CN114777551A - Heat exchanger chip, chip assembly and heat exchanger - Google Patents
Heat exchanger chip, chip assembly and heat exchanger Download PDFInfo
- Publication number
- CN114777551A CN114777551A CN202210497485.4A CN202210497485A CN114777551A CN 114777551 A CN114777551 A CN 114777551A CN 202210497485 A CN202210497485 A CN 202210497485A CN 114777551 A CN114777551 A CN 114777551A
- Authority
- CN
- China
- Prior art keywords
- chip
- heat exchanger
- flange
- flanging
- medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/10—Arrangements for sealing the margins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
- F28D9/0037—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the conduits for the other heat-exchange medium also being formed by paired plates touching each other
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The application relates to the technical field of heat exchange equipment, in particular to a heat exchanger chip, a chip assembly and a heat exchanger, wherein a first flanging is used for being connected with the chip facing to a first plate surface so as to form a first medium circulation channel between the two first flanging and the chip facing to the first plate surface; the two second flanges are arranged on the second board surface and are used for being connected with the chips facing the second board surface, so that a second medium circulation cavity is formed between the two second flanges and the chips facing the second board surface. The application aims to provide a heat exchanger chip, a chip assembly and a heat exchanger aiming at an oil-cooled heat exchanger used by soaking in a cooling medium at present, wherein part of the cooling medium does not participate in heat exchange through the heat exchanger, and the heat radiation performance of the heat exchanger is influenced.
Description
Technical Field
The application relates to the technical field of heat exchange equipment, in particular to a heat exchanger chip, a chip assembly and a heat exchanger.
Background
A heat exchanger for oil cooling in a vehicle is generally immersed in a cooling medium, and a hot-side medium is circulated through the heat exchanger to cool the hot-side medium by heat exchange between the cold and hot media. The heat exchanger is formed by stacking a plurality of layers of heat dissipation chip assemblies, each heat dissipation chip assembly comprises two chips which are connected with each other, a medium at the hot side circulates in the heat dissipation chip assembly, and a cooling medium circulates between the two heat dissipation chip assemblies. Generally, the cooling medium is located in a water cavity, a gap between the heat exchanger and the wall of the water cavity is large, the cooling medium enters from one end of the heat exchanger and exits from the other end of the heat exchanger, but most of the cooling medium does not participate in heat exchange through the heat exchanger, and heat dissipation performance of the heat exchanger is affected.
Disclosure of Invention
The application aims to provide a heat exchanger chip, a chip assembly and a heat exchanger aiming at the heat exchanger of oil cooling used by soaking in the cooling medium at present, wherein part of the cooling medium does not participate in heat exchange through the heat exchanger, and the heat radiation performance of the heat exchanger is influenced.
In order to achieve the purpose, the following technical scheme is adopted in the application:
one aspect of the present application provides a heat exchanger chip comprising: the plate comprises a plate body, a first flanging and a second flanging, wherein the plate surfaces on two sides of the plate body are respectively a first plate surface and a second plate surface;
the two first flanges are arranged on the first board surface and are used for being connected with the chips facing the first board surface, so that a first medium circulation channel is formed between the two first flanges and the chips facing the first board surface;
the two second flanges are arranged on the second board surface and are used for being connected with the chips facing the second board surface, so that a second medium circulation cavity is formed between the two second flanges and the chips facing the second board surface.
Optionally, the chip mounting structure further comprises a first connecting portion for connecting with a chip facing the second board surface, and the first connecting portion is connected to the second flange.
The technical scheme has the beneficial effects that: and a second medium circulation cavity is formed by the second flanging support, and the heat exchanger chip and the adjacent chip can be more reliably connected through the specially arranged first connecting part.
Optionally, the first connecting portion extends from one end of the second flange to the other end of the second flange in the length direction of the second flange.
The technical scheme has the beneficial effects that: and each position of the second flanging is provided with a first connecting part specially used for connecting with the chip facing the second plate surface, so that the reliability of the connection between the heat exchanger chip and the adjacent chip is further improved.
Optionally, the first connecting portion protrudes from one side, away from the plate body, of the second flanging in a first direction, and the first direction is an arrangement direction of the two second flanging.
The technical scheme has the beneficial effects that: this enables the first connection portion to be located outside the second medium circulation chamber when the first connection portion is connected to the chip facing the second plate surface, which facilitates connection between the first connection portion and the chip facing the second plate surface, and on the other hand, the first connection portion does not or hardly occupy the space in the second medium circulation chamber, so that the space in the second medium circulation chamber can be fully utilized by the second medium.
Optionally, one side of the first flange, which faces away from the plate body, is used for being hermetically connected with the chip, which faces the second plate surface, and an end of the first flange overlaps with an end of the first connecting portion.
The technical scheme has the beneficial effects that: that is to say, the tip of first turn-ups overlaps with the tip of first connecting portion and forms a handing-over region, and in this handing-over region, first turn-ups and first connecting portion form double seal with the chip that this second face faced, and then improve the sealed effect of second medium circulation chamber.
Optionally, the first flange is a straight plate extending in the first direction.
The technical scheme has the beneficial effects that: because the second flanging is mainly used as a supporting structure, and the sealing is more realized through the first flanging and the first connecting part, the first flanging is in a straight plate shape, and a straight sealing surface is easier to form and is easy to seal.
Optionally, the end portion of the first flange, the end portion of the first connecting portion, and the end portion of the second flange are connected to each other, the end portion of the second flange is an arc-shaped end, an end face of the arc-shaped end is connected to the end portion of the first flange, the end portion of the first connecting portion is located between the arc-shaped end and the end portion of the first flange in the second direction, and the second direction is the arrangement direction of the two first flanges.
The technical scheme has the beneficial effects that: this leaves a space for the end of the first connection between the end of the second flange and the end of the first flange, so that the second medium circulation chamber can be sealed by the first connection and the first flange in the joint area of the first connection and the second flange.
Optionally, the first medium circulation channel extends along a first direction, one end of the first medium circulation channel in the first direction is a first medium inlet, the other end of the first medium circulation channel in the first direction is a first medium outlet, the positions of the first medium inlet and the first medium outlet are in one-to-one correspondence with the positions of the two second flanges, and the first direction is the arrangement direction of the two second flanges.
The technical scheme has the beneficial effects that: that is, one of the positions where the second flanges are formed simultaneously forms the first medium outlet, and the other of the positions where the second flanges are formed simultaneously forms the first medium inlet, so that the first medium can smoothly flow through the first medium flow passage.
Optionally, a centre line of the first medium outlet and/or a centre line of the first medium inlet is arranged obliquely with respect to the first direction.
The technical scheme has the beneficial effects that: if a straight line extending in the first direction is provided on the plate body, the first medium inlet and the first medium outlet may be located on the same side of the straight line or on both sides of the straight line.
Another aspect of the present application provides a chip assembly including a first chip and a second chip connected to the first chip, where the first chip is a heat exchanger chip provided in an embodiment of the present application.
Optionally, the second chip is located on a side of the first chip facing the second board surface;
the first flanging is obliquely arranged relative to the plate body; the second chip is provided with a third flanging, the third flanging is positioned on one side, facing the first chip, of the second chip, and the third flanging is lapped on the outer side of the first flanging.
The technical scheme has the beneficial effects that: the cooperation between first chip and the second chip of being convenient for when assembling the chip subassembly, when making the chip subassembly, put the second chip in the below to make the third turn-ups be located position up, then put into two third turn-ups with first chip between, make the third turn-ups be located first turn-ups's the outside, make again first turn-ups with the third turn-ups be connected can.
Optionally, the heat exchanger chip further includes a first connecting portion for connecting with the chip facing the second plate surface, and the first connecting portion is connected to the second flange; the second chip is provided with a fourth flanging, the third flanging is positioned on one side, facing the first chip, of the second chip, a second connecting part is formed on the fourth flanging, the second connecting part protrudes out of the fourth flanging in a first direction, the second connecting part is used for being in sealing connection with the first connecting part, and the first direction is the arrangement direction of the two second flanging.
The technical scheme has the beneficial effects that: the first connecting part is connected with the second connecting part in a sealing mode, and therefore the second medium circulation cavity is well sealed.
The third aspect of the application provides a heat exchanger, including the chip subassembly that this application provided the second chip is all installed to the one side that the first face of first chip faced and the one side that the second face faced.
The technical scheme provided by the application can achieve the following beneficial effects:
the heat exchanger chip, chip subassembly and heat exchanger that this application embodiment provided owing to adopted be used for with the chip that first face faced is connected to form first medium circulation passageway at first turn-ups, make first medium when flowing through first medium circulation passageway, be difficult for flowing out from the heat exchanger from other directions that deviate first medium circulation passageway extending direction, and then make more first media participate in with the heat transfer in-process of the inside medium of heat exchanger, and then improve the heat transfer performance of heat exchanger.
Additional features and advantages of the present application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the present application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It should be apparent that the drawings in the following description are embodiments of the present application and that other drawings may be derived from those drawings by a person of ordinary skill in the art without inventive step.
FIG. 1 is a schematic perspective view of an embodiment of a heat exchanger according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view taken along line A-A in FIG. 1;
FIG. 3 is a schematic cross-sectional view at B-B in FIG. 1;
FIG. 4 is a schematic perspective view of an embodiment of a chip assembly provided in an embodiment of the present application;
FIG. 5 is a schematic cross-sectional view at C-C in FIG. 4;
FIG. 6 is a schematic perspective view of an angle of an embodiment of a heat exchanger chip according to an embodiment of the present disclosure;
FIG. 7 is an enlarged partial view of FIG. 6 at D;
fig. 8 is a schematic perspective view of an implementation manner of a second chip provided in an embodiment of the present application;
fig. 9 to 12 are schematic perspective views of four different embodiments of the heat exchanger chip provided in the example of the present application, where X denotes a straight line extending in the first direction, Y denotes a center line of the first medium inlet, and Z denotes a center line of the first medium outlet.
Reference numerals are as follows:
100-a chip assembly;
110-heat exchanger chip;
111-a first flange;
112-a boss;
113-a first connection;
114-second flanging;
115-a plate body;
116-a first media inlet;
117-first medium outlet;
120-a second chip;
121-third flanging;
122-fourth flange;
123-a second connection;
130-a second media flow-through chamber;
140-first medium flow channel.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
As shown in fig. 6, 7, and 9-12, one aspect of the present application provides a heat exchanger chip 110 comprising: the plate comprises a plate body 115, a first flange 111 and a second flange 114, wherein the two side plate surfaces of the plate body 115 are a first plate surface and a second plate surface respectively;
the two first flanges 111 are mounted on the first board surface, and the first flanges 111 are used for being connected with the chips facing the first board surface, so as to form a first medium circulation channel 140 between the two first flanges 111 and the chips facing the first board surface;
the two second flanges 114 are mounted on the second plate surface, and the second flanges 114 are used for connecting with the core chip facing the second plate surface, so as to form a second medium circulation cavity 130 between the two second flanges 114 and the core chip facing the second plate surface.
In the embodiment of the present application, the first medium is preferably a cooling medium, and correspondingly, the second medium is preferably a hot-side medium, so that, when the heat exchanger including the heat exchanger chip 110 provided in the embodiment of the present application is used, the heat exchanger is immersed in the first medium, the inlet and the outlet of the first medium circulation channel 140 are open to the cooling medium, and the first medium can enter and exit the first medium circulation channel 140 to exchange heat with the second medium in the heat exchanger. The heat exchanger core 110 provided in the embodiment of the present application is preferably the heat exchanger core 110 formed by integrally molding the plate body 115, the first flange 111, and the second flange 114.
The heat exchanger chip 110 provided by the embodiment of the application is used for being connected with the chip facing the first plate surface to form the first flanging 111 of the first medium circulation channel 140, so that when a first medium flows through the first medium circulation channel 140, the first medium is not easy to flow out of the heat exchanger from other directions deviating from the extending direction of the first medium circulation channel 140, and more first media participate in the heat exchange process with the medium inside the heat exchanger, and the heat exchange performance of the heat exchanger is improved.
Optionally, the heat exchanger chip 110 provided in the embodiment of the present application further includes a first connection portion 113 for connecting with the chip facing the second plate surface, and the first connection portion 113 is connected to the second flange 114. The second media circulation chamber 130 is supported by the second flange 114 and the heat exchanger chip 110 is more securely connected to the adjacent chip by the specially provided first connection 113.
Optionally, the first connecting portion 113 extends from one end of the second flange 114 to the other end of the second flange 114 in the length direction of the second flange 114. Each position of the second flange 114 is provided with a first connecting portion 113 specially used for connecting with the chip facing the second plate surface, so that the reliability of the connection between the heat exchanger chip 110 and the adjacent chip is further improved.
Optionally, the first connecting portion 113 protrudes from a side of the second flange 114 away from the plate body in a first direction, where the first direction is an arrangement direction of the two second flanges 114. This allows the first connection portion 113 to be located outside the second medium flow chamber 130 when the first connection portion 113 is connected to the chip facing the second plate surface, which facilitates the connection between the first connection portion 113 and the chip facing the second plate surface, and allows the space in the second medium flow chamber 130 to be fully utilized by the second medium because the first connection portion 113 does not or hardly occupy the space in the second medium flow chamber 130. Of course, the first connecting portion 113 may be disposed in a manner that the first connecting portion 113 protrudes from the second flange 114 toward the side of the plate body.
Optionally, a side of the first flange 111 facing away from the plate body 115 is used for being hermetically connected with the chip facing the second board surface, and an end of the first flange 111 overlaps with an end of the first connecting portion 113. That is, the end of the first flange 111 and the end of the first connection portion 113 overlap to form a connection area, and in the connection area, the first flange 111 and the first connection portion 113 form a double seal with the chip facing the second board surface, so as to improve the sealing effect of the second medium circulation cavity 130; moreover, if the extending directions of the first flange 111 and the second flange 114 are different, when the end of the second flange 114 and the end of the first flange 111 are turned over in different directions at the same position of the edge of the panel body 115, the end of the second flange 114 at the same position of the edge of the panel body 115 is generally only the thickness of the plate forming the second flange 114, which is small and not easy to be connected with the outside to form a seal, and when the first connecting portion 113 extends from one end of the second flange 114 to the other end of the second flange 114 in the length direction of the second flange 114, because the end of the first flange 111 overlaps with the end of the first connecting portion 113, the first flange 111 can cover the end of the second flange 114, and the end of the second flange 114 is provided with a position for being connected with the outside in a sealed manner by the first flange 111, the sealing effect is improved.
Optionally, the first flange 111 is in a shape of a straight plate extending along the first direction. Since the second flange 114 mainly serves as a support structure and sealing is more achieved by the first flange 111 and the first connecting portion 113, it is easier to make the first flange 111 straight plate-like to form a straight sealing surface for easy sealing. The end face of the arc-shaped end and the first flange 111 are preferably integrally formed.
Optionally, the end portion of the first flange 111, the end portion of the first connecting portion 113, and the end portion of the second flange 114 are connected to each other, the end portion of the second flange 114 is an arc-shaped end 141a, an end surface of the arc-shaped end 141a is connected to the end portion of the first flange 111, the end portion of the first connecting portion 113 is located between the arc-shaped end 141a and the end portion of the first flange 111 in a second direction, and the second direction is an arrangement direction of the two first flanges 111. This leaves a space for the end of the first connection part 113 between the end of the second flange 114 and the end of the first flange 111, and the second medium circulation chamber 130 can be sealed by the first connection part 113 and the first flange 111 in the junction area of the three.
Further, the size of the first connection portion 113 protruding from the first burring 111 from one end of the first connection portion 113 to the other end may be kept constant.
It can be understood that the connection among the end of the first flange 111, the end of the first connection portion 113, and the end of the first flange 111 refers to the connection among the end of the first flange 111, the end of the first connection portion 113, and the end of the first flange 111, which are close to the same position of the plate 115 or located at the same position of the plate 115. In the embodiment of the present invention, a plurality of bosses 112 are formed on the first plate surface, and the bosses 112 are arranged in a regular manner and face the first medium flowing channel 140.
Optionally, the first medium flowing channel 140 extends along a first direction, one end of the first medium flowing channel 140 is a first medium inlet 116, and the other end is a first medium outlet 117 in the first direction, the positions of the first medium inlet 116 and the first medium outlet 117 correspond to the positions of the two second flanges 114 one by one, and the first direction is the arrangement direction of the two second flanges 114. That is, one of the positions where the second flange 114 is formed simultaneously forms the first medium outlet 117, and the other of the positions where the second flange 114 is formed simultaneously forms the first medium inlet 116, thereby allowing the first medium to smoothly flow through the first medium flow path 140.
As shown in fig. 9 to 12, optionally, the center line Z of the first medium outlet 117 and/or the center line Y of the first medium inlet 116 are arranged obliquely with respect to the first direction. Assuming that a straight line X extending in the first direction is provided on the plate body 115, the first medium inlet 116 and the first medium outlet 117 may be located on the same side of the straight line X or on both sides of the straight line X, respectively. As shown in fig. 4 and 5, another aspect of the present application provides a chip assembly 100 including a first chip and a second chip 120 connected to the first chip, where the first chip is a heat exchanger chip 110 provided in an embodiment of the present application.
As shown in fig. 8, optionally, the second chip 120 is located on a side of the first chip facing the second board surface;
the first flange 111 is arranged obliquely relative to the plate body 115; the second chip 120 has a third flange 121, the third flange 121 is located on a side of the second chip 120 facing the first chip, and the third flange 121 is overlapped on an outer side of the first flange 111. The cooperation between first chip and the second chip 120 of being convenient for when assembling chip subassembly 100, when making chip subassembly 100, put second chip 120 in the below to make third turn-ups 121 be located position up, then put first chip between two third turn-ups 121, make third turn-ups 121 be located the outside of first turn-ups 111, make first turn-ups 111 be connected with third turn-ups 121 again can.
Optionally, the second core 120 has a fourth flange 122, the third flange 121 is located on a side of the second core 120 facing the first core, a second connecting portion 123 is formed on the fourth flange 122, the second connecting portion 123 protrudes out of the fourth flange 122 in a first direction, the second connecting portion 123 is used for being hermetically connected with the first connecting portion 113, and the first direction is a direction in which the two second flanges 114 are arranged. The first connection 113 is connected in a sealing manner to the second connection 123, so that a better sealing of the second medium flow chamber 130 is achieved.
As shown in fig. 1 to 3, a third aspect of the present application provides a heat exchanger, which includes a chip assembly 100 provided in an embodiment of the present application, and a second chip 120 is mounted on both a side facing a first plate surface and a side facing a second plate surface of the first chip.
When the second chip 120 located on the side facing the first board surface of the first chip is connected to the first chip, the first flange 111 of the first chip is overlapped on the outer side of the third flange 121 of the second chip 120.
The heat exchanger that this application embodiment provided has adopted chip subassembly 100 that this application embodiment provided, owing to adopted be used for with the chip that first face faced is connected to form first medium circulation passageway 140 at first turn-ups 111, make first medium flow through first medium circulation passageway 140 when, difficult other directions from deviating first medium circulation passageway 140 extending direction flow out from the heat exchanger, and then make more first mediums participate in with the heat transfer process of the inside medium of heat exchanger, and then improve the heat transfer performance of heat exchanger.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the scope of the technical solutions of the embodiments of the present application.
Claims (13)
1. A heat exchanger chip, comprising: the plate comprises a plate body, a first flanging and a second flanging, wherein the plate surfaces on two sides of the plate body are respectively a first plate surface and a second plate surface;
the two first flanges are arranged on the first board surface and are used for being connected with the chips facing the first board surface, so that a first medium circulation channel is formed between the two first flanges and the chips facing the first board surface;
the two second flanges are arranged on the second board surface and are used for being connected with the chips facing the second board surface, so that a second medium circulation cavity is formed between the two second flanges and the chips facing the second board surface.
2. The heat exchanger chip according to claim 1, further comprising a first connection portion for connection with the chip that the second plate face faces, the first connection portion being connected to the second flange.
3. The heat exchanger core plate according to claim 2, wherein the first connecting portion extends from one end of the second flange to the other end of the second flange in a length direction of the second flange.
4. The heat exchanger chip according to claim 2 or 3, wherein the first connecting portion protrudes from a side of the second flange away from the plate body in a first direction, and the first direction is an arrangement direction of the two second flanges.
5. The heat exchanger chip according to claim 4, wherein a side of the first flange facing away from the plate body is configured to be sealingly connected to the chip facing the second plate surface, and an end of the first flange overlaps an end of the first connection portion.
6. The heat exchanger chip according to claim 5, wherein the first bead is a straight plate shape extending in the first direction.
7. The heat exchanger chip according to claim 6, wherein the end portion of the first flange, the end portion of the first connecting portion, and the end portion of the second flange are connected to each other, the end portion of the second flange is an arc-shaped end, an end surface of the arc-shaped end is connected to the end portion of the first flange, the end portion of the first connecting portion is located between the arc-shaped end and the end portion of the first flange in a second direction, and the second direction is an arrangement direction of the two first flanges.
8. The heat exchanger chip according to claim 1, wherein the first medium flow channel extends in a first direction, one end of the first medium flow channel in the first direction is a first medium inlet, the other end of the first medium flow channel in the first direction is a first medium outlet, positions of the first medium inlet and the first medium outlet correspond to positions of the two second flanges one to one, and the first direction is an arrangement direction of the two second flanges.
9. The heat exchanger chip according to claim 8, wherein a centerline of the first medium outlet and/or a centerline of the first medium inlet are arranged obliquely with respect to the first direction.
10. A chip assembly comprising a first chip and a second chip attached to the first chip, the first chip being a heat exchanger chip according to any one of claims 1 to 9.
11. The chip assembly according to claim 10, wherein the second chip is located on a side of the first chip facing the second board surface;
the first flanging is obliquely arranged relative to the plate body; the second chip is provided with a third flanging, the third flanging is positioned on one side, facing the first chip, of the second chip, and the third flanging is lapped on the outer side of the first flanging.
12. The chip assembly of claim 11, wherein the heat exchanger chip further comprises a first connection portion for connection with the chip facing the second face, the first connection portion being connected to the second flange; the second chip is provided with a fourth flanging, the third flanging is positioned on one side, facing the first chip, of the second chip, a second connecting part is formed on the fourth flanging, the second connecting part protrudes out of the fourth flanging in a first direction, the second connecting part is used for being in sealing connection with the first connecting part, and the first direction is the arrangement direction of the two second flanging.
13. A heat exchanger comprising a chip assembly according to any one of claims 10 to 12, wherein a second chip is mounted on both a side of the first chip facing the first plate surface and a side of the second plate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210497485.4A CN114777551A (en) | 2022-05-09 | 2022-05-09 | Heat exchanger chip, chip assembly and heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210497485.4A CN114777551A (en) | 2022-05-09 | 2022-05-09 | Heat exchanger chip, chip assembly and heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114777551A true CN114777551A (en) | 2022-07-22 |
Family
ID=82437345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210497485.4A Pending CN114777551A (en) | 2022-05-09 | 2022-05-09 | Heat exchanger chip, chip assembly and heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114777551A (en) |
-
2022
- 2022-05-09 CN CN202210497485.4A patent/CN114777551A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20110247318A1 (en) | Exhaust heat exchanger | |
| US20080251242A1 (en) | Heat Exchanger | |
| JP2015534030A (en) | Heat exchanger | |
| US20100199700A1 (en) | Indoor unit for air conditioner | |
| JP6520681B2 (en) | Heat exchanger | |
| JP2008121658A (en) | Exhaust gas recirculation device | |
| EP2792988B1 (en) | Integrated heat exchanger for a vehicle | |
| CN104541121B (en) | Heat exchanger, particularly motor vehicle engine charger-air cooler | |
| KR20190111773A (en) | Intercooler consisting of a liquid-cooled pre-cooler and an air-cooled main cooler | |
| WO2017097133A1 (en) | Heat exchanger | |
| KR20140116419A (en) | Stacked-plate heat exchanger including a collector | |
| JP2008231929A (en) | Cooling water inlet structure of heat exchanger for egr cooler | |
| WO2021136017A1 (en) | Main board of intercooler, and intercooler and manufacturing method therefor | |
| JP2014169857A (en) | Exhaust heat transfer equipment | |
| CN113383205B (en) | Heat exchanger | |
| CN114777551A (en) | Heat exchanger chip, chip assembly and heat exchanger | |
| JP2002372383A (en) | Radiator for carbon dioxide gas | |
| JP5154842B2 (en) | Heat exchanger joint structure | |
| CN113028866B (en) | Intercooler core, air chamber assembly and intercooler | |
| CN211782936U (en) | Chip assembly and flue gas heat exchanger | |
| CN113883923A (en) | Casing, casing subassembly and intercooler | |
| CN216522487U (en) | Heat pump set capable of uniformly distributing air | |
| CN211204247U (en) | Ceiling machine | |
| CN210861371U (en) | Indoor unit of air conditioner | |
| CN112146475A (en) | Collecting pipe and heat exchanger |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |