CN114743460B - Display panel and display device - Google Patents
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- CN114743460B CN114743460B CN202210394714.XA CN202210394714A CN114743460B CN 114743460 B CN114743460 B CN 114743460B CN 202210394714 A CN202210394714 A CN 202210394714A CN 114743460 B CN114743460 B CN 114743460B
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses a display panel and a display device, the display panel includes: the display substrate is provided with a display area, a bending area and a chip binding area, wherein the bending area is arranged on one side of the display area and bends towards one side deviating from the light emitting side of the display area, and the chip binding area is connected with the display area through the bending area; the control chip is positioned on the chip binding area, and the control chip is positioned on one side of the chip binding area away from the light emitting side of the display area; the binding composite layer is positioned between the bending area and the display area, and at least comprises a supporting sub-layer and a functional sub-layer, and the functional sub-layer is arranged towards one side of the control chip. The display panel is provided with the binding composite layer, so that the panel based on the COP scheme can be better protected, and the impact resistance of the panel is improved.
Description
Technical Field
The present application relates to the field of display, and in particular, to a display panel and a display device.
Background
With the development of display technologies, particularly flexible display technologies based on OLEDs and the like, products such as folding and scrolling display screens have been increasingly gaining weight in the market. In the design of the display module, a COP binding scheme, namely a scheme that a driving IC is directly bound on a display panel (chip on channel) is adopted to replace a COF binding scheme (namely chip on film, the driving IC is bound on a flip chip film), so that the purposes of increasing the occupation of a visible area of a screen and realizing curved surface display are achieved.
Nevertheless, display panels, in particular display panels based on the COP scheme, and display devices have yet to be improved.
Disclosure of Invention
The present application has been made based on the findings and studies of the following problems:
the inventor finds that the display panel of the current COP binding scheme still has certain defects compared with the COF binding panel, such as: on products without rigid cover plates such as folding and rolling, the panel has certain disadvantages in drop resistance, such as drop pen test performance. In particular, when ball-and-pen test points are at IC bindings, there is a risk of failure of the board in the IC down-side.
The present application aims to alleviate or even solve at least one of the above problems to a certain extent.
In one aspect of the present application, a display panel is provided. The display panel includes: the display substrate is provided with a display area, a bending area and a chip binding area, wherein the bending area is arranged on one side of the display area and bends towards one side deviating from the light emitting side of the display area, and the chip binding area is connected with the display area through the bending area; the control chip is positioned on the chip binding area, and the control chip is positioned on one side of the chip binding area away from the light emitting side of the display area; the binding composite layer is positioned between the bending area and the display area, and at least comprises a supporting sub-layer and a functional sub-layer, wherein the functional sub-layer is arranged towards one side of the control chip. The display panel is provided with the binding composite layer, so that the panel based on the COP scheme can be better protected, and the impact resistance of the panel is improved.
According to an embodiment of the application, the support sub-layer fulfils at least one of the following conditions: the hardness of the supporting sub-layer is greater than that of the rubber material; the support sub-layer is selected from at least one of PET, inorganic carbon material and ceramic. Thus, the overall mechanical strength of the bonded composite layer can be improved.
According to an embodiment of the application, the functional sub-layer comprises at least one of the following structures: the material forming the heat conduction sublayer comprises graphite and at least one of Cu and Al; and the material forming the buffer sub-layer comprises a high polymer material with elasticity. Therefore, the performances of impact resistance, heat conduction and the like of the binding composite layer can be further improved.
According to an embodiment of the application, the buffer sub-layer is located at a side of the support sub-layer facing away from the control chip. Thus, the performance of the display panel can be further improved.
According to the embodiment of the application, a first adhesive structure is arranged between the supporting sub-layer and the functional sub-layer, the binding composite layer comprises a plurality of functional sub-layers, the functional sub-layers are arranged on two surfaces of the supporting sub-layers, which are opposite to each other, and a second adhesive structure is further arranged on one side of the functional sub-layer, which is far away from the supporting sub-layer. Thus, the performance of the display panel can be further improved.
According to the embodiment of the application, the bending area is positioned at one side of the first side of the display substrate, the display panel is provided with a second side connected with the first side, and the binding composite layer is provided with a step structure along the longitudinal section of one side of the second side. Therefore, the impact resistance of the binding composite layer can be further improved.
According to the embodiment of the application, the bending area is positioned at one side of the first side of the display substrate, the display panel is provided with a second side connected with the first side, and the binding composite layer is provided with a trapezoid shape in a longitudinal section along one side of the second side. Therefore, the impact resistance of the binding composite layer can be further improved.
According to an embodiment of the present application, the display panel further includes a cover film layer, where the cover film layer is located on the light emitting side of the display substrate and covers at least the display area, and a material forming the cover film layer is a polymer material. Therefore, the display panel can realize the folding and rolling functions.
According to an embodiment of the present application, the display panel further includes at least one of the following structures: the back film is positioned on one side, away from the light emitting side, of the display panel, and no overlap exists between the orthographic projection of the back film on the display substrate and the bending region; a first adhesive layer located on a side of the back film facing away from the display panel; the reinforcing support layer is positioned on one side of the bonding layer, which is away from the back film, and is contacted with the binding composite layer; the polaroid is positioned on the light emitting side of the display panel; the second bonding layer is positioned on one side of the polarizer, which is away from the light emitting side, and is contacted with the cover plate film layer. Thus, the performance of the display panel can be further improved.
In yet another aspect, the present application provides a display device. The display device comprises the display panel described above. Accordingly, the display device has all the features and advantages of the display panel described above, and will not be described herein. In general, the display device can realize folding and rolling functions and has better impact resistance.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic view showing a structure of a display panel in the related art;
fig. 2 shows a schematic structure of a display panel according to an embodiment of the present application;
fig. 3 is a schematic structural view showing a display panel according to still another embodiment of the present application;
FIG. 4 shows a schematic diagram of the structure of a bonded composite layer according to one embodiment of the application;
fig. 5 shows a schematic structure of a display panel according to an embodiment of the present application;
fig. 6 is a schematic structural view showing a display panel according to still another embodiment of the present application;
fig. 7 is a schematic structural view of a display panel according to still another embodiment of the present application.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present application, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present application and do not require that the present application must be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present application.
In one aspect of the present application, a display panel is provided. Referring to fig. 2, the display panel includes: the display substrate 100, the display substrate 100 has a display area 110, a bending area 120 and a chip binding area 130, the bending area 120 is disposed at one side of the display area 110 and bends towards one side away from the light emitting side of the display area, and the chip binding area 130 is connected with the display area through the bending area. The control chip 300 is located on the chip binding area 130, and the control chip 300 is located on a side of the chip binding area away from the light emitting side of the display area. The binding composite layer 200 is located between the bending region and the display region, and the binding composite layer 200 includes at least a support sub-layer 210 and a functional sub-layer 220. Wherein the functional sub-layer 220 is disposed toward the control chip 300 side. The display panel is provided with the binding composite layer, so that the panel based on the COP scheme can be better protected, and the impact resistance of the panel is improved.
For easy understanding, the principle of the display panel that the above advantageous effects can be achieved will be briefly described below:
as described above, referring to fig. 1, the display panel of the current COF bonding scheme implements the bonding of the control chip 300 through the flip chip film 20 connected to the display substrate 100. In this case, the display substrate 100 itself does not need to be bent, and therefore, the cover film 400 on the light-emitting side of the display substrate 100 may be formed of a rigid structure, such as glass. The whole shock resistance of the display panel is good under the condition, and the detection can be easily passed in ball falling and pen falling tests. However, in a display panel based on the COF binding scheme, for example, the display panel proposed by the present application shown in fig. 2, the display substrate 100 has a bending region, the control chip is directly bound on the display substrate, the ratio of the visible region of the screen with a narrower lower boundary (lower boundary) is significantly increased, and curved surface display can be realized, so that the scrolling and folding functions can be better realized. The cover film layer of the display panel with the rolling, sliding and folding functions cannot be made of rigid materials, so that the impact resistance of the current display panel, particularly the ball drop and pen drop test results are still not ideal. Particularly, the position of the panel binding chip is easy to cause defects such as dents and the like at the cover plate film layer in ball drop and pen drop test.
According to the display panel provided by the embodiment of the application, the positions of the binding chip area and the like can be protected on the premise of not remarkably improving the overall thickness of the panel by arranging the binding composite layer, so that the impact resistance of the position is improved, and the phenomenon that the surface of the flexible cover plate film layer is dented when one side of the cover plate film layer corresponding to the position of the area where the control chip is located is impacted is avoided. Specifically, the binding composite layer comprises a supporting sub-layer and a functional sub-layer, wherein the supporting sub-layer can have certain mechanical strength and serve as a main sub-layer structure for relieving stress, and the functional sub-layer can realize additional functions such as enhancing heat conduction, so that the functions of heat dissipation and the like of the panel are reduced due to the arrangement of the film layer while the mechanical strength and the shock resistance are improved.
The following describes each structure of the display panel in detail according to an embodiment of the present application:
referring to fig. 3 and fig. 5 to fig. 7, the display panel further includes a cover film 400, the cover film 400 is located on the light emitting side of the display substrate 100 and covers at least the display area, and the material forming the cover film is a polymer material. Therefore, the display panel can realize the folding and rolling functions. The display panel may further include at least one of the following structures: and a back film 700, wherein the back film 700 is positioned on one side of the display panel 100 away from the light emitting side, and the back film has no overlap between the orthographic projection and the bending area on the display substrate. Thus, the whole mechanical strength and impact resistance of the display panel can be improved by using the back film. The first adhesive layer 800 is located on a side of the back film 700 facing away from the display panel 100. The polarizer 600 is located at the light emitting side of the display panel 100, and the second adhesive layer 500 is located at a side of the polarizer 600 facing away from the light emitting side of the display panel and contacts the cover film 400, so as to fix the two structures. Referring to fig. 6, in some embodiments of the present application, the display panel may further have a reinforcing support layer 240, and the reinforcing support layer 240 is located at a side of the first adhesive layer facing away from the back film and is in contact with the bonding composite layer 200. Thus, the performance of the display panel can be further improved. The reinforced support layer may further enhance the performance of the display panel, and the material of the reinforced support layer may be a polymer material including, but not limited to, PET.
The material of the support sub-layer 210 is not particularly limited, as long as the impact resistance of the display panel can be improved and the stress can be dispersed. For example, the hardness of the support sub-layer may be greater than the hardness of the glue. Thus, the support sub-layer may better avoid dent of the flexible cover film 400 compared to a solution in which the binding composite layer 200 is not provided, but the portion to be bent is directly fixed by the glue layer 21 (as shown in fig. 1). For example, specifically, the material of the support sub-layer 210 may be selected from at least one of PET, an inorganic carbon material, and ceramic. Thus, the overall mechanical strength of the bonded composite layer can be improved.
The specific materials of the functional sub-layer 220 and the functions thereof are also not particularly limited according to the embodiment of the present application, and may be selected by those skilled in the art according to the specific structure and performance requirements of the display panel. For example, it may comprise at least one of the following structures: a thermally conductive sub-layer and a buffer sub-layer. Therefore, the heat dissipation and impact resistance of the display panel with the functional sub-layer can be improved. Specifically, the material forming the heat conductive sub-layer may include graphite and at least one of Cu and Al. The specific thickness of the thermally conductive sub-layer is not particularly limited and may be, for example, not more than 40 μm. Therefore, the heat dissipation performance of the binding composite layer can be effectively improved on the premise of not remarkably increasing the overall thickness of the binding composite layer. The material forming the buffer sub-layer comprises a high polymer material with elasticity, such as foam. Similarly, the specific thickness of the buffer sub-layer is also not particularly limited, and may be, for example, not more than 50 μm or the like. Therefore, the performances of impact resistance, heat conduction and the like of the binding composite layer can be further improved.
According to embodiments of the present application, the thermally conductive sub-layer may be disposed on a side of the binding composite layer that is proximate to the control chip. Therefore, the heat dissipation performance of the chip can be enhanced, and the buffer sub-layer can be positioned on one side of the supporting sub-layer away from the control chip, so that the stress caused by external impact can be better relieved.
According to an embodiment of the present application, referring to fig. 3, the bending region is located at a first side of the display substrate, the display panel has a second side connected to the first side, and the binding composite layer has a stepped structure along a longitudinal section (i.e., a viewing angle shown in the drawing) of one side of the second side. Therefore, the impact resistance of the binding composite layer can be further improved. Specifically, the side of the step structure having the larger bonding area is disposed close to the side of the first adhesive layer 800, i.e., the side of the step structure having the smaller bonding area is closer to the control chip 300. Thereby, impact buffering can be better enhanced, so that stress is more dispersed. According to other embodiments of the application, the binding composite layer has a trapezoid shape in longitudinal section along the aforementioned second side. Referring to fig. 4, a longer one of two bottom sides of the trapezoid may be disposed near a display area side of the display panel. Therefore, the contact area between the display panel and the outer side of the display panel can be increased, impact can be buffered better, and stress is dispersed more. Therefore, the impact resistance of the binding composite layer can be further improved. According to some embodiments of the application, "longitudinal section having a trapezoidal shape" is to be understood in a broad sense. As long as the longitudinal section of one or more of the sub-layer structures in the binding compliance layer is trapezoidal. For example, as illustrated in fig. 4, the aforementioned trapezoidal shape may be constituted by only the cross section of the second functional sub-layer 222. Alternatively, according to other embodiments of the present application, the sides of the multiple sub-layer structure shown in fig. 4 may together form two side waists of a trapezoid.
According to an embodiment of the application, a first adhesive structure is arranged between the supporting sub-layer and the functional sub-layer, and the binding composite layer comprises a plurality of functional sub-layers. In some preferred embodiments, the two opposite surfaces of the supporting sub-layer are provided with functional sub-layers, and the side of the functional sub-layer far away from the supporting sub-layer is further provided with a second adhesive structure so as to achieve the bonding and fixing of the binding composite layer and other structures. For example, referring to fig. 5 and 7, the second adhesive structure may include the aforementioned first and third adhesive layers. Thus, the performance of the display panel can be further improved. The specific composition, thickness, etc. of the first adhesive structure and the second adhesive structure are not particularly limited as long as the adhesive fixing function can be realized. For example, the materials may be the same or different, and may be selected from the group consisting of foam rubber and acrylic rubber. The thickness may be no greater than 50 microns.
For example, as shown in fig. 4, the binding composite layer may have a support sub-layer 210, and first adhesive structures 231 and 232 disposed on both sides of the support sub-layer. The support sub-layer 210 may have a first functional sub-layer 221 on a side near the control chip (i.e., the third adhesive layer 900 shown in the drawing), and a second functional sub-layer 222 on a side near the display area of the display panel. In order to achieve the adhesion fixation of the binding composite layer and other structures, a second adhesive structure, namely a third adhesive layer 900 (for fixation with a chip binding area of the display panel) and a second adhesive layer 800 (for fixation with the back film 700), may be further arranged on the outer sides of the first and second functional sublayers. The material of the supporting sub-layer may be formed of materials including, but not limited to, PET, etc., and the first adhesive structures 231 and 232, and the first and third adhesive layers may be formed of adhesive materials, such as double sided adhesive. The first and second functional sublayers may be heat conducting sublayers and formed of metal or alloy, so that the heat dissipation function of the binding composite layer can be improved, for example, the binding composite layer may be formed of metal or alloy including but not limited to Cu, al, ti, etc., and the materials of the first and second functional sublayers may be the same or different. For example, according to other embodiments of the present application, one of the first and second functional sublayers may be formed of an inorganic thermally conductive material, such as graphite, and the other may be a metal or an alloy. For example, the first functional sub-layer 221 may be formed of graphite, so as to prevent the graphite from falling off from the layered structure during use, and falling on other conductive contact points such as circuits or terminals to cause short circuit, and the like, and one or both sides of the first functional sub-layer 221 may be covered with a waterproof adhesive to prevent the graphite from being exposed. The second functional sub-layer 222 may be formed of metal, for example, cu sheet, al sheet, or the like. According to other embodiments of the present application, the locations of the graphite-formed functional sub-layers and the metal-formed functional sub-layers may also be interchanged.
Alternatively, according to other embodiments of the present application, one of the first and second functional sublayers may be a buffer sublayer and the other may be a thermally conductive sublayer. Specifically, the second functional sub-layer 222 facing the display area side of the display panel may be a buffer sub-layer formed of a polymer material having a buffer capability, including, but not limited to, foam. The first functional sub-layer 221 facing the control chip may be a heat conducting sub-layer formed of the aforementioned inorganic material (such as graphite) or metal, alloy, etc. having a heat dissipation function.
In yet another aspect, the present application provides a display device. The display device comprises the display panel described above. Accordingly, the display device has all the features and advantages of the display panel described above, and will not be described herein. In general, the display device can realize folding and rolling functions and has better impact resistance.
The scheme of the present application will be explained below with reference to examples. It will be appreciated by those skilled in the art that the following examples are illustrative of the present application and should not be construed as limiting the scope of the application. The examples are not to be construed as limiting the specific techniques or conditions described in the literature in this field or as per the specifications of the product. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
Preparing a binding composite layer:
example 1
The supporting sub-layer adopts a PET film, two sides of the PET film are provided with glue layers, the first functional sub-layer adopts a Cu sheet, and the second functional sub-layer adopts foam.
Example 2
The support sub-layer adopts foam, two sides of the foam are provided with adhesive layers, the first functional sub-layer adopts an Al sheet, and the second functional sub-layer is omitted (one side close to the display area).
Ball drop impact test:
the bound composite layers formed in example 1 and example 2 were combined with the display panel 100 to form a test sample according to the structure shown in fig. 7, wherein the cover film layer 400 was made of a flexible material. Ball drop impact conditions were as follows:
ball drop mass m=36.25 g
Diameter of pellet: phi 20mm
Ball height: 10mm of
The test results showed that no impact marks such as dents were present on the side of the cover sheet film 400 containing the test samples of example 1 and example 2. Therefore, the binding composite layer can effectively relieve the defect of poor shock resistance of the display panel with the flexible cover plate film layer.
In the description of the present specification, reference to the term "one embodiment," "another embodiment," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction. In addition, it should be noted that, in this specification, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.
Claims (9)
1. A display panel, comprising:
the display substrate is provided with a display area, a bending area and a chip binding area, wherein the bending area is arranged on one side of the display area and bends towards one side deviating from the light emitting side of the display area, and the chip binding area is connected with the display area through the bending area;
the control chip is positioned on the chip binding area, and the control chip is positioned on one side of the chip binding area away from the light emitting side of the display area;
the binding composite layer is positioned between the bending area and the display area, and at least comprises a supporting sub-layer and a functional sub-layer, and the functional sub-layer is arranged towards one side of the control chip;
the bending area is positioned at one side of the first side of the display substrate, the display panel is provided with a second side connected with the first side, and the longitudinal section of the binding composite layer along one side of the second side is in a trapezoid shape.
2. The display panel of claim 1, wherein the support sub-layer satisfies at least one of the following conditions:
the hardness of the supporting sub-layer is greater than that of the rubber material;
the support sub-layer is selected from at least one of PET, inorganic carbon material and ceramic.
3. The display panel of claim 1, wherein the functional sub-layer comprises at least one of the following structures:
the material forming the heat conduction sublayer comprises graphite and at least one of Cu and Al;
and the material forming the buffer sub-layer comprises a high polymer material with elasticity.
4. A display panel according to claim 3, characterized in that the buffer sub-layer is located on the side of the support sub-layer facing away from the control chip.
5. A display panel according to claim 3, wherein a first adhesive structure is arranged between the supporting sub-layer and the functional sub-layer, the binding composite layer comprises a plurality of the functional sub-layers, the functional sub-layers are arranged on two surfaces of the supporting sub-layers which are opposite to each other, and a second adhesive structure is further arranged on one side of the functional sub-layers away from the supporting sub-layers.
6. The display panel of claim 1, wherein the bending region is located at a first side of the display substrate, the display panel has a second side connected to the first side, and the binding composite layer has a stepped structure in a longitudinal section along the second side.
7. The display panel according to any one of claims 1 to 6, further comprising a cover film layer, wherein the cover film layer is located on a light emitting side of the display substrate and covers at least the display area, and a material forming the cover film layer is a polymer material.
8. The display panel of claim 7, further comprising at least one of the following structures:
the back film is positioned on one side, away from the light emitting side, of the display panel, and no overlap exists between the orthographic projection of the back film on the display substrate and the bending region;
a first adhesive layer located on a side of the back film facing away from the display panel;
the reinforcing support layer is positioned on one side of the bonding layer, which is away from the back film, and is contacted with the binding composite layer;
the polaroid is positioned on the light emitting side of the display panel;
the second bonding layer is positioned on one side of the polarizer, which is away from the light emitting side, and is contacted with the cover plate film layer.
9. A display device comprising the display panel of any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210394714.XA CN114743460B (en) | 2022-04-14 | 2022-04-14 | Display panel and display device |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003167230A (en) * | 2001-11-29 | 2003-06-13 | Sharp Corp | Display device, and method for manufacturing the same |
| CN111462634A (en) * | 2020-05-14 | 2020-07-28 | 京东方科技集团股份有限公司 | Display device |
| CN112634764A (en) * | 2021-01-06 | 2021-04-09 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN113658517A (en) * | 2021-09-18 | 2021-11-16 | 京东方科技集团股份有限公司 | Display module, assembly method thereof and display device |
| WO2022056995A1 (en) * | 2020-09-15 | 2022-03-24 | 武汉华星光电半导体显示技术有限公司 | Display apparatus |
| CN114333597A (en) * | 2022-01-07 | 2022-04-12 | 京东方科技集团股份有限公司 | Display module and display device |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003167230A (en) * | 2001-11-29 | 2003-06-13 | Sharp Corp | Display device, and method for manufacturing the same |
| CN111462634A (en) * | 2020-05-14 | 2020-07-28 | 京东方科技集团股份有限公司 | Display device |
| WO2022056995A1 (en) * | 2020-09-15 | 2022-03-24 | 武汉华星光电半导体显示技术有限公司 | Display apparatus |
| CN112634764A (en) * | 2021-01-06 | 2021-04-09 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN113658517A (en) * | 2021-09-18 | 2021-11-16 | 京东方科技集团股份有限公司 | Display module, assembly method thereof and display device |
| CN114333597A (en) * | 2022-01-07 | 2022-04-12 | 京东方科技集团股份有限公司 | Display module and display device |
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