CN114752319A - High-initial-adhesion and high-temperature-resistant hot melt adhesive and preparation method thereof - Google Patents
High-initial-adhesion and high-temperature-resistant hot melt adhesive and preparation method thereof Download PDFInfo
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- CN114752319A CN114752319A CN202111522058.9A CN202111522058A CN114752319A CN 114752319 A CN114752319 A CN 114752319A CN 202111522058 A CN202111522058 A CN 202111522058A CN 114752319 A CN114752319 A CN 114752319A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09J157/02—Copolymers of mineral oil hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the field of IPC (International Classification) classified C09J123/00, in particular to a high-initial-adhesion high-temperature-resistant hot melt adhesive and a preparation method thereof. The high-initial-viscosity and high-temperature-resistant hot melt adhesive at least comprises a polyolefin resin with the melt viscosity of 3000-60000, the temperature of 190 ℃ and mPa & s, a hydrogenated resin with the softening point of 80-140 ℃ and a triblock homopolymer. The hot melt adhesive prepared by the application has excellent initial viscosity and extremely low VOC, has better high temperature resistance, impact resistance, aging resistance and plasticizer resistance, is suitable for being popularized in the field of hot melt adhesives, and has wide development prospect.
Description
Technical Field
The invention relates to the field of IPC classified C09J123/00, in particular to a high-initial-adhesion and high-temperature-resistant hot melt adhesive and a preparation method thereof.
Background
In recent years, hot melt adhesive products have been widely used in the fields of sanitary care products, woodworking, paper compounding, food box packaging, automobiles (interior trims, lamps, batteries), filters, carpet paving, road construction, white home appliances, mattresses, and the like, due to their advantages such as high adhesiveness, quick setting property, good coating effect, moisture resistance, and the like, and are an adhesive material which has been widely used and studied in recent years.
The polyolefin hot melt adhesive is one kind of hot melt adhesive, and the main components of the polyolefin hot melt adhesive, such as olefin resin, softener, tackifying resin and the like, are mixed and heated into a molten state, coated on common adhered base materials such as plastics, films, paper, non-woven fabrics, foam cotton and the like, and then pressed with another adhered base material to produce an obvious adhesion effect. The liquid is changed into liquid when heated to 130-200 ℃ by equipment, and the liquid can be used by spraying, roller coating, dispensing and other methods according to the actual application requirements. When the adhesive is cooled to room temperature, the adhesive is solid, a good bonding effect can be generated by applying certain pressure in the open time, and the polyolefin hot melt adhesive can be applied to self-adhesive floors and has obvious advantages compared with yellow adhesive for early PVC floors.
The prior art (CN202010577559.6) provides a polyurethane hot melt adhesive product and a preparation method thereof, wherein a moisture-curing polyurethane hot melt adhesive is prepared by mainly adopting a method of adding thermoplastic resin and tackifying resin in the synthesis process of polyurethane, and the hot melt adhesive product is claimed to have the properties of long opening time, high initial adhesion strength, good moisture and heat resistance and the like; however, the polyurethane hot melt adhesives are slow in coating speed when used for floor processing, require constant temperature and pressure for a long time, and are prone to false adhesion. On the other hand, the polyolefin hot melt adhesive in the prior art has the defects of poor initial viscosity, short opening time and the like, and particularly, when the polyolefin hot melt adhesive is used at low temperature in winter, the phenomena of false adhesion, debonding and debonding are easy to occur because the initial viscosity is poor and the opening time is short and the base material is not sufficiently wetted.
Therefore, a polyolefin hot melt adhesive product with excellent initial viscosity, extremely low VOC, better high temperature resistance, impact resistance, aging resistance and plasticizer resistance is needed to ensure good processing effect of a PVC floor laminating stage.
Disclosure of Invention
In order to solve the problems, the invention provides a high-initial-viscosity and high-temperature-resistant hot melt adhesive, which at least comprises polyolefin resin with the melt viscosity of 3000-60000 cps and 190 ℃, hydrogenated resin with the softening point of 80-140 ℃ and triblock homopolymer.
As a preferable scheme, the hot melt adhesive further comprises, by mass, 5-20% of polyisobutylene, 4-10% of organic oil and 0.5-1% of an antioxidant.
As a preferred scheme, the hot melt adhesive comprises the following raw materials in percentage by mass: 30-40% of polyolefin resin, 3-8% of triblock homopolymer, 10-15% of polyisobutylene, 5-8% of organic oil, 1% of antioxidant and the balance of hydrogenated resin.
In a preferred embodiment, the polyolefin-based resin is at least one of poly α olefin resins.
As a preferable mode, the poly α olefin resin includes a high viscosity olefin resin and a low viscosity olefin resin.
Preferably, the mass ratio of the high-viscosity olefin resin to the low-viscosity olefin resin is 10-25: 10-25.
In a preferred embodiment, the mass ratio of the high viscosity olefin resin to the low viscosity olefin resin is 10: 25.
As a preferable mode, the high-viscosity olefin resin has a melt viscosity of 45000, cps, 190 ℃.
As a preferable mode, the low-viscosity olefin resin has a melt viscosity of 8000, cps, 190 ℃.
Preferably, the softening point of the high-viscosity olefin resin is 100 to 110 ℃.
Preferably, the low-viscosity olefin resin has a softening point of 130 to 140 ℃.
Preferably, the poly-alpha-olefin resin has a tensile strength of 1 to 6 MPa.
Preferably, the poly-alpha-olefin resin has a tensile strength of 1.5 to 5 MPa.
In a preferred embodiment, the hydrogenated resin is at least one of hydrogenated petroleum resin, hydrogenated terpene resin, hydrogenated DCPD resin, and hydrogenated rosin resin.
In a preferred embodiment, the hydrogenated resin is a mixture of hydrogenated C5 petroleum resin, hydrogenated terpene resin, and hydrogenated DCPD resin.
Preferably, the mass ratio of the hydrogenated C5 petroleum resin to the hydrogenated terpene resin to the hydrogenated DCPD resin is 15-18: 3-6: 19-22.
In a preferable embodiment, the mass ratio of the hydrogenated C5 petroleum resin, the hydrogenated terpene resin and the hydrogenated DCPD resin is 17:5: 20.
As a preferred scheme, the softening point of the hydrogenated C5 petroleum resin is 100 ℃; the hydrogenation rate of the hydrogenated C5 petroleum resin is more than or equal to 70 percent.
As a preferred embodiment, the hydrogenated terpene resin has a softening point of 90 ℃.
Preferably, the softening point of the hydrogenated DCPD resin is 90-105 ℃.
As a preferred embodiment, the softening point of the hydrogenated DCPD resin is 100 ℃.
Preferably, the triblock homopolymer is at least one of SIS, SBS and SEBS.
As a preferred embodiment, the triblock homopolymer is an SIS rubber elastomer.
In a preferred embodiment, the average molecular weight of the polyisobutylene is 400-2400.
Preferably, the average molecular weight of the polyisobutylene is 1300.
As a preferable scheme, the organic oil is at least one of white oil, naphthenic oil and epoxidized soybean oil; the antioxidant is at least one of tetra [ methyl-beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ] pentaerythritol ester, 2, 6-di-tert-butyl-p-cresol, tris [2, 4-di-tert-butylphenyl ] phosphite or dilauryl thiodipropionate.
In a preferred embodiment, the organic oil is naphthenic oil.
Preferably, the mass ratio of the triblock homopolymer to the polyolefin resin is 4-6: 30-40.
As a preferable mode, the mass ratio of the triblock homopolymer to the polyolefin-based resin is 5: 35.
the second aspect of the invention provides a preparation method of the high-initial-adhesion and high-temperature-resistant hot melt adhesive, which comprises the following steps: (1) adding a triblock homopolymer, hydrogenated resin, organic oil and an antioxidant into a reaction container, heating to 140-180 ℃, stirring under the protection of nitrogen at a stirring speed of 30-50 r/min for 60-120 minutes until the raw materials are completely dissolved; (2) adding polyolefin resin into a reaction kettle, increasing the stirring speed to 100-150 r/min, and continuously stirring for 30-60 minutes until the resin is completely molten; (3) adding polyisobutylene, stirring, discharging, and cooling to room temperature.
Has the advantages that:
1. the hot melt adhesive prepared in the application has an excellent initial adhesion effect, can bear higher use temperature, has an obvious anti-plasticizer effect, can have an excellent service life, can keep good adhesion in a long-time use process, has polar VOC content, and has a very excellent use prospect.
2. According to the hot melt adhesive prepared in the application, the specific block copolymer and the polyolefin resin are selected, and when the mass ratio of the block copolymer to the polyolefin resin is 5:35, an effective synergistic effect can be formed, the performance of the hot melt adhesive is adjusted, so that the hot melt adhesive has excellent initial adhesion and low-temperature performance, and the defects of short opening time, weak initial adhesion, poor low-temperature performance and the like of the polyolefin adhesive are overcome.
3. According to the hot melt adhesive prepared in the application, the polyolefin material with a specific softening point and the hydrogenated resin are adopted, so that the softening point of a hot melt adhesive product can be effectively balanced, various performance activities of the hot melt adhesive in high and low temperature states can be endowed, and the hot melt adhesive has good temperature resistance and impact resistance.
Detailed Description
Example 1
Embodiment 1 in a first aspect, a hot melt adhesive is provided, which comprises the following raw materials by mass: 10% of high-viscosity olefin resin, 30% of low-viscosity olefin resin, 25% of hydrogenated C5 petroleum resin, 25% of hydrogenated DCPD resin, 9% of polyisobutylene and 1% of antioxidant.
Wherein the melt viscosity of the high-viscosity olefin resin is 45000cps at 190 deg.C; the low-viscosity olefin resin has a melt viscosity of 8000cps, 190 deg.C, and tensile strength of 5.0 MPa; the softening point of the high-viscosity olefin resin is 105 ℃; the low-viscosity olefin resin had a softening point of 132 ℃ and a tensile strength of 1.5 MPa.
In this example, a high-viscosity olefin resin was purchased from a 750-size high-viscosity olefin resin product of creative chemistry; low viscosity olefin resin a low viscosity olefin resin product of type 308 from the winning chemistry was purchased.
The softening point of hydrogenated C5 petroleum resin is 100 ℃; the hydrogenation rate of the hydrogenated C5 petroleum resin is 70 percent; the softening point of the hydrogenated DCPD resin is 100 ℃.
In this example, hydrogenated C5 petroleum resin was purchased from the H-1001 model sold by henghe new materials, and hydrogenated DCPD resin was purchased from the 6100 model sold by the golden sea materials company.
The average molecular weight of the polyisobutylene is 1300, which is purchased from polyisobutylene model 1300 sold by Shandong Yongrong chemical technology Co.
The antioxidant is 2, 6-di-tert-butyl-p-cresol.
The second aspect of the present invention provides a preparation method of the above hot melt adhesive: (1) adding hydrogenated C5 petroleum resin, hydrogenated DCPD resin and an antioxidant into a reaction vessel, heating to 160 ℃, stirring under the protection of nitrogen at the stirring speed of 45r/min for 80 minutes until the raw materials are completely dissolved; (2) adding high-viscosity olefin resin and low-viscosity olefin resin into a reaction kettle, increasing the stirring speed to 120r/min, and continuously stirring for 55 minutes until the resins are completely molten; (3) adding polyisobutylene, stirring, discharging, and cooling to room temperature.
Example 2
The embodiment of the present invention is different from embodiment 1 in that: the content of the high-viscosity olefin resin was 30% and the content of the low-viscosity olefin resin was 10%.
Example 3
The embodiment of the present invention is different from embodiment 1 in that: 25% of high-viscosity olefin resin and 10% of low-viscosity olefin resin, and 5% of SIS rubber elastomer is added.
In this example, the SIS rubber elastomer was purchased from SIS1126 model sold in the chemical industry in the united nations of the south of the lake.
Example 4
The specific implementation manner of this embodiment is the same as that of embodiment 3, except that: hydrogenated C5 contains 17% resin and 8% 64# white oil.
Example 5
The embodiment of the present invention is different from embodiment 4 in that: the 64# white oil was replaced with the same amount of naphthenic oil.
In this example, naphthenic oil was purchased from a K4010 petrochemical product of Clarityy, Xinjiang.
Example 6
The embodiment of the present invention is different from embodiment 5 in that: the content of the hydrogenated DCPD resin is 20 percent, and simultaneously, 5 percent of hydrogenated terpene resin is added; the hydrogenated terpene resin had a softening point of 90 ℃.
In this example, the hydrogenated terpene resin was purchased from a hydrogenated terpene resin product of Shenzhen Jitian chemical industry.
Example 7
Embodiment 7 provides, in a first aspect, a hot melt adhesive, which comprises the following raw materials in percentage by mass: 10% of high-viscosity olefin resin, 25% of low-viscosity olefin resin, 5% of SIS rubber elastomer, 17% of hydrogenated C5 petroleum resin, 5% of hydrogenated terpene resin, 20% of hydrogenated DCPD resin, 9% of polyisobutylene, 8% of naphthenic oil and 1% of antioxidant.
In this example, the raw materials used were the same as those in examples 1 to 6.
The second aspect of the present invention provides a preparation method of the above hot melt adhesive: (1) adding the SIS rubber elastomer, hydrogenated C5 petroleum resin, hydrogenated terpene resin, hydrogenated DCPD resin, naphthenic oil and antioxidant into a reaction vessel, heating to 160 ℃, stirring under the protection of nitrogen at the stirring speed of 45r/min for 80 minutes until the raw materials are completely dissolved; (2) adding high-viscosity olefin resin and low-viscosity olefin resin into a reaction kettle, increasing the stirring speed to 120r/min, and continuously stirring for 55 minutes until the resins are completely molten; (3) adding polyisobutylene, stirring, discharging, and cooling to room temperature.
Example 8
The embodiment of the present invention is the same as embodiment 7, except that: the content of the SIS rubber elastomer is 1%.
Example 9
The embodiment of the present invention is the same as embodiment 7, except that: the content of the high viscosity olefin resin was 17.5% and the content of the low viscosity olefin resin was 17.5%.
Example 10
The embodiment of the present invention is the same as embodiment 7, except that: the polyethylene resin had a melt viscosity of 10000, 190 ℃ and mPas.
Evaluation of Properties
1. Rotational viscosity and softening point: the hotmelt adhesives obtained in all the examples were subjected to the rotary viscosity and softening point tests described in GB/T1633 and GB/T2794, 10 specimens were tested in each example, and the average of the values obtained is reported in Table 1.
2. Floor gluing test: and heating the hot melt adhesive sample prepared in the embodiment 1-10 to 175 ℃, starting floor gluing after the hot melt adhesive sample is completely melted, and ensuring the cleanness of the surface of the base material during gluing. The glue amount on the back of the floor is 45 g/flat. 180 DEG peel force (GB/T2790), 80 ℃ oven high temperature test (debonding, shrinking film, edge warping), -30 ℃ to 80 ℃ high and low temperature cycle impact (debonding, shrinking film, edge warping), 10 samples were tested for each example, and the average of the measured values is reported in Table 1.
TABLE 1
Through the embodiments 1-10 and the table 1, it can be known that the hot melt adhesive with high initial adhesion and high temperature resistance and the preparation method thereof provided by the invention have the advantages that the prepared hot melt adhesive has excellent initial adhesion viscosity, extremely low VOC, better high temperature resistance, impact resistance, aging resistance and plasticizer resistance, is suitable for popularization in the field of hot melt adhesives, and has wide development prospects.
Claims (10)
1. The utility model provides a high just glues, high temperature resistant hot melt adhesive which characterized in that: the raw materials at least comprise a polyolefin resin with the melt viscosity of 3000-60000 cps and 190 ℃, a hydrogenated resin with the softening point of 80-140 ℃ and a triblock homopolymer.
2. The high initial adhesion and high temperature resistance hot melt adhesive according to claim 1, which is characterized in that: the hot melt adhesive further comprises, by mass, 5-20% of polyisobutylene, 4-10% of organic oil and 0.5-1% of an antioxidant.
3. The high initial adhesion and high temperature resistant hot melt adhesive according to any one of claims 1 to 2, characterized in that: the polyolefin resin is at least one of poly alpha-olefin resins.
4. The high initial adhesion and high temperature resistance hot melt adhesive according to any one of claims 1 to 3, characterized in that: the hydrogenated resin is at least one of hydrogenated petroleum resin, hydrogenated terpene resin, hydrogenated DCPD resin and hydrogenated rosin resin.
5. The high initial adhesion and high temperature resistant hot melt adhesive according to claim 4, characterized in that: the softening point of the hydrogenated DCPD resin is 90-105 ℃.
6. The high initial adhesion and high temperature resistant hot melt adhesive according to any one of claims 1 to 5, which is characterized in that: the triblock homopolymer is at least one of SIS, SBS and SEBS.
7. The high initial adhesion and high temperature resistance hot melt adhesive according to claim 2, characterized in that: the average molecular weight of the polyisobutylene is 400-2400.
8. The high initial adhesion and high temperature resistance hot melt adhesive according to claim 2, wherein: the organic oil is at least one of white oil, naphthenic oil and epoxidized soybean oil; the antioxidant is at least one of tetra [ methyl-beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ] pentaerythritol ester, 2, 6-di-tert-butyl-p-cresol, tris [2, 4-di-tert-butylphenyl ] phosphite or dilauryl thiodipropionate.
9. The high initial adhesion and high temperature resistance hot melt adhesive according to any one of claims 1 to 8, which is characterized in that: the mass ratio of the triblock homopolymer to the polyolefin resin is 4-6: 30-40.
10. The preparation method of the high initial adhesion and high temperature resistant hot melt adhesive according to any one of claims 2 to 9, characterized by comprising the following steps: the method comprises the following steps: (1) adding a triblock homopolymer, hydrogenated resin, organic oil and an antioxidant into a reaction container, heating to 140-180 ℃, stirring under the protection of nitrogen at a stirring speed of 30-50 r/min for 60-120 minutes until the raw materials are completely dissolved; (2) adding polyolefin resin into a reaction kettle, increasing the stirring speed to 100-150 r/min, and continuously stirring for 30-60 minutes until the resin is completely molten; (3) adding polyisobutylene, stirring, discharging, and cooling to room temperature.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106520017A (en) * | 2016-10-20 | 2017-03-22 | 重庆中科力泰高分子材料股份有限公司 | A mono-component moisture-curing polyolefin hot-melt adhesive and a preparing method thereof |
| CN111019575A (en) * | 2019-12-19 | 2020-04-17 | 浙江金嘉科技有限公司 | High-temperature-resistant high-peeling-resistance hot-melt pressure-sensitive adhesive and preparation method thereof |
| JP2020076101A (en) * | 2018-11-07 | 2020-05-21 | 積水フーラー株式会社 | Hot-melt composition |
| CN112457806A (en) * | 2020-11-26 | 2021-03-09 | 苏州凯伦高分子新材料科技有限公司 | High-temperature-resistant hot-melt pressure-sensitive adhesive and preparation method and application thereof |
| CN112961631A (en) * | 2021-02-04 | 2021-06-15 | 上海都昱新材料科技有限公司 | High-temperature-resistant plasticizer-resistant hot melt adhesive and preparation method and application thereof |
| CN113249059A (en) * | 2021-06-30 | 2021-08-13 | 佛山南宝高盛高新材料有限公司 | End sealing hot melt adhesive without surface viscosity at 40 ℃ for sanitary materials and preparation method thereof |
-
2021
- 2021-12-13 CN CN202111522058.9A patent/CN114752319B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106520017A (en) * | 2016-10-20 | 2017-03-22 | 重庆中科力泰高分子材料股份有限公司 | A mono-component moisture-curing polyolefin hot-melt adhesive and a preparing method thereof |
| JP2020076101A (en) * | 2018-11-07 | 2020-05-21 | 積水フーラー株式会社 | Hot-melt composition |
| CN111019575A (en) * | 2019-12-19 | 2020-04-17 | 浙江金嘉科技有限公司 | High-temperature-resistant high-peeling-resistance hot-melt pressure-sensitive adhesive and preparation method thereof |
| CN112457806A (en) * | 2020-11-26 | 2021-03-09 | 苏州凯伦高分子新材料科技有限公司 | High-temperature-resistant hot-melt pressure-sensitive adhesive and preparation method and application thereof |
| CN112961631A (en) * | 2021-02-04 | 2021-06-15 | 上海都昱新材料科技有限公司 | High-temperature-resistant plasticizer-resistant hot melt adhesive and preparation method and application thereof |
| CN113249059A (en) * | 2021-06-30 | 2021-08-13 | 佛山南宝高盛高新材料有限公司 | End sealing hot melt adhesive without surface viscosity at 40 ℃ for sanitary materials and preparation method thereof |
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| CN114752319B (en) | 2023-06-23 |
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