CN114718986A - Full-suspension vibration isolation and isolation method and structure for electronic equipment - Google Patents
Full-suspension vibration isolation and isolation method and structure for electronic equipment Download PDFInfo
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- CN114718986A CN114718986A CN202210444686.8A CN202210444686A CN114718986A CN 114718986 A CN114718986 A CN 114718986A CN 202210444686 A CN202210444686 A CN 202210444686A CN 114718986 A CN114718986 A CN 114718986A
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- 238000002955 isolation Methods 0.000 title claims abstract description 76
- 239000000725 suspension Substances 0.000 title claims abstract description 30
- 239000000565 sealant Substances 0.000 claims abstract description 68
- 238000012546 transfer Methods 0.000 claims abstract description 36
- 238000013016 damping Methods 0.000 claims abstract description 13
- 238000004382 potting Methods 0.000 claims abstract description 9
- 230000009471 action Effects 0.000 claims abstract description 4
- 230000005284 excitation Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 13
- 229920002379 silicone rubber Polymers 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 8
- 238000013461 design Methods 0.000 claims description 4
- 239000000047 product Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013066 combination product Substances 0.000 description 1
- 229940127555 combination product Drugs 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/08—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with rubber springs ; with springs made of rubber and metal
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Abstract
The invention discloses a full-suspension type vibration isolation and isolation method and a structure of electronic equipment.A sensor part of the electronic equipment is respectively placed in a closed shell in a full-suspension manner, and a gap between the sensor part and the inner wall of the shell is filled by pouring sealant; completing the connection relation among all components of the electronic equipment before potting; the pouring sealant is used as a damping medium, the vibration transfer function of the pouring sealant meets the working requirement of electronic products, and when the vibration impact excitation source is transferred to the sensitive device through the shell and the pouring sealant, the vibration isolation and impact isolation of the electronic equipment are realized under the damping action of the pouring sealant. The invention can isolate vibration or impact in three directions and ensure that internal devices of the electronic equipment are not influenced by external mechanical environment.
Description
Technical Field
The invention relates to the technical improvement of anti-vibration impact of electronic equipment, in particular to a full-suspension type vibration isolation and impact isolation method and structure of electronic equipment, and belongs to the technical field of anti-vibration impact of electronic products.
Background
Depending on the environment in which the electronic device is used, the internal components of the electronic device may be subjected to vibration and impact from the external environment. Some devices are vibration sensitive devices, and their function or accuracy is adversely affected by strong vibration and high impact. For example, a gyroscope and an accelerometer in an inertial measurement unit belong to sensitive devices, and strong vibration or high impact of an external environment may change the internal structure of the device, resulting in other fault phenomena such as output saturation. It has been the research direction of those skilled in the art how to avoid the adverse effects of vibration and shock on the device, which may occur in both X, Y and Z directions of the space. Particularly, electronic products which have high requirements on precision and are sensitive to vibration and shock directly affect the normal use of the products if the problem of vibration and shock cannot be solved.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a full-suspension type vibration isolation and isolation method and a structure for electronic equipment.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the full-suspension vibration isolation and impact isolation method of the electronic equipment comprises the steps that sensor devices of the electronic equipment are respectively placed in a closed shell in a full-suspension mode, and gaps between the sensor devices and the inner wall of the shell are filled through pouring sealant; completing the connection relation among all components of the electronic equipment before potting; the pouring sealant is used as a damping medium, the vibration transfer function of the pouring sealant meets the working requirement of electronic products, and when the vibration impact excitation source is transferred to the sensitive device through the shell and the pouring sealant, the vibration isolation and impact isolation of the electronic equipment are realized under the damping action of the pouring sealant.
The pouring sealant is determined according to the following method: the ideal vibration transfer function of the electronic equipment is determined in advance, then different pouring sealants are respectively filled in gaps between the sensitive device and the inner wall of the shell, the actual vibration transfer functions of the different pouring sealants are detected through the vibration sensor, the error between the actual vibration transfer function and the ideal vibration transfer function meets the use requirement of the electronic equipment, and the pouring sealant corresponding to the actual vibration transfer function is the pouring sealant meeting the vibration transfer requirement.
The invention also provides a full-suspension vibration isolation and isolation structure of the electronic equipment, which comprises a frame, a shell and a cover plate, wherein at least a sensitive device of the electronic equipment is fixed on the frame, and the position relation of the sensitive device meets the design requirement; the frame after the sensitive device is fixed integrally forms a frame combination and is suspended in the shell, and a gap between the frame combination and the inner wall of the shell is filled with pouring sealant; the pouring sealant is used as a damping medium, and the vibration transfer function of the pouring sealant meets the working requirements of electronic products; the cover plate covers the opening of the shell to seal the sensitive device, the frame and the pouring sealant in the shell.
Preferably, the sensitive device is fixed on the frame by silicon rubber bonding; the bonding thickness is uniform and consistent everywhere.
Preferably, the bonding thickness range of the silicon rubber is 0.4-0.6 mm.
Specifically, the electronic device is an inertial measurement unit, and the corresponding sensitive devices are a gyroscope and an accelerometer.
Furthermore, the distance between the corner of the outer contour of the frame combination and the inner wall of the shell is 1-2 mm.
The frame is provided with a plurality of upward pillars, threaded holes along the length direction are machined in the centers of the end faces of the pillars and used for being connected with an external tool support, and the tool support is used for arranging the frame combination in a required position in the shell.
Preferably, the frame is provided with a plurality of mounting planes, and the sensitive device is fixed on the corresponding mounting planes to meet the required position relation.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the sensitive device is suspended in the shell, the space between the sensitive device and the inner wall of the shell is filled with the pouring sealant, and the pouring sealant is selected to enable the vibration transfer function to meet the use requirement of the electronic equipment, so that the pouring sealant is used as a damping medium, vibration isolation and impact isolation can be effectively realized, the device cannot be adversely affected by impact and vibration within a certain external strength, and the application field and the environment of the electronic equipment are enlarged.
2. The invention has flexible arrangement, except for sensitive devices which are sensitive to vibration and impact in electronic equipment, other devices can be encapsulated in the pouring sealant according to requirements, and the device has special requirements on position relation and connection relation and can be processed according to special requirements; the treatment is carried out according to the principle of convenient production and processing without special requirements.
Drawings
Fig. 1 is a schematic view of the full suspension type vibration isolation and isolation structure of the invention.
Fig. 2 is a schematic diagram of the amplitude-frequency characteristic curve of the ideal vibration transfer function of the present invention.
FIG. 3 is a diagram illustrating a vibration transfer function test under different potting compounds.
Fig. 4 is a schematic structural view of a sensitive device pasting tool according to the present invention.
Fig. 5 is a top view of the potting tool of the present invention.
Fig. 6 is a cross-sectional view of the potting tool of the present invention.
Detailed Description
The invention is described in further detail below with reference to the following figures and detailed description.
The invention relates to a full-suspension type vibration isolation and impact method of electronic equipment, which is characterized in that sensor parts of the electronic equipment are respectively placed in a closed shell in a full-suspension manner, and gaps between the sensor parts and the inner wall of the shell are filled by pouring sealant; completing the connection relation among all components of the electronic equipment before potting; the pouring sealant is used as a damping medium, the vibration transfer function of the pouring sealant meets the working requirement of electronic products, and when the vibration impact excitation source is transferred to the sensitive device through the shell and the pouring sealant, the vibration isolation and impact isolation of the electronic equipment are realized under the damping action of the pouring sealant.
Because all pouring sealants do not meet the vibration isolation and impact isolation requirements of the invention, the pouring sealants need to be determined in advance and then are produced in batches after the pouring sealants are determined. The pouring sealant is predetermined according to the following method: the ideal vibration transfer function of the electronic equipment is determined in advance, then different pouring sealants are respectively filled in gaps between the sensitive device and the inner wall of the shell, the actual vibration transfer functions of the different pouring sealants are detected through the vibration sensor, the error between the actual vibration transfer function and the ideal vibration transfer function meets the use requirement of the electronic equipment, and the pouring sealant corresponding to the actual vibration transfer function can be determined to be the pouring sealant meeting the vibration transfer requirement.
Based on the vibration isolation and isolation method and principle, the invention provides a full-suspension type vibration isolation and isolation structure of electronic equipment, and simultaneously, referring to fig. 1, the vibration isolation and isolation structure comprises a frame 3, a shell 2 and a cover plate 1, wherein at least sensitive devices of the electronic equipment are fixed on the frame, and the position relation of the sensitive devices meets the design requirements; the frame after the sensitive device is fixed integrally forms a frame combination and is suspended in the shell, and a gap between the frame combination and the inner wall of the shell is filled by pouring sealant 6; the pouring sealant 6 is used as a damping medium, and the vibration transfer function of the pouring sealant meets the working requirements of electronic products; the cover plate 1 covers the opening of the housing 2 to enclose the sensitive device, the frame 3 and the pouring sealant 6 in the housing.
As an embodiment, the electronic device is an inertial measurement unit, and the corresponding sensitive devices are a gyroscope 4 and an accelerometer 5, because the gyroscope and the accelerometer are sensitive to vibration shock.
Connection relation of the frame, the gyroscope and the accelerometer device: in order to avoid internal stress caused by inconsistent expansion degrees of different materials when the temperature changes due to different thermal expansion coefficients of a frame material and materials of a gyro and an accelerometer, the gyro and the accelerometer cannot be directly and fixedly connected on the plane of the frame, but are bonded on the plane of the frame by using silicon rubber, other sensitive devices also need to be considered, and the bonding thicknesses of all parts are uniform and consistent. Preferably, the bonding thickness range of the silicon rubber is 0.4-0.6 mm.
The relationship of the space between the outer contour corner of the frame combination and the shell is as follows: in order to ensure the vibration isolation and impact isolation performance, the distance between the corner of the outer contour of the frame combination and the inner wall of the shell is 1-2 mm.
The frame is used for pouring a sealant process: the frame is provided with a plurality of upward struts, the number of the struts on the frame is 3 or 4 in the embodiment, threaded holes along the length direction are machined in the centers of the end faces of the struts, the threaded holes are used for being connected with an external tool support, and the tool support is used for arranging the frame combination at a required position in the shell.
Fig. 1 is a schematic view of a vibration isolation and isolation structure designed by taking an inertial measurement unit as an example, and the full-suspension type vibration isolation and isolation structure is mainly divided into three parts:
1. frame combination: the sensitive device gyroscope 4 and the accelerometer 5 are bonded on mutually orthogonal planes on the frame 3 through silicon rubber, and the bonded whole forms a frame combination.
2. Housing and cover plate: the shell 2 provides the installation fixing and the reference of the whole product, the inner cavity of the shell is used for containing the frame combination and the pouring sealant, and the cover plate 1 seals the whole product.
3. Pouring sealant: and the frame combination is suspended and fixed in the inner cavity of the shell by using pouring sealant 6, and the parallel or vertical geometric relationship between the sensitive device gyroscope 4 and the accelerometer 5 and an external reference is ensured.
The shell, the potting adhesive and the inner frame are combined to form a mass, spring and damping system. According to the vibration or impact condition of the external environment of the product, the vibration transfer function of the system is designed and realized, and the purposes of vibration isolation and impact isolation are achieved.
The amplitude-frequency characteristic curve of the ideal vibration transfer function of the full-suspension type vibration isolation and isolation structure is shown in figure 2. The transfer function amplitude-frequency characteristic effectively attenuates high-frequency-band impact in an impact test condition curve, can effectively protect the gyroscope, enables the gyroscope to normally work in a high-impact or strong-vibration environment, has no resonance amplification in a medium-low frequency band, and meets the requirement of inertia measurement on dynamic performance.
The pouring sealant plays a role in vibration isolation and impact isolation in the whole structure. The type and performance of the glue directly affect the amplitude-frequency characteristic curve of the vibration transfer function, so the vibration transfer function needs to be debugged by selecting the type of the pouring glue. The specific method comprises the following steps: as shown in fig. 3, a vibration sensor 14 is fixedly connected to the frame assembly, and the actual vibration transfer function is obtained through a vibration test. And selecting pouring sealants of different models and testing to obtain different vibration transfer functions. And selecting the pouring sealant corresponding to the vibration transfer function which is consistent with the pouring sealant in the figure 2 or has the error within the allowable range as the determined pouring sealant.
The assembly process of the full-suspension type vibration isolation and impact isolation structure of the electronic equipment is divided into two procedures: 1. and 2, a sensitive device bonding procedure and a glue pouring procedure. The sensitive device bonding process is to bond the gyroscope and the accelerometer on each plane of the frame to form a frame combination, and the thickness requirements of the silicon rubber layers are consistent. In the pouring sealant process, the frame combination is suspended and fixed in the inner cavity of the shell of the product, and the sensitive axial direction of the sensitive device is required to be parallel or vertical to the reference surface of the shell.
Correspondingly, the assembly tool of the invention comprises two major parts, namely a sensitive device pasting tool and a potting tool. The sensitive device pasting tool is used for pasting and fixing the sensitive device on the frame to form a frame combination; the encapsulation tool is mainly used for suspending the assembled frame combination in the shell to determine the position and completing the pouring of the pouring sealant. The sensitive device pasting tool and the encapsulating tool are respectively explained in detail below.
Sensitive device pasting tool
Referring to fig. 4, the sensitive device attaching tool includes a base 7 and a slide positioning block 8; the middle position of the upper surface of the base 7 is provided with a frame positioning concave cavity which is used for placing a frame and is circumferentially limited by the side wall of the frame positioning concave cavity. The number of the sliding positioning blocks 8 is consistent with the number of the sensitive devices which need to be pasted on the frame through the sliding positioning blocks. The side surface of the base 7 is provided with sliding chutes which are in one-to-one correspondence with the sliding positioning blocks, and the sliding positioning blocks 8 are arranged in the corresponding sliding chutes and can slide to the middle part of the base 7 along the sliding chutes so as to be close to the frame in the frame positioning concave cavity; the sliding groove on the base determines the axial direction of the gyroscope or the accelerometer. Each sliding positioning block is provided with a clamping groove, the clamping groove is used for being inserted into a circuit board connected with the sensitive device, and the circuit board is in place when being inserted into the bottom of the clamping groove. The circuit board is perpendicular to the sliding direction of the sliding positioning block along the sliding chute along the inserting direction of the clamping groove. In the embodiment, three (two gyros and accelerometers) among four sensitive devices of the electronic equipment need to be adhered through the sliding positioning block 8, so the sliding positioning block 8 is three, the side surface of the base 7 is correspondingly provided with three sliding grooves, two of the sliding grooves are oppositely arranged, and the sliding direction of the third sliding groove is vertical to the sliding direction of the first two sliding grooves.
In the embodiment, the direction of the clamping groove is vertical extension; the direction of the sliding groove is transversely extended. The direction of the clamping groove is set, so that the sensitive device can be conveniently taken out after being stuck and the frame combination is conveniently taken out.
In order to prevent the sliding positioning block 8 from being displaced before the sensitive device is cured after being stuck in place (displacement before curing can cause the sticking position of the sensitive device to be changed therewith), the invention is provided with a locking rod 9 on the outer side surface of the sliding positioning block 8, which is back to the frame positioning cavity, two ends of the locking rod 9 are provided with through holes, and two ends of the locking rod 9 are connected with the base 7 through connecting pieces (such as screws) penetrating through the through holes so as to limit the movement of the sliding positioning block 8.
Because the inertia measurement unit in the embodiment relates to three gyros and one accelerometer, two gyros and two accelerometers can be guided by the sliding positioning block to be pasted in place by the sliding groove on the side surface of the base, and the other gyro is different from the base in direction, the invention considers that the gyros are pasted downwards from the top of the base from the angle of convenient assembly and taking out after assembly, so that the frame assembly can be separated from the bottom to the top after the gyroscopic orientation is pasted in place. Therefore, the upper end of the base is provided with two upward bosses which are used for supporting two ends of the circuit board connected with the sensitive device (namely, the other gyroscope) so as to enable the corresponding sensitive device to be suspended downwards and to be opposite to the pasting position on the frame positioned in the frame positioning cavity. The boss is provided with a pin hole, a positioning pin is fixedly inserted in the pin hole, positioning holes corresponding to the positioning pin are arranged at two ends of the corresponding circuit board, and the positioning holes at two ends of the circuit board are sleeved on the positioning pin to realize the positioning of the circuit board on the boss. When the circuit board is installed on the boss through the positioning pin, the other top is suspended on the base downwards and is opposite to the surface, needing to be installed, of the frame in the base. Thus, the bonding and fixing with the frame can be realized only by coating silicon rubber on the bonding surface of the other spinning top.
Filling and sealing tool
Referring to fig. 5 and 6, the encapsulation tool comprises a base 10 and a hoisting frame 11 buckled above the base, wherein a shell placing cavity for placing a shell is arranged in the middle of the base 10, and the base is positioned and fixed by a reference edge and a thread connection. Grooves are formed in two sides of the base structure and used for positioning the hoisting frame 11, and threaded holes are used for fixing. The hoisting frame is composed of a main board and supporting plates extending downwards at two ends of the main board, and the lower ends of the supporting plates are supported at two sides of the upper surface of the base and are fixedly connected through connecting pieces. The mainboard and the two supporting plates are integrally of an inverted U-shaped structure. The lower surface of the main board is provided with a plurality of hanging piles which are used for being fixedly connected with the frame and enabling the sensitive devices fixed on the frame to suspend in the required positions in the shell. An opening is formed in the position, corresponding to the base shell placing cavity, of the main board, and pouring sealant is poured into the shell placed in the shell placing cavity through the opening; all the hanging piles are positioned at two sides of the opening.
In order to realize multi-batch one-time assembly, the housing placing cavities are multiple and are uniformly arranged on the upper surface of the base in a matrix manner. The hoisting frames 11 are arranged side by side, the number of hoisting piles on each hoisting frame is multiple, and each group of hoisting piles is used for fixing a frame; the number of the openings on the hoisting frame corresponds to the number of the hoisting pile groups; the number of groups of the hanging piles on the hanging frame corresponds to the number of the cavities for placing the shells one by one.
And all openings corresponding to the housing placing cavity on each hoisting frame are communicated to form a large opening.
In order to facilitate the fixing of the hoisting frame 11 and the base 10, the lower end of the supporting plate is outwards and horizontally turned over and is attached to the upper surface of the base, and the turned-over part is fixedly connected with the base through a connecting piece (such as a screw 12).
In the embodiment, each group of hanging piles is composed of four hanging piles, two hanging piles are arranged on two sides of the opening, and the four hanging piles correspond to threaded holes in the full-suspension type vibration isolation and impact isolation structure frame. Each pile has a through hole in the middle through which a screw 12 passes and is connected with a threaded hole on the frame assembly 13 to fix the frame. The design of the position and the length of the hoisting frame hoisting pile needs to ensure that the frame combination is positioned in the middle of the inner cavity of the shell.
The invention relates to a method for assembling a full-suspension vibration isolation and isolation structure of electronic equipment, which comprises the following steps,
1) acquiring the assembling tool of the electronic equipment full-suspension type vibration isolation and impact isolation structure;
2) placing a shell of a full-suspension type vibration isolation and isolation structure of the electronic equipment in a shell placing concave cavity on a base of the filling and sealing tool and fixing the shell on the base through screw connection;
3) adhering the sensitive device to the corresponding position of the frame to form a frame combination;
4) the frame combination is fixedly connected with the hoisting frame in a mode of fixedly connecting the frame with the hoisting pile;
5) fixing the hoisting frame on the base to enable the sensitive device on the frame assembly to suspend at a required position in the shell;
6) pouring a pouring sealant into the shell through the opening on the main board until the sensitive device is submerged for a certain height;
7) and after the pouring sealant is solidified, loosening the connection between the hoisting frame and the combination of the base and the frame, taking down the hoisting frame, loosening the connection between the shell and the base, taking down the embedded and sealed inertia measurement combination product, and finally covering the cover plate.
Specifically, step 3) is carried out as follows,
3.1) installing a frame in the full-suspension type vibration isolation and isolation structure of the electronic equipment in a frame positioning concave cavity in the middle of the upper surface of the base;
3.2) inserting the sensitive device to be adhered into the corresponding clamping groove on the sliding positioning block through the circuit board connected with the sensitive device, then placing the adhering surface of the sensitive device upwards, and smearing a proper amount of silicon rubber on the adhering surface of the sensitive device;
3.3) horizontally placing the sliding groove corresponding to the sliding positioning block to be installed on the base upwards to enable the sliding direction of the sliding groove to be in the vertical direction; then inserting the sliding positioning block provided with the sensitive device in the step 3.2) into a sliding groove of the base to enable the sticking surface of the sensitive device to be downward, and sliding the sliding positioning block downwards along the sliding groove until the sticking surface of the sensitive device is stuck with the corresponding surface of the frame on the base; the adhesive tape is not required to be additionally stressed during pasting, and only the sliding positioning block and the sensitive device are required to be naturally pressed down by utilizing the gravity of the sliding positioning block and the sensitive device;
3.4) limiting the sliding positioning block on the base through a locking rod on the back of the sliding positioning block, wherein two ends of the locking rod are connected with the base through connecting pieces;
3.5) repeating the steps 3.2) -3.4), and finishing the pasting of other sensitive devices and the corresponding surfaces of the frame;
and 3.6) after the silicon rubber is solidified, taking the frame out of the frame positioning cavity, and simultaneously sliding the circuit board of each sensitive device out of the corresponding clamping groove of the sliding positioning block to obtain the frame combination with the sensitive devices and the frame adhered together.
Because the top surface is also required to be pasted with the gyroscope, two upward bosses are arranged at the upper end of the base and used for supporting two ends of a circuit board connected with the gyroscope at the position, so that the corresponding gyroscope is suspended downwards and is opposite to the pasting position on the frame positioned in the frame positioning concave cavity; the boss is provided with a pin hole, and a positioning pin is inserted in the pin hole; and 3) when the sensitive device is adhered to the corresponding position of the frame, after the sensitive device at the corresponding position of the sliding chute is adhered, coating a proper amount of silicon rubber on the adhering surface of the sensitive device connected with the boss, sleeving the positioning holes at the two ends of the corresponding circuit board on the positioning pins to realize the positioning of the circuit board on the boss, and adhering the sensitive device to the surface downward and corresponding to the frame.
The above examples of the present invention are merely illustrative of the present invention and are not intended to limit the embodiments of the present invention. Variations and modifications in other variations will occur to those skilled in the art upon reading the foregoing description. Not all embodiments are exhaustive. All obvious changes and modifications of the present invention are within the scope of the present invention.
Claims (9)
1. The full-suspension vibration isolation and isolation method for the electronic equipment is characterized by comprising the following steps: the sensor parts of the electronic equipment are respectively arranged in a closed shell in a full-suspension manner, and gaps between the sensor parts and the inner wall of the shell are filled by pouring sealant; completing the connection relation among all components of the electronic equipment before potting; the pouring sealant is used as a damping medium, the vibration transfer function of the pouring sealant meets the working requirement of electronic products, and when the vibration impact excitation source is transferred to the sensitive device through the shell and the pouring sealant, the vibration isolation and impact isolation of the electronic equipment are realized under the damping action of the pouring sealant.
2. The electronic device full-suspension vibration isolation and isolation method according to claim 1, wherein: the pouring sealant is determined according to the following method: the ideal vibration transfer function of the electronic equipment is determined in advance, then different pouring sealants are respectively filled in gaps between the sensitive device and the inner wall of the shell, the actual vibration transfer functions of the different pouring sealants are detected through the vibration sensor, the error between the actual vibration transfer function and the ideal vibration transfer function meets the use requirement of the electronic equipment, and the pouring sealant corresponding to the actual vibration transfer function is the pouring sealant meeting the vibration transfer requirement.
3. Electronic equipment hangs vibration isolation and dashes structure entirely, its characterized in that: the electronic equipment comprises a frame, a shell and a cover plate, wherein at least a sensitive device of the electronic equipment is fixed on the frame, and the position relation of the sensitive device meets the design requirement; the frame after the sensitive device is fixed integrally forms a frame combination and is suspended in the shell, and a gap between the frame combination and the inner wall of the shell is filled with pouring sealant; the pouring sealant is used as a damping medium, and the vibration transfer function of the pouring sealant meets the working requirements of electronic products; the cover plate covers the opening of the shell to seal the sensitive device, the frame and the pouring sealant in the shell.
4. The electronic device full-suspension vibration isolation and isolation structure according to claim 3, wherein: the sensitive device is fixedly bonded on the frame through silicon rubber; the bonding thickness is uniform and consistent everywhere.
5. The electronic device full-suspension vibration isolation and isolation structure according to claim 4, wherein: the range of the bonding thickness of the silicon rubber is 0.4-0.6 mm.
6. The electronic device full-suspension vibration isolation and isolation structure according to claim 3, wherein: the electronic equipment is an inertia measurement unit, and the corresponding sensitive devices are a gyroscope and an accelerometer.
7. The electronic device full-suspension vibration isolation and isolation structure according to claim 3, wherein: the space between the frame combination outer contour corner and the shell inner wall is 1-2 mm.
8. The electronic device full-suspension vibration isolation and isolation structure according to claim 3, wherein: the frame is provided with a plurality of upward pillars, threaded holes along the length direction are machined in the centers of the end faces of the pillars and used for being connected with an external tool support, and the tool support is used for arranging the frame combination in a required position in the shell.
9. The electronic device full-suspension vibration isolation and isolation structure according to claim 3, wherein: the frame is provided with a plurality of mounting planes, and the sensitive devices are fixed on the corresponding mounting planes to meet the required position relation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210444686.8A CN114718986A (en) | 2022-04-26 | 2022-04-26 | Full-suspension vibration isolation and isolation method and structure for electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210444686.8A CN114718986A (en) | 2022-04-26 | 2022-04-26 | Full-suspension vibration isolation and isolation method and structure for electronic equipment |
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| CN114718986A true CN114718986A (en) | 2022-07-08 |
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000297557A (en) * | 1999-04-14 | 2000-10-24 | Shimizu Corp | Viscoelastic damper |
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