CN114769372A

CN114769372A - Substrate manufacturing and shaping method and substrate

Info

Publication number: CN114769372A
Application number: CN202210418324.1A
Authority: CN
Inventors: 闫光; 杨光; 张忠平; 李�真
Original assignee: Xiluojing Medical Technology Development Shanghai Co ltd
Current assignee: Xiluojing Medical Technology Development Shanghai Co ltd
Priority date: 2022-04-20
Filing date: 2022-04-20
Publication date: 2022-07-22

Abstract

The invention provides a substrate and a substrate manufacturing and shaping method, which relate to the technical field of metal material performance analysis and structure processing, and the substrate manufacturing and shaping method comprises the following steps: a manufacturing step of manufacturing a substrate for shaping; a bending step of isothermally bending the substrate to obtain a bending angle alpha, the bending radius R being modified in the following manner₀：

Wherein k is a correction coefficient, h is a distance between the highest point and the lowest point of the substrate in a state of being bent to the maximum degree, A is a distance between the left end and the right end of the substrate in a state of being bent to the maximum degree, and S is the thickness of the substrate; the invention utilizes the isothermal bending forming technology to carry out bending treatment on the sheet and carries out relative error calculation on different isothermal temperatures so as to achieve the purpose of fitting the measured curved surface, has good research prospect on isothermal forming for preparing the substrate, and has the advantages of good research prospectThe bend radius is corrected, so that the relative error of the shape of the shaped substrate can be reduced, and the effects of stable measurement and high sensitivity can be realized.

Description

Substrate manufacturing and shaping method and substrate

Technical Field

The invention belongs to the technical field of metal material performance analysis and structure processing, and particularly relates to a substrate manufacturing and shaping method and a substrate.

Background

Sensors face a number of technical challenges, one of which is the packaging problem. Because the physical characteristics of the substrate have certain difference and the pasting positions are different, the obtained strain after different packaging is inconsistent with the real strain value of the tested structure. In addition, different objects to be measured have different structures and surface characteristics, and therefore, the packaging of the fixture must be adjusted according to different actual conditions. For a structure to be measured with a curved surface, the use of common plastic and rubber substrates can cause deviation of measurement results, influence the measurement sensitivity and cannot meet the use requirements.

Disclosure of Invention

The invention aims to provide a substrate manufacturing and shaping method and a substrate, wherein the manufacturing method corrects a measured curved surface and reduces the relative error of the shape of the substrate, so that the manufactured substrate has the advantages of stable measurement and high sensitivity.

In order to achieve the purpose, the invention provides the following technical scheme: a substrate manufacturing and shaping method and a substrate are provided, wherein the manufacturing method comprises the following steps:

a manufacturing step of manufacturing a substrate for setting;

a bending step of isothermally bending the substrate to obtain a bending angle alpha, the bending radius R being modified in the following manner₀：

Wherein k is a correction coefficient, h is a distance between the highest point and the lowest point of the substrate in a state of being bent to the maximum, a is a distance between the left end and the right end of the substrate in a state of being bent to the maximum, and S is a thickness of the substrate.

The bending angle alpha can be directly measured by an angle meter, and the k value is calculated according to the alpha value, so that the corrected bending radius R is obtained₀。

Preferably, the bending step further comprises:

determining the relative angle error:

determining the bending radius error:

wherein alpha is the measured angle, alpha_aIs the angle of the concave die, R_aR is a radius of the die, and R is a radius of the substrate in a state where the substrate is rebounded to the maximum after being bent.

Preferably, the bending step further comprises:

and respectively testing the bending angle rebound of the substrate after bending under different angles, different bending temperatures and different pressure holding times relative to the rolling direction of the substrate by taking the size of a forming die adopted in the bending step as a reference and controlling variables so as to obtain the optimal bending condition.

Preferably, the substrate in the manufacturing step is made of a nickel titanium alloy, especially TiNi-0₂。

Preferably, the bending step further comprises: and placing the bent substrate into a mold, and keeping the pressure for not less than 3min under the action of the load.

Preferably, the bending step further comprises: the bending temperature is set to 25 ℃ and n ℃ in sequence, and n is an integral multiple of 100 ℃.

Preferably, the bending step further comprises: the substrate angle with respect to the rolling direction was set to 0 °, 45 °, 90 °.

The invention also provides a substrate, which is manufactured by the substrate manufacturing and shaping method.

Compared with the prior art, the invention has the beneficial effects that: the nickel-titanium alloy is adopted to replace the traditional plastic and rubber substrate, the deformation degree of the substrate is reduced when the curved surface structure is measured, the relative error of the shape of the substrate is favorably reduced, meanwhile, the isothermal bending forming technology is adopted to carry out bending treatment on the nickel-titanium alloy sheet, the nickel-titanium alloy structure with equiaxial crystal grains is obtained, the deformation degree of the substrate when the curved surface structure is measured is further reduced, the purpose of fitting the measured curved surface is easier to achieve, the bending radius is corrected, the relative error of the shape of the substrate after shaping is more favorably reduced, and the effects of stable measurement and high sensitivity are realized.

Drawings

FIG. 1 is a schematic view of a substrate in an unbent state: a. a top view; b. a left view;

FIG. 2 is a schematic illustration of an isometric view of a substrate in an unflexed state;

FIG. 3 is a schematic diagram of a process flow for making and shaping a substrate;

FIG. 4 is a schematic view of an apparatus for bending a substrate;

fig. 5 is a schematic view of a case where the substrate is bent.

Reference numerals:

1. a female die; 2. a male die; 3. die sleeve; 4. a guide block;

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, the technical solution provided by the present invention is: a substrate manufacturing and shaping method and a substrate.

In order to better apply the sensor to the monitoring of the curved surface structure, the invention provides the following method. Specifically, in the method, the substrate is made of nickel-titanium alloy, and the nickel-titanium alloy has low density and specific strengthHigh temperature, corrosion resistance, high and low temperature resistance, and the ability to recover its original shape at a certain temperature after plastic deformation, and is particularly suitable for the encapsulation of sensors applied on curved surfaces, so in this embodiment, it is a very ideal substrate material, especially, TiNi-0 is used₂As a base material, among them, TiNi-0₂The phase transition temperature of the catalyst is 45-90 degrees.

Specifically, in the manufacturing step, the substrate may be obtained as follows:

first, a bar stock of a size, for example, phi 54mm x 100mm is taken and first a flat end face is turned on a lathe, for example, a numerically controlled lathe. The outer circle of the bar is then finish turned to bring the gear of the bar to e.g. phi 50.8 mm. Then, a wire cut electrical discharge machine is used for precisely cutting a thin substrate with the thickness of 1mm by a slow wire.

Further, rough manual polishing was performed by sandpaper of #600 to #800 to #1000 in this order. Then, the diamond is ground by spraying a polishing agent with 10 μm, 9 μm, 7 μm, 5 μm and 3 μm diamond in sequence for semi-finish polishing, which is performed on a high-strength cast iron HT200-300 grinding platform. Then, a lubricating liquid of a mixed reinforcing agent (such as a silane coupling agent and an aluminate coupling agent), a dispersing agent (such as organic alcohol) and an adhesive (such as rosin and gelatin) is used for infiltrating the grinding wheel to achieve the surface roughness of 1.35 mu m, and the surface quality is further improved by adopting a grinding wheel polishing mode, and the operation is carried out on a portable wind tunnel grinding machine. Then mixed polishing is carried out by mixing a polishing cloth with a diamond spray polishing agent of 0.5 mu m, and the operation can be carried out on a P-1 metallographic sample polishing machine. And finally, performing high-precision polishing by adopting a magnetic field electrochemical composite polishing method, wherein the main components of the electrolyte comprise perchloric acid, n-butanol and absolute ethyl alcohol, and the magnetic field intensity is 0.2T. Thus, through the polishing process, the surface quality of the thin substrate is greatly improved, and the manufactured substrate is particularly favorable for being applied to curved surfaces.

After the polishing process, an ultrasonic cleaning machine is used for cleaning the precisely polished plate, namely acetone, isopropyl alcohol and absolute ethyl alcohol are adopted for ultrasonic cleaning. And after grinding and polishing, cutting the blank by using a linear cutting machine. The reference dimensions may be 60mm by 14mm with a thickness of 1 mm.

On the basis, as shown in fig. 1a, 1b and 2, on the basis of the blank obtained after the cutting, a structure suitable for packaging can be further processed on the blank. In an embodiment, a groove portion extending along a length direction of the blank and two hole portions communicating with the groove portion are formed at one side portion of the blank, wherein the size of the hole portion may be Φ 3 mm. The substrate in this example was thus obtained.

Specifically, the bending step, i.e., the bending operation of the substrate, will be described continuously below. Wherein the bending operation is performed on a bending device provided, which may be, for example, a punching device, as shown in fig. 4, comprising a female die 1, a male die 2, a die sleeve 3 connected to the female die 1, and a guide block 4 connected to the male die 2.

In the bending step, specifically, the following steps are included.

Step 1) arranging a bending device under the isothermal bending condition, namely arranging a female die 1 in a die sleeve 3 under the isothermal condition, laying a plate on the female die 1, and pressing the male die 2 in alignment with the working surface of the female die 1.

Step 2) bending tests were performed at various temperatures to determine the optimum bending conditions. Specifically, the size of a bending forming die is taken as a reference, and the bending angle rebound value after the workpiece is bent at different angles, different bending temperatures and different pressure holding times relative to the plate in the rolling direction is tested in a control variable mode. In this way the aforementioned optimum bending conditions are obtained.

Specifically, the TiNi-02 plate, namely the substrate, can be sequentially bent at 25 ℃ and n ℃, wherein n is integral multiple of 100 ℃, 25 ℃ is used as room temperature, and the span with the rest temperature, such as 100 ℃/200 ℃/./1000 ℃, is larger, so that the influence of the bending temperature on the substrate shaping condition can be more favorably highlighted, and the optimal bending temperature can be more favorably obtained. The substrate is cut at different angles with respect to the rolling direction, which may be 0 °, 45 °, 90 °.

Specifically, after bending, the bent substrate is placed in a mold, and the pressure is maintained for 1min, 2min and 3min under the action of load.

And 3) collecting a flatness test value of the plate before bending and an angle value of the workpiece after bending. As shown in FIG. 5a and FIG. 5b, the bending angle α after bending is calculated and the bending radius R is corrected by using the angle measuring instrument and the optimum calculation method₀。

Wherein the bending angle

Wherein k is an introduced correction coefficient:

after the correction calculation formula is introduced, the bending angle alpha is obtained_aThe value is obtained.

The bending angle alpha can be directly measured by an angle meter, and the k value is calculated according to the alpha value, so that the corrected bending radius R is obtained₀So as to determine the optimal reaction conditions for manufacturing the substrate.

The correction factor added is a bending-related curvature calculation, and the correction factor is added to the bending angle calculation to further refine the bending angle with respect to the measured angle.

The invention mainly aims to not research the size of fine grains, the specific temperature of isothermal forming can be obtained in a data table in the content of a specification, and the higher the adopted temperature is, the lower the relative error of the obtained substrate is under the same angle of rolling direction.

Specifically, the relative angle error is determined from the measured and calculated bend angles:

sample bend radius error:

in the above formula, S is a groupThickness of the base, α_aIs the angle of the concave die, R_aThe radius of the die is h, the distance between the highest point and the lowest point of the substrate in the state of being bent to the maximum, A is the distance between the left end and the right end of the substrate in the state of being bent to the maximum, and R is the radius of the substrate in the state of being rebounded to the maximum after being bent. Referring still specifically to fig. 5a and 5b, a single bend may be achieved, and fig. 5a and 5b are only schematic illustrations of a bend, not meant to be exclusive, and specifically, only an example of a bend angle is shown, and at this angle, the angle measured by the angle gauge is corrected, the relative error value is calculated, the data in the table below is obtained, and the optimum reaction conditions are determined for producing the nitinol substrate with the lowest relative error, otherwise the forming angle of α is changed.

According to the experimental results, the relative errors of the angles were measured while maintaining the pressure for 3min at 0 °, 45 °, and 90 ° with respect to the rolling direction of the substrate, respectively, at 25 ℃, 500 ℃, 600 ℃, and 700 ℃ in the present example, as follows:

as can be seen from the above table, the relative angle error of the bending radius gradually decreases at a bending temperature of 25 ℃ to 800 ℃, so that the relative bending angle error of the substrate manufactured by the isothermal molding technique is continuously reduced as the molding temperature increases.

In the bending step, repeated comparison tests can be carried out according to the conditions set in the step 2), the relative error of the shape of the part after isothermal bending is obtained, the pressure maintaining time after forming is also an important influence factor except for the great influence of the temperature, the pressure maintaining time is 1min, 2min and 3min under the same load, the rolling direction angle is 45 degrees, the bending temperature is 800 ℃, and the relative error value shown in the following table is obtained:

dwell time (min)	Relative error value (%)
		1	2.6
2	2.5
		3	2.4

Therefore, it is known that, in the nickel-titanium alloy plate, the relative error value is relatively reduced along with the increase of the dwell time, so that the bending effect of the substrate can be ensured and the relative error of the part shape can be reduced when the bending temperature of the substrate is 0 DEG relative to the rolling direction and the dwell time can be more than or equal to 3min at 1000 ℃.

It should be noted that, in this embodiment, the substrate bending process of the sensor is only to test the performance of the bending setting, and does not use a specific curved surface structure as the setting standard, in other words, fig. 5a and 5b only schematically show a bending condition, and do not mean that it is the only condition.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method of shaping a substrate, the method comprising:

a manufacturing step of manufacturing a substrate for shaping;

Where k is a correction coefficient, h is a distance between the highest point and the lowest point of the substrate in the state where the substrate is bent to the maximum, a is a distance between the left and right ends of the substrate in the state where the substrate is bent to the maximum, and S is a thickness of the substrate.

2. A method of forming a substrate in accordance with claim 1, wherein: the bending step bends the substrate by means of stamping, and the bending step further comprises:

determining the relative angle error:

determining the bending radius error:

3. A method for forming a substrate according to claim 1, wherein: the bending step further comprises:

4. A method for forming a substrate according to claim 1, wherein: the substrate in the manufacturing step is made of nickel-titanium alloy, especially TiNi-0₂。

5. A method of forming a substrate in accordance with claim 2, wherein: the bending step further comprises: and placing the bent substrate into a mold, and keeping the pressure for not less than 3min under the action of the load.

6. A method of forming a substrate according to claim 3, wherein: the bending step further comprises: the bending temperature is set to 25 ℃ and n ℃ in sequence, and n is an integral multiple of 100 ℃.

7. A method of forming a substrate according to claim 3, wherein: the bending step further comprises: the substrate angle with respect to the rolling direction was set to 0 °, 45 °, 90 °.

8. A substrate produced by the method of claims 1 to 7.