CN114715835A - Semiconductor MEMS packaging structure and method - Google Patents
Semiconductor MEMS packaging structure and method Download PDFInfo
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- CN114715835A CN114715835A CN202210368120.1A CN202210368120A CN114715835A CN 114715835 A CN114715835 A CN 114715835A CN 202210368120 A CN202210368120 A CN 202210368120A CN 114715835 A CN114715835 A CN 114715835A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0083—Temperature control
- B81B7/009—Maintaining a constant temperature by heating or cooling
- B81B7/0093—Maintaining a constant temperature by heating or cooling by cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
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Abstract
The invention discloses a semiconductor MEMS packaging structure, comprising: packaging structure main part, prevent falling exhaust assembly, packaging structure main part includes base plate, sensor group, the sealing cap body, and sensor group sets up on the base plate, and the sealing cap body sets up on the base plate and covers and establish on sensor group, is provided with the exhaust hole on the sealing cap body, prevents falling exhaust assembly and sets up on the base plate to the sealing cap body is located prevents falling exhaust assembly. When the semiconductor MEMS packaging structure is used, heat generated by the work of the sensor group can be exhausted to the outside through the exhaust hole, and then the heat is further exhausted to the outside in an accelerated manner through the anti-falling exhaust assembly, so that the semiconductor MEMS packaging structure has a good cooling effect, good working environment temperature can be kept, and the working efficiency and the life cycle of the semiconductor MEMS packaging structure are prevented from being affected by heating and scalding. The invention also discloses a packaging method of the semiconductor MEMS packaging structure, which avoids the influence of heat and scalding on the working efficiency and the life cycle of the semiconductor MEMS packaging structure.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor MEMS packaging structure and a method.
Background
The MEMS microsensor is a general name of a series of microsensors designed, processed and packaged by means of MEMS technology, and includes a pressure sensor, a humidity sensor, a temperature sensor, an acceleration sensor, and the like. The packaging of the MEMS microsensor is the last step of the MEMS microsensor towards market acceptance and widespread use by customers, and is also a very critical step in the manufacturing of the MEMS microsensor. At present, in the packaging process of the MEMS chip, the MEMS chip may be exposed to high temperature environments for many times, such as chip mounting, housing mounting, and the like; and the condition of very warm use also can appear in the terminal application process, and current encapsulation is only simple trompil to the heat dissipation and is handled, leads to the working effect of chip not good. Therefore, there is a need for a semiconductor MEMS packaging method that at least partially solves the problems of the prior art.
Disclosure of Invention
In this summary, concepts in a simplified form are introduced that are further described in the detailed description. This summary of the invention is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
To at least partially solve the above problems, the present invention provides a semiconductor MEMS package structure, comprising: the packaging structure comprises a packaging structure main body and an anti-falling exhaust assembly, wherein the packaging structure main body comprises a substrate, a sensor group and a sealing cap body, the sensor group is arranged on the substrate, the sealing cap body is arranged on the substrate and covers the sensor group, an exhaust hole is formed in the sealing cap body, the anti-falling exhaust assembly is arranged on the substrate, and the sealing cap body is located in the anti-falling exhaust assembly.
According to the semiconductor MEMS packaging structure provided by the embodiment of the invention, the sensor group comprises the lining plate and the sensor chip, the lining plate is arranged in the packaging area of the substrate, the sensor chip is arranged on the chip area on the lining plate, and the periphery of the chip area is provided with the conductive pin group.
According to the semiconductor MEMS packaging structure provided by the embodiment of the invention, the periphery of the bottom of the packaging cap body is provided with the packaging fin plate, the packaging fin plate is provided with a plurality of packaging clamping grooves, two adjacent packaging clamping grooves are communicated, the packaging clamping grooves which are parallel at intervals are provided with the packaging clamping buckles in a matching mode, each packaging clamping buckle comprises a first clamping buckle seat, a second clamping buckle seat, a clamping buckle rod, a clamping buckle fixing rod and a clamping buckle spring, the first clamping buckle seat and the second clamping buckle seat are arranged on the preformed hole of the substrate, one end of each clamping buckle rod is hinged to the first clamping buckle seat, the clamping buckle rod is buckled in the packaging clamping groove, the other end of each clamping buckle seat is fixedly connected with the second clamping buckle seat through the clamping buckle fixing rod, and the clamping buckle spring is sleeved on the clamping buckle fixing rod and is positioned below the clamping buckle rod.
The semiconductor MEMS packaging structure according to the embodiment of the invention further comprises: the inner supporting assembly is arranged in the sealing cap body and comprises a lower bearing block, an upper bearing block and a plurality of middle energy absorption mechanisms, the lower bearing block is arranged on the base plate, a plurality of lower bearing rods are arranged on the lower bearing block, the middle energy absorption mechanisms are arranged on the lower bearing rods, the upper ends of the middle energy absorption mechanisms are provided with the upper bearing rods, and the upper bearing blocks are arranged on the upper bearing rods and abut against the inner top surface of the sealing cap body.
According to the semiconductor MEMS packaging structure of the embodiment of the invention, the middle energy absorbing mechanism comprises an outer skeleton energy absorbing set and an inner skeleton energy absorbing set, the outer skeleton energy absorbing set comprises an elastic skeleton, an outer C-shaped elastic plate, an inner support sliding inclined rod and an inner elastic telescopic rod, the inner skeleton energy absorbing set is arranged in the elastic skeleton, the upper end and the lower end of the elastic skeleton are respectively provided with a connecting boss, the two connecting bosses are respectively connected with the lower bearing rod and the upper bearing rod, the outer C-shaped elastic plate is provided with two connecting bosses which are respectively positioned on the outer walls of two sides of the elastic skeleton, the end part of the outer C-shaped elastic plate is provided with an outer tightening plate, the outer C-shaped elastic plate and the outer wall of the elastic skeleton are provided with an inner support sliding inclined rod and an inner elastic telescopic rod, the inner support sliding inclined rod is positioned above the inner elastic telescopic rod, and the lower end of the inner support sliding inclined rod is provided with a sliding guide disc, the sliding guide disc is connected with the outer wall of the elastic framework in a sliding mode.
According to the semiconductor MEMS packaging structure provided by the embodiment of the invention, the inner skeleton energy absorption group comprises a first energy absorption seat and two second energy absorption seats, the first energy absorption seat is arranged between the two second energy absorption seats, the first energy absorption seat comprises two bearing seat discs, a plurality of first elastic angle-shaped rods, a plurality of inner C-shaped elastic plates and a plurality of inner elastic discs, the upper ends and the lower ends of the first elastic angle-shaped rods are respectively connected with the upper bearing seat disc and the lower bearing seat disc, the inner C-shaped elastic plates are arranged on the inner wall of the first elastic angle-shaped rods, the inner elastic plates are arranged between the inner C-shaped elastic plates and the first elastic angle-shaped rods, and the inner elastic discs are fixedly connected with the inner C-shaped elastic plates.
According to the semiconductor MEMS packaging structure provided by the embodiment of the invention, the second energy absorption seat comprises second elastic angle-shaped rods, vertical rods and energy absorption springs, the vertical rods are arranged on the bearing seat disc, the two second elastic angle-shaped rods are arranged on the vertical rods, and the energy absorption springs are sleeved on the vertical rods and positioned between the second elastic angle-shaped rods.
According to the semiconductor MEMS packaging structure of the embodiment of the invention, the anti-falling exhaust assembly comprises an anti-falling outer cover, an anti-falling inner cover, an inner anti-falling backing plate and an air draft frame, wherein the anti-falling outer cover, the anti-falling inner cover, the inner anti-falling backing plate and the air draft frame are arranged on the inner side wall of the anti-falling inner cover, the anti-falling connecting frame is arranged on the periphery of the upper end of the anti-falling outer cover, the first outer air vent is arranged at each end of the anti-falling outer cover, the second outer air vent is arranged on the side wall of the anti-falling inner cover, a plurality of third outer air vents are arranged on the top of the anti-falling outer cover, the anti-falling inner cover and the inner anti-falling backing plate are arranged in the anti-falling outer cover, the openings are formed in the upper end and the lower end of the anti-falling inner cover, a plurality of air vent holes are arranged on the periphery of the anti-falling inner cover, the inner anti-falling backing plate is positioned above the anti-falling inner cover, so that the air vent holes correspond to the first outer air vent holes and the second outer air vent holes respectively, the air draft frame is arranged in the inner cover, the anti-falling inner cover, the bottom of the anti-falling inner cover is provided with four fixing holes, one of them the fixed orifices lateral wall is provided with the locking opening, be provided with in the fixed orifices and prevent falling the fastener, prevent falling the fastener and include the anchorage bar and prevent falling the spring, the upper end of anchorage bar passes in proper order the slide opening of base plate, fixed orifices, interior anti-falling backing plate extends to the interior top surface of preventing falling the dustcoat is connected, prevent falling the spring setting and be in on the anchorage bar and be located the fixed orifices, the both ends of convulsions frame all are provided with miniature air extractor, be provided with interior bleeder vent on the lateral wall of convulsions frame, interior bleeder vent with ventilative side opening, the outer bleeder vent of second correspond.
The invention also provides a packaging method of the semiconductor MEMS packaging structure, which comprises the following steps:
step (a), mounting a lining plate in a packaging area of a substrate, so that the lining plate is electrically connected with pins at the bottom of the substrate;
step (b), mounting a sensor chip on a chip area of a lining plate;
step (c), smearing sealing heat dissipation silica gel on a preassembly area of the substrate, wherein the preassembly area is positioned on the periphery of the lining plate;
step (d), mounting the sealing cap body on the preassembly area, and adhering the packaging fin plate of the sealing cap body to the sealing heat dissipation silica gel;
step (e), two packaging clips are arranged on two sides of the packaging cap body, and the packaging clips are fixedly connected with the substrate and are buckled in packaging clip grooves of the packaging clips;
step (f), installing the anti-falling exhaust assembly on the substrate, and enabling the sealing cap body to be located in the anti-falling exhaust assembly
The packaging method of the semiconductor MEMS packaging structure is characterized by further comprising the following steps: and (f), the step (f) is positioned between the step (c) and the step (d), and the step (f) is that the plurality of inner supporting components are respectively arranged on the periphery of the lining plate.
Compared with the prior art, the invention at least comprises the following beneficial effects:
1. the invention provides a semiconductor MEMS packaging structure, which comprises: packaging structure main part, prevent falling exhaust assembly, this packaging structure main part includes the base plate, sensor group, the sealing cap body, sensor group installs on the base plate, the sealing cap body is installed on the base plate and is covered on sensor group, the exhaust hole has been seted up here on the sealing cap body, it installs on the base plate to prevent falling exhaust assembly, and the sealing cap body is located prevents falling exhaust assembly, when using this semiconductor MEMS packaging structure, the heat that sensor group work produced can be discharged to the outside through the exhaust hole, then ground is discharged the heat to the external world with higher speed through preventing falling exhaust assembly, make this semiconductor MEMS packaging structure have good cooling effect, can keep good operational environment temperature, avoid generating heat and sending out heat and scalding work efficiency and the life cycle that influence semiconductor MEMS packaging structure.
2. The invention also provides a packaging method of the semiconductor MEMS packaging structure, which is characterized in that the anti-falling exhaust component is arranged on the substrate, when the semiconductor MEMS packaging structure is used, heat generated by the working of the sensor group can be exhausted to the outside through the exhaust hole, and then the heat is further exhausted to the outside in an accelerated manner through the anti-falling exhaust component, so that the semiconductor MEMS packaging structure has a good cooling effect, the good working environment temperature can be kept, and the working efficiency and the life cycle of the semiconductor MEMS packaging structure are prevented from being influenced by heating and scalding.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a front view of the structure of the present invention.
FIG. 2 is a schematic diagram of a sensor group according to the present invention.
FIG. 3 is a top view of the package structure of the present invention.
Fig. 4 is a schematic structural view of the packaging clip of the present invention.
Fig. 5 is a schematic structural view of the inner support assembly of the present invention.
FIG. 6 is a schematic structural view of an intermediate energy absorbing mechanism of the present invention.
FIG. 7 is a schematic structural view of an energy absorbing exoskeleton set in the present invention.
FIG. 8 is a schematic structural view of an energy absorbing endoskeleton assembly of the present invention.
FIG. 9 is a schematic view of the anti-crash vent assembly of the present invention.
Fig. 10 is a left side view of the structure of the drop-resistant housing of the present invention.
Fig. 11 is a schematic view of an explosion-proof vent assembly according to the present invention.
Detailed Description
The present invention is further described in detail below with reference to the drawings and examples so that those skilled in the art can practice the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1 to 11, the present invention provides a semiconductor MEMS package structure, including: the packaging structure comprises a packaging structure body 100 and an anti-falling exhaust assembly 4, wherein the packaging structure body 100 comprises a substrate 101, a sensor group and a cap sealing body 104, the sensor group is arranged on the substrate 101, the cap sealing body 104 is arranged on the substrate 101 and covers the sensor group, an exhaust hole is formed in the cap sealing body 104, the anti-falling exhaust assembly 4 is arranged on the substrate 101, and the cap sealing body 104 is located in the anti-falling exhaust assembly 4.
The working principle and the beneficial effects of the technical scheme are as follows: the invention provides a semiconductor MEMS packaging structure, which comprises: the packaging structure body 100 and the anti-falling exhaust assembly comprise a substrate 101, a sensor group and a sealing cap body 104, wherein the sensor group is mounted on the substrate 101, the sealing cap body 104 is mounted on the substrate 101 and covers the sensor group, an exhaust hole is formed in the sealing cap body 104, the anti-falling exhaust assembly 4 is mounted on the substrate 101, and the sealing cap body 104 is located in the anti-falling exhaust assembly 4, so when the semiconductor MEMS packaging structure is used, heat generated by the operation of the sensor group can be exhausted to the outside through the exhaust hole, and then the heat is further exhausted to the outside in an accelerated manner through the anti-falling exhaust assembly 4, so that the semiconductor MEMS packaging structure has a good cooling effect, a good working environment temperature can be kept, and the working efficiency and the life cycle of the semiconductor MEMS packaging structure are prevented from being influenced by heating and scalding.
In one embodiment, the sensor group includes a substrate 102 and a sensor chip 103, the substrate 102 is disposed on a packaging area of the substrate 101, the sensor chip 103 is disposed on a chip area 105 on the substrate 102, and a conductive lead group 106 is disposed around the chip area 105.
The working principle and the beneficial effects of the technical scheme are as follows:
the specific structure of the sensor group is provided in the implementation, the sensor group of the structure comprises a lining plate 102 and a sensor chip 103, specifically, the lining plate 102 is installed in a packaging area of a substrate 101, the sensor chip 103 is installed on a chip area 105 on the lining plate 102, a conductive pin group 106 is arranged around the chip area 105, so that the sensor chip 103 is located above the substrate 101 through the lining plate 102, heat generated in the working process of the sensor chip 103 can be discharged to the surrounding, the operation of the anti-falling exhaust component 4 is facilitated, the semiconductor MEMS packaging structure has a good cooling effect, a good working environment temperature can be kept, and the working efficiency and the life cycle of the semiconductor MEMS packaging structure are prevented from being affected by heat generation and scalding.
In one embodiment, a packaging fin plate 107 is disposed around the bottom of the cap body 104, a plurality of packaging clip grooves 108 are disposed on the packaging fin plate 107, two adjacent packaging clip grooves 108 are communicated with each other, the packaging clip grooves 108 spaced apart from each other and parallel to each other are provided with a packaging clip 2, the packaging clip 2 includes a first clip seat 201, a second clip seat 202, a clip rod 203, a clip fixing rod 204 and a clip spring 205, the first clip seat 201 and the second clip seat 202 are disposed on a preformed hole of the substrate 101, one end of the clip rod 203 is hinged to the first clip seat 201, the clip rod 203 is fastened in the packaging clip grooves 108, the other end of the clip rod is fixedly connected to the second clip seat 202 through the clip fixing rod 204, and the clip spring 205 is sleeved on the clip fixing rod 204 and located below the clip rod 203.
The working principle and the beneficial effects of the technical scheme are as follows: in this embodiment, a packaging fin 107 is installed around the bottom of the sealing cap body 104, and a plurality of packaging clip slots 108 are formed on the packaging fin 107, two adjacent packaging clip slots 108 are communicated with each other, so that the plurality of packaging clip slots 108 are shaped like a Chinese character jing, and a packaging clip 2 is disposed in the packaging clip slots 108 spaced apart from each other and parallel to each other, and the sealing cap body 104 can be quickly installed on the substrate 101 by the packaging clip 2, the packaging clip 2 includes a first clip seat 201, a second clip seat 202, a clip rod 203, a clip fixing rod 204, and a clip spring 205, specifically, the first clip seat 201 and the second clip seat 202 are fixedly installed on a preformed hole of the substrate 101, so that the first clip seat 201 and the second clip seat 202 are located on the same side of the sealing cap body 104, where one end of the clip rod 203 is hinged to the first clip seat 201, so that the clip rod 203 is rotatably fastened in the packaging clip slots 108, the other end is fixedly connected with the second clip seat 202 through the clip fixing rod 204, and the clip spring 205 is sleeved on the clip fixing rod 204 and located below the clip rod 203, so that when the packaging clip 2 needs to be opened, an operator only needs to open the clip fixing rod 204, and the clip spring 205 upwards pops up the clip rod 203, so that the packaging clip 2 is quickly opened, the cap body 104 can be taken down, and the efficiency is improved.
In one embodiment, further comprising: inner support assembly 3, inner support assembly 3 sets up in the cap body 104, inner support assembly 3 includes bearing block 31 down, goes up bearing block 32 and a plurality of middle energy-absorbing mechanism 33, bearing block 31 sets up down on the base plate 101, be provided with a plurality of lower carrier bars 311 down on the bearing block 31, middle energy-absorbing mechanism 33 sets up down on the carrier bar 311, the upper end of middle energy-absorbing mechanism 33 is provided with carrier bar 331, it sets up to go up bearing block 32 go up on the carrier bar 331 and support and push against the interior top surface of cap body 104.
The working principle and the beneficial effects of the technical scheme are as follows: in the embodiment, an inner supporting component 3 is fitted in the sealing cap body 104, and the inner supporting component 3 plays a role of shock resistance, and the inner supporting component 3 comprises a lower bearing block 31, an upper bearing block 32 and a plurality of middle energy absorption mechanisms 33, specifically, the lower bearing block 31 is mounted on the base plate 101, a plurality of lower bearing rods 311 are designed on the lower bearing block 31, and the middle energy absorbing mechanism 33 is fixedly arranged on the lower bearing rods 311, meanwhile, the upper end of the middle energy absorbing mechanism 33 is provided with an upper bearing rod 331, the upper bearing block 32 is arranged on the upper bearing rod 331, meanwhile, the upper bearing block 32 is propped against the inner top surface of the sealing cap body 104, when a vibration is transmitted to the inner supporting member 3 on the base plate 101, the middle energy absorbing mechanism 33 in the inner supporting member 3 deforms up and down to counteract the energy of the vibration, thereby playing an anti-seismic role and avoiding the semiconductor MEMS packaging structure from being broken and damaged.
In one embodiment, the middle energy absorbing mechanism 33 includes an outer skeleton energy absorbing set 34 and an inner skeleton energy absorbing set 35, the outer skeleton energy absorbing set 34 includes an elastic skeleton 341, an outer C-shaped elastic plate 342, an inner tension sliding diagonal bar 343 and an inner elastic telescopic bar 344, the inner skeleton energy absorbing set 35 is disposed in the elastic skeleton 341, the upper and lower ends of the elastic skeleton 341 are both provided with connecting bosses 345, the two connecting bosses 345 are respectively connected with the lower bearing bar 311 and the upper bearing bar 331, the outer C-shaped elastic plate 342 is provided with two elastic plates and is respectively located on the outer walls of the two sides of the elastic skeleton 341, the end of the outer C-shaped elastic plate 342 is provided with an outer tension plate 346, the outer C-shaped elastic plate 342 and the outer wall of the elastic skeleton 341 are provided with an inner tension sliding diagonal bar 343 and an inner elastic telescopic bar 344, the inner tension sliding diagonal bar 343 is located above the inner elastic telescopic bar 344, the lower end of the inner support sliding diagonal bar 343 is provided with a sliding guide disc 347, and the sliding guide disc 347 is connected with the outer wall of the elastic framework 341 in a sliding manner.
The working principle and the beneficial effects of the technical scheme are as follows: the embodiment provides a specific structure of the middle energy absorbing mechanism 33, the middle energy absorbing mechanism 33 of the structure includes an outer skeleton energy absorbing group 34 and an inner skeleton energy absorbing group 35, specifically, the outer skeleton energy absorbing group 34 includes an elastic skeleton 341, an outer C-shaped elastic plate 342, an inner strut sliding diagonal bar 343 and an inner elastic telescopic bar 344, where the inner skeleton energy absorbing group 35 is installed in the elastic skeleton 341, the upper and lower ends of the elastic skeleton 341 are both provided with connecting bosses 345, the two connecting bosses 345 are respectively connected with the lower bearing bar 311 and the upper bearing bar 331, the outer C-shaped elastic plate 342 is provided with two connecting bosses and respectively located on the outer walls of both sides of the elastic skeleton 341, the end of the outer C-shaped elastic plate 342 is provided with an outer tightening plate 346, the outer C-shaped elastic plate 342 and the outer wall of the elastic skeleton 341 are provided with the inner strut sliding diagonal bar 343 and the inner elastic telescopic bar 344, where the inner strut sliding diagonal bar 343 is located above the inner elastic telescopic bar 344, the lower end of the inner support sliding diagonal 343 is provided with a sliding guide disc 347, and the sliding guide disc 347 is connected with the outer wall of the elastic framework 341 in a sliding way; therefore, when the outer frame energy absorption set 34 receives vibration energy, the outer C-shaped elastic plate 342 and the elastic frame 341 are both outwardly supported, so that the outer C-shaped elastic plate 342 and the elastic frame 341 deform, the inner elastic telescopic rod 344 extends at this time, the inner support sliding inclined rod 343 can slide on the outer wall of the elastic frame 341, and then the outer C-shaped elastic plate 342 and the elastic frame 341 gradually recover to the original shape due to the tendency of the inner elastic telescopic rod 344 to counteract the vibration energy, thereby playing a role in resisting vibration and avoiding the semiconductor MEMS package structure from collapsing and being damaged.
In one embodiment, the inner frame energy absorption set 35 includes a first energy absorption seat 36, two second energy absorption seats 37, the first energy absorption seat 36 is disposed between the two second energy absorption seats 37, the first energy absorption seat 36 includes two carrier plates 361, a plurality of first resilient angle-shaped rods 362, a plurality of inner C-shaped elastic plates 363, and a plurality of inner elastic plates 364, upper and lower ends of the plurality of first resilient angle-shaped rods 362 are respectively connected to the upper and lower carrier plates 361, the inner C-shaped elastic plates 363 are disposed on inner walls of the first resilient angle-shaped rods 362, the inner elastic plates 364 are disposed between the inner C-shaped elastic plates 363 and the first resilient angle-shaped rods 362, and the inner elastic plates 364 are fixedly connected to the inner C-shaped elastic plates 363.
The working principle and the beneficial effects of the technical scheme are as follows: the embodiment provides a specific structure of an energy absorbing group 35 of an inner frame, the energy absorbing group 35 of the structure comprises a first energy absorbing seat 36, two second energy absorbing seats 37, specifically, the first energy absorbing seat 36 is installed between the two second energy absorbing seats 37, the first energy absorbing seat 36 comprises two carrier seat discs 361, a plurality of first resilient angle-type rods 362, a plurality of inner C-shaped elastic plates 363 and a plurality of inner elastic discs 364, the upper ends and the lower ends of the plurality of first resilient angle-type rods 362 are respectively connected with the upper and the lower carrier seat discs 361, the inner C-shaped elastic plates 363 are installed on the inner walls of the first resilient angle-type rods 362, the inner elastic discs 364 are installed between the inner C-shaped elastic plates 363 and the first resilient angle-type rods 362, and the inner elastic plates 364 are fixedly connected with the inner C-shaped elastic plates 363, because the first resilient angle-type rods 362 and the inner C-shaped elastic plates 363 are pressed by the upper and the lower second seats 37, the energy absorbing group maintains a bending shape and has elastic potential energy, therefore, when the vibration is transmitted into the inner frame energy absorption set 35, the inner first elastic angle-shaped rod 362 in the inner frame energy absorption set 35 is expanded outwards when being impacted by the vibration, at this time, the inner C-shaped elastic plate moves inwards to expand, then the first elastic angle-shaped rod 362 moves inwards again, the inner C-shaped elastic plate moves towards the first elastic angle-shaped rod 362, and the inner elastic disc 364 prevents the first elastic angle-shaped rod 362 and the inner C-shaped elastic plate from being too close to each other, so that the vibration energy is offset through the reciprocating action of the first elastic angle-shaped rod 362 and the inner C-shaped elastic plate, and a better vibration-resistant effect is achieved.
In one embodiment, the second energy-absorbing seat 37 includes second elastic angle-shaped rods 371, vertical rods 372 and energy-absorbing springs 373, the vertical rods 372 are disposed on the carrier tray 361, two second elastic angle-shaped rods 371 are disposed on the vertical rods 372, and the energy-absorbing springs 373 are sleeved on the vertical rods 372 and located between the second elastic angle-shaped rods 371.
The working principle and the beneficial effects of the technical scheme are as follows: the embodiment provides a specific structure of the second energy absorbing seat 37, the second energy absorbing seat 37 of the structure includes a second elastic angle-shaped rod 371, a vertical rod 372 and an energy absorbing spring 373, specifically, the vertical rod 372 is installed on the bearing seat disk 361, the upper end of the vertical rod 372 is connected with the inner wall of the elastic framework 341, two second elastic angle-shaped rods 371 are installed on the vertical rod 372, and the energy absorbing spring 373 is sleeved on the vertical rod 372 and is located between the second elastic angle-shaped rods 371; here, the two second energy absorbing seats 37 squeeze the first energy absorbing seat 36 towards the middle, so that the first elastic angle-shaped rod 362 and the inner C-shaped elastic plate 363 in the first energy absorbing seat 36 are kept in a bent shape and have elastic potential energy; therefore, when the vibration is transmitted to the second energy absorbing seat 37, the second energy absorbing seat 37 acts along with the outer framework energy absorbing set 34 and the first energy absorbing seat 36, when the elastic framework 341 and the first elastic angle-shaped rod 362 are outwards spread, the height of the whole middle energy absorbing mechanism 33 has a downward contraction trend, so that the second energy absorbing seat 37 moves towards the middle, the high speed of the whole middle energy absorbing mechanism 33 is further upwards raised, the second energy absorbing seat 37 moves towards two sides, and the height of the whole middle energy absorbing mechanism 33 is repeatedly contracted and raised until the whole middle energy absorbing mechanism is restored to the original state, so that the vibration energy is counteracted, the effect of counteracting the semiconductor MEMS packaging structure is further achieved, the semiconductor MEMS packaging structure is prevented from being cracked and damaged, and the life cycle of the semiconductor MEMS packaging structure is prolonged.
In one embodiment, further comprising: prevent falling exhaust subassembly 4, prevent falling exhaust subassembly 4 and set up on base plate 101, and the sealing cap body 104 is located prevent falling exhaust subassembly 4 is interior, prevent falling exhaust subassembly 4 including preventing falling dustcoat 41, preventing falling inner cover 42, interior fall backing plate 43 and convulsions frame 44 of preventing falling, the upper end of preventing falling dustcoat 41 all is provided with all around and prevents falling even frame 411, and both ends are provided with first outer ventilative hole 412 respectively, are provided with second outer bleeder hole 413 on the lateral wall, and the top is provided with a plurality of third outer ventilative holes 414, prevent falling inner cover 42, interior fall backing plate 43 all set up prevent falling in the dustcoat 41, the upper and lower end of preventing falling inner cover 42 all link up the opening, prevent all being provided with a plurality of ventilative side holes 421 on the lateral wall all around of falling inner cover 42, interior fall backing plate 43 of preventing is located prevent falling inner cover 42's top, make a plurality of ventilative side hole 421 respectively with first outer ventilative hole 412, The outer bleeder vent 413 of second corresponds, convulsions frame 44 sets up in preventing falling inner cover 42, the bottom of preventing falling inner cover 42 is provided with four fixed orificess 422, one of them the fixed orifices 422 lateral wall is provided with locking opening 423, be provided with in the fixed orifices 422 and prevent falling fastener 423, prevent falling fastener 423 including anchorage bar 424 and prevent falling spring 425, anchorage bar 424's upper end passes in proper order the sliding hole of base plate 101, fixed orifices 422, interior anti-falling backing plate 43 extends to prevent falling the interior top surface of outer cover 41 and connect, prevent falling spring 425 and set up on anchorage bar 424 and be located the fixed orifices 422, the both ends of convulsions frame 44 all are provided with miniature air extractor 441, be provided with interior bleeder vent 442 on convulsions frame 44's the lateral wall, interior bleeder vent 442 with ventilative side hole 421, the outer bleeder vent 413 of second correspond.
The working principle and the beneficial effects of the technical scheme are as follows: the embodiment provides a specific structure of the anti-falling exhaust assembly 4, the anti-falling exhaust assembly 4 is mounted on the substrate 101 and is covered outside the sealing cap body 104, so that the sealing cap body 104 is positioned in the anti-falling exhaust assembly 4, and heat is exhausted to the outside in an accelerated manner through the anti-falling exhaust assembly 4, so that the semiconductor MEMS packaging structure has a good cooling effect, can keep a good working environment temperature, and avoids heating and scalding to influence the working efficiency and the life cycle of the semiconductor MEMS packaging structure;
the anti-falling exhaust assembly 4 comprises an anti-falling outer cover 41, an anti-falling inner cover 42, an inner anti-falling base plate 43 and an air draft frame 44, and particularly, the periphery of the upper end of the anti-falling outer cover 41 is provided with an anti-falling connecting frame 411, so that the anti-falling connecting frame 411 is elastic and is provided with a plurality of anti-falling holes, and the anti-falling connecting frame 411 has better deformation capability after being vibrated or contacted with the ground, so that the energy of vibration can be offset, and the anti-falling effect is achieved; the two ends of the anti-falling outer cover 41 are respectively provided with a first outer ventilation hole 412, the side wall is provided with a second outer ventilation hole 413, and the top is provided with a plurality of third outer ventilation holes 414, so when the air draft frame 44 is positioned in the anti-falling inner cover 42 to work, the two ends of the air draft frame 44 are provided with the micro air extractors 441, the micro air extractors 441 continuously discharge hot air exhausted by the sealing cap body 104 outwards, and the hot air is extracted to the air side hole 421 and the second outer ventilation hole 413 through the micro air extractors 441 and the inner ventilation holes 442 to be discharged outwards; meanwhile, an inner anti-falling base plate 43 is arranged between the anti-falling inner cover 42 and the anti-falling outer cover 41, so that the anti-falling exhaust assembly 4 has a good anti-seismic and anti-falling effect; further, because the bottom of the anti-falling inner cover 42 is provided with four fixing holes 422, one of the fixing holes 422 has a side wall opened with a locking opening 423, the anti-falling fastener 423 is inserted into the fixing hole 422, the anti-falling fastener 423 comprises a fastening rod 424 and an anti-falling spring 425, the upper end of the fastening rod 424 passes through the base plate 101, the fixing hole 422, the sliding hole of the inner anti-falling backing plate 43 in sequence and extends to the inner top surface of the anti-falling outer cover 41 to be connected, here, the anti-falling spring 425 is installed on the fastening rod 424 and located in the fixing hole 422, so the anti-falling inner cover 42 is connected to the anti-falling outer cover 41, and meanwhile, the air draft frame 44 is also fixed in the anti-falling inner cover 42.
The invention also provides a packaging method of the semiconductor MEMS packaging structure, which comprises the following steps:
step a, mounting a lining plate 102 in a packaging area of a substrate 101, so that the lining plate 102 is electrically connected with pins at the bottom of the substrate 101;
step b, mounting the sensor chip 103 on the chip area 105 of the lining plate 102;
c, smearing sealing heat dissipation silica gel on a preassembly area of the substrate 101, wherein the preassembly area is positioned on the periphery of the lining plate 102;
d, mounting the cap sealing body 104 on the preassembly area, so that the packaging fin 107 of the cap sealing body 104 is adhered to the sealing heat dissipation silica gel;
step e, installing two packaging clips 2 on two sides of the cap body 104, wherein the packaging clips 2 are fixedly connected with the substrate 101 and are buckled in the packaging clip grooves 108 of the packaging clips 2;
and f, mounting the anti-falling exhaust assembly 4 on the substrate 101, and enabling the cap sealing body 104 to be located in the anti-falling exhaust assembly 4.
Further, still include: step f and step h, wherein the step f is positioned between the step c and the step d, and the step f is to install the plurality of inner support assemblies 3 on the periphery of the lining plate 102 respectively; step h follows step e.
The working principle and the beneficial effects of the technical scheme are as follows: the invention also provides a packaging method of the semiconductor MEMS packaging structure, which is characterized in that the anti-falling exhaust component is arranged on the substrate, when the semiconductor MEMS packaging structure is used, heat generated by the working of the sensor group can be exhausted to the outside through the exhaust hole, and then the heat is further exhausted to the outside in an accelerated manner through the anti-falling exhaust component, so that the semiconductor MEMS packaging structure has a good cooling effect, the good working environment temperature can be kept, and the working efficiency and the life cycle of the semiconductor MEMS packaging structure are prevented from being influenced by heating and scalding.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
While embodiments of the invention have been disclosed above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in various fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.
Claims (10)
1. A semiconductor MEMS package structure, comprising: packaging structure main part (100), prevent falling exhaust subassembly (4), packaging structure main part (100) includes base plate (101), sensor group, the cap body (104), the sensor group sets up on base plate (101), cap body (104) set up on base plate (101) and cover establish on the sensor group, be provided with the exhaust hole on the cap body (104), prevent falling exhaust subassembly (4) and set up on base plate (101), and cap body (104) are located prevent falling exhaust subassembly (4).
2. A semiconductor MEMS package structure according to claim 1, wherein the sensor group comprises a substrate (102), a sensor chip (103), the substrate (102) is disposed on a package region of the substrate (101), the sensor chip (103) is disposed on a chip region (105) on the substrate (102), and a group of conductive pins (106) is disposed around the chip region (105).
3. The semiconductor MEMS packaging structure according to claim 1, wherein a packaging fin plate (107) is disposed around the bottom of the packaging cap body (104), the packaging fin plate (107) is provided with a plurality of packaging clip grooves (108), two adjacent packaging clip grooves (108) are mutually communicated, the packaging clip grooves (108) which are spaced and parallel are provided with packaging clips (2), each packaging clip (2) comprises a first clip seat (201), a second clip seat (202), a clip rod (203), a clip fixing rod (204) and a clip spring (205), the first clip seat (201) and the second clip seat (202) are disposed on a prepared hole of the substrate (101), one end of the clip rod (203) is hinged to the first clip seat (201), and the clip rod (203) is fastened in the packaging clip groove (108), the other end of the connecting rod is fixedly connected with the second clamping seat (202) through a clamping fixing rod (204), and a clamping spring (205) is sleeved on the clamping fixing rod (204) and is positioned below the clamping rod (203).
4. The semiconductor MEMS package structure of claim 1, further comprising: interior vaulting subassembly (3), interior vaulting subassembly (3) set up in the cap body (104), interior vaulting subassembly (3) are including bearing block (31) down, last bearing block (32) and a plurality of middle energy-absorbing mechanism (33), bearing block (31) set up down on base plate (101), be provided with a plurality of lower carrier bar (311) down on bearing block (31), middle energy-absorbing mechanism (33) set up down on bearing bar (311), the upper end of middle energy-absorbing mechanism (33) is provided with carrier bar (331), it sets up to go up bearing block (32) go up on bearing bar (331) and support the top surface in the cap body (104).
5. The semiconductor MEMS packaging structure according to claim 4, wherein the middle energy absorbing mechanism (33) comprises an outer frame energy absorbing set (34) and an inner frame energy absorbing set (35), the outer frame energy absorbing set (34) comprises an elastic frame (341), an outer C-shaped elastic plate (342), an inner support sliding diagonal rod (343) and an inner elastic telescopic rod (344), the inner frame energy absorbing set (35) is disposed in the elastic frame (341), the upper and lower ends of the elastic frame (341) are both provided with connecting bosses (345), the two connecting bosses (345) are respectively connected with the lower bearing rod (311) and the upper bearing rod (331), the outer C-shaped elastic plate (342) is provided with two connecting bosses respectively located on the outer walls of the two sides of the elastic frame (341), and the end of the outer C-shaped elastic plate (342) is provided with an outer tightening plate (346), an inner supporting sliding inclined rod (343) and an inner elastic telescopic rod (344) are arranged on the outer walls of the outer C-shaped elastic plate (342) and the elastic framework (341), the inner supporting sliding inclined rod (343) is located above the inner elastic telescopic rod (344), a sliding guide disc (347) is arranged at the lower end of the inner supporting sliding inclined rod (343), and the sliding guide disc (347) is in sliding connection with the outer wall of the elastic framework (341).
6. The semiconductor MEMS package structure of claim 5, the inner framework energy absorption group (35) comprises a first energy absorption seat (36) and two second energy absorption seats (37), the first energy absorbing seat (36) is arranged between the two second energy absorbing seats (37), the first energy absorbing seat (36) comprises two bearing seat discs (361), a plurality of first elastic angle-shaped rods (362), a plurality of inner C-shaped elastic plates (363) and a plurality of inner elastic discs (364), the upper ends and the lower ends of the first elastic angle-shaped rods (362) are respectively connected with the upper bearing seat disc (361) and the lower bearing seat disc (361), the inner C-shaped elastic plate (363) is arranged on the inner wall of the first elastic angle-shaped rod (362), the inner spring plate (364) is arranged between the inner C-shaped spring plate (363) and the first elastic angle-shaped rod (362), and the inner spring plate (364) is fixedly connected with the inner C-shaped spring plate (363).
7. The semiconductor MEMS package structure of claim 6, wherein the second energy absorbing seat (37) comprises second elastic angle-shaped rods (371), vertical rods (372) and energy absorbing springs (373), the vertical rods (372) are disposed on the carrier tray (361), two second elastic angle-shaped rods (371) are disposed on the vertical rods (372), and the energy absorbing springs (373) are sleeved on the vertical rods (372) and located between the second elastic angle-shaped rods (371).
8. The semiconductor MEMS package structure of claim 1, further comprising: prevent falling exhaust subassembly (4) including preventing falling dustcoat (41), preventing falling inner cover (42), interior fall backing plate (43) and convulsions frame (44) of preventing, the upper end of preventing falling dustcoat (41) all is provided with all around and prevents falling even frame (411), and both ends are provided with first outer ventilative hole (412) respectively, are provided with second outer bleeder vent (413) on the lateral wall, and the top is provided with outer ventilative hole (414) of a plurality of third, prevent falling inner cover (42), interior fall backing plate (43) of preventing all setting up in preventing falling dustcoat (41), the last lower extreme of preventing falling inner cover (42) all has link up the opening, prevent all being provided with a plurality of ventilative side openings (421) on the lateral wall all around of falling inner cover (42), interior fall backing plate (43) of preventing is located the top of falling inner cover (42), make a plurality of ventilative side opening (421) respectively with first outer ventilative hole (412), The second outer ventilation holes (413) correspond to each other, the air draft frame (44) is arranged in the anti-falling inner cover (42), the bottom of the anti-falling inner cover (42) is provided with four fixing holes (422), one of the fixing holes (422) is provided with a locking opening (423), an anti-falling fastener (423) is arranged in each fixing hole (422), the anti-falling fastener (423) comprises a fastening rod (424) and an anti-falling spring (425), the upper end of the fastening rod (424) sequentially penetrates through the sliding holes of the base plate (101), the fixing holes (422) and the inner anti-falling base plate (43) and extends to the inner top surface of the anti-falling outer cover (41) to be connected, the anti-falling spring (425) is arranged on the fastening rod (424) and located in the fixing holes (422), the two ends of the air draft frame (44) are respectively provided with a micro air exhauster (441), the side wall of the air draft frame (44) is provided with inner ventilation holes (442), the inner vent holes (442) correspond to the vent side holes (421) and the second outer vent holes (413).
9. A packaging method of a semiconductor MEMS packaging structure is characterized by comprising the following steps:
step (a), mounting a lining plate (102) in a packaging area of a substrate (101) so that the lining plate (102) is electrically connected with pins at the bottom of the substrate (101);
a step (b) of mounting the sensor chip (103) on the chip region (105) of the backing plate (102);
step (c), smearing sealing heat dissipation silica gel on a preassembly area of the substrate (101), wherein the preassembly area is positioned on the periphery of the lining plate (102);
step (d), installing the sealing cap body (104) on the preassembly area, and enabling the packaging fin plate (107) of the sealing cap body (104) to be bonded to the sealing heat dissipation silica gel;
and (e) installing two packaging clips (2) on two sides of the packaging cap body (104), wherein the packaging clips (2) are fixedly connected with the substrate (101) and are buckled in packaging clip grooves (108) of the packaging clips (2).
10. The packaging method of the semiconductor MEMS packaging structure, according to claim 9, further comprising: step (f) and step (h), wherein the step (f) is positioned between the step (c) and the step (d), and the step (f) is to install a plurality of internal support components (3) on the periphery of the lining plate (102) respectively; and (f) mounting the anti-falling exhaust assembly (4) on the substrate (101) after the step (h) is carried out, and enabling the cap sealing body (104) to be located in the anti-falling exhaust assembly (4).
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