CN114775007B - High-tin-content tinned plate for electronic product and production method thereof - Google Patents
High-tin-content tinned plate for electronic product and production method thereof Download PDFInfo
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- CN114775007B CN114775007B CN202210398099.XA CN202210398099A CN114775007B CN 114775007 B CN114775007 B CN 114775007B CN 202210398099 A CN202210398099 A CN 202210398099A CN 114775007 B CN114775007 B CN 114775007B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 239000005028 tinplate Substances 0.000 claims abstract description 52
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000005406 washing Methods 0.000 claims abstract description 26
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 24
- 239000010959 steel Substances 0.000 claims abstract description 24
- 238000002161 passivation Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000001035 drying Methods 0.000 claims abstract description 15
- 239000003513 alkali Substances 0.000 claims abstract description 11
- 230000003746 surface roughness Effects 0.000 claims abstract description 11
- 239000002253 acid Substances 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 6
- 239000007921 spray Substances 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 239000008237 rinsing water Substances 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- 238000005554 pickling Methods 0.000 claims 1
- 241000565357 Fraxinus nigra Species 0.000 abstract description 14
- 229910045601 alloy Inorganic materials 0.000 abstract description 14
- 239000000956 alloy Substances 0.000 abstract description 14
- NNIPDXPTJYIMKW-UHFFFAOYSA-N iron tin Chemical compound [Fe].[Sn] NNIPDXPTJYIMKW-UHFFFAOYSA-N 0.000 abstract description 2
- 239000007769 metal material Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004075 alteration Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The application particularly relates to a high tin amount tinning plate for electronic products and a production method thereof, belonging to the technical field of metal material treatment, wherein the method comprises the following steps: carrying out alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflow, extruding, passivation, rinsing, drying and oiling on the steel substrate to obtain a high-tin-content tinning plate; wherein the surface roughness Sa of the steel substrate is 0.6-0.85 mu m, and the surface skewness Ssk of the steel substrate>0; by improving the surface roughness of the tin plate, the surface skewness Ssk of the tin plate is controlled>0, the alloy layer content of the tinning plate is more than or equal to 1.5g/m 2 The sharpness and hardness of the peak shape of the tin plate are improved, the friction resistance of the high tin iron is improved, and the problem of black ash friction generated by friction between strip steel and a roller system in the production process of the high tin amount tin plate can be effectively reduced.
Description
Technical Field
The application belongs to the technical field of metal material treatment, and particularly relates to a high-tin-content tin plate for an electronic product and a production method thereof.
Background
The tin plate is a product with strong production technology, complex technology and high quality requirement, and is widely applied to non-food industries such as food packaging, pressure containers, electronic products, various containers and the like. High tin tinning plate (plating layer 8.4-15.1 g/m) 2 ) The tin plate is a product with highest production difficulty in tin plate, is generally used for cans, luncheon meats, electronic connectors and the like with high requirements on surface brightness and corrosion resistance, and compared with a tin plate with low tin content, the tin plate with high tin content has thicker surface tin layer and poor wear resistance, and the problems of black ash friction caused by friction between strip steel and a roller system are more likely to occur in the production process, so that the corrosion resistance and the attractiveness of the surface of the high tin iron are seriously affected.
At present, the following methods are generally adopted for solving the black ash defect on the surface of the tin plate: firstly, the passivation current density is reduced, and the black ash generated in the passivation process is lightened, but the method can only solve the black ash problem of the passivation process, and can not solve the black ash problem generated by friction between strip steel and a roller system; secondly, the cleanliness of the solution of the production line is improved, the rinsing water quantity is increased, and the problem of the cleanliness of the solution only solved by the method causes black ash defects; and thirdly, wiping the surface of the finished tin plate by adopting a black ash wiping device, so that the problem of black ash friction caused by friction between the strip steel and a roller system can be effectively solved, but the secondary quality problem of scratch and chromatic aberration is easily generated on the surface of the strip steel due to soft tin layer texture on the surface of Gao Xitie in the production process.
Disclosure of Invention
The application aims to provide a high-tin-content tin plate for electronic products and a production method thereof, which are used for solving the problem of black dust generated by friction between strip steel and a roller system in the current production process of the high-tin-content tin plate.
The embodiment of the application provides a production method of a high-tin-content tin plate for electronic products, which comprises the following steps: carrying out alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflow, extruding, passivation, rinsing, drying and oiling on the steel substrate to obtain a high-tin-content tinning plate;
wherein the surface roughness Sa of the steel substrate is 0.6-0.85 mu m, and the surface skewness Ssk of the steel substrate is more than 0.
Optionally, the alkaline washing solution for alkaline spray washing comprises a KOH solution, wherein the mass concentration of the KOH solution is 35 g/L+/-5 g/L, and the temperature of the KOH solution is 70-80 ℃; the current density of the electrolytic alkaline washing is 20A/dm 2 -25A/dm 2 。
Optionally, the acid washing solution of the chemical acid washing adopts H 2 SO 4 Solution of H 2 SO 4 The mass concentration of the solution is 45 g/L+/-5 g/L, and H 2 SO 4 The temperature of the solution was 45 ℃ + -5 ℃.
Optionally, the electroplating solution adopts an MSA high-speed tinning system, the sulfate radical concentration of the MSA high-speed tinning system is 0.5g/L-5g/L, and the tin mud content of the MSA high-speed tinning system is less than 1g/L.
Optionally, the reflow is performed by pure inductance reflow, the temperature of the reflow is more than or equal to 280 ℃, the time t1 of the reflow is more than or equal to 0.5s, and the dead time t2 of the steel substrate after the reflow is more than or equal to 1.5s is less than or equal to 3s.
Optionally, the passivation solution concentration is 25 g/L+ -3g/L, the passivation temperature is 42+ -2deg.C, the passivation pH is 4.4+ -0.2, and the passivation current density is 0.4As/dm 2 -0.6As/dm 2 。
Optionally, the oil coating amount of the oil coating is 2mg/m 2 -10mg/m 2 。
Optionally, the rinsing adopts reverse rinsing, and the conductivity of the rinsing water at the last stage of the reverse rinsing is less than or equal to 1000 mu s/cm.
Based on the same inventive concept, the embodiment of the application also provides a high-tin-content tin plate for electronic products, which is prepared by the production method of the high-tin-content tin plate for electronic products according to claims 1 to 8.
Optionally, the tin layer weight of the tin plate is 8.4g/m 2 -11.2g/m 2 The tin alloy content of the tin plate is 1.5g/m 2 -2.0g/m 2 。
One or more technical solutions in the embodiments of the present application at least have the following technical effects or advantages:
the embodiment of the application provides a production method of a high-tin-content tin plate for electronic products, which comprises the following steps: carrying out alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflow, extruding, passivation, rinsing, drying and oiling on the steel substrate to obtain a high-tin-content tinning plate; wherein the surface roughness Sa of the steel substrate is 0.6-0.85 mu m, and the surface skewness Ssk of the steel substrate>0; by improving the surface roughness of the tin plate, the surface skewness Ssk of the tin plate is controlled>0, the alloy layer content of the tinning plate is more than or equal to 1.5g/m 2 The hardness of the tip end position of the tinplate is improved, the friction resistance of the high-tin iron is improved, and the problem of black ash friction generated by friction between strip steel and a roller system in the production process of the high-tin-content tinplate can be effectively reduced.
The foregoing description is only an overview of the present application, and is intended to be implemented in accordance with the teachings of the present application in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present application more readily apparent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method provided in an embodiment of the present application.
Detailed Description
The advantages and various effects of the present application will be more clearly apparent from the following detailed description and examples. It will be understood by those skilled in the art that these specific embodiments and examples are intended to illustrate the application, not to limit the application.
Throughout the specification, unless specifically indicated otherwise, the terms used herein should be understood as meaning as commonly used in the art. Accordingly, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. In case of conflict, the present specification will control.
Unless otherwise specifically indicated, the various raw materials, reagents, instruments, equipment and the like used in the present application are commercially available or may be prepared by existing methods.
The technical scheme of the embodiment of the application aims to solve the technical problems, and the overall thought is as follows:
according to an exemplary embodiment of the application, a method for producing a high tin amount tinning plate for electronic products is provided, which relates to a tinning production line production process flow, and comprises the steps of alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflow, squeezing, passivation, rinsing, drying and oiling. In order to solve the technical problem that floating ash defects are generated by mutual friction between the high tin amount tinplate and a roller system in the production process, the process parameters of each step are as follows:
(1) The surface roughness Sa of the cold-rolled electroplated tin plate substrate is between 0.6 and 0.85 mu m, and preferably the roughness of the substrate is controlled between 0.7 and 0.85 mu m; the surface skewness Ssk of the cold-rolled electroplated tin plate substrate is more than 0, and preferably Ssk is more than 0.3;
controlling the substrate surface roughness Sa to be between 0.6 and 0.85 mu m and the surface skewness Ssk>The reason of 0 is that the higher Sa is more beneficial to improving the friction resistance of the tinplate, the higher Ssk is, the sharper the peak shape of the base plate is, the more beneficial to improving the friction resistance of the tinplate, and the content of the alloy layer of the tinplate is controlled to be more than or equal to 1.5g/m 2 The hardness of the tip position of the tinning plate can be improved, and the friction resistance of the tinning plate can be further improved. When the surface roughness is excessively large, the appearance and the welding performance of the tinned plate are not good, and the roller efficiency is greatly reduced during rolling production.
(2) The alkaline washing solution adopts KOH solution with concentration of 35+/-5 g/L, temperature of 70-80 ℃ and electrolytic alkaline washing current density of 20-25A/dm 2 ；
(3) The acid washing is chemical acid washing, and a 45+/-5 g/L sulfuric acid aqueous solution is adopted, wherein the temperature is 45+/-5 ℃;
the plating solution adopts an MSA high-speed tinning system, the concentration of sulfate radical in the plating solution is controlled to be 0.5-5g/L, the tin mud content in the plating solution is controlled to be less than 1g/L, the concentration of sulfate radical is preferably controlled to be 1-3g/L, the tin mud content in the plating solution is controlled to be less than 0.5g/L, and the thickness of a tin layer on the surface of high-tin iron is 8.4-11.2g/m 2 ；
(4) The reflow mode adopts pure inductance reflow, the reflow temperature is more than or equal to 280 ℃, the reflow time t1 is more than or equal to 0.5s, the dead time of the strip steel after reflow is more than or equal to 1.5s and less than or equal to 3s, and the alloy tin content is more than or equal to 1.5g/m 2 Preferably the alloy tin content is not less than 1.6g/m 2 ；
The reflow temperature is controlled to be more than or equal to 280 ℃, the reflow time t1 is controlled to be more than or equal to 0.5s, the alloy layer of the tin plate is relatively compact within the range, and the alloy layer can be stably controlled to be more than or equal to 1.5g/m 2 Above, the alloy layer on the surface of the tinning plate with the too small value has poor compactness and thick alloy layerThe degree of the reaction cannot be stably controlled at 1.5g/m 2 The above.
The dead time of the strip steel after reflow is controlled to be more than or equal to 1.5s and less than or equal to 3s, which is beneficial to the stable growth of an alloy layer, and the oxidation degree of the surface of the tin plate with the overlarge time value is increased, which is not beneficial to the stable performance of the subsequent passivation process.
The thicker the alloy layer is, the better the friction resistance of the tinning plate is, and the gold-tin content is controlled to be more than or equal to 1.5g/m 2 Can effectively improve the friction resistance of the tinning plate.
(5) The tin plate passivation process is controlled according to the following conditions: the passivation concentration is controlled at 25+/-3 g/L, the passivation temperature is 42+/-2 ℃, the passivation pH is 4.4+/-0.2, and the passivation current density is 0.5As/dm 2 ；
(6) Controlling the oil coating quantity of the surface of the tinned plate to be 2-10mg/m 2 Between them, the preferable oil-coating quantity is controlled to be 3-6mg/m 2 ；
All rinsing in the production process is reverse rinsing, and the water conductivity of the rinsing water at the last stage is controlled below 1000 mu s/cm.
The high tin amount tin plate for electronic products and the production method thereof according to the present application will be described in detail with reference to examples, comparative examples and experimental data.
The surface floating ash of the tinned plate cannot be tested by adopting a conventional black ash testing method, and the following rules are specially formulated for judging the surface floating ash:
o: after the white paper is wiped, no wiping trace exists under natural light.
X: after the white paper is wiped, wiping traces are clearly visible under natural light.
In the following experiments, parameters except the table are selected differently, and the rest parameters in the experimental process are the same parameters and meet the range provided by the embodiment of the application.
Surface floating ash conditions corresponding to different surface morphologies:
it can be seen from the above table that the surface floating ash portion of the tin plate can be eliminated as the roughness of the substrate increases, and the surface floating ash of the tin plate can be completely eliminated when the surface roughness Sa of the tin plate is controlled to be between 0.6 and 0.85 μm and the skewness Ssk >0.
Different alloy tin amounts correspond to the ash floating condition
As can be seen from the above table, when the alloy tin content is more than or equal to 1.5g/m 2 And during the process, the floating ash on the surface of the tinning plate is effectively controlled.
One or more technical solutions in the embodiments of the present application at least have the following technical effects or advantages:
(1) The method of the embodiment of the application controls the surface skewness Ssk of the tin plate by improving the surface roughness of the tin plate>0, the alloy layer content of the tinning plate is more than or equal to 1.5g/m 2 The sharpness and hardness of the peak shape of the tinplate are improved, the friction resistance of the high-tin iron is improved, and the friction resistance of the high-tin iron can be effectively reduced by 8.4g/m 2 -11.2g/m 2 The problem of black dust generated by friction between strip steel and a roller system in the production process of the high-tin-content tinning plate;
(2) The method provided by the embodiment of the application is suitable for products with strict requirements on the black ash level of the surface of the tinning plate, the black ash level of the surface of the tinning plate obtained by adopting the control technology of the black ash level of the surface of the tinning plate provided by the method can reach the I-II level, the surface of the tinning plate has no floating ash defect, and the requirements of customers on the corrosion resistance and the attractiveness of the tinning plate products are met.
Finally, it is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (8)
1. A method for producing a high tin amount tin plate for electronic products, the method comprising: carrying out alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflow, extruding, passivation, rinsing, drying and oiling on the steel substrate to obtain a high-tin-content tinning plate; wherein the weight of the tin layer of the tin plate is 8.4g/m 2 -11.2g/m 2 The tin alloy content of the tin plate is 1.5g/m 2 -2.0g/m 2 The surface roughness Sa of the steel substrate is 0.6-0.85 mu m, and the surface skewness Ssk of the steel substrate>0, the reflow adopts pure inductance reflow, the temperature of the reflow is more than or equal to 280 ℃, the time t1 of the reflow is more than or equal to 0.5s, and the dead time t2 of the steel substrate after the reflow is more than or equal to 1.5s is less than or equal to 3s.
2. The method for producing a high tin amount tin plate for electronic products according to claim 1, wherein the alkali
The spray-washed alkaline washing solution comprises a KOH solution, wherein the mass concentration of the KOH solution is 35 g/L+/-5 g/L, and the temperature of the KOH solution is 70-80 ℃; the current density of the electrolytic alkaline washing is 20A/dm 2 -25A/dm 2 。
3. The method for producing a high tin content tin plate for electronic products as claimed in claim 1, whereinThe chemical pickling solution adopts H 2 SO 4 Solution of H 2 SO 4 The mass concentration of the solution is 45 g/L+/-5 g/L, and H 2 SO 4 The temperature of the solution was 45 ℃ + -5 ℃.
4. The method for producing a high tin amount tin plate for electronic products according to claim 1, wherein said electric parts
The plating solution is an MSA high-speed tinning system, the sulfate radical concentration of the MSA high-speed tinning system is 0.5g/L-5g/L, and the tin mud content of the MSA high-speed tinning system is less than 1g/L.
5. The method for producing a high tin content tin plate for electronic products according to claim 1, wherein the blunting
The concentration of the passivation solution is 25 g/L+/-3 g/L, the passivation temperature is 42+/-2 ℃, and the passivation pH value is 4.4
(+ -0.2) the current density of the passivation is 0.4As/dm 2 -0.6As/dm 2 。
6. The method for producing a high tin amount tin plate for electronic products according to claim 1, wherein the oil coating amount of the oil coating is 2mg/m 2 -10mg/m 2 。
7. The method for producing a high tin content tin plate for electronic products according to claim 1, wherein the rinsing adopts counter rinsing, and the conductivity of the rinsing water of the last stage of the counter rinsing is less than or equal to 1000 μs/cm.
8. A high tin amount tin plate for electronic products, characterized in that the tin plate is produced by the production method of the high tin amount tin plate for electronic products according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210398099.XA CN114775007B (en) | 2022-04-12 | 2022-04-12 | High-tin-content tinned plate for electronic product and production method thereof |
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| CN202210398099.XA CN114775007B (en) | 2022-04-12 | 2022-04-12 | High-tin-content tinned plate for electronic product and production method thereof |
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| CN114775007B true CN114775007B (en) | 2023-12-01 |
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