CN114716633A - Polyethylene glycol modified melamine resin and preparation method and application thereof - Google Patents
Polyethylene glycol modified melamine resin and preparation method and application thereof Download PDFInfo
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- CN114716633A CN114716633A CN202210235100.7A CN202210235100A CN114716633A CN 114716633 A CN114716633 A CN 114716633A CN 202210235100 A CN202210235100 A CN 202210235100A CN 114716633 A CN114716633 A CN 114716633A
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- polyethylene glycol
- melamine resin
- modified melamine
- phenol
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- 229920000877 Melamine resin Polymers 0.000 title claims abstract description 45
- 239000002202 Polyethylene glycol Substances 0.000 title claims abstract description 39
- 229920001223 polyethylene glycol Polymers 0.000 title claims abstract description 39
- 239000004640 Melamine resin Substances 0.000 title claims abstract description 28
- 150000007974 melamines Chemical class 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title description 5
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims abstract description 42
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 36
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 18
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims abstract description 16
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002904 solvent Substances 0.000 claims abstract description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 229940068918 polyethylene glycol 400 Drugs 0.000 claims description 11
- -1 polyethylene Polymers 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 239000013557 residual solvent Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 abstract description 13
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 abstract description 12
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 description 13
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
- 230000033228 biological regulation Effects 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 239000011188 CEM-1 Substances 0.000 description 3
- 101100257127 Caenorhabditis elegans sma-2 gene Proteins 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 102000002423 Octamer Transcription Factor-6 Human genes 0.000 description 1
- 108010068113 Octamer Transcription Factor-6 Proteins 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 235000019658 bitter taste Nutrition 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 238000009223 counseling Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002085 irritant Substances 0.000 description 1
- 231100000021 irritant Toxicity 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000575 pesticide Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/12—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
- C08G14/10—Melamines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses polyethylene glycol modified melamine resin, aiming at providing modified melamine resin which has toughness and low water absorption and does not contain nonyl phenol; the technical scheme comprises the following components in parts by weight: 80-120 parts of polyethylene glycol, 50-70 parts of phenol, 180-class melamine, 2-3 parts of p-toluenesulfonic acid, 2.5-3.5 parts of triethanolamine, 4-5 parts of triethylamine, 330-class 430 parts of formaldehyde and 270-class 330 parts of solvent; relates to the technical field of copper-clad plates.
Description
Technical Field
The invention relates to a resin, in particular to polyethylene glycol modified melamine resin, and also relates to a preparation method of the polyethylene glycol modified melamine resin; belongs to the technical field of copper-clad plates.
Background
Polyethylene glycol (PEG) is a high molecular polymer with the chemical formula of HO (CH)2CH2O)nH, no irritation, slightly bitter taste, good water solubility and good compatibility with a plurality of organic components. Has excellent lubricity, moisture retention, dispersibility and bonding agent, can be used as an antistatic agent, a softening agent and the like, and has extremely wide application in the industries of cosmetics, pharmacy, chemical fiber, rubber, plastics, papermaking, paint, electroplating, pesticides, metal processing, food processing and the like.
The molecular structure of the polyethylene glycol is a long flexible carbon chain, and the polyethylene glycol contains a large number of ether bonds to endow the polyethylene glycol with toughness, and in addition, the hydroxyl groups at two ends of the molecule can participate in the reaction with phenol and have good hydrophilicity, so the polyethylene glycol is very suitable for replacing nonyl phenol to be used for toughening and modifying phenolic resin, and is prepared into water-soluble resin for impregnating insulating paper. Meanwhile, compared with nonyl phenol, polyethylene glycol is non-toxic, harmless, non-irritant, environment-friendly and free of adverse effects on human, animal and plant contact.
The polyethylene glycol has different properties according to different relative molecular masses, and from colorless, odorless and sticky liquid to waxy solid, the molecular weight is too small, the toughening effect is insufficient, and the molecular weight is too large, so that the permeability of the resin to paper fibers is influenced.
The european union, "legislation on chemical registration, evaluation, licensing and restrictions" (simply "REACH") has been formally implemented. According to the regulatory requirements, the eu committee will establish a unified chemical monitoring and management system and complete the management of all relevant chemicals 2012 ago. The REACH regulation has a wider influence range than the instructions implemented in the european union in recent years, and it incorporates about 3 ten thousand chemical products and downstream products such as textiles, light industry, and pharmaceuticals in the market of the european union into 3 management and monitoring systems respectively for registration, evaluation, and approval, and products not incorporating the management systems cannot be sold in the market of the european union, and REACH is a regulation for the european union to perform preventive management on all chemicals entering the market thereof.
As a major concern of REACH regulations, the list of highly focused Substance (SVHC) candidates has undergone many updates since REACH was effective. On 19/1/2021, eu chemical administration (ECHA) added 2 substances from the new counseling list to the official SVHC candidate list, by which time the SVHC candidate list had been increased to 211.
If any SVHC candidate substance with the concentration of more than 0.1% is contained in the 'goods' product released into the European Union market, European Union manufacturers or importers should fulfill the obligation of notice, notice and the like specified by the REACH regulation: when the consumer consults, the relevant information is provided to the consumer within 45 days; at levels > 0.1% and total quantities of this material entering the eu of >1 ton/year, eu producers or importers must first notify ECHA product party for market in the eu. If a product (e.g., paint, ink, etc.) of the "substance or mixture" type contains an SVHC candidate, the manufacturer should provide safety specifications (SDS) to downstream users. And from 5/1/2021, the supplier of the goods must report the information of the SVHC substances in the goods in the SCIP database of ECHA according to the requirement of the european union "waste framework directive".
Nonyl phenol is newly added to the eighth SVHC list formally effective 12/19/2012. And nonyl phenol is mainly used for modifying phenolic resin, and the flexibility is provided for the product by virtue of the flexible long chain at the ortho position of the phenolic hydroxyl. Although the amount of nonylphenol added to the whole plate is small, the limit of nonylphenol is occasionally exceeded during actual inspection. This will greatly affect the exit of my board and downstream products. Therefore, while the toughness of the plate is not reduced, the nonyl phenol is necessarily eliminated from the formula
Disclosure of Invention
In view of the above problems, the present invention is directed to a modified melamine resin which has both toughness and low water absorption and which does not contain nonylphenol.
Therefore, the first technical scheme provided by the invention is as follows:
the polyethylene glycol modified melamine resin comprises the following components in parts by weight: 80-120 parts of polyethylene glycol, 50-70 parts of phenol, 180-class melamine, 2-3 parts of p-toluenesulfonic acid, 2.5-3.5 parts of triethanolamine, 4-5 parts of triethylamine, 330-class 430 parts of formaldehyde and 270-class 330 parts of solvent.
Further, the polyethylene glycol modified melamine resin comprises the following components in parts by weight: 100 parts of polyethylene glycol, 60 parts of phenol, 210 parts of melamine, 2.5 parts of p-toluenesulfonic acid, 3.0 parts of triethanolamine, 4.6 parts of triethylamine, 380 parts of formaldehyde and 300 parts of solvent.
Further, the polyethylene glycol modified melamine resin is characterized in that the solvent comprises 190 parts of water by 150-140 parts of methanol by 120-140 parts.
Further, the polyethylene glycol modified melamine resin is characterized in that the polyethylene glycol is polyethylene glycol 400.
Therefore, the second technical scheme provided by the invention is the preparation method of the polyethylene glycol modified melamine resin, which is characterized by sequentially comprising the following steps of:
1) adding 80-120 parts of polyethylene glycol 400, 8-12 parts of phenol, 18-22 parts of melamine, 60-80 parts of water and all p-toluenesulfonic acid weighed above into a reaction kettle, stirring, heating to 85-95 ℃, and keeping the temperature for 1.5 hours; then adding 2.5-3.5 parts of triethanolamine and cooling to 75-85 ℃;
2) adding 4-5 parts of triethylamine and 430 parts of 330-containing organic formaldehyde into the step 1), heating the residual phenol, melamine and formaldehyde in the step 1) to 90-100 ℃, keeping the temperature for 20 minutes, then beginning to take 10ml of resin to test the mixing degree of water, stopping heating when the mixing degree reaches 150ml of 100-containing organic formaldehyde, adding the residual solvent to cool, and taking out the mixture from the kettle when the temperature is lower than 60 ℃.
The last technical scheme provided by the invention is that the polyethylene glycol modified melamine resin is used as the first glue for producing and bonding the copper-clad plate.
Compared with the prior art, the technical scheme provided by the invention has the following technical advantages:
1. according to the technical scheme provided by the invention, the CEM-1 prepared by modifying the phenolic resin by using the polyethylene glycol instead of nonylphenol is more solder-tolerant than the existing resin.
2. Compared with the first resin currently used in the production line, the polyethylene glycol modified phenolic resin provided by the invention has good stability, is still clear and transparent when standing for one month in a room temperature environment, and has no phenomena of layering, turbidity and the like, while the original nonylphenol modified phenolic resin has a layering phenomenon after standing for one day at the room temperature.
3. The polyethylene glycol modified phenolic resin is used, so that the addition of nonyl phenol can be avoided in the production process of the CEM-1 board, the CEM-1 board is ensured to completely meet the full REACH regulation, and the influence on the board and the product yield of a downstream PCB due to the excessive nonyl phenol is avoided.
Detailed Description
The following detailed description of the invention is to be construed as exemplary only and does not limit the invention to the specific embodiments which are set forth in any way whatsoever, as any one can make limited number of modifications within the scope of the appended claims.
The following examples are given by way of routine experimentation and practice in the art, unless otherwise indicated.
Example 1
The invention provides polyethylene glycol modified melamine resin which comprises the following components in parts by weight: 120 parts of polyethylene glycol 400, 70 parts of phenol, 180 parts of melamine, 3 parts of p-toluenesulfonic acid, 2.5 parts of triethanolamine, 5 parts of triethylamine, 330 parts of formaldehyde, 150 parts of water and 120 parts of methanol.
Example 2
The invention provides polyethylene glycol modified melamine resin which comprises the following components in parts by weight: 80 parts of polyethylene glycol 400, 50 parts of phenol, 240 parts of melamine, 2 parts of p-toluenesulfonic acid, 3.5 parts of triethanolamine, 4 parts of triethylamine, 430 parts of formaldehyde, 150 parts of water and 140 parts of methanol.
Example 3
The invention provides polyethylene glycol modified melamine resin which comprises the following components in parts by weight: 90 parts of polyethylene glycol 400, 55 parts of phenol, 200 parts of melamine, 2.5 parts of p-toluenesulfonic acid, 3 parts of triethanolamine, 4.5 parts of triethylamine, 350 parts of formaldehyde, 170 parts of water and 130 parts of methanol.
Example 4
The invention provides polyethylene glycol modified melamine resin which comprises the following components in parts by weight: 100 parts of polyethylene glycol 400, 60 parts of phenol, 210 parts of melamine, 2.5 parts of p-toluenesulfonic acid, 3 parts of triethanolamine, 4.6 parts of triethylamine, 400 parts of formaldehyde, 190 parts of water and 140 parts of methanol.
Example 5
The invention provides polyethylene glycol modified melamine resin which comprises the following components in parts by weight: 100 parts of polyethylene glycol 400, 60 parts of phenol, 210 parts of melamine, 2.5 parts of p-toluenesulfonic acid, 3.0 parts of triethanolamine, 4.6 parts of triethylamine, 380 parts of formaldehyde, 170 parts of water and 130 parts of methanol.
The preparation method of the polyethylene glycol modified melamine resin provided in examples 1 to 5 sequentially comprises the following steps:
1) adding the polyethylene glycol 400, the phenol 16 wt%, the melamine 10 wt%, the water 60 wt% and all the p-toluenesulfonic acid weighed in the embodiments 1 to 5 into a reaction kettle, stirring, heating to 85-95 ℃, and keeping the temperature for 1.5 hours; then adding 2.5-3.5 parts of triethanolamine and cooling to 75-85 ℃;
2) adding the triethylamine and the formaldehyde weighed in the embodiments 1 to 5 into the step 1), heating the residual phenol, the melamine and the formaldehyde in the step 1) to 90-100 ℃ again, keeping the temperature for 20 minutes, then beginning to take 10ml of resin to test the mixing degree of water, stopping heating when the mixing degree reaches 150ml of resin, adding the residual solvent to cool, and taking out the mixture from the kettle when the temperature is lower than 60 ℃.
The first glue solution for preparing the copper-clad plate by adopting the polyethylene glycol modified melamine resin prepared in the claim 1 is prepared by uniformly mixing 833 parts by weight of the polyethylene glycol modified melamine resin (PPM resin for short) provided in the embodiment 1 to 5 with 167 parts by weight of methanol.
Specific indexes of the polyethylene glycol-modified melamine resins provided in examples 1 to 5 are shown in table 1:
remarking: solid content test method: removing 2+/-0.2g of PPM resin glue solution, baking for 1 hour in an oven at the temperature of 135 ℃, weighing the rest net weight resin, dividing the weight by the net weight of the resin glue solution, and multiplying by 100 percent; the first glue solution is baked in an oven at the baking temperature of 150 ℃ for 1 hour, and the testing methods are consistent;
method for testing the degree of mixing of water: weighing 10+/-0.1ml of PPM resin by using a 200ml measuring cylinder, adding water, continuously shaking to fully mix the water with the resin, stopping adding the water when the milky color of the resin slowly appears and is not changed, and visually observing the amount of the added water to obtain the mixing degree of the water;
to better demonstrate the advantages of the solutions provided in the present application, experimental data of the dipping formulations of the solutions provided in comparative example 1 and example 5 are given below, see table 2.
The melamine resin provided in comparative example 1 is prepared by a one-step method, namely 100 parts of polyethylene glycol 400, 60 parts of phenol and 380 parts of formaldehyde are put into a reaction kettle, 4.6 parts of triethylamine is added, the temperature is raised to 92-95 ℃, the temperature is kept for reaction for 30-40 minutes, then sampling is carried out, the gelling time is detected, when the gelling time reaches 180-280 seconds, the temperature is cooled to 45 ℃, and methanol is added and mixed uniformly to obtain a phenolic resin solution.
Remarking: the test plate is a single-sided plate with a thickness of 1.6 mm.
Claims (6)
1. The polyethylene glycol modified melamine resin is characterized by comprising the following components in parts by weight: 80-120 parts of polyethylene glycol, 50-70 parts of phenol, 180-class melamine, 2-3 parts of p-toluenesulfonic acid, 2.5-3.5 parts of triethanolamine, 4-5 parts of triethylamine, 330-class 430 parts of formaldehyde and 270-class 330 parts of solvent.
2. The polyethylene glycol-modified melamine resin according to claim 1, which comprises the following components in parts by weight: 100 parts of polyethylene glycol, 60 parts of phenol, 210 parts of melamine, 2.5 parts of p-toluenesulfonic acid, 3.0 parts of triethanolamine, 4.6 parts of triethylamine, 380 parts of formaldehyde and 300 parts of solvent.
3. The polyethylene glycol-modified melamine resin according to claim 1 or 2, wherein said solvent comprises 190 parts of water and 140 parts of methanol in a range of 150-.
4. The polyethylene glycol-modified melamine resin according to claim 1 or 2, wherein the polyethylene glycol is polyethylene glycol 400.
5. The method for producing the polyethylene glycol-modified melamine resin according to claim 1, comprising the steps of, in order:
1) adding 80-120 parts of polyethylene glycol 400, 8-12 parts of phenol, 18-22 parts of melamine, 60-80 parts of water and all p-toluenesulfonic acid weighed according to claim 1 into a reaction kettle, stirring, heating to 85-95 ℃, and keeping the temperature for 1.5 hours; then adding 2.5-3.5 parts of triethanolamine and cooling to 75-85 ℃;
2) adding 4-5 parts of triethylamine and 430 parts of 330-containing organic formaldehyde into the step 1), heating the residual phenol, melamine and formaldehyde in the step 1) to 90-100 ℃, keeping the temperature for 20 minutes, then beginning to take 10ml of resin to test the mixing degree of water, stopping heating when the mixing degree reaches 150ml of 100-containing organic formaldehyde, adding the residual solvent to cool, and taking out the mixture from the kettle when the temperature is lower than 60 ℃.
6. The polyethylene glycol modified melamine resin of claim 1, which is used as a first glue for bonding in the production of copper-clad plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210235100.7A CN114716633A (en) | 2022-03-11 | 2022-03-11 | Polyethylene glycol modified melamine resin and preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210235100.7A CN114716633A (en) | 2022-03-11 | 2022-03-11 | Polyethylene glycol modified melamine resin and preparation method and application thereof |
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| CN114716633A true CN114716633A (en) | 2022-07-08 |
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| CN202210235100.7A Pending CN114716633A (en) | 2022-03-11 | 2022-03-11 | Polyethylene glycol modified melamine resin and preparation method and application thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102690403A (en) * | 2012-06-15 | 2012-09-26 | 太尔胶粘剂(广东)有限公司 | Modified phenol formaldehyde resin and preparation method thereof |
| CN105461871A (en) * | 2015-12-17 | 2016-04-06 | 福建利豪电子科技股份有限公司 | Preparation method and application of cashew nut phenolic resin and manufacturing method of paper-based copper-clad plate |
| CN106432655A (en) * | 2016-09-13 | 2017-02-22 | 抚州市龙兴电子材料有限公司 | Epoxidized soybean oil modified phenolic resin as well as preparation method and application thereof |
| CN111763492A (en) * | 2020-07-13 | 2020-10-13 | 福建隆达竹业有限公司 | Modified melamine phenolic resin adhesive |
| CN113214444A (en) * | 2021-05-13 | 2021-08-06 | 建滔（佛冈）积层纸板有限公司 | PEG-400 modified phenolic resin glue solution and application thereof |
-
2022
- 2022-03-11 CN CN202210235100.7A patent/CN114716633A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102690403A (en) * | 2012-06-15 | 2012-09-26 | 太尔胶粘剂(广东)有限公司 | Modified phenol formaldehyde resin and preparation method thereof |
| CN105461871A (en) * | 2015-12-17 | 2016-04-06 | 福建利豪电子科技股份有限公司 | Preparation method and application of cashew nut phenolic resin and manufacturing method of paper-based copper-clad plate |
| CN106432655A (en) * | 2016-09-13 | 2017-02-22 | 抚州市龙兴电子材料有限公司 | Epoxidized soybean oil modified phenolic resin as well as preparation method and application thereof |
| CN111763492A (en) * | 2020-07-13 | 2020-10-13 | 福建隆达竹业有限公司 | Modified melamine phenolic resin adhesive |
| CN113214444A (en) * | 2021-05-13 | 2021-08-06 | 建滔（佛冈）积层纸板有限公司 | PEG-400 modified phenolic resin glue solution and application thereof |
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