CN114758971A - Semi-automatic packaging system and packaging method thereof - Google Patents
Semi-automatic packaging system and packaging method thereof Download PDFInfo
- Publication number
- CN114758971A CN114758971A CN202210526878.3A CN202210526878A CN114758971A CN 114758971 A CN114758971 A CN 114758971A CN 202210526878 A CN202210526878 A CN 202210526878A CN 114758971 A CN114758971 A CN 114758971A
- Authority
- CN
- China
- Prior art keywords
- punching
- die
- automatic
- semi
- frame product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention provides a semi-automatic packaging system and a packaging method thereof, wherein the semi-automatic packaging system comprises: the plastic packaging device, the automatic punching device and the semi-automatic punching device; the plastic packaging device at least comprises two plastic packaging presses, one plastic packaging press is used for automatically packaging the frame product A in a plastic mode, and the other plastic packaging press is used for manually packaging the frame product B in a plastic mode; the automatic punching device is used for automatically punching waste rubber of the frame product A; the semi-automatic punching device is used for manually punching waste rubber of the frame product B. According to the invention, a semi-automatic punching device is added on the basis of an automatic packaging system in the prior art, so that in the stages of production, research, development, debugging and small-batch testing, products in various packaging forms can be subjected to plastic packaging by using one plastic packaging device, and simultaneously, the punching of waste glue of the products is finished efficiently and in high quality, so that the products are packaged; meanwhile, the semi-automatic punching device is low in cost, and the semi-automatic packaging system does not need to increase excessive cost and time investment, so that the popularization and application of the invention are facilitated.
Description
Technical Field
The invention relates to the field of integrated circuit packaging, in particular to a semi-automatic packaging system and a packaging method thereof.
Background
Integrated circuit packaging is advancing with the development of integrated circuits. With the continuous development of various industries such as aerospace, aviation, machinery, light industry, chemical industry and the like, the integrated circuit is required to have higher and higher integration level and more complex functions. The integrated circuit package not only plays a role in electrically connecting the bonding point in the integrated circuit chip with the outside, but also provides a stable and reliable working environment for the integrated circuit chip, and plays a role in mechanical or environmental protection for the integrated circuit chip, so that the integrated circuit chip can play a normal function and is ensured to have high stability and reliability.
Most of the existing packaging systems are automatic packaging systems, and workers place products arranged on a frame on a feeding part and then start a control system to automatically operate; the frame product is transferred to a material loading platform by a feeding part, meanwhile, resin is transferred to a preparation position by a resin loading part, the frame product and the resin are respectively grabbed by a robot gripper, then transferred to a plastic package press, the frame product is placed at a mould, the resin is placed in an injection molding barrel, the robot gripper is withdrawn from the plastic package press, the plastic package press is used for carrying out mould assembly, the frame product is subjected to plastic package, after the frame product is completely molded in the plastic package press, the robot gripper takes the frame product out of the plastic package press and transfers the frame product to a punching device, the frame product is placed on a punching lower mould of the punching device, the punching lower mould moves to a position corresponding to a punching upper mould through a straight rail, the punching upper mould is pressed down by a cylinder, a cutter hidden in the punching upper mould is ejected out, the waste glue part on the frame product is separated from a main body part of the frame product by matching with the punching lower mould, and the waste glue below the punching upper mould is thrown into a waste glue box below the punching upper mould, and then punching an upper die to carry the frame products to a product receiving part, taking down the frame products by a robot gripper of the receiving part, putting the frame products into a receiving box, and finishing a cycle. However, the automatic packaging system can only package one product on line, the packaging form of the automatic packaging system is consistent with that of the product produced automatically, and other products packaged manually cannot be punched automatically.
In view of the above, there is a need to provide a semi-automatic packaging system and a packaging method thereof, so as to meet the requirements that in the stages of production, research, development, and debugging and small-batch testing, a plastic packaging device is commonly used for plastic packaging of products in multiple packaging forms, and punching of waste glue of the products is completed without excessive cost and time investment.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a semi-automatic packaging system and a packaging method thereof, which are used to solve the problems in the prior art that excessive cost and time investment are not required in the stages of production, research, development, and small-batch testing, products in multiple packaging forms are packaged by using a common plastic packaging device, and waste adhesive punching of frame products is completed.
To achieve the above and other related objects, the present invention provides a semi-automatic packaging system, comprising:
a plastic packaging device, an automatic punching device and a semi-automatic punching device 10;
the plastic packaging device at least comprises two plastic packaging presses, one plastic packaging press is used for carrying out automatic plastic packaging on the frame product A, and the other plastic packaging press is used for carrying out manual plastic packaging on the frame product B;
the automatic punching device is used for automatically punching waste glue of the frame product A after plastic packaging;
and the semi-automatic punching device is used for manually punching the waste rubber of the frame product B after plastic package.
Optionally, the semi-automatic die cutting device comprises:
the punching device comprises a punching base, a punching die, a punching cylinder, a cylinder bracket and an air source switch;
the punching die is arranged on the punching base and is used for punching the waste glue of the frame product B;
the cylinder support is arranged above the punching base and used for fixedly supporting the punching cylinder, and the punching cylinder is positioned above the punching die and used for driving the punching die to perform punching operation on waste glue of the frame product B;
the air source switch is arranged on the side edge of the punching cylinder and used for controlling the operation of the punching cylinder.
Optionally, the punching die comprises a punching upper die and a punching upper die, the punching upper die and the punching lower die are arranged on the punching base up and down relatively, the punching upper die reciprocates up and down, and the punching of the waste rubber of the frame product B is realized.
Optionally, a plurality of cutters for punching the waste rubber of the frame product B are arranged on the lower surface of the punching upper die; and the upper surface of the punching lower die is provided with a punching hole which is right opposite to the cutter and is used for leaking the waste glue of the frame product B after punching and plastic packaging.
Optionally, the semi-automatic punching device further comprises a positioning pin, at least one side of the punching upper die is provided with a positioning hole, a corresponding position of the punching base is provided with a bolt hole, and the positioning pin fixes the punching upper die on the punching base through the bolt hole and the positioning hole; the punching lower die is provided with four positioning holes, the corresponding position of the punching base is provided with the bolt holes, and the positioning pins fix the punching lower die on the punching base through the bolt holes and the positioning holes.
Optionally, the semi-automatic punching device further comprises a waste glue box, wherein the waste glue box is arranged below the punching die and used for collecting waste materials of the frame products B punched from the punching die.
Optionally, a handle is arranged on a side edge of the waste glue box, and is used for pulling out the waste glue box and pouring out the waste material of the frame product B. Optionally, the plastic packaging device comprises at most four plastic packaging presses.
The invention also provides a packaging method based on any one of the semi-automatic packaging systems, which comprises the following steps:
s1: providing the semi-automatic packaging system;
s2: the frame product A is automatically sealed by at least one plastic sealing press, and the frame product B is manually sealed by at least one plastic sealing press;
s3: the automatic punching device automatically punches the waste rubber of the frame product A, and the semi-automatic punching device manually punches the waste rubber of the frame product B;
s4: and collecting the frame product A and the frame product B after the punching of the waste rubber is finished.
Optionally, in step S3 of the packaging method of the semi-automatic packaging system, when the semi-automatic die-cutting device is the semi-automatic die-cutting device according to any one of the above descriptions, the die-cutting method of the semi-automatic die-cutting device is as follows: and manually placing the frame product B into the punching die, opening the air source switch, driving the punching die by the punching cylinder, completing punching action of the frame product B through the punching die, punching waste glue, and resetting the punching die by the punching cylinder to prepare for next punching.
As described above, the semi-automatic packaging system and the packaging method thereof of the present invention have the following advantages: according to the semi-automatic packaging system, the semi-automatic punching device is added on the basis of the automatic packaging system in the prior art, so that the requirement that products in various packaging forms can be subjected to plastic packaging by one plastic packaging device in the stages of production, research, development, debugging and small-batch testing is met, and meanwhile, the punching of waste glue of the products is finished efficiently and high in quality, so that the products are packaged; meanwhile, the semi-automatic punching device is low in cost, and a semi-automatic packaging system does not need to increase excessive cost investment, so that the popularization and the application of the semi-automatic punching device are facilitated.
Drawings
Fig. 1 shows a schematic top view of a semi-automatic punching device according to the invention.
Fig. 2 is a schematic top view of an upper blanking die of the semi-automatic blanking apparatus of the present invention.
Fig. 3 is a schematic top view of a lower die for punching in the semiautomatic punching apparatus of the present invention.
Fig. 4 is a schematic diagram showing the structure of an air source switch of the semi-automatic punching device of the invention.
FIG. 5 is a flow chart illustrating a packaging method of the semi-automatic packaging system according to the present invention.
Description of the element reference
10 semi-automatic punching device
11 die-cut base
121 punching upper die
122 punching upper die
123 positioning hole
124 punching hole
13 die-cut cylinder
14 cylinder support
15 air source switch
16 waste rubber box
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 5. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
In prior art, generally an automatic plastic packaging device is full of four plastic packaging presses, other parts are indispensable, to volume production encapsulation form, can put into production simultaneously with four plastic packaging presses and guarantee the maximum output, but when expanding new encapsulation line, if purchase whole equipment at the beginning will be a very big input, but do not have equipment, can not carry out the engineering lot again, the trial production of small batch volume, can't carry out the debugging verification work of new product, usually can purchase corresponding exchange part under this kind of condition and switch, or manual plastic packaging, after the product plastic packaging is accomplished, then change corresponding die-cut part, it is die-cut to carry out the waste rubber in unison.
The first method of replacing the exchange component is suitable for the situation that the production capacity is not full and the exchange component is always in standby state. Because if the exchange part for producing the product A is replaced by the exchange part for producing the product B, the equipment can only automatically produce the product B, the product A cannot produce, the time for replacing the exchange part and debugging generally needs about 12 hours, the multi-variety production cannot be well considered, and a large amount of replacement operation time is wasted.
The second manual plastic packaging method is suitable for uniform automatic punching after all products are packaged in a plastic mode, is suitable for the condition that the number of the products is large, but the machine can be stopped properly, and still wastes some productivity. The operation can realize the online automatic operation of the product A, the product B selects a plastic package press to carry out manual plastic package, the manual plastic package is not influenced initially, and when the product B reaches a certain amount or the plastic package is finished, the waste glue of the product B needs to be punched to ensure that the product B can flow to the next procedure; at this time, the punching component of the product A needs to be replaced by the replacing component of the product B, although the replacement time is short, usually about 30 minutes, after the replacing component of the product B is replaced, the product A cannot automatically operate, the product A stops production, the punching of the product B is waited, the punching at this time can only be semi-automatic, a control system needs to be manually operated, the lower punching die is moved to a position right opposite to the position close to the upper punching die, the frame product is manually placed on the lower punching die, then corresponding operation is started in system control, equipment performs punching, and automatic material collection is performed after punching.
The two types are conventional operation modes of most manufacturers at present, and based on the findings and research and analysis, the inventor provides a semi-automatic packaging system and a packaging method thereof so as to solve the problems that products in various packaging forms can be subjected to plastic packaging by using one plastic packaging device and the waste glue of the products is punched without excessive cost and time investment in the stages of production, research, development and debugging and small-batch testing.
Example one
As shown in fig. 1, the present embodiment provides a semi-automatic packaging system, which includes: a plastic packaging device, an automatic punching device and a semi-automatic punching device 10;
the plastic packaging device at least comprises two plastic packaging presses, one plastic packaging press is used for carrying out automatic plastic packaging on the frame product A, and the other plastic packaging press is used for carrying out manual plastic packaging on the frame product B;
the automatic punching device is used for automatically punching waste glue of the frame product A after plastic packaging;
the semi-automatic punching device 10 is used for manually punching waste glue of the frame product B after plastic packaging.
The working process of the semi-automatic packaging system of the embodiment is as follows: placing the frame product A into the plastic packaging press for automatic plastic packaging, after the plastic packaging of the frame product A is completed, conveying the frame product A onto an automatic punching device on a production line machine table, automatically punching waste glue, and collecting the frame product A; meanwhile, the frame product B is placed into another plastic package press for manual plastic package, the frame product B after plastic package is completed is manually placed into the semi-automatic punching device 10 for manual waste glue punching, the frame product B is collected, and simultaneous online operation and output of different products are achieved.
It should be noted here that the automatic plastic packaging and the automatic punching are completed automatically on a machine table of the assembly line by some robot grippers and other mechanical structure devices, and manual intervention is not required at all in the operation process; the manual plastic packaging and the manual punching are performed by the plastic packaging press and the semi-automatic punching device 10 in the embodiment, and the operation is completed semi-automatically under manual intervention.
The semi-automatic packaging system of the embodiment is additionally provided with the semi-automatic punching device 10 on the basis of the automatic packaging system in the prior art, so that the requirement that products in various packaging forms can be plastically packaged by one common plastic packaging device under the condition of no excessive cost and time investment in production, research, development and debugging and small-batch testing stages is met, the punching of waste glue of the products is efficiently and high-quality completed, and the products are packaged.
As an example, the plastic packaging device comprises at most four plastic packaging presses; when the frame product A is in automatic production operation, the plastic packaging device can simultaneously separate a plastic packaging press to manually package the frame product B, and manually punch the frame product B, so that two products, namely the frame product A and the frame product B, can be simultaneously produced in an online operation; in one example, the plastic packaging device comprises three plastic packaging presses, the frame product A is automatically and manually packaged, one frame product C can be manually packaged by the plastic packaging press, manual punching is completed, and three products are simultaneously produced in an online operation; in another example, the plastic packaging device comprises four plastic packaging presses, the frame product A is automatically and manually packaged, the frame product B can be further extracted out by two plastic packaging presses, the frame product C and the frame product D are respectively and manually packaged, manual punching is completed, and simultaneous online operation and output of the four products are achieved. In addition, the number of the plastic packaging presses can be multiple (four at most), but only two products, namely the frame product a and the frame product B, are produced on line, only one of the plastic packaging presses is needed to be separated for manually packaging the frame product B, or one of the plastic packaging presses is needed to be separated for automatically packaging the frame product a, so that at least two products can be produced on line at the same time, and the plastic packaging presses can be set according to actual conditions without limitation.
Example two
As shown in fig. 1 to 4, the present embodiment provides a semiautomatic blanking apparatus applied to the first embodiment, including:
the punching device comprises a punching base 11, a punching die, a punching cylinder 13, a cylinder support 14 and an air source switch 15;
the punching die is arranged on the punching base 11 and is used for punching the waste glue of the frame product B;
the cylinder support 14 is arranged above the punching base 11 and used for fixedly supporting the punching cylinder 13, and the punching cylinder 13 is located above the punching die and used for driving the punching die to perform punching operation on waste glue of the frame product B;
the air source switch 15 is disposed on a side of the punching cylinder 13 (as shown in fig. 1 and 4) and configured to control the operation of the punching cylinder 13.
The semi-automatic punching device is independent of equipment outside an assembly line machine table of an automatic packaging system, the frame product B needs to be placed manually, and then manual punching is carried out through the semi-automatic punching device; the semi-automatic punching device of the embodiment avoids the problem that the force is unbalanced during manual violent punching, so that the frame is deformed or the punching is incomplete after punching.
As shown in fig. 2 to 3, as an example, the punching mold includes an upper punching mold 121 and a lower punching mold 122, the upper punching mold 121 and the lower punching mold 122 are disposed on the punching base 11 in a vertically opposite manner, and the upper punching mold 121 reciprocates vertically to punch the waste adhesive of the frame product B.
As shown in fig. 2 and 3, as an example, the lower surface of the upper die 121 is provided with a plurality of cutters for punching the waste adhesive of the frame product B; and the upper surface of the lower punching die 122 is provided with a punching hole 124 right opposite to the cutter, and the punching hole is used for leaking waste glue of the frame product B after punching and plastic packaging.
It should be noted here that, as an example, preferably, the shape of the cutter for die cutting the frame product B waste glue is wedge-shaped, so that the cutter is sharp and can maintain a complete die cutting cross section when die cutting; in the non-punching state, the frame product B is located at a position to be punched preset by the upper punching die 122, and the waste glue of the frame product B is located above the punching hole 124 and is in a hollow state; in the punching state, the cutter performs a punching motion downwards along the edge of the frame product B, passes through the punching hole 124, completes a punching action, and the waste glue leaks out of the punching hole 124.
As shown in fig. 2 and fig. 3, as an example, the semi-automatic punching device 10 further includes a positioning pin, at least one side of the upper punching die 121 is provided with a positioning hole 123, a corresponding place of the punching base 11 is provided with a latch hole, and the positioning pin fixes the upper punching die 121 to the punching base 11 through the latch hole and the positioning hole 123; four positioning holes 123 are formed in the lower punching die 122, bolt holes are formed in positions corresponding to the punching bases 11, and the lower punching die 122 is fixed to the punching bases 11 through the bolt holes and the positioning holes 123 by the positioning pins.
Here, it is preferable that, as an example, a positioning hole 123 is provided at one side of the upper die-cutting die 121, and the positioning pin is fixed to the die-cutting base 11, and can support the weight of the upper die-cutting die 121 and maintain normal operation; the positioning pins for fixing the upper die 121 can be directly taken out from the side, which is beneficial to the installation and disassembly of the upper die 121. Four positioning holes 123 arranged on the lower punching die 122 are circumferentially and regularly distributed on four corners of the lower punching die 122; the punching lower die 122 can also be fixed by screws, so long as the requirement for easy installation and disassembly of the punching lower die 122 is met, the die can also be set according to the actual situation, and the limitation is not limited herein. In addition, a handle is arranged on the side of the lower punching die 122, which is beneficial to mounting and dismounting the lower punching die 122 on the punching base 11.
By way of example, the semi-automatic punching device 10 further comprises a waste glue box 16, and the waste glue box 16 is arranged below the punching die and used for collecting waste materials of the frame products B punched from the punching die. The side edge of the waste glue box 16 is provided with a handle which is used for pulling out the waste glue box 16 and pouring out the waste material of the frame product B.
It should be noted that the depth of the waste glue box 16 is at least enough to receive the length of the cutter, and as an example, the depth of the waste glue box 16 is preferably to receive a certain amount of waste glue, so as to avoid that the waste glue is too shallow, the waste glue receiving amount is small, and when the waste glue reaches a certain amount, the waste glue cannot smoothly enter the waste glue box 16 and is carried out by the cutter, thereby affecting the punching operation. The specific size of the waste adhesive box 16 can be set according to actual conditions, and is not set here.
In the present embodiment, the apparatus 10 further includes other internal structural components, which are conventional to those skilled in the art, and the structure and principle of which are well known to those skilled in the art, and therefore, will not be described in detail herein.
EXAMPLE III
The present invention provides a packaging method of a semi-automatic packaging system, which can be used to use the semi-automatic packaging system described in the first embodiment, as shown in fig. 5, the packaging method of the semi-automatic packaging system described above is described in detail.
First, step S1 is performed to provide the semi-automatic packaging system, which is the semi-automatic packaging system in the first embodiment.
And step S2, automatically and manually packaging the frame product A by at least one plastic packaging press, and manually packaging the frame product B by at least one plastic packaging press.
As an example, the plastic packaging device comprises at most four plastic packaging presses; when the frame product A is in automatic production operation, the plastic packaging device can simultaneously separate the frame product B which is manually packaged by the plastic packaging press, and manually punch the frame product B, so that two products, namely the frame product A and the frame product B, can be simultaneously produced in an online operation; in an example, the plastic packaging device comprises three plastic packaging presses, the frame product A is automatically and manually packaged, and the frame product B can be further manually packaged by drawing out one plastic packaging press to manually package the frame product C; in another example, the plastic packaging device comprises four plastic packaging presses, the frame product A is automatically and manually packaged, and the frame product B can be further manually packaged by drawing out two plastic packaging presses to manually package the frame product C and the frame product D. In addition, the number of the plastic packaging presses can be multiple (four at most), one of the plastic packaging presses is only needed to be separated for manually packaging the frame product B, or one of the plastic packaging presses is needed to be separated for automatically packaging the frame product A, so that at least two products can be simultaneously produced on line, the setting can be carried out according to actual conditions, and no limitation is imposed on the setting.
Next, step S3 is performed, in which the automatic die-cutting device automatically cuts the waste glue of the frame product a, and the semi-automatic die-cutting device 10 manually cuts the waste glue of the frame product B.
When the semiautomatic blanking apparatus 10 according to any one of embodiments 10 is the semiautomatic blanking apparatus 10 according to step S3, the present embodiment further provides a blanking method of the semiautomatic blanking apparatus 10, including: after the die-cut mould is opened, will frame product B is manual place in preset die-cut position in the die-cut mould, after the die-cut position of frame product B is taken one's place, manually open air source switch 15, die-cut cylinder 13 drive the die-cut mould, die-cut mould compound die is die-cut, frame product B passes through die-cut mould accomplishes die-cut action, will frame product B's waste rubber is punched and is cut off, die-cut cylinder 13 drive the die-cut mould resets, also promptly the die-cut mould is in the die-cut state, and manual collection takes out frame product B prepares next die-cut waste rubber operation afterwards.
In one example, four different products are simultaneously produced on line, the frame product a can automatically die-cut waste glue by using the automatic die-cutting device, when only one semi-automatic die-cutting device 10 is used for manually die-cutting different products, different products are replaced for die-cutting, only the die-cutting die needs to be directly detached and taken down, and the die-cutting die corresponding to different products is installed, so that the operation is convenient; or a plurality of semi-automatic punching devices 10 are manufactured, and the semi-automatic punching devices 10 are low in cost, convenient to expand and beneficial to rapid production of multiple products. Based on the same principle, three different products can be produced simultaneously on line.
And finally, step S4 is carried out, and the frame product A and the frame product B after the punching waste glue is finished are collected.
It should be noted that, when collecting the frame product a, the robot gripper may automatically collect the frame product B after the automatic punching device completes punching, and collect the frame product B manually after the semi-automatic punching device 10 completes manual punching.
In summary, the present invention provides a semi-automatic packaging system and a packaging method thereof, the semi-automatic packaging system includes: the plastic packaging device, the automatic punching device and the semi-automatic punching device; the plastic packaging device at least comprises two plastic packaging presses, one plastic packaging press is used for carrying out automatic plastic packaging on the frame product A, and the other plastic packaging press is used for carrying out manual plastic packaging on the frame product B; the automatic punching device is used for automatically punching waste glue of the frame product A after plastic packaging; and the semi-automatic punching device is used for manually punching the waste rubber of the frame product B after plastic package. According to the invention, a semi-automatic punching device is added on the basis of an automatic packaging system in the prior art, so that in the stages of production, research, development, debugging and small-batch testing, products in various packaging forms can be subjected to plastic packaging by using one plastic packaging device, and simultaneously, the punching of waste glue of the products is finished efficiently and in high quality, so that the products are packaged; meanwhile, the semi-automatic punching device is low in cost, and the semi-automatic packaging system does not need to increase excessive money and time investment, so that the popularization and the application of the invention are facilitated. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (10)
1. A semi-automatic packaging system, comprising:
a plastic packaging device, an automatic punching device and a semi-automatic punching device;
the plastic packaging device at least comprises two plastic packaging presses, one plastic packaging press is used for carrying out automatic plastic packaging on the frame product A, and the other plastic packaging press is used for carrying out manual plastic packaging on the frame product B;
the automatic punching device is used for automatically punching waste glue of the frame product A after plastic packaging;
and the semi-automatic punching device is used for manually punching the waste rubber of the frame product B after plastic package.
2. The semi-automatic packaging system of claim 1, wherein said semi-automatic die cutting device comprises:
the punching device comprises a punching base, a punching die, a punching cylinder, a cylinder bracket and an air source switch;
the punching die is arranged on the punching base and is used for punching the waste glue of the frame product B;
the cylinder support is arranged above the punching base and used for fixedly supporting the punching cylinder, and the punching cylinder is positioned above the punching die and used for driving the punching die to perform punching operation on waste glue of the frame product B;
the air source switch is arranged on the side edge of the punching cylinder and used for controlling the operation of the punching cylinder.
3. A semi-automatic die-cutting device according to claim 2, characterized in that: the punching die comprises an upper punching die and a lower punching die, the upper punching die and the lower punching die are arranged on the punching base relatively up and down, the upper punching die reciprocates up and down, and the punching die is used for punching the waste rubber of the frame product B.
4. A semi-automatic die-cutting device according to claim 3, characterized in that: the lower surface of the upper punching die is provided with a plurality of cutters for punching the waste rubber of the frame product B; and the upper surface of the punching lower die is provided with a punching hole which is right opposite to the cutter and is used for leaking the waste glue of the frame product B after punching and plastic packaging.
5. A semi-automatic die-cutting device according to claim 3, characterized in that: the semi-automatic punching device further comprises a positioning pin, at least one side edge of the punching upper die is provided with a positioning hole, a corresponding position of the punching base is provided with a bolt hole, and the positioning pin fixes the punching upper die on the punching base through the bolt hole and the positioning hole; the punching lower die is provided with four positioning holes, the corresponding position of the punching base is provided with the bolt holes, and the positioning pins fix the punching lower die on the punching base through the bolt holes and the positioning holes.
6. A semi-automatic die-cutting device according to claim 2, characterized in that: the semi-automatic punching device further comprises a waste glue box, wherein the waste glue box is arranged below the punching die and used for collecting waste materials of the frame products B punched in the punching die.
7. A semi-automatic die-cutting device according to claim 2, characterized in that: and a handle is arranged on the side edge of the waste rubber box and used for pulling out the waste rubber box and pouring out the waste material of the frame product B.
8. The semi-automatic packaging system of claim 1, wherein: the plastic packaging device comprises at most four plastic packaging presses.
9. A packaging method of a semi-automatic packaging system according to any one of claims 1 to 8, characterized in that:
s1: providing the semi-automatic packaging system;
s2: the frame product A is automatically sealed by at least one plastic sealing press, and the frame product B is manually sealed by at least one plastic sealing press;
s3: the automatic punching device automatically punches the waste rubber of the frame product A, and the semi-automatic punching device manually punches the waste rubber of the frame product B;
s4: and collecting the frame product A and the frame product B after the punching of the waste rubber is finished.
10. The packaging method of a semi-automatic packaging system according to claim 9, wherein in step S3, when the semi-automatic die-cutting device is the semi-automatic die-cutting device according to any one of claims 2 to 7, the die-cutting method of the semi-automatic die-cutting device is: will frame product B is manual place in the die-cut mould, open the air supply switch, die-cut cylinder drive die-cut mould, frame product B passes through die-cut action is accomplished to die-cut mould, cuts off the scrap rubber, die-cut cylinder drive die-cut mould resets, prepares next die-cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210526878.3A CN114758971A (en) | 2022-05-16 | 2022-05-16 | Semi-automatic packaging system and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210526878.3A CN114758971A (en) | 2022-05-16 | 2022-05-16 | Semi-automatic packaging system and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114758971A true CN114758971A (en) | 2022-07-15 |
Family
ID=82335494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210526878.3A Pending CN114758971A (en) | 2022-05-16 | 2022-05-16 | Semi-automatic packaging system and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114758971A (en) |
-
2022
- 2022-05-16 CN CN202210526878.3A patent/CN114758971A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104289582B (en) | Flip-over type forming device for electronic device pins | |
| CN218004781U (en) | Semi-automatic packaging system | |
| CN205573050U (en) | Rubber mold laminated material production automation equipment | |
| CN114758971A (en) | Semi-automatic packaging system and packaging method thereof | |
| CN205997506U (en) | A kind of multistation laser moulding press | |
| CN206230596U (en) | A kind of integration apparatus for possessing automatically to patch and automatic die cutting function | |
| JPH0433527B2 (en) | ||
| CN101612702A (en) | The device that is used for machining ports of special pipe | |
| CN206780900U (en) | One kind injection automatic shearing frock | |
| CN109433929A (en) | A kind of bending and molding hardware dies auxiliary device | |
| CN213197670U (en) | Paper cutter with autoloading function | |
| CN2552676Y (en) | Automatic demould device for computer fully automatic rotating disk injection machine | |
| CN210589701U (en) | Disc blanking all-in-one | |
| CN210499212U (en) | Numerical control quadruplex position cuts off all-in-one that punches a hole | |
| CN210708037U (en) | Bottom cap collecting film packaging machine | |
| CN2912919Y (en) | Fast positioning device for mold and workbench | |
| CN203495052U (en) | Full-automatic shaver head assembly riveting equipment | |
| CN113510790A (en) | Battery packing box puncher | |
| CN212525638U (en) | Automatic punching equipment | |
| CN219789419U (en) | Cardboard perforating device is used in carton production | |
| CN209615712U (en) | Material strip automatic cutting device | |
| CN202239886U (en) | TO-220 packaged product self-counting cutting device | |
| CN111376435A (en) | Peripheral supplementary automatic nail equipment that buries of injection molding machine mould shaping | |
| CN218638376U (en) | Automatic mould for flat movable bottom plate | |
| CN220361878U (en) | Die-cut device of die-casting product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |