CN114713974B - Laser cutting method, device, equipment and storage medium - Google Patents

Laser cutting method, device, equipment and storage medium Download PDF

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Publication number
CN114713974B
CN114713974B CN202210241209.1A CN202210241209A CN114713974B CN 114713974 B CN114713974 B CN 114713974B CN 202210241209 A CN202210241209 A CN 202210241209A CN 114713974 B CN114713974 B CN 114713974B
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China
Prior art keywords
laser cutting
cutting
micro
cutting head
laser
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CN114713974A (en
Inventor
张明治
张亚旭
封雨鑫
陈焱
高云峰
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Shenzhen Han's Smart Control Technology Co ltd
Han s Laser Technology Industry Group Co Ltd
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Shenzhen Han's Smart Control Technology Co ltd
Han s Laser Technology Industry Group Co Ltd
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Priority to CN202210241209.1A priority Critical patent/CN114713974B/en
Publication of CN114713974A publication Critical patent/CN114713974A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention provides a laser cutting method, a device, equipment and a storage medium, wherein the laser cutting method comprises the following steps: controlling a laser cutting head to cut a workpiece along a preset cutting path; when the laser cutting head moves to the mark point, confirming the connection type of the micro-connection area; if the connection type of the micro-connection area is the first connection type, the cutting speed of the laser cutting head is unchanged, and other cutting parameters of the laser cutting head are adjusted to be preset values. In the laser cutting process, the cutting effect of the laser cutting head is changed in real time at the mark point, so that the upper part of the micro-connection area is cut off by the laser cutting head, the micro-connection area has certain connection strength, and the connection of the two sides of a workpiece can be maintained through the micro-connection area, thereby avoiding the situations of falling off of a cut part of the workpiece, tilting of the workpiece and the like.

Description

Laser cutting method, device, equipment and storage medium
Technical Field
The present invention relates to the field of laser processing technologies, and in particular, to a laser cutting method, device, apparatus, and storage medium.
Background
Laser cutting equipment is often used in the industrial machinery industry, and when the laser cutting equipment processes a workpiece, the conditions of falling of a workpiece cutting part, tilting of the workpiece and the like can occur, so that the problems of poor processing safety, easiness in damaging the workpiece and the like are caused.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present application provides a laser cutting method, apparatus, device and storage medium, which can form a micro-connection area on a workpiece, and avoid the occurrence of workpiece dropping, workpiece tilting, and the like.
The embodiment adopts the following technical scheme:
a laser cutting method comprising the steps of:
controlling a laser cutting head to cut a workpiece along a preset cutting path;
when the laser cutting head moves to the mark point, confirming the connection type of the micro-connection area;
If the connection type of the micro-connection area is the first connection type, the cutting speed of the laser cutting head is unchanged, and other cutting parameters of the laser cutting head are adjusted to be preset values.
Further, in the laser cutting method, other cutting parameters of the laser cutting head include laser power, laser frequency and laser duty cycle.
Further, in the laser cutting method, the method further includes the steps of:
If the connection type of the micro-connection area is the second connection type, the laser light source is turned off, and the laser cutting head is lifted to a preset height.
Further, in the laser cutting method, the method further includes the steps of:
calculating the moving distance of the laser cutting head along the cutting direction in real time;
and when the distance of the laser cutting head moving along the cutting direction reaches the preset length of the micro-connection area, the cutting mode of the laser cutting head is adjusted in real time.
Further, in the laser cutting method, the step of calculating the distance of the laser cutting head moving along the cutting direction in real time includes a calculation formula:
wherein S xy is the distance that the laser cutting head moves along the cutting direction, and S xyi is the distance that the laser cutting head moves in a single interpolation period.
Further, in the laser cutting method, after the step of adjusting the cutting mode of the laser cutting head in real time after the distance of the laser cutting head moving along the cutting direction reaches the preset length of the micro-connection area, the method further includes the steps of:
after the laser cutting head is controlled to complete cutting along the preset cutting path, the laser cutting head is controlled to cut along the next cutting path, and whether the next cutting path has mark points is judged in advance.
Further, in the laser cutting method, the method further includes the steps of:
and acquiring processing parameter information, wherein the processing parameter information comprises preset cutting tracks, mark point positions, connection types of micro-connection areas and lengths of the micro-connection areas.
A laser cutting device, comprising:
the cutting module is used for controlling the laser cutting head to cut the workpiece along a preset cutting path;
the confirming module is used for confirming the connection type of the micro-connection area when the laser cutting head moves to the mark point;
and the adjusting module is used for keeping the cutting speed of the laser cutting head unchanged after confirming that the connection type of the micro-connection area is the first connection type, and adjusting other cutting parameters of the laser cutting head to be a preset value.
A laser cutting apparatus comprising a memory and a processor, the memory having a computer program stored therein, the processor when executing the computer program implementing a laser cutting method as claimed in any one of the preceding claims.
A computer readable storage medium storing computer executable instructions arranged to perform a laser cutting method as claimed in any one of the preceding claims.
Compared with the prior art, the invention provides the laser cutting method, the device, the equipment and the storage medium, in the laser cutting process, the cutting speed of the laser cutting head is kept unchanged at the mark point, other cutting parameters of the laser cutting head are adjusted to be preset values, the cutting effect of the laser cutting head can be changed, the upper part of the micro-connection area is cut off by the laser cutting head, the micro-connection area has certain connection strength, the connection of two sides of a workpiece can be kept through the micro-connection area, and further the situations of falling off of a cut part of the workpiece, tilting of the workpiece and the like are avoided.
Drawings
Fig. 1 is a flowchart of a laser cutting method provided by the present application.
Fig. 2 is a schematic structural view of the micro-connection region in fig. 1.
Fig. 3 is a schematic illustration of the cut of the first connection type provided in fig. 1.
Fig. 4 is a schematic illustration of a cut of the second connection type provided in fig. 1.
Fig. 5 is a schematic flow chart of the embodiment in fig. 1.
Fig. 6 is a schematic structural diagram of a laser cutting device provided by the application.
Fig. 7 is a schematic structural diagram of a laser cutting device provided by the application.
Detailed Description
In order to make the objects, technical solutions and effects of the present application clearer and more specific, the present application will be described in further detail below with reference to the accompanying drawings and examples. It is to be understood that the specific examples described herein are for purposes of illustration only and are not intended to limit the application, as elements, structures and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
Laser cutting devices are often used in the industrial machinery industry, and when processing a workpiece, the laser cutting device uses a micro-connection process in order to ensure that the cut workpiece does not fall off. The micro-connection process has the effects that the workpiece is still connected with the plate after being processed, the workpiece is prevented from tilting and falling, the processing safety is improved, and the workpiece is protected from being damaged.
Referring to fig. 1, the laser cutting method provided by the present application is used for forming a micro-connection area on a workpiece, so that the workpiece remains in a connection state after being cut, and includes the steps of:
s100, controlling a laser cutting head to cut a workpiece along a preset cutting path;
s200, when the laser cutting head moves to the mark point, confirming the connection type of the micro-connection area;
And S300, if the connection type of the micro-connection area is the first connection type, the cutting speed of the laser cutting head is unchanged, and other cutting parameters of the laser cutting head are adjusted to be preset values.
In the step S100 and the step S300, the cutting speed of the laser cutting head is kept unchanged, and the cutting quality is prevented from being reduced due to cutting pause; the other cutting parameters of the laser cutting head are adjusted from normal values to preset values, and at the moment, the depth of the workpiece cut by the laser cutting head is changed from the condition that the workpiece is completely cut to the condition that the workpiece is partially cut.
As shown in fig. 2, the upper part of the micro-connection area 20 is cut by the laser cutting head, the micro-connection area is located below the main body of the workpiece 10, and the micro-connection area 20 has a certain connection strength, and the connection of the two sides of the workpiece 10 can be maintained through the micro-connection area 20, so that the situations that the cut part of the workpiece 10 falls, the workpiece 10 tilts, and the like are avoided, and the problems that the processing safety of the workpiece 10 is poor, the workpiece is easy to damage, and the like are solved.
When a general micro-connection process is adopted, the micro-connection area 20 cannot maintain the connection effect if being too small, and the difficulty of separation is high if being too large. And the workpiece 10 is separated to leave a larger burr, which requires polishing and other secondary processing, and consumes a great deal of time and labor cost. In addition, if a punching process is used in the cutting process, the micro-connection area 20 may also have a dent after punching, which causes uneven edges of the workpiece and affects the machining accuracy of the workpiece.
Therefore, referring to fig. 3, the moving track of the laser cutting head is S1, and the length of the micro-connection region 20 is L. At the marker point a, the connection type of the micro connection area 20 may be confirmed first. For example, if the connection type of the micro connection area 20 is the first connection type, there is a high connection quality requirement for the micro connection area 20, that is, a traceless connection effect needs to be achieved.
By executing step S300, the cutting process parameters are dynamically and precisely changed, and the effect of traceless micro-connection can be achieved. Meanwhile, according to the strength requirement of the micro-connection, different strength grades can be set, and the micro-connection effect is changed by adjusting the strength grade. After the traceless micro-connection cutting is finished, namely at the point B, the cutting parameters of the laser cutting head can be quickly recovered to normal values, and the cutting effect after the micro-connection is ensured to be normal.
The laser cutting method provided by the application further comprises the following steps:
S50, acquiring processing parameter information, wherein the processing parameter information comprises preset cutting tracks, mark point positions, connection types of the micro-connection areas and preset lengths of the micro-connection areas.
Before cutting is performed, the processing parameter information may be obtained first, so as to determine whether the mark point exists and the connection type of the micro connection area 20 at the mark point in real time during the cutting process, thereby ensuring that the cutting of the micro connection area 20 is accurately completed.
In some embodiments, the laser cutting method provided by the present application further includes the steps of:
and S400, if the connection type of the micro-connection area is the second connection type, turning off the laser light source and lifting the laser cutting head to a preset height.
If the connection type of the micro-connection area 20 is the second connection type, this represents that the connection quality requirement for the micro-connection area 20 is not high, so that the micro-connection can be achieved by adopting the conventional connection method. Referring to fig. 4, step S400 may be performed to avoid the laser cutting head cutting the micro-connection area by turning off the laser light source and lifting the laser cutting head to a predetermined height at the mark point a. After micro-connection cutting is finished, namely, at the point B, the laser cutting head can be opened again, if punching is needed, the cutting height is kept to be the preset height, and if cutting is needed, the cutting height is adjusted to be the original height, so that the normal cutting effect is ensured.
In some embodiments, the laser cutting method provided by the present application further includes the steps of:
s500, calculating the moving distance of the laser cutting head along the cutting direction in real time;
And S600, adjusting the cutting mode of the laser cutting head in real time after the distance of the laser cutting head moving along the cutting direction reaches the preset length of the micro-connection area.
Specifically, step S600 includes the calculation formula:
wherein S xy is the distance that the laser cutting head moves along the cutting direction, and S xyi is the distance that the laser cutting head moves in a single interpolation period.
When the length of S xy is equal to the length L of the micro-connection area 20, i.e., L-S xy =0, the laser cutting head has moved from the mark point a to the point B, at which point the traceless micro-connection cutting state is ended, the cutting parameters of the laser cutting head are restored to the initial values or the laser cutting head is turned on again to complete the subsequent cutting process.
The laser cutting method provided by the application further comprises the following steps:
And S700, after the laser cutting head is controlled to complete cutting along a preset cutting path, the laser cutting head is continuously controlled to cut along a next cutting path, and whether a mark point exists in the next cutting path is judged in advance.
Referring to fig. 5, the specific control flow of the laser cutting method provided by the application is as follows:
1. CNC loads the NC task program to be processed.
2. CNC calls a process database and reads the process parameters.
3. The compiler compiles the NC and obtains processing parameter information, such as: the number of outlines, the positions of marking points, the connection type of micro-connection areas, the preset length of the micro-connection areas and the like.
4. CNC processes the compiled NC program. And when the current contour is processed, judging whether a mark point exists, if so, continuing to judge the connection type of the micro-connection area at the mark point, and if not, continuing to cut until the current contour is finished.
5. The connection type defining the conventional micro connection area is M200, and the connection type defining the traceless micro connection area is M201.
If the compiler judges that the current connection type is M200, when the current connection type is cut to the mark point A, the laser light source is turned off, the laser cutting head is lifted, when the laser cutting head moves to the end position point B, the laser cutting head descends to the cutting position, and the cutting parameters before the laser cutting head is called are continuously cut. If the perforation is set, the perforation is executed first and then the cutting is continued.
If the connection type is M201, when the connection type is cut to the mark point A, entering a traceless micro-connection cutting state, immediately calling the process task 1, wherein the process task 1 is a cutting parameter during micro-connection cutting, and the laser power, the laser frequency, the laser duty ratio, the gas pressure, the cutting height and the like during micro-connection cutting can be set in advance. Meanwhile, in the traceless micro-connection cutting state, the cutting speed is kept unchanged from the previous cutting speed, and the light emitting state is kept.
6. And calculating the accumulated length S xy of the movement of the laser cutting head during micro-connection cutting, and ending the traceless micro-connection cutting state and recovering to the cutting process task to continue cutting when the accumulated length S xy is equal to the preset length L of the micro-connection area.
7. After the current contour machining is finished, cutting of the next contour is automatically executed, the compiler continues to read the connection type of the marker point position of the next contour and the micro-connection area, and the process 5 is re-executed.
8. If the current processing task is completed, exiting; otherwise, continuing to process until the NC task is finished.
In addition, referring to fig. 6, the present application further provides a laser cutting device, including:
the cutting module A1 is used for controlling the laser cutting head to cut the workpiece along a preset cutting path;
a confirming module A2 for confirming the connection type of the micro-connection area when the laser cutting head moves to the mark point;
And the adjusting module A3 is used for keeping the cutting speed of the laser cutting head unchanged after confirming that the connection type of the micro-connection area is the first connection type, and adjusting other cutting parameters of the laser cutting head to be a preset value.
In some embodiments, the adjustment module A3 is further configured to turn off the laser light source and raise the laser cutting head to a preset height after confirming that the connection type of the micro connection area is the second connection type.
In some embodiments, the laser cutting device further comprises:
The calculating module A4 is used for calculating the moving distance of the laser cutting head along the cutting direction in real time;
When the calculation module A4 obtains that the distance of the laser cutting head moving along the cutting direction reaches the preset length of the micro-connection area, the cutting mode of the laser cutting head can be adjusted to be the original cutting mode in real time through the adjustment module A3.
The present application also provides a non-transitory computer readable storage medium storing computer executable instructions configured to perform the laser cutting method of the above embodiments.
Referring to fig. 7, the present application further provides a laser cutting apparatus, including: at least one central processing unit B1 (processor), an example of which is a central processing unit B1 in fig. 4; a memory B2 (memory); a display screen B3, a laser cutting head B4, a bus and a communication interface (Communications Interface) may also be included. The CPU B1, the memory B2, the display screen B3 and the communication interface can complete communication through buses; the display screen B3 is set to display a user operation interface preset in an initial setting mode, and meanwhile, the display screen B3 can also display a process control window; the communication interface can transmit information; the central processing unit B1 may call logic instructions in the memory B2 to perform the method of the above embodiment by controlling the laser cutting head B4.
The central Processor B1 may be a central processing unit (Central Processing Unit, CPU), the Processor B1 may also be other general purpose processors, digital signal processors (DIGITAL SIGNAL processors, DSP), application SPECIFIC INTEGRATED Circuit (ASIC), off-the-shelf Programmable gate array (Field-Programmable GATE ARRAY, FPGA) or other Programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like.
In addition, the logic instructions in the memory B2 may be implemented in the form of software functional units and may be stored in a computer readable storage medium when sold or used as a separate piece of work.
The memory B2 is a computer readable storage medium, and may be configured to store a software program, a computer executable program, and program instructions or modules corresponding to the methods in the embodiments of the present application. The central processing unit B1 executes the functional application and the data processing by running the software program, instructions or modules stored in the memory B2, that is, implements the method in the above-described embodiment.
The memory B2 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, at least one application program required for functions; the storage data area may store data created according to the use of the terminal device, etc. In addition, the memory B2 may include a high-speed random access memory, and may also include a nonvolatile memory.
All or part of the steps of the above embodiments may be implemented by hardware, or may be implemented by a program to instruct related hardware, where the program may be stored in a computer readable storage medium, and the storage medium may be a non-transitory storage medium, including a U-disc, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk or an optical disk, or other various media that may store program codes, and may also be a transitory storage medium.
It will be understood that equivalents and modifications will occur to those skilled in the art and are to be included within the scope of the application as defined in the following claims.

Claims (9)

1. A laser cutting method for forming micro-joint regions on a workpiece, comprising the steps of:
controlling a laser cutting head to cut a workpiece along a preset cutting path;
when the laser cutting head moves to the mark point, confirming the connection type of the micro-connection area;
If the connection type of the micro-connection area is the first connection type, the cutting speed of the laser cutting head is unchanged, other cutting parameters of the laser cutting head are adjusted to be preset values, so that the depth of the workpiece cut by the laser cutting head is changed, and the workpiece is changed from being completely cut to being partially cut;
If the connection type of the micro-connection area is the second connection type, the laser light source is turned off, and the laser cutting head is lifted to a preset height.
2. The laser cutting method of claim 1, wherein the other cutting parameters of the laser cutting head include laser power, laser frequency and laser duty cycle.
3. The laser cutting method according to any one of claims 1-2, further comprising the step of:
calculating the moving distance of the laser cutting head along the cutting direction in real time;
and when the distance of the laser cutting head moving along the cutting direction reaches the preset length of the micro-connection area, the cutting mode of the laser cutting head is adjusted in real time.
4. A laser cutting method according to claim 3, wherein the step of calculating in real time the distance the laser cutting head moves in the cutting direction comprises the calculation formula:
wherein S xy is the distance that the laser cutting head moves along the cutting direction, and S xyi is the distance that the laser cutting head moves in a single interpolation period.
5. The laser cutting method according to claim 3, further comprising, after the step of adjusting the cutting mode of the laser cutting head in real time after the distance moved by the laser cutting head in the cutting direction reaches the preset length of the micro connection area, the steps of:
after the laser cutting head is controlled to complete cutting along the preset cutting path, the laser cutting head is controlled to cut along the next cutting path, and whether the next cutting path has mark points is judged in advance.
6. The laser cutting method according to any one of claims 1-2, further comprising the step of:
and acquiring processing parameter information, wherein the processing parameter information comprises preset cutting tracks, mark point positions, connection types of micro-connection areas and lengths of the micro-connection areas.
7. A laser cutting device, comprising:
the cutting module is used for controlling the laser cutting head to cut the workpiece along a preset cutting path;
the confirming module is used for confirming the connection type of the micro-connection area when the laser cutting head moves to the mark point;
The adjusting module is used for keeping the cutting speed of the laser cutting head unchanged after confirming that the connection type of the micro-connection area is the first connection type, adjusting other cutting parameters of the laser cutting head to be a preset value, changing the depth of the laser cutting head for cutting the workpiece, and changing from completely cutting the workpiece to partially cutting the workpiece;
the adjustment module is also used for turning off the laser light source and lifting the laser cutting head to a preset height after confirming that the connection type of the micro-connection area is the second connection type.
8. A laser cutting apparatus comprising a memory and a processor, the memory having stored therein a computer program which when executed by the processor implements the laser cutting method of any one of claims 1 to 6.
9. A computer readable storage medium storing computer executable instructions arranged to perform the laser cutting method of any one of claims 1 to 6.
CN202210241209.1A 2022-03-11 2022-03-11 Laser cutting method, device, equipment and storage medium Active CN114713974B (en)

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Application Number Priority Date Filing Date Title
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CN114713974B true CN114713974B (en) 2024-06-04

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992006815A1 (en) * 1990-10-18 1992-04-30 Fanuc Ltd Method of working with laser beam
CN1112866A (en) * 1994-02-24 1995-12-06 三菱电机株式会社 Laser cutting method eliminating defects in regions where cutting conditrons are changed
CN108817695A (en) * 2018-07-17 2018-11-16 大族激光科技产业集团股份有限公司 Laser cutting method, device and digital control system
CN111451649A (en) * 2020-04-17 2020-07-28 大族激光科技产业集团股份有限公司 Laser pipe cutting machine feeding method and laser pipe cutting machine
CN111633344A (en) * 2020-04-23 2020-09-08 大族激光科技产业集团股份有限公司 Flight cutting control method, controller, device and storage medium
CN112091444A (en) * 2020-08-07 2020-12-18 大族激光科技产业集团股份有限公司 Groove cutting control method and device, storage medium and laser cutting equipment
CN112666893A (en) * 2020-12-24 2021-04-16 上海柏楚数控科技有限公司 Laser cutting control method, device, controller, electronic device and medium

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992006815A1 (en) * 1990-10-18 1992-04-30 Fanuc Ltd Method of working with laser beam
CN1112866A (en) * 1994-02-24 1995-12-06 三菱电机株式会社 Laser cutting method eliminating defects in regions where cutting conditrons are changed
CN108817695A (en) * 2018-07-17 2018-11-16 大族激光科技产业集团股份有限公司 Laser cutting method, device and digital control system
CN111451649A (en) * 2020-04-17 2020-07-28 大族激光科技产业集团股份有限公司 Laser pipe cutting machine feeding method and laser pipe cutting machine
CN111633344A (en) * 2020-04-23 2020-09-08 大族激光科技产业集团股份有限公司 Flight cutting control method, controller, device and storage medium
CN112091444A (en) * 2020-08-07 2020-12-18 大族激光科技产业集团股份有限公司 Groove cutting control method and device, storage medium and laser cutting equipment
CN112666893A (en) * 2020-12-24 2021-04-16 上海柏楚数控科技有限公司 Laser cutting control method, device, controller, electronic device and medium

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