CN114698345A - Jet type cooling system for chip and photovoltaic panel - Google Patents
Jet type cooling system for chip and photovoltaic panel Download PDFInfo
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- 238000001816 cooling Methods 0.000 title claims abstract description 103
- 239000007788 liquid Substances 0.000 claims description 57
- 238000001704 evaporation Methods 0.000 claims description 43
- 230000008020 evaporation Effects 0.000 claims description 43
- 238000005057 refrigeration Methods 0.000 claims description 34
- 239000007921 spray Substances 0.000 claims 3
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- 230000008901 benefit Effects 0.000 abstract description 4
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- 238000000034 method Methods 0.000 description 8
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- 230000008569 process Effects 0.000 description 6
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- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000007906 compression Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
- H01L31/0521—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells using a gaseous or a liquid coolant, e.g. air flow ventilation, water circulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a jet cooling system of a chip and a photovoltaic panel, wherein an evaporator device is adaptively installed on a heat source device, two ends of the evaporator device are respectively communicated with a vacuum tank, a jet pump and a jet circulation device through pipelines, the other end of the vacuum tank is communicated with the jet pump, the output end of the jet pump is connected with an external heat exchanger, and the output end of the external heat exchanger is communicated with the jet circulation device. The invention selects the configuration of the system according to different working condition requirements to adapt to the closed-loop cooling of the heat source body devices in various temperature ranges, the required equipment is simple, the energy consumption is less, the working efficiency is higher, and the whole system has simple structure, strong stability and good economic benefit.
Description
Technical Field
The invention relates to the technical field of chip and photovoltaic panel refrigeration, in particular to a jet cooling system for a chip and a photovoltaic panel.
Background
In recent years, with the wide application of computers and the internet, the proportion of energy consumption of a data center to total energy consumption of the whole society is larger, and according to statistics, the energy consumption cost of the data center accounts for about 50% of the total cost, including various aspects such as electric power, occupied space of a machine room, bandwidth and the like. The energy consumption of the data center is huge, and is mainly concentrated on server equipment and refrigeration equipment, wherein the energy consumption of a refrigeration system accounts for 30% -50% of the operation energy consumption of the whole machine room. By applying the cloud computing technology and through virtualization and real-time migration power management technology, the number and the operation time of the main equipment can be greatly reduced, so that the energy consumption of the main equipment is greatly reduced, the energy efficiency is improved, and the energy conservation and emission reduction are really realized. Cooling equipment is the largest source of energy consumption, typically consuming 33% of the total energy consumption of a data center, followed by 18% ups. The energy consumption ratios of the air conditioner and the power distribution equipment are respectively 9% and 5%. While it is currently "mainstream" in data centers to employ tightly coupled cooling, newer methods tend to be better and draw more attention in meeting energy efficiency needs. The traditional cooling mode of the database center mainly comprises the following steps: the air-cooled direct evaporation type air conditioning unit comprises an air-cooled direct evaporation type air conditioning unit, a water-cooled direct evaporation type air conditioning unit, a chilled water type air conditioning system and a double-cold-source air conditioning system. Immersion cooling has recently emerged: the servers are entirely immersed in mineral oil in order to obtain a very high cooling efficiency with a minimum of energy consumption. However, when a technician needs to process servers with oil distributed inside and outside, it is obvious that the cooling method is not suitable for all application scenarios.
In addition, the big strategy of developing new energy in China is vigorously, the photovoltaic new energy industry is rapidly developed, and the photovoltaic energy has the characteristics of low cost, high efficiency and no pollution, and plays a leading role in the application of renewable energy. However, in recent times, the electrical efficiency of photovoltaic cells has not improved significantly. The main reason is that the photon energy is excessive after the photon transition of the semiconductor material, and the excessive energy is converted into waste heat, so that the temperature of the photovoltaic module is increased, and the energy conversion efficiency is reduced. In the practical application process of the solar photovoltaic cell, the power generation efficiency of the solar cell is found to be reduced along with the increase of the surface temperature of the cell. The research shows that: the relative photoelectric conversion efficiency is reduced by 0.5 percent when the temperature of the battery rises by 1 ℃. Therefore, cooling of the solar cell is very important to improve the power generation efficiency. And different cooling modes are different for reducing the temperature of the solar cell and improving the photovoltaic power generation efficiency. Related research results at home and abroad in recent years also see that the solar photovoltaic power generation system is obtained through simulation experiments on the basis of contrastively analyzing the cooling and power generation efficiency of three traditional natural circulation cooling systems, forced circulation cooling systems and novel solar photovoltaic cooling systems: the economy of natural circulation cooling is very strong; forced circulation cooling is suitable for experiments and researches; the novel solar photovoltaic photo-thermal cooling effect is best, and particularly has incomparable advantages compared with the conventional technology after being combined with a building, but the cost is higher; the heat dissipation effect of the forced convection battery plate provided with the fan is obviously better than that of a battery plate with natural convection, the electric efficiency of the forced convection battery plate is obviously higher than that of the battery plate with natural convection, and the average absolute electric efficiency of the forced convection battery plate is 0.675 percent higher than that of the battery plate with natural convection; the absolute average net electrical efficiency of the forced convection cell plate provided with the fan is 0.565 percent higher than that of a cell plate with natural convection. The novel cooling technology mainly comprises 3 cooling technologies such as a heat pipe cooling technology, a micro-channel cooling technology and a liquid jet impingement cooling technology, and the three cooling modes can improve the power generation efficiency.
Existing studies have shown that: at 20 x concentration, the temperature of the photovoltaic power generation system without using a cooling means is as high as 84 ℃, the efficiency of the battery is reduced by 50%, and when a copper flat heat pipe is adopted, the temperature of the battery can be not more than 46 ℃, and at the temperature, the efficiency of the battery is only reduced by 10%. According to measurement, under the condition of a cooling system, the temperature of the back surface is between 43 ℃ and 55 ℃, the temperature of the front surface of the solar panel is generally higher than that of the back surface by about 10 ℃, and the temperature of the front surface of the solar panel can reach 70 ℃ without cooling, so that the solar panel is facilitated to work in a proper temperature range when a cooling device is added, and the solar panel has important influence on improving the efficiency of the photovoltaic cell.
In the prior art, the cooling mode of a chip and a photovoltaic panel mainly adopts a phase change or heat pipe cooling mode, and the heat pipe cooling has larger heat flux density only under the condition of higher heat source temperature, because the heat is used as the driving force of phase change, the ideal heat transfer can be realized only by the larger temperature difference between the heat source body temperature and the cooling medium temperature, and although the cold end and the hot end exist, the heat is finally carried to the outdoor for heat dissipation by cooling water; phase change compression cooling methods, which typically increase the temperature and pressure of the vapor by means of a compressor, condense the vapor to its liquid state by means of a condenser and return it to an evaporator for further evaporation and cooling, have some disadvantages: the practical use thereof in cooling electrical and electronic equipment devices is limited, above all because the compressor itself is very power consuming, and in high thermal load application environments the electrical power required by the compressor may also exceed the power available for it; secondly, in cooling electric and electronic components, the heat load may be in frequent changes, which easily causes the non-evaporated refrigerant to be sucked into the compressor, thus easily causing the compressor to be damaged by liquid impact, resulting in greatly shortened service life of the compressor.
In order to solve the cooling problem of the chip or the photovoltaic panel with high efficiency, a jet cooling system of the chip and the photovoltaic panel needs to be developed to solve the technical problems of complex cooling process, low cooling efficiency and the like of the chip and the photovoltaic panel in the prior art.
Disclosure of Invention
In order to solve the technical problem, the invention provides a jet cooling system of a chip and a photovoltaic panel, which comprises a heat source body device, an evaporator device, a vacuum tank, a jet pump, a jet circulation device and an external heat exchanger, wherein the evaporator device is installed on the heat source body device in a matched mode, two ends of the evaporator device are respectively communicated with the vacuum tank, the jet pump and the jet circulation device through pipelines, the other end of the vacuum tank is communicated with the jet pump, the output end of the jet pump is connected with the external heat exchanger, and the output end of the external heat exchanger is communicated with the jet circulation device.
Preferably, the evaporator device comprises a heat conduction plate, a coiled pipe heat exchanger and an evaporation throttling device, wherein the coiled pipe heat exchanger is arranged in the heat conduction plate, and the evaporation throttling device is arranged at the input end of the coiled pipe heat exchanger.
Preferably, the jet circulation device comprises a jet circulation box, an exhalation valve and a jet circulation pump, the output end of the external heat exchanger is communicated with the input end of the jet circulation box through a pipeline, the jet circulation box is provided with the exhalation valve, the output end of the jet circulation box is communicated with the input end of the jet circulation pump through a pipeline, and the output end of the jet circulation pump is respectively communicated with the jet pump and the evaporation throttling device through pipelines.
Preferably, the coiled pipe heat exchanger comprises an evaporation liquid channel, a circulation liquid pipeline and a steam confluence channel, the evaporation throttling device is communicated with the input end of the evaporation liquid channel, the output end of the evaporation liquid channel is communicated with the steam confluence channel through a plurality of groups of circulation liquid pipelines, and the output end of the steam confluence channel is communicated with the input end of the jet pump.
Preferably, the external heat exchanger is a plate heat exchanger.
Preferably, the external heat exchanger is a finned tube heat exchanger.
Preferably, the output end of the plate heat exchanger is connected with the input end of the cooling tower through a pipeline, the output end of the cooling tower is connected with the input end of the plate heat exchanger through a pipeline, and the output end of the plate heat exchanger is provided with a cooling circulating pump.
Preferably, the combined cooling device comprises a compressor, a refrigeration evaporator, a refrigeration circulating pump, a refrigeration throttling device and a condenser, wherein the output end of the plate type heat exchanger is connected with the refrigeration evaporator through a pipeline, the output end of the refrigeration evaporator is respectively connected with the input ends of the compressor, the refrigeration throttling device and the plate type heat exchanger, the other ends of the compressor and the refrigeration throttling device are connected with the condenser, and the output end of the condenser is connected with the cooling tower through a pipeline.
Preferably, an evaporator stop valve is arranged on a connecting pipeline between the output end of the refrigeration evaporator and the plate heat exchanger; and a condenser stop valve is arranged on an output end pipeline of the condenser.
Preferably, the circulation liquid duct is a flat tube.
Compared with the prior art, the invention has the following beneficial effects:
(1) the invention selects the configuration of the system according to different working condition requirements to adapt to the closed-loop cooling of the heat source body device 1 in various temperature ranges, the required equipment is simple, the energy consumption is less, the working efficiency is higher, and the whole system has simple structure, strong stability and good economic benefit.
Drawings
FIG. 1 is a schematic structural view of embodiment 1 of the present invention;
FIG. 2 is a schematic structural diagram of embodiment 2 of the present invention;
FIG. 3 is a schematic structural diagram of embodiment 3 of the present invention;
FIG. 4 is a schematic view of the evaporator apparatus of the present invention;
fig. 5 is a cross-sectional view of fig. 4 of the present invention.
Detailed Description
The invention is further described with reference to the following drawings and detailed description.
As shown in fig. 1 to 5, a jet cooling system for a chip and a photovoltaic panel includes a heat source device 1, an evaporator device 2, a heat conducting plate 201, a serpentine heat exchanger 202, an evaporation liquid channel 203, a circulation liquid pipeline 204, a steam converging channel 205, an evaporation throttling device 206, a vacuum tank 3, a jet pump 4, an injection circulation tank 5, an exhalation valve 6, an injection circulation pump 7, a plate heat exchanger 8, a finned tube heat exchanger 9, a cooling tower 10, a cooling circulation pump 11, a compressor 12, a refrigeration evaporator 13, a refrigeration circulation pump 14, a refrigeration throttling device 15, a condenser 16, an evaporator stop valve 17, a condenser stop valve 18, a cooling tower inlet stop valve 19, and a cooling tower outlet stop valve 20.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
As shown in fig. 1, 4 and 5, an evaporator device 2 is fittingly installed on a heat source body device 1, two ends of the evaporator device 2 are respectively communicated with a vacuum tank 3, a jet pump 4 and an injection circulation device through pipelines, the other end of the vacuum tank 3 is communicated with the jet pump 4, the output end of the jet pump 4 is connected with a finned tube heat exchanger 9, and the output end of the finned tube heat exchanger 9 is communicated with the injection circulation device;
the evaporator device 2 comprises a heat conducting plate 201, a coiled heat exchanger 202 and an evaporation throttling device 206, wherein the coiled heat exchanger 202 is arranged in the heat conducting plate 201, and the evaporation throttling device 206 is arranged at the input end of the coiled heat exchanger 202;
the coiled pipe heat exchanger 202 comprises an evaporation liquid channel 203, circulation liquid pipelines 204 and a steam confluence channel 205, an evaporation throttling device 206 is communicated with the input end of the evaporation liquid channel 203, the output end of the evaporation liquid channel 203 is communicated with the steam confluence channel 205 through a plurality of groups of circulation liquid pipelines 204, the circulation liquid pipelines 204 are flat pipes and can be better attached to the heat source body device 1 for heat dissipation, and the output end of the steam confluence channel 205 is communicated with the input end of the jet pump 4;
the jet circulation device comprises a jet circulation box 5, an expiratory valve 6 and a jet circulation pump 7, the output end of the finned tube heat exchanger 9 is communicated with the input end of the jet circulation box 5 through a pipeline, the expiratory valve 6 is arranged on the jet circulation box 5, the output end of the jet circulation box 5 is communicated with the input end of the jet circulation pump 7 through a pipeline, and the output end of the jet circulation pump 7 is respectively communicated with the jet pump 4 and the evaporation throttling device 206 through pipelines.
The working principle of the embodiment is as follows: when the jet circulation pump 7 works, a large stream of jet circulation liquid is pushed to flow to and is injected into the jet pump 4, another large stream of jet circulation liquid is divided into a plurality of small streams to enter the evaporation throttling device 206 in front of the inlet of the evaporator device 2, the jet circulation liquid entering the coiled pipe heat exchanger 202 is subjected to vacuum because of the jet pump 4, so that the jet circulation liquid absorbs the heat of the heat source device 1 and is evaporated under the condition of negative pressure, the evaporated fluid is sucked into the jet pump 4 to release latent heat, the latent heat is released to become liquid and is mixed with the jet circulation liquid, the temperature of the jet circulation liquid is increased by more than 10 degrees, when the temperature of the jet circulation liquid reaches more than 45 ℃, the jet steam action of the jet circulation liquid is reduced rapidly, because the circulation liquid loses the action of condensed steam, the jet circulation liquid is evaporated under the relative vacuum condition, and the evaporation speed balances the jet steam quantity of the jet circulation liquid, leading to the complete loss of the injection effect. Therefore, during the operation, the injection liquid is required to be sent into the finned tube heat exchanger 9 together to exchange heat with the outside air, the temperature of the injection circulating liquid is kept below 25 ℃ all the time to work, and finally the injection circulating liquid flows into the injection circulating box 5, after the air is removed through the air exhaust valve 6 arranged at the upper part of the injection circulating box, the injection circulating pump 7 is pressed into the jet pump 4 and the evaporator device 2 again to realize the cycle-and-cycle circulation process. This embodiment is suitable for the working method that the heat source body device 1 directly radiates with the outdoor air.
Example 2
As shown in fig. 2, 4 and 5, an evaporator device 2 is fittingly installed on a heat source body device 1, two ends of the evaporator device 2 are respectively communicated with a vacuum tank 3, a jet pump 4 and an injection circulation device through pipelines, the other end of the vacuum tank 3 is communicated with the jet pump 4, an output end of the jet pump 4 is connected with a plate heat exchanger 8, and an output end of the plate heat exchanger 8 is communicated with the injection circulation device;
the evaporator device 2 comprises a heat conducting plate 201, a coiled heat exchanger 202 and an evaporation throttling device 206, wherein the coiled heat exchanger 202 is arranged in the heat conducting plate 201, and the evaporation throttling device 206 is arranged at the input end of the coiled heat exchanger 202;
the coiled pipe heat exchanger 202 comprises an evaporation liquid channel 203, circulation liquid pipelines 204 and a steam confluence channel 205, an evaporation throttling device 206 is communicated with the input end of the evaporation liquid channel 203, the output end of the evaporation liquid channel 203 is communicated with the steam confluence channel 205 through a plurality of groups of circulation liquid pipelines 204, the circulation liquid pipelines 204 are flat pipes and can be better attached to the heat source body device 1 for heat dissipation, and the output end of the steam confluence channel 205 is communicated with the input end of the jet pump 4;
the jet circulation device comprises a jet circulation box 5, an expiratory valve 6 and a jet circulation pump 7, the output end of the plate-type heat exchanger 8 is communicated with the input end of the jet circulation box 5 through a pipeline, the expiratory valve 6 is arranged on the jet circulation box 5, the output end of the jet circulation box 5 is communicated with the input end of the jet circulation pump 7 through a pipeline, and the output end of the jet circulation pump 7 is respectively communicated with the jet pump 4 and the evaporation throttling device 206 through pipelines;
the output end of the plate heat exchanger 8 is connected with the input end of the cooling tower 10 through a pipeline, the output end of the cooling tower 10 is connected with the input end of the plate heat exchanger 8 through a pipeline, and the output end of the plate heat exchanger 8 is provided with a cooling circulating pump 11.
The working principle of the embodiment is as follows: except that the plate heat exchanger 8 and the cooling circulation pump 11 are added to cooperate with the water cooling mode of the cooling tower 10, the rest working principles are the same as those of the embodiment 1, the wet bulb temperature which is slightly lower than the ambient temperature by 1-2 ℃ can be realized in the embodiment, the cooling and heat dissipation scale of the embodiment is wider in application range compared with that of the embodiment 1, and in other working requirements, one cooling tower 10, one plate heat exchanger 8 and the corresponding cooling circulation pump 11 can be added to correspond to a plurality of groups of circulation systems of the jet pump 4 to realize large-scale heat dissipation, which is not shown in the figure.
Example 3
As shown in fig. 3, 4 and 5, an evaporator device 2 is fittingly installed on a heat source body device 1, two ends of the evaporator device 2 are respectively communicated with a vacuum tank 3, a jet pump 4 and an injection circulation device through pipelines, the other end of the vacuum tank 3 is communicated with the jet pump 4, an output end of the jet pump 4 is connected with a plate heat exchanger 8, and an output end of the plate heat exchanger 8 is communicated with the injection circulation device;
the evaporator device 2 comprises a heat conducting plate 201, a coiled heat exchanger 202 and an evaporation throttling device 206, wherein the coiled heat exchanger 202 is arranged in the heat conducting plate 201, and the evaporation throttling device 206 is arranged at the input end of the coiled heat exchanger 202;
the coiled pipe heat exchanger 202 comprises an evaporation liquid channel 203, circulation liquid pipelines 204 and a steam confluence channel 205, wherein an evaporation throttling device 206 is communicated with the input end of the evaporation liquid channel 203, the output end of the evaporation liquid channel 203 is communicated with the steam confluence channel 205 through a plurality of groups of circulation liquid pipelines 204, the circulation liquid pipelines 204 are flat pipes and can be better attached to the heat source device 1 for heat dissipation, and the output end of the steam confluence channel 205 is communicated with the input end of the jet pump 4;
the jet circulation device comprises a jet circulation box 5, an expiratory valve 6 and a jet circulation pump 7, the output end of the plate-type heat exchanger 8 is communicated with the input end of the jet circulation box 5 through a pipeline, the expiratory valve 6 is arranged on the jet circulation box 5, the output end of the jet circulation box 5 is communicated with the input end of the jet circulation pump 7 through a pipeline, and the output end of the jet circulation pump 7 is respectively communicated with the jet pump 4 and the evaporation throttling device 206 through pipelines;
the output end of the plate heat exchanger 8 is connected with the input end of the cooling tower 10 through a pipeline, the output end of the cooling tower 10 is connected with the input end of the plate heat exchanger 8 through a pipeline, and the output end of the plate heat exchanger 8 is provided with a cooling circulating pump 11.
The combined cooling device comprises a compressor 12, a refrigeration evaporator 13, a refrigeration circulating pump 14, a refrigeration throttling device 15 and a condenser 16, the output end of the plate type heat exchanger 8 is connected with the refrigeration evaporator 13 through a pipeline, the output end of the refrigeration evaporator 13 is respectively connected with the compressor 12, the refrigeration throttling device 15 and the input end of the plate type heat exchanger 8, the other ends of the compressor 12 and the refrigeration throttling device 15 are connected with the condenser 16, and the output end of the condenser 16 is connected with the cooling tower 10 through a pipeline. An evaporator stop valve 17 is arranged on a connecting pipeline between the output end of the refrigeration evaporator 13 and the plate heat exchanger 8; the output end pipeline of the condenser 16 is provided with a condenser stop valve 18.
The working principle of the embodiment is as follows: taking the circulation systems of two groups of jet pumps 4 as an example, the difference from the embodiment 2 is that a combined cooling device is additionally arranged to realize cooling and heat dissipation in a wider temperature range, the embodiment is an additional system which is used for strengthening the flow combination of a refrigeration air conditioning unit configured when the environmental temperature may exceed more than 30 ℃ in summer in some regions, and the purpose of efficiently spraying and ejecting steam to realize heat absorption of a heat source body cannot be realized by simply directly cooling the sprayed circulation liquid to below 25 ℃ by air due to overhigh environmental temperature; when the temperature of the injection circulating liquid is higher than 30 ℃, the effect is greatly reduced, and when the temperature of the injection circulating liquid is higher than 45 ℃, the capacity of injecting steam is lost; the working process of this embodiment is through the work of jet pump 7 and jet pump 4 to draw steam and lead to the circulation liquid to absorb the heat of heat source body device 1 and evaporate, impel heat source body device 1 to be cooled down, the latent heat that rethread jet pump 7 absorbed the transfer is taken to plate heat exchanger 8 in and is carried out heat exchange with the combination cooling device, the heat of heat source body device 1 is transferred to cooling tower 10 again to the combination cooling device through compressor 12 work, the wet bulb temperature of environment is realized through the water-cooling of cooling tower 10, just so can keep the temperature of jet circulation liquid to work below 25 ℃, thereby can guarantee that the system is in high-efficient stable running state all the time.
When the combined cooling device in the flow structure system stops working under the condition of low ambient temperature, the compressor 12 is in a stop state, the refrigeration circulating pump 14 is also in a stop state, the stop valve 26 of the refrigeration evaporator 13 is closed, and the stop valve 24 of the refrigeration unit condenser 23 is also closed. The outlet cooling tower cutoff valve 25 is opened, and the inlet cooling tower cutoff valve 21 is also opened. The cooling circulation pump 17 is operated to bring the heat transferred from the heat source obtained from the two plate heat exchangers 9 to the cooling tower 10 for heat dissipation. When the environment temperature is higher, the operation of the refrigerating unit can not be kept below 25 ℃, the evaporator stop valve 17 of the evaporator 19 of the refrigerating unit is opened, and the condenser stop valve 18 is also opened; the cooling tower stop valve 20 is closed, the cooling tower stop valve 19 is closed, the refrigerating circulating pump 17 is started, and the compressor 12 is started, so that the operation of the combined cooling device can always keep the spraying circulating liquid to work at 25 ℃, the power of the combined cooling device is much lower than that of a refrigerating unit prepared by the traditional cooling process, the spraying circulating liquid is effectively maintained at 25 ℃, the actual effect is not realized if the refrigerating air conditioning unit needs to maintain the temperature of the chilled water at about 12 ℃, the difference is 13 ℃, the energy is saved, and the energy consumption is reduced.
In the invention, the heat source body device 1 is generally a chip or a photovoltaic panel or a combination device thereof, the invention shows the heat dissipation cooling form of the heat source body device 1 under different temperature conditions through different embodiments, the configuration of the system is selected according to different working condition requirements so as to adapt to the closed-loop cooling of the heat source body device 1 in various temperature ranges, the required equipment is simple, the energy consumption is less, the working efficiency is higher, the whole system has simple structure, strong stability and good economic benefit.
The above-mentioned embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and therefore, modifications, equivalent changes, improvements, etc. made in the claims of the present invention are still included in the scope of the present invention.
Claims (10)
1. The jet cooling system for the chip and the photovoltaic panel is characterized in that: including heat source body device (1), evaporimeter device (2), vacuum tank (3), jet pump (4), spray circulating device and outside heat exchanger, evaporimeter device (2) are installed to the adaptation on heat source body device (1), evaporimeter device (2) both ends are respectively through pipeline and vacuum tank (3), jet pump (4) and spray circulating device intercommunication, the other end and jet pump (4) the intercommunication of vacuum tank (3), the output and the outside heat exchanger of jet pump (4) are connected, the output and the spray circulating device intercommunication of outside heat exchanger.
2. The fluidic cooling system for chips and photovoltaic panels according to claim 1, characterized in that: the evaporator device (2) comprises a heat conduction plate (201), a coiled heat exchanger (202) and an evaporation throttling device (206), wherein the coiled heat exchanger (202) is arranged in the heat conduction plate (201), and the evaporation throttling device (206) is arranged at the input end of the coiled heat exchanger (202).
3. The fluidic cooling system for chips and photovoltaic panels according to claim 2, characterized in that: the jet circulation device comprises a jet circulation box (5), an expiratory valve (6) and a jet circulation pump (7), the output end of the external heat exchanger is communicated with the input end of the jet circulation box (5) through a pipeline, the expiratory valve (6) is arranged on the jet circulation box (5), the output end of the jet circulation box (5) is communicated with the input end of the jet circulation pump (7) through a pipeline, and the output end of the jet circulation pump (7) is communicated with the jet pump (4) and the evaporation throttling device (206) through pipelines respectively.
4. The fluidic cooling system for chips and photovoltaic panels according to claim 2, characterized in that: the coiled pipe heat exchanger (202) comprises an evaporation liquid channel (203), circulation liquid pipelines (204) and a steam confluence channel (205), wherein the evaporation throttling device (206) is communicated with the input end of the evaporation liquid channel (203), the output end of the evaporation liquid channel (203) is communicated with the steam confluence channel (205) through a plurality of groups of circulation liquid pipelines (204), and the output end of the steam confluence channel (205) is communicated with the input end of the jet pump (4).
5. The jet cooling system for the chip and the photovoltaic panel as claimed in any one of claims 1 to 4, wherein: the external heat exchanger is a plate heat exchanger (8).
6. The jet cooling system for the chip and the photovoltaic panel as claimed in any one of claims 1 to 4, wherein: the external heat exchanger is a finned tube heat exchanger (9).
7. The fluidic cooling system for chips and photovoltaic panels according to claim 5, characterized in that: the output end of the plate type heat exchanger (8) is connected with the input end of the cooling tower (10) through a pipeline, the output end of the cooling tower (10) is connected with the input end of the plate type heat exchanger (8) through a pipeline, and the output end of the plate type heat exchanger (8) is provided with a cooling circulating pump (11).
8. The fluidic cooling system for chips and photovoltaic panels according to claim 7, characterized in that: still include combination cooling device, combination cooling device includes compressor (12), refrigeration evaporimeter (13), refrigeration circulating pump (14), refrigeration throttling arrangement (15) and condenser (16), the output of plate heat exchanger (8) passes through the pipeline and is connected with refrigeration evaporimeter (13), the output of refrigeration evaporimeter (13) is connected with the input of compressor (12), refrigeration throttling arrangement (15) and plate heat exchanger (8) respectively, the other end of compressor (12) and refrigeration throttling arrangement (15) all is connected with condenser (16), the output of condenser (16) pass through the pipeline with cooling tower (10) are connected.
9. The fluidic cooling system for chips and photovoltaic panels according to claim 8, characterized in that: an evaporator stop valve (17) is arranged on a connecting pipeline between the output end of the refrigeration evaporator (13) and the plate heat exchanger (8); and a condenser stop valve (18) is arranged on an output end pipeline of the condenser (16).
10. The fluidic cooling system for chips and photovoltaic panels according to claim 2, characterized in that: the circulating liquid pipeline (204) is a flat pipe.
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4438633A (en) * | 1982-11-12 | 1984-03-27 | Hiser Leland L | Method and apparatus for using low grade thermal energy to improve efficiency of air conditioning and refrigeration systems |
| CN2177621Y (en) * | 1993-12-23 | 1994-09-21 | 西安交通大学 | Energy-saving air-conditioner for vehicle and ship |
| CN1818509A (en) * | 2006-03-09 | 2006-08-16 | 西安交通大学 | Steam jetting refrigerating circulation system |
| CN101813352A (en) * | 2009-02-25 | 2010-08-25 | 王海 | Jet-type air conditioner |
| CN202254476U (en) * | 2011-09-30 | 2012-05-30 | 北京时代科仪新能源科技有限公司 | Efficient heat energy processing system |
| CN105180490A (en) * | 2015-09-09 | 2015-12-23 | 中国科学院理化技术研究所 | Integrated natural cooling machine room air conditioner system |
| CN211400153U (en) * | 2019-12-19 | 2020-09-01 | 北京丰联奥睿科技有限公司 | Water-cooled power heat pipe multi-connected air conditioning system |
| CN113829841A (en) * | 2021-10-08 | 2021-12-24 | 上海汇缔科技有限公司 | Heat source auxiliary driving refrigerating device |
| CN217742096U (en) * | 2022-04-11 | 2022-11-04 | 湖南创化低碳环保科技有限公司 | Jet type cooling system for chip and photovoltaic panel |
-
2022
- 2022-04-11 CN CN202210371797.0A patent/CN114698345A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4438633A (en) * | 1982-11-12 | 1984-03-27 | Hiser Leland L | Method and apparatus for using low grade thermal energy to improve efficiency of air conditioning and refrigeration systems |
| CN2177621Y (en) * | 1993-12-23 | 1994-09-21 | 西安交通大学 | Energy-saving air-conditioner for vehicle and ship |
| CN1818509A (en) * | 2006-03-09 | 2006-08-16 | 西安交通大学 | Steam jetting refrigerating circulation system |
| CN101813352A (en) * | 2009-02-25 | 2010-08-25 | 王海 | Jet-type air conditioner |
| CN202254476U (en) * | 2011-09-30 | 2012-05-30 | 北京时代科仪新能源科技有限公司 | Efficient heat energy processing system |
| CN105180490A (en) * | 2015-09-09 | 2015-12-23 | 中国科学院理化技术研究所 | Integrated natural cooling machine room air conditioner system |
| CN211400153U (en) * | 2019-12-19 | 2020-09-01 | 北京丰联奥睿科技有限公司 | Water-cooled power heat pipe multi-connected air conditioning system |
| CN113829841A (en) * | 2021-10-08 | 2021-12-24 | 上海汇缔科技有限公司 | Heat source auxiliary driving refrigerating device |
| CN217742096U (en) * | 2022-04-11 | 2022-11-04 | 湖南创化低碳环保科技有限公司 | Jet type cooling system for chip and photovoltaic panel |
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