CN114710920A - Heat dissipation substrate, preparation method, testing device, testing method and flexible electronic device - Google Patents
Heat dissipation substrate, preparation method, testing device, testing method and flexible electronic device Download PDFInfo
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- CN114710920A CN114710920A CN202111590162.1A CN202111590162A CN114710920A CN 114710920 A CN114710920 A CN 114710920A CN 202111590162 A CN202111590162 A CN 202111590162A CN 114710920 A CN114710920 A CN 114710920A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 67
- 238000012360 testing method Methods 0.000 title claims abstract description 65
- 239000000758 substrate Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 230000000694 effects Effects 0.000 claims abstract description 27
- 239000012782 phase change material Substances 0.000 claims abstract description 21
- 239000011159 matrix material Substances 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 53
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 53
- 238000010438 heat treatment Methods 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 27
- -1 Polydimethylsiloxane Polymers 0.000 claims description 26
- 239000012188 paraffin wax Substances 0.000 claims description 22
- 239000000523 sample Substances 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000013068 control sample Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000010146 3D printing Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229940057995 liquid paraffin Drugs 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims 1
- 238000011160 research Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 230000036760 body temperature Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000009792 diffusion process Methods 0.000 description 1
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- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/20—Clinical contact thermometers for use with humans or animals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
Abstract
The invention relates to a heat dissipation substrate, a preparation method, a testing device, a testing method and a flexible electronic device, wherein the heat dissipation substrate comprises an elastic substrate, a phase-change material and a metal sheet, the phase-change material is filled in a cavity formed by the elastic substrate, and the metal sheet is placed on the upper surface or the lower surface of the phase-change material; aiming at a special space application scene, the traditional elastic matrix is transformed by using the phase-change material to prepare a novel elastic matrix with a temperature control function, the heat exchange performance between the flexible electronic device and the radiating surface is enhanced, and a preparation method of the radiating matrix, a testing device and a testing method of the radiating effect are provided, so that a complete research method and a testing method are provided for the radiating of the flexible electronic device.
Description
Technical Field
The invention relates to a heat dissipation substrate, in particular to a heat dissipation substrate for a flexible electronic device and a flexible electronic device based on-orbit human body monitoring of astronauts.
Background
With the development of manned aerospace industry, the life support and the physiological parameter acquisition of astronauts become one of the important challenges in the field, and how to monitor the physiological parameters of the astronauts, such as body temperature, pulse, heartbeat and the like in real time under the condition of ensuring comfort and evaluate the physiological state of human bodies in real time becomes the next difficult problem to overcome. The novel flexible electronic device overcomes the limitation that the traditional rigid device cannot be bent and stretched, realizes the miniaturization, light weight and flexibility of electronic elements through the integration of a polymer matrix, a stretchable wire and functional elements, can be directly integrated in skin tissues of astronauts, monitors the physiological information of the astronauts in real time, and has important significance for manned spaceflight.
However, electronic devices all generate heat, and when a short circuit occurs, sudden high current and high heat may occur, and direct contact with the skin of a human body may cause pain or burn of the human body. In a space environment, the microgravity at the orbit height of the spacecraft is about (10 < -6 > g to 10 < -3 > g) (g is the acceleration of free falling body on the ground), and in this case, the natural convection heat exchange effect of the fluid is weakened or even disappears, so that the contact surface of the flexible electronic device and the air is in a quasi-adiabatic state, which makes the heat dissipation of the flexible electronic device difficult. When the temperature is too high, the normal work of the device can be influenced and even the device can be damaged. The prior art of flexible electronic devices directly integrated on human skin mainly adopts a method for reducing power, which limits the functions and efficiency of the integrated flexible electronic devices, influences the detection precision of physiological parameters such as body temperature, pulse, heartbeat and the like, and limits the endurance of the electronic devices.
Disclosure of Invention
The invention aims to provide a heat dissipation substrate, a preparation method, a test device, a test method and a flexible electronic device, wherein when the extensible flexible electronic device is used in a space environment, under the condition that the natural convection heat exchange effect of a fluid is weakened or even disappears, the contact surface of the flexible electronic device and air is in a quasi-heat insulation state, and the heat dissipation device aims at the flexible electronic device integrated on the skin surface of an astronaut.
The technical scheme of the invention is as follows: a heat dissipation base body is used in a flexible electronic device and comprises an elastic base body, a phase change material and a metal sheet, wherein the phase change material is filled in a cavity formed by the elastic base body, and the metal sheet is placed on the upper surface or the lower surface of the phase change material.
Furthermore, the elastic matrix is in a shape of a circular sheet and is made of silica gel materials, the phase-change material is paraffin, and the metal sheet is a copper sheet or a snakelike copper wire.
Furthermore, the volume ratio of the elastic matrix to the paraffin to the copper sheets is 10: 3: 0.01.
On the other hand, a preparation method is provided for preparing the heat dissipation substrate, and specifically comprises the following steps:
step S1, preparing a mould for the elastic matrix, wherein the mould is a cylindrical hollow mould with the inner diameter of 15mm and the height of 5mm, the shape of the mould is drawn by using three-dimensional drawing software, and the mould is obtained by a 3D printing technology;
step S2, weighing a Polydimethylsiloxane (PDMS) main agent and a hardening agent according to the proportion of 10:1, pouring the weighed materials into a disposable small-size measuring cup, manually stirring the materials for 5 minutes until the materials are uniform, pouring a first preset amount of Polydimethylsiloxane (PDMS) into a mold, and putting the mold into a preheated oven for curing;
step S3, placing a boss with the diameter of 10mm and the height of 1.5mm on the top of Polydimethylsiloxane (PDMS), pouring Polydimethylsiloxane (PDMS) with a second preset amount, wherein the pouring height of the Polydimethylsiloxane (PDMS) is equal to the boss, and placing the Polydimethylsiloxane (PDMS) into a preheated oven for curing;
step S4, taking out the small bosses, and placing copper sheets with the same bottom surfaces, wherein the height of the copper sheets is smaller than that of the bosses;
s5, placing a certain weight of solid paraffin on a copper sheet, heating to melt the paraffin into liquid and level with Polydimethylsiloxane (PDMS), and curing the liquid paraffin;
step S6, weighing a Polydimethylsiloxane (PDMS) main agent and a hardening agent according to the ratio of 10:1, pouring the weighed materials into a disposable small-size measuring cup, manually stirring the materials for 5 minutes until the materials are uniform, pouring a third preset amount of Polydimethylsiloxane (PDMS) into a mold until the materials are flush, and putting the mold into a preheated oven for curing.
On the other hand, the heat dissipation effect testing device is used for testing the heat dissipation effect of the flexible electronic device heat dissipation base body and comprises a heat dissipation effect testing sample, a heat dissipation effect comparison sample and a space station carrying testing unit, wherein the heat dissipation effect testing sample comprises the flexible electronic device heat dissipation base body, a heating plate and a temperature sensor; the heat dissipation effect comparison sample comprises an elastic base body, a heating sheet and a temperature sensor, paraffin and a copper sheet are not included in the elastic base body of the comparison sample, the heating sheet is fixed at the bottoms of the heat dissipation base body of the flexible electronic device and the elastic base body by the aid of the same material of the base body, the temperature sensor is fixed at the top of the heat dissipation base body, the heating sheet is electrified and heated through a lead, and the temperature sensor transmits analog voltage signals through the lead.
On the other hand, the method for testing the heat dissipation effect of the heat dissipation substrate of the flexible electronic device comprises the following steps:
step Z1, starting a test, wherein when the space station carrying test unit is in a backlight area and the temperature in the cabin displayed by the temperature sensor is stable and is about 26 ℃, the space station sends an instruction to the test device to request the test to be started;
step Z2, heating the test sample and the control sample by a heating plate simultaneously, wherein the heating current is about 70mA, the heating time is about 40s, and the heating power of each sample is about 0.67W;
step Z3, recording the heating starting time, current and power of the heating sheet and related test data by the main control chip of the test unit, and acquiring the temperature and time of 3 temperature sensors on each test sample within 1000 s;
step Z4, the test unit sends test data to the space station host;
step Z5, when the test unit temperature exceeds the predetermined threshold, the space station immediately sends a stop test command.
On the other hand, the flexible electronic device based on the on-orbit human body monitoring of the astronaut is provided, and the heat dissipation substrate is adopted as an elastic substrate of the flexible electronic device.
The invention has the following beneficial effects: when the flexible electronic device is directly integrated on skin tissues of an astronaut and physiological information of the astronaut is monitored in real time, the natural convection heat exchange effect of fluid is weakened or even disappears under the condition of in-orbit microgravity, the contact surface of the flexible electronic device and air in a cabin is in a quasi-adiabatic state, so that heat dissipation of the flexible electronic device is difficult, normal work of the flexible electronic device can be influenced or even damaged when the temperature is too high, the traditional elastic base body is modified by utilizing a phase change material aiming at a special space application scene, a novel elastic base body with a temperature control function is prepared, and the heat exchange performance between the flexible electronic device and a heat dissipation surface is enhanced. On the basis of the traditional elastic matrix, a paraffin phase change material is packaged, and a copper sheet or a copper wire is added to increase the heat dissipation in the surface; the preparation method of the heat dissipation substrate, the test device and the test method of the heat dissipation effect are provided, and a complete research method and a complete test method are provided for the heat dissipation of the flexible electronic device.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation substrate of a flexible electronic device.
Fig. 2 is a sectional view taken in the direction of a-a in fig. 1.
Fig. 3 is a schematic diagram of a method of making a heat-dissipating substrate for a flexible electronic device.
Wherein the figures include the following reference numerals: 1. an elastic base; 2. a phase change material; 3. a metal sheet; 4. A mold; 5. a boss; 6. a heating plate; 7. a wire; 8. a temperature sensor.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Example 1
As shown in fig. 1-2, a heat dissipation substrate of a flexible electronic device, which is used as a substrate of a flexible electronic device for in-orbit human body monitoring of astronauts, comprises an elastic substrate 1, a phase change material 2 and a metal sheet 3, wherein the phase change material 2 is filled in a cavity formed by the elastic substrate 1, and the metal sheet 3 is placed on the upper surface or the lower surface of the phase change material 2. When the temperature of a flexible electronic device integrated on the skin of a human body is sharply increased in emergency situations such as short circuit or too high power, the phase-change material is subjected to phase change to absorb a large amount of heat, so that the skin of a astronaut is protected to prevent burning, and the metal sheet is used for enhancing heat dissipation in the direction parallel to the skin.
The elastic matrix 1 is in a circular sheet shape, heat dissipation is more uniform in the peripheral direction, the elastic matrix is made of silica gel materials, the silica gel materials can be stretched, biocompatibility is good, and the comfort level of adhesion with skin is high.
The phase-change material 2 is preferably paraffin, the phase-change temperature of the paraffin is 40-50 ℃, the paraffin is at the temperature that human skin cannot be scalded, and the phase-change material is suitable for being used as a substrate of a skin electronic device.
The metal sheet 3 is preferably a copper sheet, so that the copper sheet has good heat conductivity and high heat dissipation efficiency, and the scald prevention effect is better; the copper sheet can be snakelike copper wire, has increased the transparency.
The phase change of the paraffin is the main mode of the flexible electronic device for absorbing heat energy, so the volume ratio of the paraffin is relatively large, but the rigidity of the paraffin is higher than that of the elastic matrix, the bending performance of the elastic matrix of the flexible electronic device is influenced by the excessively large volume ratio, and therefore the volume ratio is preferably 10: 3.
According to the heat conductivity coefficient of the elastic matrix, the volume ratio of the elastic matrix to the paraffin to the copper sheet is 10: 3: 0.01, the volume ratio of the copper sheet is small, the copper sheet is mainly used for improving the diffusion of heat in the direction parallel to the skin, and meanwhile, the flexibility of a device cannot be influenced, namely, the copper sheet is bendable, so that the area of the copper sheet is large, the thickness of the copper sheet is small, the thickness of the copper sheet is 200 micrometers generally, and the volume ratio of the copper sheet is extremely small.
Example 2
As shown in fig. 3, a method for preparing a heat dissipation substrate of a flexible electronic device specifically includes the following steps:
step S1, preparing a mold 4 for the elastic base 1, the mold being a cylindrical hollow mold having an inner diameter of 15mm and a height of 5mm, drawing the shape of the mold by using three-dimensional drawing software, and obtaining the shape by using a 3D printing technique, as shown in fig. 3 (a).
Step S2, weighing the Polydimethylsiloxane (PDMS) main agent and the hardening agent according to the ratio of 10:1, pouring the weighed materials into a disposable small-size measuring cup, manually stirring the materials for 5 minutes until the materials are uniform, pouring the first preset amount of Polydimethylsiloxane (PDMS) into a mold, and putting the mold into a preheated oven for curing, wherein the diagram is shown in fig. 3 (b).
Step S3, placing a boss 5 with a diameter of 10mm and a height of 1.5mm on top of the Polydimethylsiloxane (PDMS), casting a second predetermined amount of Polydimethylsiloxane (PDMS), the casting height of the Polydimethylsiloxane (PDMS) being equal to the boss, and placing the Polydimethylsiloxane (PDMS) into a preheated oven for curing, as shown in fig. 3 (c).
And step S4, taking out the small bosses, placing the copper sheets 3 with the same bottom surfaces, wherein the height of the copper sheets 3 is less than that of the bosses 5, as shown in FIG. 3 (d).
Step S5, placing a certain weight of paraffin wax 2 on the copper sheet 3, heating to melt the paraffin wax 2 into liquid state and level with Polydimethylsiloxane (PDMS), and curing the liquid paraffin wax, as shown in fig. 3 (e).
Step S6, weighing a Polydimethylsiloxane (PDMS) main agent and a hardening agent according to the proportion of 10:1, pouring the weighed materials into a disposable small-size measuring cup, manually stirring the materials for 5 minutes until the materials are uniform, pouring a third preset amount of PDMS into a mold until the materials are flush, and putting the mold into a preheated oven for curing, as shown in fig. 3 (f).
Example 3
A heat dissipation effect testing device of a flexible electronic device heat dissipation base body comprises a heat dissipation effect testing sample, a heat dissipation effect comparison sample and a space station carrying testing unit, wherein the heat dissipation effect testing sample comprises the flexible electronic device heat dissipation base body, a heating plate 6 and a temperature sensor 8, which are described in embodiment 1; the heat dissipation effect control sample comprises an elastic matrix, a heating plate 6 and a temperature sensor 8, and paraffin 2 and a copper plate 3 are not included in the elastic matrix of the control sample. The bottom of the flexible electronic device radiating base body is fixed with the heating sheet 6 by utilizing the same material of the elastic base body, the top is fixed with the temperature sensor 8, the heating sheet 6 is electrified and heated through the lead 7, and the temperature sensor 8 transmits an analog voltage signal through the lead 7. The heating plate 6 is used for simulating a sudden heating source when the temperature of the flexible electronic device integrated on the skin of a human body is sharply increased under emergency conditions such as short circuit or too high power, the temperature sensor is arranged at the top of the heat dissipation substrate of the flexible electronic device to measure the temperature of the top of the heat dissipation substrate after heat dissipation by the heat dissipation substrate,
the temperature sensors are a plurality of temperature sensors which are uniformly arranged in the same plane on the top of the heat dissipation base body, and 3 temperature sensors are preferred.
Example 4
A method for testing a heat dissipation effect of a heat dissipation substrate of a flexible electronic device, using the device for testing a heat dissipation effect of a heat dissipation substrate of a flexible electronic device described in embodiment 3, specifically comprising the steps of:
and step Z1, starting the test, wherein when the space station carrying test unit is in the backlight area and the temperature in the cabin displayed by the temperature sensor is stable and is about 26 ℃, the space station sends an instruction to the test device to start the test.
Step Z2, the test sample and the control sample were heated simultaneously by the heat patch at a heating current of about 70mA for a heating time of about 40s and a heating power of about 0.67W for each sample.
Step Z3, the test unit main control chip records the test data such as the heating starting time of the heating sheet, the current (power) and the like, and collects the temperature and the time of 3 temperature sensors on each test sample within 1000 s.
And step Z4, the test unit sends test data to the space station host.
Step Z5, when the test unit temperature exceeds the predetermined threshold, the space station immediately sends a stop test command.
Example 5
A flexible electronic device based on in-orbit human body monitoring of astronauts, employing the heat dissipating substrate of embodiment 1 as an elastic substrate of the flexible electronic device.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (7)
1. A heat dissipation base body is used in a flexible electronic device and is characterized by comprising an elastic base body, a phase-change material and a metal sheet, wherein the phase-change material is filled in a cavity formed by the elastic base body, and the metal sheet is placed on the upper surface or the lower surface of the phase-change material.
2. The heat dissipation substrate according to claim 1, wherein the elastic substrate is a circular sheet made of silica gel, the phase change material is paraffin, and the metal sheet is a copper sheet or a serpentine copper wire.
3. The heat dissipation substrate of claim 1, wherein the volume ratio of the elastic substrate to the paraffin to the copper sheet is 10: 3: 0.01.
4. A method for preparing a heat-dissipating substrate according to any one of claims 1 to 3, comprising the steps of:
step S1, preparing a mould for the elastic matrix, wherein the mould is a cylindrical hollow mould with the inner diameter of 15mm and the height of 5mm, the shape of the mould is drawn by using three-dimensional drawing software, and the mould is obtained by a 3D printing technology;
step S2, weighing a Polydimethylsiloxane (PDMS) main agent and a hardening agent according to the proportion of 10:1, pouring the weighed materials into a disposable small-size measuring cup, manually stirring the materials for 5 minutes until the materials are uniform, pouring a first preset amount of Polydimethylsiloxane (PDMS) into a mold, and putting the mold into a preheated oven for curing;
step S3, placing a boss with the diameter of 10mm and the height of 1.5mm on the top of Polydimethylsiloxane (PDMS), pouring Polydimethylsiloxane (PDMS) with a second preset amount, wherein the pouring height of the Polydimethylsiloxane (PDMS) is equal to the boss, and placing the Polydimethylsiloxane (PDMS) into a preheated oven for curing;
step S4, taking out the small bosses, and placing copper sheets with the same bottom surfaces, wherein the height of the copper sheets is smaller than that of the bosses;
step S5, placing a certain weight of solid paraffin on a copper sheet, heating to melt the paraffin into liquid and level with Polydimethylsiloxane (PDMS), and solidifying the liquid paraffin;
step S6, weighing a Polydimethylsiloxane (PDMS) main agent and a hardening agent according to the ratio of 10:1, pouring the weighed materials into a disposable small-size measuring cup, manually stirring the materials for 5 minutes until the materials are uniform, pouring a third preset amount of Polydimethylsiloxane (PDMS) into a mold until the materials are flush, and putting the mold into a preheated oven for curing.
5. A heat dissipation effect testing apparatus for testing the heat dissipation effect of the heat dissipation substrate according to any one of claims 1 to 3, comprising a heat dissipation effect test sample, a heat dissipation effect control sample, and a space station mounting test unit, wherein the heat dissipation effect test sample comprises the heat dissipation substrate according to any one of claims 1 to 3, a heating plate, and a temperature sensor; the heat dissipation effect comparison sample comprises an elastic base body, a heating sheet and a temperature sensor, paraffin and a copper sheet are not included in the elastic base body of the comparison sample, the heating sheet is fixed at the bottoms of the heat dissipation base body and the elastic base body by using the same material of the base body, the temperature sensor is fixed at the top, the heating sheet is electrified and heated through a lead, and the temperature sensor transmits an analog voltage signal through the lead.
6. A method for testing the heat dissipation effect of a heat dissipation substrate is characterized by comprising the following steps:
step Z1, starting a test, wherein when the space station carrying test unit is in a backlight area and the temperature in the cabin displayed by the temperature sensor is stable and is about 26 ℃, the space station sends an instruction to the test device to request the test to be started;
step Z2, heating the test sample and the control sample by a heating plate simultaneously, wherein the heating current is about 70mA, the heating time is about 40s, and the heating power of each sample is about 0.67W;
step Z3, recording test data such as heating starting time, current (power) and the like of the heating sheet by the main control chip of the test unit, and acquiring the temperature and time of 3 temperature sensors on each test sample within 1000 s;
step Z4, the test unit sends test data to the space station host;
step Z5, when the test unit temperature exceeds the predetermined threshold, the space station immediately sends a stop test command.
7. A flexible electronic device based on in-orbit human body monitoring of astronauts, characterized in that an elastic substrate of the heat dissipation substrate according to any of claims 1 to 3 is used as the flexible electronic device.
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| CN202111590162.1A CN114710920A (en) | 2021-12-23 | 2021-12-23 | Heat dissipation substrate, preparation method, testing device, testing method and flexible electronic device |
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| CN202111590162.1A CN114710920A (en) | 2021-12-23 | 2021-12-23 | Heat dissipation substrate, preparation method, testing device, testing method and flexible electronic device |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5945217A (en) * | 1997-10-14 | 1999-08-31 | Gore Enterprise Holdings, Inc. | Thermally conductive polytrafluoroethylene article |
| CN107771011A (en) * | 2017-09-28 | 2018-03-06 | 深圳市英威腾电气股份有限公司 | A kind of flexible phase-change heat radiating device |
| KR20180088151A (en) * | 2017-01-26 | 2018-08-03 | 충북대학교 산학협력단 | A Manufacturing Method of Flexible Tactile Sensor |
-
2021
- 2021-12-23 CN CN202111590162.1A patent/CN114710920A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5945217A (en) * | 1997-10-14 | 1999-08-31 | Gore Enterprise Holdings, Inc. | Thermally conductive polytrafluoroethylene article |
| KR20180088151A (en) * | 2017-01-26 | 2018-08-03 | 충북대학교 산학협력단 | A Manufacturing Method of Flexible Tactile Sensor |
| CN107771011A (en) * | 2017-09-28 | 2018-03-06 | 深圳市英威腾电气股份有限公司 | A kind of flexible phase-change heat radiating device |
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