CN114793389A - Soft-hard combined board and manufacturing method thereof - Google Patents
Soft-hard combined board and manufacturing method thereof Download PDFInfo
- Publication number
- CN114793389A CN114793389A CN202110105739.9A CN202110105739A CN114793389A CN 114793389 A CN114793389 A CN 114793389A CN 202110105739 A CN202110105739 A CN 202110105739A CN 114793389 A CN114793389 A CN 114793389A
- Authority
- CN
- China
- Prior art keywords
- layer
- board
- protective layer
- rigid
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 239000010410 layer Substances 0.000 claims abstract description 155
- 239000011241 protective layer Substances 0.000 claims abstract description 96
- 239000003292 glue Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 38
- 239000012790 adhesive layer Substances 0.000 claims description 29
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 21
- 239000000758 substrate Substances 0.000 description 19
- 238000010586 diagram Methods 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a soft and hard combined board and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: obtaining a pretreatment soft board, wherein at least one surface of the pretreatment soft board is provided with a circuit layer; arranging a protective layer on the surface of the pretreatment soft board provided with the circuit layer, so that part of the circuit layer is covered by the protective layer and part of the circuit layer is exposed; and filling the surface of the other part of the pretreated flexible printed circuit board except the part of the surface covered by the protective layer with the gummosis adhesion layer so that the gummosis adhesion layer fills the gap of the exposed part of the circuit layer. According to the manufacturing method of the rigid-flex board, the protective layer covers part of the circuit layer on the preprocessed flexible board to realize the bending function, the gummosis bonding layer is filled on the other part of the circuit layer except the part of the circuit layer covering the protective layer, and the gap of the exposed part of the circuit layer is filled, so that the problems of glue shortage and layering of the rigid-flex board are avoided.
Description
Technical Field
The invention relates to the technical field of processing of circuit boards, in particular to a rigid-flex board and a manufacturing method thereof.
Background
Pcb (printed Circuit board), which is also called printed Circuit board (pcb) and printed Circuit board (pcb), is an important electronic component, is a support for electronic components, and is a provider for electrical connection of electronic components. It is called a printed wiring board because it is manufactured by electronic printing.
In many fields, the printed circuit board and the flexible circuit board need to be combined for use, so that the printed circuit board plays a supporting role to ensure the hardness of the circuit board, and the flexible circuit board realizes a bendable function. In the traditional rigid-flex board processing, a printed circuit board and a flexible circuit board are bonded by using a low-flow-glue prepreg. The low-flow-rate prepreg is used in the laminating process, and the flowability and the filling property of the low-flow-rate prepreg are poorer than those of the common flow-rate prepreg, so that the problem of glue shortage and delamination often easily occurs on plates with thicker copper and denser circuits.
Disclosure of Invention
The invention mainly solves the technical problem of providing a rigid-flex board and a manufacturing method thereof, and solves the problem that the rigid-flex board in the prior art is in glue shortage and layered.
In order to solve the technical problems, the first technical scheme adopted by the invention is as follows: a manufacturing method of a soft and hard combined board is provided, which comprises the following steps: obtaining a pretreatment soft board, wherein at least one surface of the pretreatment soft board is provided with a circuit layer; arranging a protective layer on the surface of the pretreated flexible printed circuit board provided with the circuit layer, so that part of the circuit layer is covered by the protective layer and part of the circuit layer is exposed; and filling the gummosis bonding layer on the surface of the other part of the pretreated flexible printed circuit board except the part covered by the protective layer, so that the gummosis bonding layer fills the gap of the exposed part of the circuit layer.
Wherein, the step of filling the gummosis adhesive layer on the surface of the other part of the pretreated flexible printed circuit board except the part covered by the protective layer so that the gummosis adhesive layer fills the gap of the exposed part of the circuit layer comprises the following steps: and sequentially stacking the low-flow adhesive layer and the hard board on the other parts of the pretreated soft board except the part covered by the protective layer, and laminating.
Wherein the low-flow adhesive layer is a low-flow prepreg.
Wherein the hard plate and the protective layer are partially laminated.
The method comprises the following steps of pre-treating the surface of the flexible printed circuit board, wherein the surface of the flexible printed circuit board except the surface covered by the protective layer is filled with the gumming adhesion layer, so that the gumming adhesion layer fills the gap of the exposed part of the circuit layer, and the method comprises the following steps: arranging a glue resisting layer on the area of the pretreated soft board covered with the protective layer, and at least partially covering the protective layer; the step of filling the gummosis adhesive layer on the surface of the other part of the soft board except the part covered by the protective layer so that the gummosis adhesive layer fills the gap of the exposed part of the circuit layer comprises the following steps: and removing the glue resisting layer.
Wherein, set up the glue blocking layer on the region that the preliminary treatment soft board covers and is stamped the protective layer, the step of covering the protective layer at least part includes: covering a dry film on the surface of the pretreated soft board provided with the protective layer; and removing part of the dry film to expose the surface of the pretreatment soft board not covered by the protective layer and form a glue resisting layer on the rest part of the dry film.
Wherein the step of removing a portion of the dry film comprises: and forming an opening on the dry film by adopting an exposure and development method.
Wherein, the glue-resisting layer only covers part of the protective layer.
The protective layer is made of polyimide, and the gummosis adhesive layer is made of resin.
In order to solve the technical problems, the second technical scheme adopted by the invention is as follows: provided is a rigid-flex board manufactured by the method for manufacturing the rigid-flex board.
The beneficial effects of the invention are: different from the situation of the prior art, the provided soft and hard combined plate and the manufacturing method thereof comprise the following steps: obtaining a pretreatment soft board, wherein at least one surface of the pretreatment soft board is provided with a circuit layer; arranging a protective layer on the surface of the pretreatment soft board provided with the circuit layer, so that part of the circuit layer is covered by the protective layer and part of the circuit layer is exposed; and filling the gummosis bonding layer on the surface of the other part of the pretreated flexible printed circuit board except the part covered by the protective layer, so that the gummosis bonding layer fills the gap of the exposed part of the circuit layer. According to the manufacturing method of the soft and hard combined board, the protection layer covers part of the circuit layer on the preprocessed soft board to realize the bending function, the gummosis bonding layer is filled on the other part of the circuit layer except the part covered by the protection layer, and the gap of the exposed part of the circuit layer is filled, so that the problems of gum shortage and layering of the soft and hard combined board are avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a method for manufacturing a rigid-flex printed circuit board according to the present invention;
fig. 2 is a schematic flow chart of a method for manufacturing a rigid-flex printed circuit board according to an embodiment of the present invention;
fig. 3 is a schematic flowchart illustrating an embodiment of step S23 in the method for manufacturing a rigid-flex printed circuit board shown in fig. 2;
fig. 4(a) to 4(f) are schematic structural diagrams corresponding to steps in the method for manufacturing a rigid-flex printed circuit board provided in fig. 2;
fig. 5(a) to 5(f) are schematic structural views of steps of the method for manufacturing a rigid-flex printed circuit board provided in fig. 2, which correspond to another angle;
fig. 6 is a schematic structural diagram of a rigid-flex board provided by the invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. Further, the term "plurality" herein means two or more than two.
The terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the described features. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indicators such as up, down, left, right, front, and rear … … in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly. The terms "comprising" and "having," as well as any variations thereof, in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a method for manufacturing a rigid-flex printed circuit board according to an embodiment of the present invention. In this embodiment, a method for manufacturing a rigid-flex board is provided, where the method for manufacturing a rigid-flex board includes the following steps.
S11: and obtaining a pretreated soft board, wherein at least one surface of the pretreated soft board is provided with a circuit layer.
Specifically, a pre-processing soft board is obtained, wherein the pre-processing soft board comprises a flexible substrate and a circuit layer arranged on at least one surface of the flexible substrate. The pre-treated soft board can be divided into a bending part and a connecting part. The bending part of the soft board is used for realizing the bending function, and the connecting part of the soft board is used for connecting the hard board. The material of the flexible substrate may be polyimide.
S12: and arranging a protective layer on the surface of the pretreatment flexible board provided with the circuit layer, so that part of the circuit layer is covered by the protective layer and part of the circuit layer is exposed.
Specifically, at least part of the bent part of the pretreated soft board is covered with a protective layer so as to avoid the influence of the subsequent manufacturing process on the bending function of the pretreated soft board. In a specific embodiment, a glue resisting layer is arranged on the area, covered with the protective layer, of the pretreatment soft board, and the protective layer is at least partially covered. Specifically, a dry film is covered on the surface of the pretreated soft board provided with the protective layer; and removing part of the dry film to expose the surface of the pretreatment soft board not covered by the protective layer and form a glue resisting layer on the rest part of the dry film. In one embodiment, the openings are formed on the dry film by exposure and development. Wherein, the glue blocking layer only covers part of the protective layer. The protective layer is made of polyimide.
S13: and filling the gummosis bonding layer on the surface of the other part of the pretreated flexible printed circuit board except the part covered by the protective layer, so that the gummosis bonding layer fills the gap of the exposed part of the circuit layer.
Specifically, the connection part of the pre-processed flexible printed circuit board is filled with the gummosis bonding layer, so that the gummosis bonding layer is filled in the gap of the exposed part of the circuit layer. The surface of the other part except the partial surface covered by the protective layer of the bending part of the preprocessed soft board is filled with the gummosis bonding layer, so that the gap of the exposed part of the circuit layer is filled with the gummosis bonding layer, and then the gap of the circuit layer is filled before the pressing of the hard board, thereby avoiding the phenomenon of glue shortage and layering of the manufactured soft and hard combination board.
In an alternative embodiment, after the flow adhesive layer is filled on the pre-treated flexible printed circuit board, the glue resisting layer covered on the protective layer of the pre-treated flexible printed circuit board is removed. Wherein the gummosis bonding layer is resin. In an alternative embodiment, the low-flow adhesive layer and the hard sheet are stacked in sequence on the other part of the pretreated soft sheet except the part of the surface covered by the protective layer, and are pressed. Wherein the low-flow glue bonding layer is a low-flow glue prepreg. Wherein, the hardboard and the protective layer are partially laminated.
The manufacturing method of the rigid-flex board provided by the embodiment comprises the steps of obtaining a preprocessed flexible board, wherein at least one surface of the preprocessed flexible board is provided with a circuit layer; arranging a protective layer on the surface of the pretreatment soft board provided with the circuit layer, so that part of the circuit layer is covered by the protective layer and part of the circuit layer is exposed; and filling the surface of the other part of the pretreated flexible printed circuit board except the part of the surface covered by the protective layer with the gummosis adhesion layer so that the gummosis adhesion layer fills the gap of the exposed part of the circuit layer. According to the manufacturing method of the rigid-flex board, the protective layer covers part of the circuit layer on the preprocessed flexible board to realize the bending function, the gummosis bonding layer is filled on the other part of the circuit layer except the part of the circuit layer covering the protective layer, and the gap of the exposed part of the circuit layer is filled, so that the problems of glue shortage and layering of the rigid-flex board are avoided.
Referring to fig. 2, fig. 4(a) to fig. 4(f), and fig. 5(a) to fig. 5(f), fig. 2 is a schematic flow chart of an embodiment of a method for manufacturing a rigid-flex printed circuit board according to the present invention. Fig. 4(a) to 4(f) are schematic structural diagrams corresponding to steps in the method for manufacturing the rigid-flex printed circuit board provided in fig. 2; fig. 5(a) to 5(f) are schematic structural views of steps of the method for manufacturing a rigid-flex printed circuit board provided in fig. 2, the steps corresponding to another angle. In the embodiment, a method for manufacturing a rigid-flex board is provided, and the method for manufacturing the rigid-flex board includes the following steps.
S21: and obtaining a pretreated soft board, wherein at least one surface of the pretreated soft board is provided with a circuit layer.
Specifically, referring to fig. 4(a) and fig. 5(a), the flexible printed circuit board 1 is obtained, where the flexible printed circuit board 1 includes a flexible substrate 11 and a circuit layer 12 disposed on at least one surface of the flexible substrate 11. The pretreated flexible printed circuit board 1 can be divided into two parts, namely a bending part 13 and a connecting part 14. Wherein, the bending part 13 of the soft board 1 is used for realizing the bending function, and the connecting part 14 of the soft board 1 is used for connecting the hard board 3. The material of the flexible substrate 11 may be polyimide. In one embodiment, the pre-processed flexible printed circuit board 1 includes a flexible substrate 11 and circuit layers 12 disposed on opposite surfaces of the flexible substrate 11. In an alternative embodiment, the bent portion 13 may be disposed between the two connection portions 14. In an embodiment, the bending portion 13 is one end of the soft board 1, and the connecting portion 14 is the other end of the soft board 1. In one embodiment, the pre-processed flexible board 1 has a first direction and a second direction disposed perpendicular to the first direction. The extending direction of the bent portion 13 and the extending direction of the connecting portion 14 may be the same, that is, the extending direction of the bent portion 13 and the extending direction of the connecting portion 14 are the same as the first direction, that is, the bent portion 13 is parallel to the connecting portion 14 in the first direction. The extending direction of the bent portion 13 and the extending direction of the connecting portion 14 are perpendicular to each other.
S22: and arranging a protective layer on the surface of the pretreatment flexible board provided with the circuit layer, so that part of the circuit layer is covered by the protective layer and part of the circuit layer is exposed.
Specifically, referring to fig. 4(b) and 5(b), the protective layer 15 is adhered to the bent portion 13 of the pretreated flexible printed circuit board 1 by an adhesive. A fixed protective layer 15 may be adhered to at least one surface of the bent portion 13. In an embodiment, a fixing protection layer 15 may be adhered to one surface of the bending portion 13 of the sub-flexible board. In another embodiment, the protective layer 15 may be fixed on the bending portion 13 of the sub-flexible board opposite to the two surfaces. The protective layer 15 may be fixed to the surface of the bent portion 13 of the pre-processed flexible board 1 in other ways. Among them, the protective layer 15 may be a polyimide film.
In a specific embodiment, a protective layer 15 may be partially covered on the surface of the bent portion 13 of the pre-processed soft board 1 to perform the bending function of the pre-processed soft board 1. The surface of the bent portion 13 of the pretreated flexible printed circuit board 1 may be entirely covered with the protective layer 15, or the bending function of the pretreated flexible printed circuit board 1 may be realized.
The protective layer 15 completely covers the surface of the bent portion 13 of the soft board 1 in the first direction, and the protective layer 15 may partially cover the surface of the bent portion 13 of the soft board 1 in the second direction, or completely cover the surface of the bent portion 13 of the soft board 1 in the second direction.
S23: and arranging a glue resisting layer on the area of the protective layer covered on the pretreatment soft board, and at least partially covering the protective layer.
Specifically, referring to fig. 4(c) and fig. 5(c), the glue blocking layer 16 completely covers the surface of the protection layer 15 in the first direction, and the glue blocking layer 16 may partially cover the surface of the protection layer 15 in the second direction or completely cover the surface of the protection layer 15 in the second direction.
In an alternative embodiment, a resist layer 16 is provided on the protective layer 15. Wherein the glue-blocking layer 16 is a high temperature resistant tape type of tape; this ensures that the flash is also removed with the adhesive tape as the glue barrier 16. The material of the glue-resistant layer 16 can be polyimide tape, PTFE (polytetrafluoroethylene ) tape, and other tapes that can meet the requirements. Also, in the specification, the term "high temperature resistant" in the term "high temperature resistant tape" means "not deformed and decomposed at a temperature higher than 200 ℃, and not polluting the panel".
In another embodiment, please refer to fig. 3, wherein fig. 3 is a schematic flowchart illustrating an embodiment of step S23 in the method for manufacturing a rigid-flex printed circuit board provided in fig. 2. The step of providing the resist layer 16 on the area of the pre-processed flexible board 1 covered with the protective layer 15 includes the following substeps.
S231: and covering a dry film on the surface of the pretreated soft board provided with the protective layer.
Specifically, a dry film is coated on the surface of the side of the flexible board 1 provided with the protective layer 15, so that the dry film completely covers the surface of the bending part 13 and the surface of the connecting part 14 of the flexible board 1. In another alternative embodiment, the surface of the soft board 1 on which the protective layer 15 is disposed is covered with a dry film, so that the dry film only completely covers the surface of the bent portion 13 of the soft board 1. The dry film may be a photoresist.
S232: and removing part of the dry film to expose the surface of the pretreatment soft board which is not covered by the protective layer and form a glue resisting layer on the rest part of the dry film.
Specifically, the dry film on the soft board 1 may be removed by exposure and development, so that the surface of the soft board 1 not covered by the protection layer 15 is exposed. In another alternative embodiment, the surface of the pre-processed soft board 1 not covered by the protective layer 15 and the part of the surface of the protective layer 15 near the connecting portion 14 may also be exposed. The dry film is partially cured and crosslinked during the exposure process to form a resist layer 16, wherein the uncured and crosslinked dry film is removed during the development process, so that the surface of the pretreated flexible printed circuit board 1 not covered by the protective layer 15 is exposed. Wherein at least part of the surface of the protective layer 15 is covered with a glue resisting layer 16.
S24: and filling the gummosis bonding layer on the surface of the other part of the pretreated flexible printed circuit board except the part covered by the protective layer, so that the gummosis bonding layer fills the gap of the exposed part of the circuit layer.
Specifically, referring to fig. 4(d) and fig. 5(d), a gummosis adhesive layer 17 is disposed on the surface of the portion of the pretreated flexible printed circuit board 1 except for the portion covered by the protective layer 15, and the gummosis adhesive layer 17 is heated in a hot pressing manner to be in a flowing state and then filled into the gap between the circuit layers 12, so that the gummosis adhesive layer 17 is filled into the gap between the circuits in the circuit layers 12. After the pressing is completed, the flow adhesive layer 17 is filled into the gaps between the lines. Wherein, the material of the gummosis adhesion layer 17 is resin. Since the resin does not contain glass fibers, the resin can better fill the gaps between the wires in the wire layer 12. After the pressing is finished, the filled pretreatment flexible printed circuit board 1 is polished by grinding, so that the gummosis bonding layer 17 is flush with the exposed surface of the gum blocking layer 16.
S25: and removing the glue resisting layer.
Specifically, referring to fig. 4(e) and fig. 5(e), the photoresist layer 16 on the protective layer 15 disposed on the pre-processed flexible printed circuit board 1 is completely removed, so that the protective layer 15 is completely exposed. In another embodiment, a portion of the resist layer 16 is removed to completely expose the surface of the protection layer 15 in the first direction.
S26: and sequentially stacking the low-flow adhesive layer and the hard board on the other parts of the pretreated soft board except the part covered by the protective layer, and laminating.
Specifically, referring to fig. 4(f) and 5(f), the connecting portion 14 of the pretreated flexible board 1 obtained in step S25 is sequentially stacked with the low-flow adhesive layer 2 and the rigid board 3, and is pressed. The hard board 3 is fixed on the corresponding area of the connecting part 14 of the soft board 1 by the low-flow adhesive layer 2. The bent portion 13 of the pretreated flexible sheet 1 is not covered at all with the low-flow adhesive layer 2 and the hard sheet 3. In another alternative embodiment, the partially folded portion 13 adjacent to the connecting portion 14 of the pre-processed soft board 1 covers the low flow adhesive layer 2 and the hard board 3. The bending part 13 in the pretreated soft board 1 is exposed in the first direction, and the bending part 13 in the pretreated soft board 1 can partially cover the low-flow adhesive layer 2 and the hard board 3 in the second direction, so as to cover the gap between the protective layer 15 and the flow adhesive layer 17, thereby avoiding the delamination of the manufactured rigid-flexible board 100 in the bending process. The low-flow adhesive layer 2 may be a low-flow prepreg. In an alternative embodiment, the sub-hard sheet 3 includes a rigid substrate and a conductive layer disposed on at least one surface of the rigid substrate. In one embodiment, the sub-rigid board 3 includes a rigid substrate and conductive layers disposed on opposite surfaces of the rigid substrate. Wherein, the material of the rigid substrate can be polytetrafluoroethylene.
The manufacturing method of the rigid-flex board 100 provided by the embodiment includes obtaining a pre-processed flexible board 1, where at least one surface of the pre-processed flexible board 1 is provided with a circuit layer 12; arranging a protective layer 15 on the surface of the pretreatment flexible board 1 provided with the circuit layer 12, so that part of the circuit layer 12 is covered by the protective layer 15 and part is exposed; the surface of the other part of the surface of the pretreated flexible printed circuit board 1 except the part covered by the protective layer 15 is filled with the gummosis adhesion layer 17, so that the gummosis adhesion layer 17 fills the gap of the exposed part of the circuit layer 12. According to the manufacturing method of the rigid-flex board 100, the protective layer 15 covers part of the circuit layer 12 on the pretreated flexible board 1 to realize the bending function, the gummosis bonding layer 17 is filled on the other part of the circuit layer 12 except the part covering the protective layer 15, and the gap of the exposed part of the circuit layer 12 is filled, so that the problems of glue shortage and delamination of the rigid-flex board 100 are avoided.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a rigid-flex board provided by the present invention. In this embodiment, a rigid-flex board 100 is provided, and the rigid-flex board 100 at least includes a preprocessed flexible board 1 and a hard board 3. At least one surface of the pretreated flexible printed circuit board 1 is provided with a wiring layer 12. The pretreatment soft board 1 is provided with a partial covering protective layer 15 on the surface of the circuit layer 12, the protective layer 15 only covers the part of the circuit layer 12, the other parts of the pretreatment soft board 1 except the part covering the protective layer 15 are provided with a hard board 3 on the surface, a low-flow adhesive bonding layer 2 is arranged between the hard board 3 and the pretreatment soft board 1 provided with the circuit layer 12, and a gap between circuits in the circuit layer 12 is filled with a flow adhesive bonding layer 17. Wherein the surface of the gummosis adhesion layer 17 close to the low gummosis adhesion layer 2 is flush with the surface of the wiring layer 12 close to the hard board 3.
The pretreatment flexible printed circuit board 1 includes a flexible substrate 11 and circuit layers 12 disposed on two opposite surfaces of the flexible substrate 11, and the flexible substrate 11 may be made of polyimide. The hard plate 3 includes a rigid substrate and conductive layers disposed on two opposite surfaces of the rigid substrate, and the rigid substrate may be made of teflon. The material of the gummosis adhesion layer 17 is resin, and the low gummosis adhesion layer 2 is a low gummosis prepreg.
The soft and hard combined board provided by the embodiment can fill the gummosis bonding layer through the gap between the circuits in the circuit layer, so that the problem of glue shortage caused by lamination between the circuit layers is avoided; the pretreated soft board and the hard board are bonded through the low-flow adhesive layer, so that the phenomenon of layering of the soft and hard combined board is avoided.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes performed by the present specification and the attached drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A manufacturing method of a rigid-flex board is characterized by comprising the following steps:
obtaining a pretreatment soft board, wherein at least one surface of the pretreatment soft board is provided with a circuit layer;
arranging a protective layer on the surface of the pretreatment soft board provided with the circuit layer, so that part of the circuit layer is covered by the protective layer and part of the circuit layer is exposed;
and filling a gummosis bonding layer on the surface of the other part of the pretreatment flexible printed circuit except the part of the surface covered by the protective layer, so that the gummosis bonding layer fills the gap of the exposed part of the circuit layer.
2. The method for manufacturing the rigid-flex board according to claim 1, wherein the step of filling the surface of the part of the flexible board except the part of the surface covered by the protective layer with the adhesive layer so that the adhesive layer fills the gap of the exposed part of the circuit layer is followed by the steps of:
and sequentially stacking a low-flow adhesive layer and a hard board on the other parts of the pretreated soft board except the part of the surface covered by the protective layer, and pressing.
3. The method for manufacturing the rigid-flex board according to claim 2, wherein the low-flow adhesive layer is a low-flow prepreg.
4. The method for manufacturing an rigid-flex board according to claim 2, wherein the hard board and the protective layer are partially laminated.
5. The method for manufacturing the rigid-flex board according to claim 1, wherein the step of filling the surface of the other part of the pretreated flexible board except the part of the surface covered by the protective layer with the gumming adhesion layer so that the gumming adhesion layer fills the gap of the exposed part of the circuit layer is preceded by the steps of:
arranging a glue resisting layer on the area of the pretreatment soft board covered with the protective layer, and at least partially covering the protective layer;
the step of filling the surface of the other part of the pretreated flexible printed circuit board except the part of the surface covered by the protective layer with the gummosis adhesive layer so that the gummosis adhesive layer fills the gap of the exposed part of the circuit layer comprises the following steps:
and removing the glue resisting layer.
6. The method for manufacturing the rigid-flex board according to claim 5, wherein a glue blocking layer is arranged on the area of the pre-processed flexible board covered with the protective layer, and the step of at least partially covering the protective layer comprises the following steps:
covering a dry film on the surface of the pretreatment soft board provided with the protective layer;
and removing part of the dry film, so that the surface of the pretreatment soft board which is not covered by the protective layer is exposed, and the residual part of the dry film forms the glue resisting layer.
7. The method for manufacturing the rigid-flex board according to claim 6, wherein the step of removing a portion of the dry film comprises: and forming an opening on the dry film by adopting an exposure and development method.
8. The method for manufacturing a rigid-flex board according to claim 5, wherein the glue resisting layer only covers part of the protective layer.
9. The method for manufacturing the rigid-flex printed circuit board according to claim 1, wherein the material of the protective layer is polyimide, and the adhesive layer is resin.
10. A rigid-flex board, characterized in that it is produced by the method of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110105739.9A CN114793389A (en) | 2021-01-26 | 2021-01-26 | Soft-hard combined board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110105739.9A CN114793389A (en) | 2021-01-26 | 2021-01-26 | Soft-hard combined board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114793389A true CN114793389A (en) | 2022-07-26 |
Family
ID=82459622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110105739.9A Pending CN114793389A (en) | 2021-01-26 | 2021-01-26 | Soft-hard combined board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114793389A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604574A (en) * | 2016-12-20 | 2017-04-26 | 高德（江苏）电子科技有限公司 | Flex-rigid printed circuit board and preparation process thereof |
| CN107846793A (en) * | 2017-10-30 | 2018-03-27 | 高德（江苏）电子科技有限公司 | The technique that a kind of Rigid Flex is pressed using hardboard mode |
| CN211047442U (en) * | 2019-09-04 | 2020-07-17 | 深南电路股份有限公司 | Printed circuit board and electronic equipment using same |
-
2021
- 2021-01-26 CN CN202110105739.9A patent/CN114793389A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604574A (en) * | 2016-12-20 | 2017-04-26 | 高德（江苏）电子科技有限公司 | Flex-rigid printed circuit board and preparation process thereof |
| CN107846793A (en) * | 2017-10-30 | 2018-03-27 | 高德（江苏）电子科技有限公司 | The technique that a kind of Rigid Flex is pressed using hardboard mode |
| CN211047442U (en) * | 2019-09-04 | 2020-07-17 | 深南电路股份有限公司 | Printed circuit board and electronic equipment using same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI355867B (en) | Wiring board and method for manufacturing the same | |
| KR101098072B1 (en) | Flexible wiring board and method of manufacturing same | |
| JP5121942B2 (en) | Flex-rigid wiring board and manufacturing method thereof | |
| WO2009118935A1 (en) | Flex-rigid wiring board and method for manufacturing the same | |
| CN110636702B (en) | Circuit board and manufacturing method thereof | |
| KR20080046133A (en) | Flexible printed wiring board and method for manufacturing same | |
| KR101569156B1 (en) | Printed wiring board | |
| JP6414652B1 (en) | Multilayer substrate and electronic equipment | |
| TWI507100B (en) | Flex-rigid compound printed circuit board and method for manufacturing same | |
| JP2007173477A (en) | Flexible printed wiring board | |
| JP5509480B2 (en) | Flexible printed wiring board connection structure, manufacturing method thereof, and electronic device | |
| WO2011052358A1 (en) | Wiring board and method for producing same | |
| CN114793389A (en) | Soft-hard combined board and manufacturing method thereof | |
| JPH07106728A (en) | Rigid-flexible printed wiring board and manufacture thereof | |
| TWI376178B (en) | Method for manufacturing printed circuit board | |
| WO2019198241A1 (en) | Method for manufacturing board with embedded components, and board with embedded components | |
| JP2011222962A (en) | Print circuit board and method of manufacturing the same | |
| JP5457308B2 (en) | Flexible printed wiring board | |
| JP5027535B2 (en) | Multilayer printed wiring board and manufacturing method thereof | |
| CN111406444A (en) | Method of manufacturing flexible printed circuit board and flexible printed circuit board | |
| JP2004134467A (en) | Multilayered wiring board, material for it, and method of manufacturing it | |
| TW201349956A (en) | Embedded flex circuit board and method of fabricating the same | |
| KR200415210Y1 (en) | Rigid-flexible Printed Circuit Board | |
| CN114630509A (en) | Rigid-flex board and manufacturing method thereof | |
| JP2008235346A (en) | Flexible printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |