CN114678462A - Piezoelectric film sensor structure on double-sided flexible circuit board and preparation method - Google Patents
Piezoelectric film sensor structure on double-sided flexible circuit board and preparation method Download PDFInfo
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- CN114678462A CN114678462A CN202210228929.4A CN202210228929A CN114678462A CN 114678462 A CN114678462 A CN 114678462A CN 202210228929 A CN202210228929 A CN 202210228929A CN 114678462 A CN114678462 A CN 114678462A
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- Prior art keywords
- circuit board
- film sensor
- thin film
- piezoelectric film
- piezoelectric
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- 239000010408 film Substances 0.000 claims description 38
- 239000010409 thin film Substances 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000013039 cover film Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000007738 vacuum evaporation Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 8
- 239000007788 liquid Substances 0.000 description 6
- 238000002788 crimping Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention relates to the technical field of piezoelectric film sensors, in particular to a piezoelectric film sensor structure and a preparation method thereof, wherein the piezoelectric film sensor structure comprises a flexible circuit board, a first metal layer, a second metal layer and a third metal layer, wherein the flexible circuit board is of a double-sided metal structure and comprises an upper surface metal layer and a lower surface metal shielding layer; a piezoelectric film, comprising: the bottom electrode is arranged on the upper surface metal layer; the piezoelectric film layer is arranged above the bottom electrode; and the upper electrode is arranged above the piezoelectric film layer and comprises an electrode leading-out structure connected with the bottom electrode. The invention fully utilizes the upper and lower metal layers of the double-sided flexible circuit board to strengthen the piezoelectric film sensor from the aspects of structure and performance, improves the reliability, simultaneously has miniaturized connector, is convenient to be connected with a mainboard, realizes the multi-lead-out function, and effectively solves the problem that the bonding pad and the connector can not be connected by direct welding.
Description
Technical Field
The invention relates to the technical field of piezoelectric film sensors, in particular to a piezoelectric film sensor structure and a preparation method thereof.
Background
Piezoelectric thin films are generally flexible polymer organic materials, and are thinner, lighter and softer than inorganic piezoelectric materials, and have advantages over inorganic piezoelectric materials in performance, so that piezoelectric thin films are more and more favored in places with higher requirements on space and structure.
However, the piezoelectric film has a major disadvantage that the curie temperature is low, often lower than 100 ℃, so that a series of manufacturing processes around the piezoelectric film are controlled to be at a low temperature, so that the manufacturing process of the piezoelectric film sensor is more specific than the conventional sensor manufacturing process, and particularly, the electrode lead-out is a key process of the piezoelectric film sensor.
The upper and lower electrode of piezoelectric film sensor because the lower reason of piezoelectric film curie temperature can only adopt low temperature silver thick liquid printing, and low temperature silver thick liquid melting point is lower, after the electrode wire is drawn forth, can't be through welding this kind of high temperature technology, with electrode and connector or lead wire welding, consequently often the traditional mode can only adopt the mode of riveting or crimping to draw forth the pad of low temperature silver thick liquid preparation.
If the electrode of the piezoelectric film sensor adopts a riveting mode, the thickness of the leading-out position is larger, the miniaturization of the sensor is not facilitated, and if the electrode of the piezoelectric film sensor adopts a crimping mode, the area of a single bonding pad is inevitably larger, the leading-out quantity of the electrodes of the sensor can be limited, and the leading-out quantity of the electrodes of the sensor array is not facilitated.
Disclosure of Invention
The invention also aims to provide a piezoelectric film sensor structure on the double-sided flexible circuit board and a preparation method thereof, so as to solve the technical problems;
a piezoelectric film sensor structure on a double-sided flexible circuit board comprises,
the flexible circuit board is of a double-sided metal structure and comprises an upper surface metal layer and a lower surface metal shielding layer;
a piezoelectric film, comprising:
the bottom electrode is arranged on the upper surface metal layer;
the piezoelectric film layer is arranged above the bottom electrode;
and the upper electrode is arranged above the piezoelectric film layer and comprises an electrode leading-out structure connected with the bottom electrode.
Preferably, the piezoelectric device further comprises an upper covering film covering the piezoelectric film.
Preferably, the bottom electrode includes a first pad disposed on the upper surface metal layer, and the electrode lead-out structure is electrically connected to the first pad.
Preferably, the piezoelectric film includes a signal outgoing line disposed on the upper surface metal layer, and the signal outgoing line is connected to the first pad.
Preferably, the flexible circuit board is further provided with a circuit board leading-out structure, and the tail end of the circuit board leading-out structure is provided with a second bonding pad connected with the first bonding pad.
Preferably, the second pad is electrically connected to an external connector.
Preferably, a plurality of ground vias are arranged on two sides of the circuit board leading-out structure.
A method for preparing a piezoelectric thin film sensor structure on a double-sided flexible circuit board, which is applied to the piezoelectric thin film sensor structure, comprises the following steps:
step S1, fabricating the bottom electrode on the upper surface metal layer of the flexible circuit board;
step S2, fabricating the piezoelectric thin film layer on the bottom electrode;
step S3, manufacturing the upper electrode on the piezoelectric film layer by adopting a low-temperature silver paste printing mode and/or a vacuum evaporation plating mode;
step S4, fabricating the electrode lead-out structure on the upper electrode and connecting the bottom electrode.
Preferably, the method further comprises the following steps:
step S5, electrically connecting the connector with the second pad by means of soldering and/or conductive adhesive.
The invention has the beneficial effects that: by adopting the technical scheme, the piezoelectric film sensor is reinforced in structure and performance by fully utilizing the upper and lower metal layers of the double-sided flexible circuit board, the reliability is improved, meanwhile, the connector is miniaturized, is conveniently connected with a mainboard, realizes multiple leading-out functions, and effectively solves the problem that a bonding pad and the connector cannot be connected through direct welding.
Drawings
FIG. 1 is an exploded view of a piezoelectric film sensor configuration in an embodiment of the invention;
FIG. 2 is an assembled schematic view of a piezoelectric thin film sensor structure in an embodiment of the invention;
FIG. 3 is a schematic structural diagram of a top metal layer according to an embodiment of the present invention;
fig. 4 is a schematic step diagram of a method for manufacturing a piezoelectric thin film sensor structure according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
A piezoelectric film sensor structure on a double-sided flexible circuit board comprises,
The flexible circuit board 1 is of a double-sided metal structure and comprises an upper surface metal layer 2 and a lower surface metal shielding layer 3;
a piezoelectric thin film 4 comprising:
a bottom electrode 41 disposed on the upper surface metal layer 2;
a piezoelectric thin film layer 42 disposed above the bottom electrode 41;
and an upper electrode 43 disposed above the piezoelectric thin film layer 42, wherein the upper electrode 43 includes an electrode lead-out structure 44 connected to the bottom electrode 41.
Specifically, according to the technical scheme, double-sided metal layers of the flexible circuit board 1 are fully utilized, the flexible circuit board 1 is used as the bottom electrode 41, the base material and the signal outgoing line, and then the piezoelectric film sensor is manufactured on the substrate of the flexible circuit board 1 layer by layer.
In whole manufacture process, connector welding process can effectively be realized to upper surface metal level 2, and the lower surface metal level can regard as the signal shielding layer, has all strengthened piezoelectric film sensor from structure and performance, simultaneously because flexible circuit board 1's two-sided metallic structure has been borrowed to most region, and only local area has used piezoelectric film 4 and low temperature conductive silver thick liquid, and the reliability has also obtained the promotion.
In a preferred embodiment, the piezoelectric film sensor structure further includes an upper cover film 5 covering the piezoelectric film 4 for protecting the piezoelectric film sensor.
In a preferred embodiment, the bottom electrode 41 includes a first bonding pad 21 disposed on the upper surface metal layer 2, and the electrode lead-out structure 44 is electrically connected to the first bonding pad 21.
In a preferred embodiment, the piezoelectric film 4 includes a signal lead disposed on the upper surface metal layer 2, the signal lead being connected to the first pad 21.
In a preferred embodiment, the flexible circuit board 1 is further provided with a circuit board lead-out structure, and the end of the circuit board lead-out structure is provided with a second bonding pad 22 connected with the first bonding pad 21.
In a preferred embodiment, the second pads 22 are electrically connected to an external connector.
Specifically, the defect that the mode that adopts riveted mode or adoption crimping to the electrode of piezoelectric film sensor leads to among the prior art, this technical scheme's way is the connector that direct welding contains a plurality of pin feet on low temperature silver thick liquid pad, just so can realize drawing forth characteristics more like the circuit board, the connector is more miniaturized simultaneously, very convenient and mainboard connection, and adopt indirect mode to realize effectively solving because low temperature silver thick liquid is lower because the fusing point, lead to the pad and the unable continuous problem of mode through direct bonding of connector.
Specifically, the connector is welded on the bonding pad of the flexible circuit board 1, so that the indirect welding of the electrode of the piezoelectric film sensor and the connector is realized, and if a welding mode is adopted, the use of conductive adhesive can be avoided, so that the whole sensor structure is compact, miniaturized and light and thin, and the miniaturized and large-quantity piezoelectric film sensor array is possible.
In a preferred embodiment, a plurality of ground vias 23 are provided on both sides of the circuit board exit structure.
A method for manufacturing a piezoelectric thin film sensor structure on a double-sided flexible circuit board, the piezoelectric thin film sensor structure in any one of the above embodiments, comprising:
step S1, forming a bottom electrode 41 on the metal layer 2 on the upper surface of the flexible printed circuit board 1;
step S2, forming the piezoelectric thin film layer 42 on the bottom electrode 41;
step S3, manufacturing the upper electrode 43 on the piezoelectric thin film layer 42 by using a low temperature silver paste printing method and/or a vacuum evaporation method;
in step S4, an electrode lead-out structure 44 is formed on the upper electrode 43 and connected to the bottom electrode 41.
Further, still include:
step S5, electrically connecting the connector with the second pad 22 by means of soldering and/or conductive paste.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (9)
1. A piezoelectric film sensor structure on a double-sided flexible circuit board is characterized by comprising,
the flexible circuit board is of a double-sided metal structure and comprises an upper surface metal layer and a lower surface metal shielding layer;
a piezoelectric film, comprising:
the bottom electrode is arranged on the upper surface metal layer;
the piezoelectric film layer is arranged above the bottom electrode;
and the upper electrode is arranged above the piezoelectric film layer and comprises an electrode leading-out structure connected with the bottom electrode.
2. The piezoelectric thin film sensor structure according to claim 1, further comprising an upper cover film covering over the piezoelectric thin film.
3. The piezoelectric thin film sensor structure of claim 1, wherein the bottom electrode comprises a first pad disposed on the top surface metal layer, and the electrode lead-out structure is electrically connected to the first pad.
4. The piezoelectric thin film sensor structure according to claim 3, wherein the piezoelectric thin film includes a signal lead line provided to the upper surface metal layer, the signal lead line connecting the first pad.
5. The piezoelectric thin film sensor structure of claim 1, wherein the flexible circuit board is further provided with a circuit board lead-out structure, and a second bonding pad is arranged at the end of the circuit board lead-out structure and connected with the first bonding pad.
6. The piezoelectric thin film sensor structure of claim 5, wherein the second pad is electrically connected to an external connector.
7. The piezoelectric film sensor structure of claim 5, wherein a plurality of ground vias are disposed on both sides of the circuit board exit structure.
8. A method for manufacturing a piezoelectric thin film sensor structure on a double-sided flexible circuit board, which is applied to the piezoelectric thin film sensor structure of any one of claims 1 to 7, and which comprises the following steps:
step S1, manufacturing the bottom electrode on the upper surface metal layer of the flexible circuit board;
step S2, fabricating the piezoelectric thin film layer on the bottom electrode;
step S3, manufacturing the upper electrode on the piezoelectric film layer by adopting a low-temperature silver paste printing mode and/or a vacuum evaporation plating mode;
step S4, fabricating the electrode lead-out structure on the upper electrode and connecting the bottom electrode.
9. The method of making a piezoelectric thin film sensor structure of claim 8, further comprising:
step S5, electrically connecting the connector with the second pad by means of soldering and/or conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210228929.4A CN114678462A (en) | 2022-03-08 | 2022-03-08 | Piezoelectric film sensor structure on double-sided flexible circuit board and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210228929.4A CN114678462A (en) | 2022-03-08 | 2022-03-08 | Piezoelectric film sensor structure on double-sided flexible circuit board and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114678462A true CN114678462A (en) | 2022-06-28 |
Family
ID=82072363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210228929.4A Pending CN114678462A (en) | 2022-03-08 | 2022-03-08 | Piezoelectric film sensor structure on double-sided flexible circuit board and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114678462A (en) |
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2022
- 2022-03-08 CN CN202210228929.4A patent/CN114678462A/en active Pending
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