an S13 pad pattern, electroplating an S14 pattern, alkaline etching S15, plating S16 characters, tin spraying S17, molding S18, electrically testing S19, inspecting S20 and packaging S21. According to the manufacturing method of the high-pressure-resistant super-thick copper PCB, the traditional silk-screen solder resist ink is replaced by a resin printing and PP pressing mode, and the high pressure resistance can be improved to 5000V or more from below 3000V in the prior art; the PCB board manufactured by the method has good consistency of the height of the pad graph and the insulating layer around the pad, and is more favorable for the application of surface mounting of high-end components such as small-spacing ICs and the like on the premise of ensuring the insulativity.

Description

Manufacturing method of high-voltage-resistant ultra-thick copper PCB
Technical Field
The invention relates to the technical field of PCB (printed circuit board), in particular to a manufacturing method of a high-voltage-resistant ultra-thick copper PCB.
Background
With the development trend of miniaturization and integration of electronic products, the PCB board as one of the core components of the electronic products is also developed to have high density, high multi-layer and thick copper characteristics. The ultra-thick copper PCB is widely applied to the field of some high-power electrical appliances, power supplies and other equipment, and the PCB generally needs to resist high voltage. The conventional PCB surface has the purpose of electrical insulation measurement between circuits through silk-screen solder resist ink, but for the ultra-thick copper PCB with the thickness of more than 300 mu m, because the height difference between the copper thickness on the surface and the base material is too large, the ink after silk-screen printing is difficult to flow into the gaps of all thick copper patterns or the ink thickness in the dense circuit area after silk-screen printing is too thin, and the like, so that the high pressure resistance of the silk-screen solder resist ink method can only reach below 3000V generally.
Based on the situation, the invention provides a manufacturing method of a high-voltage-resistant ultra-thick copper PCB, which can effectively solve the problems.
Disclosure of Invention
The invention aims to provide a manufacturing method of a high-pressure-resistant ultra-thick copper PCB. According to the manufacturing method of the high-pressure-resistant super-thick copper PCB, the traditional silk-screen solder resist ink is replaced by a resin printing and PP pressing mode, and the high pressure resistance can be improved to 5000V or more from below 3000V; the PCB board manufactured by the method has good consistency of the height of the pad pattern and the insulating layer around the pad, and is more beneficial to the application of surface mounting of high-end components such as small-spacing ICs and the like on the premise of ensuring the insulativity.
The invention is realized by the following technical scheme:
a manufacturing method of a high-voltage-resistant ultra-thick copper PCB comprises the following steps: s1, cutting, S2, an inner layer circuit, S3, inner layer pressing, S4, drilling, S5, conductive adhesive, S6, VCP electroplating, S7, an outer layer circuit, S8, resin printing, S9, leveling, S10, outer layer pressing, S11, laser windowing, S12, flash plating, S13 pad pattern, S14, pattern electroplating, S15, alkaline etching, S16, characters, S17, tin spraying, S18, molding, S19, electrical testing, S20, inspection, S21 and packaging.
According to the manufacturing method of the high-pressure-resistant super-thick copper PCB, the traditional silk-screen solder resist ink is replaced by a resin printing and PP pressing mode, and the high pressure resistance can be improved to 5000V or more from below 3000V in the prior art; the PCB board manufactured by the method has good consistency of the height of the pad pattern and the insulating layer around the pad, and is more beneficial to the application of surface mounting of high-end components such as small-spacing ICs and the like on the premise of ensuring the insulativity.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step S8 is specifically implemented as the following steps:
s8.1, removing foreign matters such as oxidation and the like on the surface of the PCB through super-roughening chemical treatment or sand blasting treatment;
s8.2, carrying out primary baking on the PCB by using a tunnel furnace, wherein the primary baking temperature is 120 ℃, and the baking time is 120 min;
s8.3, selecting a copper-free copper-clad plate with the plate thickness of 0.1-0.3 mm, hollowing out a copper-clad plate area at a corresponding position on a PCB (printed Circuit Board) to be filled with resin by using a precision milling machine, fixing the copper-clad plate area on a screen printing machine of a printing machine by using glue, further removing a silk screen in the copper-clad plate effective area, and finally sealing the periphery of the copper-clad plate and the silk screen by using a solvent-resistant adhesive tape.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step S9 is specifically implemented as the following steps:
s9.1, conveying the PCB into a leveling machine, and leveling the surface of the resin printed on the PCB;
s9.2, placing the leveled PCB into a tunnel furnace for secondary baking, wherein the secondary baking is segmented baking, and the secondary baking is sequentially carried out for 10min at 60 ℃, 20min at 90 ℃ and 90min at 120 ℃.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step S10 is specifically implemented as the following steps:
s10.1, respectively pre-laminating 106PP and release films on the upper surface and the lower surface of the PCB in sequence;
s10.2, setting corresponding stitching parameters according to the Tg value of the resin of the PCB, and laminating the PCB, the 106PP and the release film.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step S11 is specifically implemented as the following steps:
s11.1, removing PP and resin in a pattern area of a welding pad required to be welded on the surface of the PCB;
s11.1, ablation was performed by means of multiple pulses using a laser device of the CO2 type.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step S12 is specifically implemented as: electroplating a layer of thin copper of 1-3 um on the surface of the PCB and the laser windowing area in the step S11.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step S13 is specifically implemented as the following steps:
s13.1, pasting a layer of photosensitive dry film on the surface of the PCB;
s13.2, carrying out contraposition exposure through ultraviolet irradiation;
and S13.3, developing by using a sodium carbonate or potassium carbonate developing solution with the mass concentration of 0.8-1.2%, and exposing the pad pattern on the surface of the PCB after developing.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step S14 is specifically implemented as: and calculating the required electroplating time according to the electroplating area, setting electroplating parameters, and then carrying out pattern electroplating, wherein the copper thickness of the electroplated PCB surface pad area is 0-25 um higher than the height of the PCB insulating layer.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step S15 is specifically implemented as the following steps:
s15.1, etching an outer layer circuit pattern by using etching liquid;
s15.2, polishing the PCB by using a four-axis heavy ceramic brush plate polishing machine or a sand belt plate polishing machine.
According to the above technical solution, as a further preferable technical solution of the above technical solution, in step S8.3, the speed of the printer is set to 2.6m/min, and the blade pressure is set to 5.5Kg/cm 2 。
Compared with the prior art, the invention has the following advantages and beneficial effects:
according to the manufacturing method of the high-pressure-resistant super-thick copper PCB, the traditional silk-screen solder resist ink is replaced by a resin printing and PP pressing mode, and the high pressure resistance can be improved to 5000V or more from below 3000V; the PCB board manufactured by the method has good consistency of the height of the pad graph and the insulating layer around the pad, and is more favorable for the application of surface mounting of high-end components such as small-spacing ICs and the like on the premise of ensuring the insulativity.
Detailed Description
In order that those skilled in the art will better understand the technical solutions of the present invention, preferred embodiments of the present invention are described below with reference to specific examples.
A manufacturing method of a high-voltage-resistant ultra-thick copper PCB comprises the following steps: s1, cutting, S2, an inner layer circuit, S3, inner layer pressing, S4, drilling, S5, conductive adhesive, S6, VCP electroplating, S7, an outer layer circuit, S8, resin printing, S9, leveling, S10, outer layer pressing, S11, laser windowing, S12, flash plating, S13 pad pattern, S14, pattern electroplating, S15, alkaline etching, S16, characters, S17, tin spraying, S18, molding, S19, electrical testing, S20, inspection, S21 and packaging.
According to the manufacturing method of the high-pressure-resistant super-thick copper PCB, the traditional silk-screen solder resist ink is replaced by a resin printing and PP pressing mode, and the high pressure resistance can be improved to 5000V or more from below 3000V; the PCB board manufactured by the method has good consistency of the height of the pad pattern and the insulating layer around the pad, and is more beneficial to the application of surface mounting of high-end components such as small-spacing ICs and the like on the premise of ensuring the insulativity.
Further, in another embodiment, the step S8 is specifically implemented as the following steps:
s8.1, removing foreign matters such as oxidation and the like on the surface of the PCB through super-roughening chemical treatment or sand blasting treatment; thereby ensuring the binding force between the printed resin and the PCB;
s8.2, carrying out primary baking on the PCB by using a tunnel furnace, wherein the primary baking temperature is 120 ℃, and the baking time is 120 min. The purpose of the primary baking of the invention is to remove water vapor in the pcb, thereby reducing the stress in the board.
S8.3, selecting a copper-free copper-clad plate with the plate thickness of 0.1-0.3 mm, hollowing out the copper-clad plate area at the corresponding position on the PCB needing resin filling by using a precision milling machine, fixing the copper-clad plate area on a screen printing plate of a printing machine by using glue, further removing the silk screen in the effective area of the copper-clad plate, and finally sealing the periphery of the copper-clad plate and the silk screen by using a solvent-resistant adhesive tape.
Further, in another embodiment, the step S9 is specifically implemented as the following steps:
s9.1, conveying the PCB into a leveling machine, and leveling the surface of the resin printed on the PCB;
s9.2, placing the leveled PCB into a tunnel furnace for secondary baking, wherein the secondary baking is segmented baking, and the secondary baking is sequentially carried out for 10min at 60 ℃, 20min at 90 ℃ and 90min at 120 ℃. The purpose of the secondary baking of the invention is to firmly fix the printed resin and the PCB together to form an integrated structure.
Further, in another embodiment, the step S10 is specifically implemented as the following steps:
s10.1, respectively pre-laminating 106PP and release films on the upper surface and the lower surface of the PCB in sequence;
s10.2, setting corresponding pressing parameters according to the Tg value of the resin of the PCB, and laminating and superposing the PCB, the 106PP and the release film. It should be noted that in step S8.3, since the printed resin is prone to inclusion and foaming, the kiss pressure needs to be reduced by 10% and the temperature rise rate needs to be reduced by 20% before Tg on the conventional PCB board lamination parameters during lamination.
Further, in another embodiment, the step S11 is specifically implemented as the following steps:
s11.1, removing PP and resin in a pattern area needing welding of a bonding pad on the surface of the PCB;
s11.1, ablation was performed by means of multiple pulses using a CO2 type laser device.
Further, in another embodiment, the step S12 is specifically implemented as: electroplating a layer of thin copper of 1-3 um on the surface of the PCB and the laser windowing area in the step S11.
Further, in another embodiment, the step S13 is specifically implemented as the following steps:
s13.1, pasting a layer of photosensitive dry film on the surface of the PCB;
s13.2, carrying out alignment exposure through ultraviolet irradiation;
and S13.3, developing by using a sodium carbonate or potassium carbonate developing solution with the mass concentration of 0.8-1.2%, and exposing the bonding pad pattern on the surface of the PCB after developing.
Further, in another embodiment, the step S14 is specifically implemented as: and calculating the required electroplating time according to the electroplating area, setting electroplating parameters and then carrying out pattern electroplating, wherein the copper thickness of the surface pad area of the electroplated PCB is 0-25 um higher than the height of the insulating layer of the PCB.
Further, in another embodiment, the step S15 is specifically implemented as the following steps:
s15.1, etching an outer layer circuit pattern by using an etching solution;
s15.2, polishing the PCB by using a four-axis heavy ceramic brushing and grinding machine or an abrasive belt grinding machine.
Further, in another embodiment, the resin printing speed is reduced by 20-30% and the blade pressure is increased by 15-20% compared to the conventional solder resist ink printing speed due to the higher viscosity, so in step S8.3, the speed of the printer is set to 2.6m/min and the blade pressure is set to 5.5Kg/cm 2 。
It should be noted that the manufacturing methods of the several processes of cutting, inner layer circuit, inner layer pressing, drilling, conductive adhesive, VCP electroplating and outer layer circuit of the present invention are consistent with those of the conventional multilayer PCB, and the subsequent processes of writing, tin spraying, molding, electrical measurement, inspection and packaging are also consistent with those of the conventional PCB, so that the present invention is not specifically described.
Unless expressly stated or limited otherwise, the terms "disposed," "connected," and "connected" are used broadly and encompass, for example, being fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all simple modifications and equivalent variations of the above embodiments according to the technical spirit of the present invention are included in the scope of the present invention.

Claims (10)

1. A manufacturing method of a high-pressure-resistant super-thick copper PCB is characterized by comprising the following steps: the method comprises the following steps: s1, cutting, S2, an inner layer circuit, S3, inner layer pressing, S4, drilling, S5, conductive adhesive, S6, VCP electroplating, S7, an outer layer circuit, S8, resin printing, S9, leveling, S10, outer layer pressing, S11, laser windowing, S12, flash plating, S13 pad pattern, S14, pattern electroplating, S15, alkaline etching, S16, characters, S17, tin spraying, S18, molding, S19, electrical testing, S20, inspection, S21 and packaging.
2. The method for manufacturing the high-voltage resistant ultra-thick copper PCB according to claim 1, wherein the method comprises the following steps: the step S8 is specifically implemented as the following steps:
s8.1, removing foreign matters such as oxidation and the like on the surface of the PCB through super-roughening chemical treatment or sand blasting treatment;
s8.2, carrying out primary baking on the PCB by using a tunnel furnace, wherein the primary baking temperature is 120 ℃, and the baking time is 120 min;
s8.3, selecting a copper-free copper-clad plate with the plate thickness of 0.1-0.3 mm, hollowing out a copper-clad plate area at a corresponding position on a PCB (printed Circuit Board) to be filled with resin by using a precision milling machine, fixing the copper-clad plate area on a screen printing machine of a printing machine by using glue, further removing a silk screen in the copper-clad plate effective area, and finally sealing the periphery of the copper-clad plate and the silk screen by using a solvent-resistant adhesive tape.
3. The method for manufacturing the high-voltage resistant ultra-thick copper PCB according to claim 1, wherein the method comprises the following steps: the step S9 is specifically implemented as the following steps:
s9.1, conveying the PCB into a leveling machine, and leveling the surface of the resin printed on the PCB;
s9.2, placing the leveled PCB into a tunnel furnace for secondary baking, wherein the secondary baking is segmented baking, and sequentially baking for 10min at 60 ℃, 20min at 90 ℃ and 90min at 120 ℃.
4. The method for manufacturing the high-voltage-resistant ultra-thick copper PCB as claimed in claim 1, wherein the method comprises the following steps: the step S10 is specifically implemented as the following steps:
s10.1, respectively and sequentially pre-laminating 106PP and release films on the upper surface and the lower surface of the PCB;
s10.2, setting corresponding stitching parameters according to the Tg value of the resin of the PCB, and laminating the PCB, the 106PP and the release film.
5. The method for manufacturing the high-voltage-resistant ultra-thick copper PCB as claimed in claim 1, wherein the method comprises the following steps: the step S11 is specifically implemented as the following steps:
s11.1, removing PP and resin in a pattern area needing welding of a bonding pad on the surface of the PCB;
s11.1, use of CO 2 Laser devices of the type and by means of multiple pulses.
6. The method for manufacturing the high-voltage resistant ultra-thick copper PCB board as claimed in claim 5, wherein the method comprises the following steps: the step S12 is specifically implemented as follows: electroplating a layer of thin copper of 1-3 um on the surface of the PCB and the laser windowing area in the step S11.
7. The method for manufacturing the high-voltage-resistant ultra-thick copper PCB as claimed in claim 1, wherein the method comprises the following steps: the step S13 is specifically implemented as the following steps:
s13.1, pasting a layer of photosensitive dry film on the surface of the PCB;
s13.2, carrying out contraposition exposure through ultraviolet irradiation;
and S13.3, developing by using a sodium carbonate or potassium carbonate developing solution with the mass concentration of 0.8-1.2%, and exposing the bonding pad pattern on the surface of the PCB after developing.
8. The method for manufacturing the high-voltage resistant ultra-thick copper PCB according to claim 1, wherein the method comprises the following steps: the step S14 is specifically implemented as: and calculating the required electroplating time according to the electroplating area, setting electroplating parameters, and then carrying out pattern electroplating, wherein the copper thickness of the electroplated PCB surface pad area is 0-25 um higher than the height of the PCB insulating layer.
9. The method for manufacturing the high-voltage resistant ultra-thick copper PCB according to claim 1, wherein the method comprises the following steps: the step S15 is specifically implemented as the following steps:
s15.1, etching an outer layer circuit pattern by using an etching solution;
s15.2, polishing the PCB by using a four-axis heavy ceramic brush plate polishing machine or a sand belt plate polishing machine.
10. The method for manufacturing the high-voltage resistant ultra-thick copper PCB according to claim 1, wherein the method comprises the following steps: in step S8.3, the speed of the press is set to 2.6m/min and the blade pressure is set to 5.5Kg/cm 2 。
CN202210185028.1A 2022-02-28 2022-02-28 Manufacturing method of high-pressure-resistant super-thick copper PCB Pending CN114793393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210185028.1A CN114793393A (en) 2022-02-28 2022-02-28 Manufacturing method of high-pressure-resistant super-thick copper PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210185028.1A CN114793393A (en) 2022-02-28 2022-02-28 Manufacturing method of high-pressure-resistant super-thick copper PCB

Publications (1)

Publication Number Publication Date
CN114793393A true CN114793393A (en) 2022-07-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210185028.1A Pending CN114793393A (en) 2022-02-28 2022-02-28 Manufacturing method of high-pressure-resistant super-thick copper PCB

Country Status (1)

Country Link
CN (1) CN114793393A (en)

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