CN114760813A - Heat dissipation method of electronic integrated module - Google Patents
Heat dissipation method of electronic integrated module Download PDFInfo
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- CN114760813A CN114760813A CN202210338550.9A CN202210338550A CN114760813A CN 114760813 A CN114760813 A CN 114760813A CN 202210338550 A CN202210338550 A CN 202210338550A CN 114760813 A CN114760813 A CN 114760813A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000002826 coolant Substances 0.000 claims abstract description 39
- 230000005855 radiation Effects 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 9
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 8
- 239000000498 cooling water Substances 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 239000011737 fluorine Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 4
- 230000010354 integration Effects 0.000 abstract description 16
- 230000000694 effects Effects 0.000 description 18
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000191 radiation effect Effects 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20354—Refrigerating circuit comprising a compressor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation method of an electronic integrated module, which comprises the following steps: a: the electronic integrated module is installed on the vertical radiator by respectively connecting the transverse auxiliary radiator and the vertical radiator through a transverse circulating heat exchange assembly with a cooling medium arranged inside; b: controlling the cooling medium to circularly flow, continuously radiating heat generated by the electronic integrated module in a vertical radiating manner through the vertical radiator, and continuously performing heat exchange with the circularly flowing cooling medium through the heat generated by the electronic integrated module; the cooling medium after absorbing heat circularly flows to the transverse auxiliary radiator, and the heat is transversely conducted to the transverse auxiliary radiator for radiating; and repeating the steps until the heat dissipation of the electronic integrated module is completed. The method adopts a mode of combining transverse conduction heat dissipation and vertical conduction heat dissipation to dissipate heat of the electronic integrated module, and solves the technical problems that the heat dissipation performance is poor and the deep integration of intelligent equipment is not facilitated in the prior art.
Description
Technical Field
The invention belongs to the technical field of electronic heat dissipation, and particularly relates to a heat dissipation method of an electronic integrated module.
Background
At present, all industries are moving towards intellectualization. With the rapid development of science and technology, the types of intelligent equipment are more and more. However, no matter which intelligent device is used, electronic components with a core control function cannot be separated. For the current intelligent devices, various electronic components are generally required to be integrated into an integrated electronic integration module, and the integration level of the electronic integration module determines the structure and volume of the intelligent device to a great extent. For example, the higher the integration level of the electronic integration module, the more precise the structure of the intelligent device is, the smaller the volume of the intelligent device is, and accordingly, the stronger the performance of the intelligent device is, and the more market can be occupied. Therefore, the current intelligent devices are developed towards integration, miniaturization and more intelligence.
At the present stage, along with the progress of the technology, the integration level of the electronic integrated module is higher and higher, and the intelligent effect is better and better. Accordingly, in order to ensure the normal operation of the electronic integrated module, a better heat dissipation method needs to be adopted to dissipate heat of the electronic integrated module. At present, most of electronic integrated modules are cooled by common radiators with fins, namely, the electronic integrated module 7 is installed on the common radiators, and when the electronic integrated module is in work, heat of the electronic integrated module 7 is firstly conducted to the common radiators, and then the fins of the common radiators are used for dissipating the heat. However, the heat conduction principle of this heat dissipation method is to transfer heat from the electronic integrated module 7 to the ordinary heat sink, i.e. to transfer heat vertically, and the heat transfer area is small, and the heat transfer area is generally within 45 ° of the contact area between the electronic integrated module 7 and the ordinary heat sink, as shown in fig. 4, so that the heat dissipation efficiency is low, and the increasingly high heat dissipation requirements in the electronic field cannot be met.
In addition, the document with publication number CN103021877A discloses a high-density chip heat dissipation method using dual-path heat transfer, which includes the following steps: firstly, welding a chip on a printed board; then, installing radiators on the surface of the chip and the bottom surface of the printed board; and finally, heat-conducting insulating media are filled between the chip and the radiator and between the printed board and the radiator. The method can improve the heat dissipation capability of the chip by establishing two parallel heat transfer paths to shunt heat on the heat transfer paths of the chip. However, because the size of the heat sink is large and the size of the chip is small, the two heat sinks related to the method are respectively arranged on the two sides of the chip, which is equivalent to clamping the chip between the two heat sinks, so that a large space must be reserved to mount the chip, and the miniaturization of the product is not facilitated. Furthermore, although the heat radiators are respectively arranged on the two sides of the chip in the method, the heat radiation mode is still vertical heat radiation, so that the heat radiation efficiency is still low, and the heat radiation effect is still poor.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides a heat dissipation method of an electronic integrated module, which adopts a mode of combining transverse conduction heat dissipation and vertical conduction heat dissipation to dissipate heat of the electronic integrated module, can effectively improve the heat dissipation efficiency and the heat dissipation effect on the premise of reducing the volume of a vertical heat dissipation structure, and solves the technical problems that the heat dissipation performance of the electronic integrated module is poor and the deep integration and the miniaturization of intelligent equipment are not facilitated in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a heat dissipation method of an electronic integrated module is characterized by comprising the following steps:
step A: arranging a vertical radiator and a transverse auxiliary radiator, installing an electronic integrated module on the vertical radiator, and respectively connecting the transverse auxiliary radiator and the vertical radiator by using a transverse circulating heat exchange assembly internally provided with a cooling medium;
and B: starting the transverse circulating heat exchange assembly, controlling a cooling medium to circularly flow between the vertical radiator and the transverse auxiliary radiator, continuously radiating heat generated by the electronic integration module in a vertical heat radiation mode through the vertical radiator, and continuously performing heat exchange with the circularly flowing cooling medium by the heat generated by the electronic integration module; the cooling medium after absorbing heat circularly flows to the transverse auxiliary radiator, and the heat is transversely conducted to the transverse auxiliary radiator for radiating; and repeating the steps until the heat dissipation of the electronic integrated module is completed.
In the step A, the volume of the transverse auxiliary radiator is larger than that of the vertical radiator.
In the step B, the cooling medium is cooling fluorine or cooling water, and when the cooling medium is the cooling fluorine, the flow speed is 0.4-0.6 m/s; when the cooling medium is cooling water, the flow velocity is 4-6 m/s.
In the step B, the heat dissipation rate of the electronic integrated module after heat dissipation is finished is improved by 20-30%.
The transverse circulating heat exchange assembly comprises a circulating heat exchange pipe and a supercharger, the circulating heat exchange pipe is respectively connected with the vertical radiator and the transverse auxiliary radiator, a cooling medium is arranged in the circulating heat exchange pipe, and the supercharger is arranged in the middle of the circulating heat exchange pipe and used for controlling the cooling medium to circularly flow between the vertical radiator and the transverse auxiliary radiator.
And the pipe section of the circulating heat exchange pipe between the vertical radiator and the transverse auxiliary radiator is of a linear structure or a bent structure.
The pipe section of the circulating heat exchange pipe positioned in the vertical radiator and the pipe section of the circulating heat exchange pipe positioned in the transverse auxiliary radiator are both in a snake-shaped structure.
The booster is a booster valve or a booster pump.
The electronic integrated module is characterized in that the transverse auxiliary radiator is provided with radiating fins perpendicular to the circulating heat exchange tube, the vertical radiator is provided with an installation surface and radiating fins perpendicular to the circulating heat exchange tube, and the electronic integrated module is fixed on the installation surface.
By adopting the technical scheme, the invention has the beneficial technical effects that:
1. the electronic integrated module is provided with the vertical radiator, the transverse auxiliary radiator and the transverse circulating heat exchange assembly capable of controlling a cooling medium to circularly flow between the transverse auxiliary radiator and the vertical radiator, based on the arrangement structure, the electronic integrated module can be radiated from two aspects during actual radiation, and on one hand, part of heat generated by the electronic integrated module is continuously radiated in a vertical radiation mode through the vertical radiator; on the other hand, part of the heat generated by the heat exchanger continuously exchanges heat with the cooling medium which flows circularly, and then is transversely conducted to the transverse auxiliary radiator for heat dissipation, namely, the heat dissipation area is increased through the transverse auxiliary radiator, so that the heat dissipation speed can be increased, and the heat dissipation effect can be improved.
In addition, because the vertical radiator of installing the electronic integration module links to each other with horizontal auxiliary heat radiator through horizontal circulation heat exchange assemblies, consequently the volume of vertical radiator can reduce to with electronic integration module volume looks adaptation, therefore can reduce the volume of intelligent equipment under the prerequisite of guaranteeing its effective radiating effect, more be favorable to the degree of depth of intelligent equipment to integrate and the miniaturization.
In summary, the invention adopts a mode of combining horizontal conduction heat dissipation and vertical conduction heat dissipation to dissipate heat of the electronic integrated module, thereby not only reducing the volume of the vertical radiator, but also effectively improving the heat dissipation efficiency and the heat dissipation effect, and solving the technical problems that the electronic integrated module in the prior art has poor heat dissipation performance and is not beneficial to the deep integration and miniaturization of intelligent equipment.
2. The volume of the transverse auxiliary radiator is larger than that of the vertical radiator, and the mounting position of the transverse auxiliary radiator is not limited, so that the transverse auxiliary radiator is beneficial to accelerating the heat dissipation speed of a product and improving the heat dissipation effect on one hand, and is more convenient for the miniaturization design of the product on the other hand.
3. In the step B of the invention, cooling fluorine or cooling water with different flow rates can be respectively adopted as cooling media to conduct heat, so that different application scenes can be met, and a better heat exchange effect is achieved.
4. In the step B, the heat dissipation rate of the electronic integrated module after the heat dissipation is finished is improved by 20-30%, and compared with the prior art, the heat dissipation effect of the electronic integrated module is effectively reduced.
5. The invention adopts the circulating heat exchange tube and the supercharger as the transverse circulating heat exchange assembly, not only has the advantages of heat absorption effect, stable transverse heat transfer and the like, but also has the advantages of simple structure, convenient operation, low cost and the like.
6. The pipe section between the vertical radiator and the transverse auxiliary radiator on the circulating heat exchange pipe can be in a linear structure or a bent structure, so that the mounting positions of the transverse auxiliary radiator and the vertical radiator in a product are not limited, the transverse auxiliary radiator and the transverse auxiliary radiator can be mounted at reasonable positions according to actual combination inside the product, and the product volume is further reduced.
7. According to the invention, the pipe sections positioned in the vertical radiator and the transverse auxiliary radiator on the circulating heat exchange pipe are both arranged in the serpentine structure, so that the heat exchange effect is greatly improved, and the heat dissipation capability is further improved.
8. The invention adopts the booster valve or the booster pump as the booster piece, and can ensure that the cooling medium can stably and circularly flow so as to ensure better heat dissipation performance.
9. The transverse auxiliary radiator and the vertical radiator are respectively provided with the radiating fins, and the radiating fins are respectively vertical to the circulating heat exchange tube.
Drawings
FIG. 1 is a schematic view of a connection structure according to the present invention;
FIG. 2 is a schematic sectional view of the upper section of the circulating heat exchange tube in a linear structure;
FIG. 3 is a schematic sectional view of the upper pipe section of the circulating heat exchange pipe in a bent structure;
fig. 4 is a schematic diagram of a heat dissipation structure of a conventional electronic integrated module.
Labeled in the figure as: 1. the heat exchanger comprises a circulating heat exchange tube, 2, a pressurizing piece, 3, a transverse auxiliary radiator, 4, a vertical radiator, 5, a mounting surface, 6, radiating fins, 7 and an electronic integrated module.
Detailed Description
Example 1
The embodiment discloses a heat dissipation method of an electronic integrated module, which mainly utilizes a mode of combining horizontal conduction heat dissipation and vertical conduction heat dissipation to dissipate heat of the electronic integrated module 7, and can effectively improve the heat dissipation efficiency and the heat dissipation effect on the premise of reducing the volume of a vertical heat dissipation structure. It should be noted that the lateral heat dissipation refers to the heat dissipation by using a cooling medium that circulates and flows to laterally exchange part of the heat to another heat dissipation area, so as to achieve the purpose of increasing the heat exchange rate and increasing the heat transfer efficiency.
Specifically, the heat dissipation method comprises the following steps:
step A: the vertical radiator 4 and the transverse auxiliary radiator 3 are arranged firstly, and the size of the transverse auxiliary radiator 3 is preferably larger than that of the vertical radiator 4, so that the better radiating effect is ensured. In addition, the number of the vertical heat radiators 4 and the number of the horizontal auxiliary heat radiators 3 are preferably one, but a plurality of horizontal auxiliary heat radiators 3 may be provided according to actual needs to further improve the heat radiation effect. And then the electronic integrated module 7 is installed on the vertical radiator 4, and is respectively connected with the transverse auxiliary radiator 3 and the vertical radiator 4 by using a transverse circulating heat exchange assembly with a cooling medium arranged inside.
Preferably, the transverse circulating heat exchange assembly comprises a circulating heat exchange tube 1 and a supercharger, the circulating heat exchange tube 1 is respectively connected with the vertical radiator 4 and the transverse auxiliary radiator 3, and two ends of the specific circulating heat exchange tube 1 can be respectively hidden and fixed in the vertical radiator 4 and the transverse auxiliary radiator 3 in an embedding and fixing mode so as to improve the heat exchange effect of the cooling medium. The cooling medium can be cooling fluorine or cooling water, and is arranged in the circulating heat exchange tube 1 and used for exchanging heat with the transverse auxiliary radiator 3 and the vertical radiator 4 respectively. The booster is a booster valve or a booster pump, is mainly arranged in the middle of the circulating heat exchange tube 1 and is used for controlling a cooling medium to circularly flow between the vertical radiator 4 and the transverse auxiliary radiator 3.
Preferably, as shown in fig. 2 and 3, the pipe section of the circulating heat exchange pipe 1 between the vertical radiator 4 and the transverse auxiliary radiator 3 is in a linear structure or a bent structure. When the pipe section between the vertical radiator 4 and the horizontal auxiliary radiator 3 is a straight structure, the horizontal auxiliary radiator 3 and the vertical radiator 4 are suitable for being installed on the same plane, and when the pipe section between the vertical radiator 4 and the horizontal auxiliary radiator 3 is a bent structure, the horizontal auxiliary radiator 3 and the vertical radiator 4 are suitable for being installed in a bent mode or in a vertical mode with an angle.
In addition, in order to improve the heat exchange effect between the cooling medium and the heat, preferably, the pipe section of the circulating heat exchange pipe 1 located in the vertical radiator 4 and the pipe section of the circulating heat exchange pipe 1 located in the transverse auxiliary radiator 3 are both in a serpentine structure, that is, the pipe section of the circulating heat exchange pipe 1 located in the vertical radiator 4 is hidden and fixed in the vertical radiator 4 in a serpentine arrangement structure, and the pipe section of the circulating heat exchange pipe 1 located in the transverse auxiliary radiator 3 is hidden and fixed in the transverse auxiliary radiator 3 in a serpentine arrangement structure.
Preferably, the present embodiment further defines the structure of the heat sink. Specifically, the transverse auxiliary heat radiator 3 can be a regular square structure, one surface of the transverse auxiliary heat radiator 3 can be a plane, a heat radiation fin 6 without limiting the structure is arranged on the other parallel surface, and the heat radiation fin 6 is preferably perpendicular to the circulating heat exchange tube 1. The vertical radiator 4 can also be in a regular square structure, one surface of the vertical radiator 4 is provided with a mounting surface 5, the electronic integrated module 7 is fixed on the mounting surface 5, the other parallel surface is also provided with a radiating fin 6 without limiting the structure, and the radiating fin 6 is preferably vertical to the circulating heat exchange tube 1. In practical applications, in order to improve the heat dissipation effect, the transverse auxiliary heat sink 3 may be configured as a housing structure as shown in fig. 3.
And B: when the electronic integrated module 7 continuously generates heat, the transverse circulating heat exchange assembly is started, the cooling medium is controlled to circularly flow between the vertical radiator 4 and the transverse auxiliary radiator 3, part of the heat generated by the electronic integrated module 7 is continuously radiated in a vertical heat radiation mode through the vertical radiator 4, and meanwhile, part of the heat generated by the electronic integrated module 7 is also continuously subjected to heat exchange with the circularly flowing cooling medium; the cooling medium after absorbing heat circularly flows to the transverse auxiliary radiator 3, and the heat is transversely conducted to the transverse auxiliary radiator 3 for heat dissipation; and the cooling medium circularly flows to the vertical radiator 4 after radiating heat through the transverse auxiliary radiator 3 and exchanges heat with the heat generated by the electronic integrated module 7 again, and the process is repeated until the heat radiation of the electronic integrated module 7 is finished. After the heat dissipation is finally completed, the heat dissipation rate of the electronic integrated module 7 after the heat dissipation is completed is improved by 20-30%.
In the step, the pipe diameter of the circulating heat exchange pipe 1 is phi 2-phi 20mm, and when the cooling medium is cooling fluorine, the flowing speed is 0.4-0.6 m/s; when the cooling medium is cooling water, the flow speed is 4-6 m/s. But in order to ensure the best transverse conduction heat dissipation effect, the pipe diameter of the circulating heat exchange pipe 1 is preferably phi 10mm, and when the cooling medium is cooling fluorine, the flowing speed is preferably 0.5 m/s; when the cooling medium is cooling water, it is preferable that the flow velocity thereof is 5 m/s.
Example 2
This example verifies the method described in example 1 as follows:
in this embodiment, taking a 50A IPM product as an example, when the ordinary heat sink is powered on 50A in the background art, the temperature of the electronic integration module 7 is measured to be 120 ℃, and after the heat dissipation is performed by adding the method of the present invention, the temperature of the electronic integration module 7 is measured to be about 96 ℃, the temperature is reduced by 24 ℃, and the reduction amplitude is about 20%.
Compared with the 18 ℃ temperature drop in the patent documents cited in the background art, the temperature drop of the invention is larger. In addition, the volume of the vertical radiator 4 can be reduced to be matched with the volume of the electronic integrated module 7, so that the volume of intelligent equipment can be effectively reduced, and the effect of the intelligent equipment is better.
While the invention has been described with reference to specific embodiments, any feature disclosed in this specification may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise; all of the disclosed features, or all of the method or process steps, may be combined in any combination, except mutually exclusive features and/or steps.
Claims (9)
1. A heat dissipation method of an electronic integrated module is characterized by comprising the following steps:
Step A: arranging a vertical radiator (4) and a transverse auxiliary radiator (3), installing an electronic integrated module (7) on the vertical radiator (4), and respectively connecting the transverse auxiliary radiator (3) and the vertical radiator (4) by using a transverse circulating heat exchange assembly internally provided with a cooling medium;
and B, step B: starting a transverse circulating heat exchange assembly, controlling a cooling medium to circularly flow between a vertical radiator (4) and a transverse auxiliary radiator (3), continuously radiating heat generated by an electronic integrated module (7) in a vertical heat radiation mode through the vertical radiator (4), and continuously performing heat exchange with the circularly flowing cooling medium by the heat generated by the electronic integrated module (7); the cooling medium after absorbing heat circularly flows to the transverse auxiliary radiator (3), and the heat is transversely conducted to the transverse auxiliary radiator (3) for radiating; repeating the steps until the heat dissipation of the electronic integrated module (7) is completed.
2. The heat dissipation method of an electronic integrated module according to claim 1, wherein: in the step A, the volume of the transverse auxiliary radiator (3) is larger than that of the vertical radiator (4).
3. The heat dissipation method of an electronic integrated module according to claim 1, wherein: in the step B, the cooling medium is cooling fluorine or cooling water, and when the cooling medium is the cooling fluorine, the flow speed is 0.4-0.6 m/s; when the cooling medium is cooling water, the flow velocity is 4-6 m/s.
4. The heat dissipation method of an electronic integrated module according to claim 1, wherein: in the step B, the lifting range of the heat dissipation rate of the electronic integrated module (7) after heat dissipation is finished is 20% -30%.
5. The method for dissipating heat of an electronic integrated module according to any one of claims 1 to 4, wherein: the transverse circulating heat exchange assembly comprises a circulating heat exchange pipe (1) and a supercharger, the circulating heat exchange pipe (1) is respectively connected with a vertical radiator (4) and a transverse auxiliary radiator (3), a cooling medium is arranged in the circulating heat exchange pipe (1), and the supercharger is arranged in the middle of the circulating heat exchange pipe (1) and used for controlling the cooling medium to circularly flow between the vertical radiator (4) and the transverse auxiliary radiator (3).
6. The method for dissipating heat of an electronic integrated module according to claim 5, wherein: the pipe section between the vertical radiator (4) and the transverse auxiliary radiator (3) on the circulating heat exchange pipe (1) is of a linear structure or a bent structure.
7. The method for dissipating heat of an electronic integrated module according to claim 5, wherein: the pipe section of the circulating heat exchange pipe (1) positioned in the vertical radiator (4) and the pipe section of the circulating heat exchange pipe positioned in the transverse auxiliary radiator (3) are both in a snake-shaped structure.
8. The method for dissipating heat of an electronic integrated module according to claim 5, wherein: the booster is a booster valve or a booster pump.
9. The method for dissipating heat of an electronic integrated module according to claim 5, wherein: the heat exchanger is characterized in that the transverse auxiliary radiator (3) is provided with heat radiating fins (6) vertical to the circulating heat exchange tube (1), the vertical radiator (4) is provided with an installation surface (5) and heat radiating fins (6) vertical to the circulating heat exchange tube (1), and the electronic integrated module (7) is fixed on the installation surface (5).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210338550.9A CN114760813A (en) | 2022-04-01 | 2022-04-01 | Heat dissipation method of electronic integrated module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210338550.9A CN114760813A (en) | 2022-04-01 | 2022-04-01 | Heat dissipation method of electronic integrated module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117835466A (en) * | 2024-03-05 | 2024-04-05 | 西安天隆科技有限公司 | Thermoelectric circulation heating device with auxiliary heat and PCR equipment |
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| CN114003111A (en) * | 2021-10-26 | 2022-02-01 | 紫光股份有限公司 | Heat dissipation equipment for computer chip |
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2022
- 2022-04-01 CN CN202210338550.9A patent/CN114760813A/en active Pending
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| CN117835466A (en) * | 2024-03-05 | 2024-04-05 | 西安天隆科技有限公司 | Thermoelectric circulation heating device with auxiliary heat and PCR equipment |
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Application publication date: 20220715 |