CN114670151B - Temperature control clamping device, crimping box and error code testing device - Google Patents
Temperature control clamping device, crimping box and error code testing device Download PDFInfo
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- CN114670151B CN114670151B CN202210581783.1A CN202210581783A CN114670151B CN 114670151 B CN114670151 B CN 114670151B CN 202210581783 A CN202210581783 A CN 202210581783A CN 114670151 B CN114670151 B CN 114670151B
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- 238000012360 testing method Methods 0.000 title claims abstract description 22
- 238000002788 crimping Methods 0.000 title claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 230000000149 penetrating effect Effects 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims description 53
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 18
- 238000005057 refrigeration Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 claims description 5
- 239000000110 cooling liquid Substances 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Semiconductor Lasers (AREA)
- Control Of Temperature (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The invention provides a temperature control clamping device, a crimping box and an error code testing device, and belongs to the technical field of digital communication. The temperature control clamping device comprises a fixed substrate; a cylinder having a retractable plunger rod; the cylinder supporting plate is fixedly connected with the fixed base plate and used for fixing the cylinder; the movable push plate is positioned below the cylinder supporting plate and is fixedly connected with the plunger rod; the limiting plate is fixedly connected with the fixed substrate and is used for penetrating through the optical module; the upper temperature control module is positioned above the optical module and is hung at the movable push plate through a first fastener; the lower temperature control module is positioned below the optical module; the pressing block structure is hung at the movable push plate through a second fastener; the lever plate is rotatably connected with the fixed base plate through a rotating shaft, the axis of the rotating shaft is horizontally arranged, and the upper surfaces of the two ends of the lever plate are opposite to the bottom of the pressing block structure and the bottom surface of the lower temperature control module respectively. The temperature control clamping device, the crimping box and the error code testing device can ensure the surface quality of the optical module.
Description
Technical Field
The invention relates to the technical field of digital communication, in particular to a temperature control clamping device, a crimping box and an error code testing device.
Background
In the current optical module test, the module is attached to the temperature control module (semiconductor cooling plate + heat sink + water cooling head) by using a fastening mode of a screw or an elbow clip. Since the optical module needs to be in good contact with the heat sink, the module is easily scratched during plugging. Some optical module manufacturers use a high-temperature adhesive tape or other light, thin and wear-resistant medium to be placed between the optical module and the heat sink, so that the appearance of the optical module is poor due to loss of test efficiency.
Disclosure of Invention
It is an object of a first aspect of the present invention to provide a temperature-controlled clamping device that can ensure the surface quality of an optical module.
It is a further object of the invention to ensure that the compression makes the heat conducting surfaces in effective contact without damaging the surface of the optical module.
A further object of the present invention is to ensure the plugging accuracy of the optical module.
It is an object of a second aspect of the invention to provide a crimp box comprising a temperature-controlled clamping device as described above.
It is an object of a third aspect of the invention to provide an error code testing device comprising the above-described splice box.
In particular, the present invention provides a temperature controlled clamping device for crimping and temperature control of an optical module, comprising:
fixing the substrate;
a cylinder having a retractable plunger rod;
the cylinder supporting plate is fixedly connected with the fixed base plate and used for fixing the cylinder;
the movable push plate is positioned below the cylinder supporting plate and is fixedly connected with the plunger rod;
the limiting plate is fixedly connected with the fixed substrate and is used for penetrating through the optical module;
the upper temperature control module is positioned above the optical module and is hung at the movable push plate through a first fastener, and the upper temperature control module is used for gradually pressing the upper surface of the optical module when the movable push plate moves downwards;
the lower temperature control module is positioned below the optical module;
the pressing block structure is hung at the movable push plate through a second fastening piece and is used for moving downwards when the movable push plate moves downwards;
the lever plate is rotatably connected with the fixed base plate through a rotating shaft, the axis of the rotating shaft is horizontally arranged, and the upper surfaces of two ends of the lever plate are respectively opposite to the bottom of the pressing block structure and the bottom surface of the lower temperature control module, so that the lower temperature control module is tilted through the lever plate when the pressing block structure moves downwards, and the lower temperature control module is gradually pressed against the lower surface of the optical module;
the first fastening piece comprises a first cap part and a first column part, the first cap part is positioned above the movable push plate, the first column part penetrates through the movable push plate and then is fixedly connected with the upper temperature control module, the first column part can move relative to the movable push plate, and a first spring is sleeved on the part, positioned between the movable push plate and the upper temperature control module, of the first column part;
the second fastener includes second cap portion and second post portion, the second cap portion is located the top of activity push pedal, the second post portion passes behind the activity push pedal with the briquetting structure links firmly, the second post portion can for the activity push pedal removes, the second post position in the activity push pedal with partial cover between the briquetting structure is equipped with the second spring.
Optionally, a guide pin is arranged on the top surface of the upper temperature control module, and the cylinder supporting plate and the movable push plate are respectively provided with a first guide hole and a second guide hole for penetrating the guide pin.
Optionally, the upper temperature control module includes:
the upper water-cooling head cover is used for arranging the guide pin and the first fastener;
the upper heat sink is fixedly connected with the upper water-cooling head cover and forms a first cavity together with the upper water-cooling head cover, and the bottom surface of the upper heat sink is provided with a first heat conduction surface for conducting heat to the upper surface of the optical module;
the upper water cooling structure is arranged in the first containing cavity;
and the first semiconductor refrigeration piece is arranged in the first containing cavity, and the upper surface and the lower surface of the first semiconductor refrigeration piece are respectively contacted with the upper water cooling structure and the upper heat sink.
Optionally, the lower temperature control module includes:
the lower water cooling head upper cover is provided with an opening which is communicated in the vertical direction;
the top surface of the lower heat sink is provided with a heat conduction boss which is matched with the opening, and the top surface of the heat conduction boss is a second heat conduction surface which is used for conducting heat to the lower surface of the optical module;
the top surface of the second semiconductor refrigeration piece is in contact with the lower heat sink;
the lower water cooling structure is in contact with the bottom surface of the second semiconductor refrigerating sheet;
and the lower water-cooling head lower cover is fixedly connected with the lower water-cooling head upper cover and forms a second containing cavity together with the lower water-cooling head upper cover, and the second containing cavity is used for containing the lower heat sink, the second semiconductor refrigeration piece and the lower water-cooling structure.
Optionally, the temperature-controlled clamping device further comprises: and the third fastening piece is provided with a third cap part and a third column part, the third column part penetrates through the lower temperature control module and then is fixedly connected with the fixed base plate, the lower temperature control module can move relative to the third column part, a third spring is sleeved on the third column part, and two ends of the third spring are respectively abutted against the third cap part and the top surface of the lower temperature control module.
Optionally, the limiting plate is provided with a mounting through hole for penetrating the optical module, and part of the mounting through hole penetrates through the upper surface and the lower surface of the limiting plate, so that the optical module is in contact with the upper temperature control module and the lower temperature control module; and the bottoms of the two sides of the mounting through hole are provided with limiting convex strips for limiting the height of the bottom surface of the optical module.
Optionally, the temperature-controlled clamping device further comprises:
the supporting column, with fixed baseplate fixed connection, the top of supporting column with the bottom surface butt of cylinder layer board just locks through the fourth fastener.
In particular, the invention further provides a crimping box, which comprises a shell and the temperature control clamping device, wherein the temperature control clamping device is arranged in the shell.
Particularly, the invention also provides an error code testing device, which comprises an error code instrument, a DUT (device under test) circuit board and the crimp box, wherein the crimp box and the error code instrument form detachable connection, the DUT circuit board is provided with an interface for splicing the optical module, and the circuit board is connected with a testing chip of the error code instrument through a radio frequency connector.
According to an embodiment of the invention, a temperature control clamping device capable of bidirectional pressure connection and temperature control is provided, wherein a movable push plate is driven to move downwards by a plunger rod of an air cylinder, so that an upper temperature control module is pressed and connected to the upper surface of an optical module, and a lower temperature control module is also pressed and connected to the lower surface of the optical module through a pressing block structure and transmission of a lever plate. Because the driving force of the upper temperature control module and the lower temperature control module is cylinders, the power can be accurately provided, the reasonable crimping force is ensured, the temperature control module and the optical module are not required to be crimped in a manual mode, the scratch is not easy to occur, and the appearance quality of the optical module is ensured.
According to an embodiment of the invention, a specific connection mode of the pressing block structure, the upper temperature control module and the movable push plate is provided, and by respectively designing the pressure of the cylinder, the parameters of the first spring and the second spring, the size of the lever plate and the like, the force of pressing the upper surface and the lower surface of the optical module can be ensured, and the surface of the optical module is not damaged while the heat conducting surface is effectively contacted by ensuring the pressing.
Furthermore, due to the arrangement of the first spring and the second spring, the upper temperature control module and the lower temperature control module have a buffering effect on the force of the optical module, and the protection of the quality of the upper surface of the optical module is facilitated.
According to one embodiment of the invention, the guide pins and the guide holes aligned with the guide pins are arranged, so that the upper temperature control module can be ensured to move downwards along the vertical direction and not to be inclined, the upper temperature control module can be stably pressed to the upper surface of the optical module, and effective compression joint is ensured.
According to an embodiment of the invention, the cylinder supporting plate is further provided with corresponding abdicating holes at positions aligned with the first fastening piece and the second fastening piece, so as to provide a containing space for the first cap part and the second cap part and also play a certain role in guiding to ensure the vertical movement of the movable push plate.
According to one embodiment of the invention, the third spring is arranged to buffer the pressure applied to the optical module by the lower temperature control module, so that the quality of the lower surface of the optical module can be protected.
According to one embodiment of the invention, the bottom parts of two sides of the mounting through hole are provided with limiting convex strips for limiting the height of the bottom surface of the optical module, so that the position of the optical module inserted into the mounting through hole is aligned with an interface for plugging the optical module on a circuit board of a DUT (device to be tested), and the plugging precision of the optical module is ensured.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the invention will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
FIG. 1 is a cross-sectional view of a temperature controlled clamping device (in a crimped state) according to one embodiment of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a cross-sectional structural view of a temperature controlled clamp device according to one embodiment of the present invention at a second fastener;
FIG. 4 is an exploded view of an upper temperature control module of a temperature controlled clamping device in accordance with one embodiment of the present invention;
FIG. 5 is an exploded view of a lower temperature control module of a temperature controlled clamping device in accordance with one embodiment of the present invention;
FIG. 6 is a cross-sectional structural view of a temperature controlled clamping device according to one embodiment of the present invention at a third fastener;
FIG. 7 is a schematic view of the internal structure of a crimp box according to one embodiment of the present invention;
fig. 8 is a schematic structural diagram of an error code testing device (an upper cover of a splice case is hidden) according to an embodiment of the present invention.
Reference numerals:
100-temperature control clamping device, 10-fixed base plate, 20-air cylinder, 21-plunger rod, 30-air cylinder supporting plate, 301-first guide hole, 302-first abdicating hole, 40-movable push plate, 401-second guide hole, 50-limiting plate, 501-installation through hole, 502-limiting convex strip, 503-second abdicating hole, 60-upper temperature control module, 61-upper water cooling head cover, 611-guide pin, 62-upper heat sink, 63-upper water cooling structure, 64-first semiconductor refrigeration sheet, 65-first water pipe, 70-lower temperature control module, 71-lower water cooling head upper cover, 711-opening, 72-lower heat sink, 721-heat conduction boss, 73-second semiconductor refrigeration sheet, 74-lower water cooling structure, 75-lower water cooling head lower cover, 76-a second water pipe, 80-a pressing block structure, 90-a lever plate, 91-a rotating shaft, 101-a first fastener, 102-a second fastener, 103-a first spring, 104-a second spring, 105-a third fastener, 106-a third spring, 107-a supporting column, 108-a fourth fastener, 111-a first guide sleeve, 112-a second guide sleeve, 113-a third guide sleeve, 200-an optical module, 210-a shell, 201-a first air joint, 202-an air pipe, 203-a second air joint, 204-a handle, 300-an error code instrument and 400-a DUT circuit board.
Detailed Description
FIG. 1 is a cross-sectional view of a temperature controlled clamping device 100 (in a crimped state) according to one embodiment of the present invention. Fig. 2 is a partially enlarged view of a portion a in fig. 1. FIG. 3 is a cross-sectional view of a temperature controlled clamping device 100 according to one embodiment of the present invention at a second fastener 102. The present invention further provides a temperature control clamping device 100 for crimping and temperature control of an optical module 200, in one embodiment, as shown in fig. 1, the temperature control clamping device 100 includes a fixed substrate 10, a cylinder 20, a cylinder supporting plate 30, a movable push plate 40, a limiting plate 50, an upper temperature control module 60, a lower temperature control module 70, a press block structure 80, and a lever plate 90. The cylinder 20 has a retractable plunger rod 21. The cylinder support plate 30 is fixedly connected to the fixing substrate 10 and is used for fixing the cylinder 20, as shown in fig. 1, the cylinder 20 is fixed above the cylinder support plate 30. The movable push plate 40 is located below the cylinder support plate 30 and is fixedly connected with the plunger rod 21, for example, by a screw. The limiting plate 50 is fixedly connected to the fixing substrate 10 and is used to penetrate through the optical module 200. The upper temperature control module 60 is located above the optical module 200 and is suspended at the movable push plate 40 through a first fastener 101, and the upper temperature control module 60 is used for gradually pressing the upper surface of the optical module 200 when the movable push plate 40 moves downwards. The lower temperature control module 70 is located below the optical module 200. The press block structure 80 is suspended at the movable push plate 40 by a second fastening member 102 and is used for moving downwards when the movable push plate 40 moves downwards. The lever plate 90 is rotatably connected with the fixed substrate 10 through the rotating shaft 91, the axis of the rotating shaft 91 is horizontally arranged, and the upper surfaces of the two ends of the lever plate 90 are respectively opposite to the bottom of the briquetting structure 80 and the bottom surface of the lower temperature control module 70, so that the lower temperature control module 70 is tilted through the lever plate 90 when the briquetting structure 80 moves downwards, and the lower temperature control module 70 and the lower surface of the optical module 200 are gradually compressed. When in use, the fixed base plate 10 is fixed and the cylinder 20 is started. As shown in fig. 3, in one embodiment, the second fastening member 102 includes a second cap portion and a second post portion, the second cap portion is located above the movable push plate 40, the second post portion is fixedly connected to the compact structure 80 after passing through the movable push plate 40, the second post portion is movable relative to the movable push plate 40, and a portion of the second post portion located between the movable push plate 40 and the compact structure 80 is sleeved with the second spring 104. Similarly, the first fastening member 101 includes a first cap portion and a first column portion, the first cap portion is located above the movable push plate 40, the first column portion is fixedly connected to the upper temperature control module 60 after penetrating through the movable push plate 40, the first column portion can move relative to the movable push plate 40, and a first spring 103 is sleeved on a portion of the first column portion located between the movable push plate 40 and the upper temperature control module 60.
In the temperature control clamping device 100 capable of performing two-way crimping and temperature control, the plunger rod 21 of the cylinder 20 drives the movable push plate 40 to move downward, on one hand, the upper temperature control module 60 is caused to be crimped to the upper surface of the optical module 200, and on the other hand, the lower temperature control module 70 is caused to be crimped to the lower surface of the optical module 200 through the transmission of the pressing block structure 80 and the lever plate 90. Since the driving force of the upper temperature control module 60 and the lower temperature control module 70 is the cylinder 20, the driving force can be accurately provided, a reasonable crimping force is ensured, and the temperature control module is not required to be crimped with the optical module 200 in a manual mode, so that scratches are not easily generated, and the appearance quality of the optical module 200 is ensured.
The embodiment provides a concrete connection mode of the pressing block structure 80, the upper temperature control module 60 and the movable push plate 40. In this embodiment, when the piston rod of the cylinder 20 pushes the movable push plate 40 to move downward, the upper temperature control module 60 and the press block structure 80 suspended by the movable push plate 40 also move downward synchronously due to the gravity. When the upper temperature control module 60 moves down to the bottom to abut against the upper surface of the optical module 200, the movable push plate 40 starts to compress the first spring 103, pushing the upper temperature control module 60 to press the upper surface of the optical module 200 with a proper pressure. When the pressing block structure 80 moves downward to contact with the lever plate 90, the movable push plate 40 starts to compress the second spring 104, so as to press one end of the lever plate 90, such that the other end of the lever plate 90 tilts the lower temperature control module 70, and the lower temperature control module 70 moves upward to contact the top surface thereof with the bottom surface of the optical module 200. By respectively designing the pressure of the cylinder 20, the parameters of the first spring 103 and the second spring 104, the size of the lever plate 90, and the like, the force of pressing the upper surface and the lower surface of the optical module 200 can be ensured, and the surface of the optical module 200 is not damaged while the heat conducting surface is effectively contacted by the pressing.
Further, due to the arrangement of the first spring 103 and the second spring 104, the upper temperature control module 60 and the lower temperature control module 70 have a buffering effect on the force of the optical module 200, which is beneficial to protecting the quality of the upper surface of the optical module 200.
As shown in fig. 3, in one embodiment, a guide pin 611 is disposed at the top surface of the upper temperature control module 60, and the cylinder support plate 30 and the movable push plate 40 are respectively provided with a first guide hole 301 and a second guide hole 401 for passing through the guide pin 611.
In this embodiment, the guide pins 611 and the guide holes aligned therewith are provided, so that the upper temperature control module 60 can be ensured to move downward in the vertical direction without being tilted, and the upper temperature control module 60 can be stably pressed onto the upper surface of the optical module 200, thereby ensuring effective pressure connection.
Further, as shown in fig. 3, a first guide sleeve 111 is further disposed in the first guide hole 301, and is engaged with the guide pin 611, the first guide sleeve 111 is made of a wear-resistant material, and the guide pin 611 and the cylinder support plate 30 are not easily damaged by the arrangement of the first guide sleeve 111. Accordingly, in the present embodiment, the diameter of the second guide hole 401 is set larger than the diameter of the guide pin to avoid contact therebetween.
Further, the cylinder block 30 is further provided with corresponding first relief holes 302 (see fig. 3) at positions aligned with the first fastening member 101 and the second fastening member 102 for providing accommodation spaces for the first cap and the second cap, and also for providing a certain guide function to ensure the vertical movement of the movable push plate 40.
Fig. 4 is an exploded view of the upper temperature control module 60 of the temperature controlled clamp apparatus 100 in accordance with one embodiment of the present invention. As shown in FIG. 4, in one embodiment, the upper thermal control module 60 includes an upper water cooled header cover 61, an upper heat sink 62, an upper water cooling structure 63, and a first semiconductor chilling plate 64. The upper water-cooling head cover 61 is used for arranging the guide pin 611 and the first fastening member 101, and the first fastening member 101 can be installed by arranging a plurality of threaded holes on the upper water-cooling head cover. The upper heat sink 62 is fixedly connected with the upper water-cooling head cover 61 and forms a first cavity together with the upper water-cooling head cover 61, and a first heat conducting surface is arranged on the bottom surface of the upper heat sink 62 and used for conducting heat to the upper surface of the optical module 200. The upper water-cooling structure 63 is disposed in the first cavity. The first semiconductor cooling plate 64 is disposed in the first cavity and the upper surface and the lower surface thereof are respectively in contact with the upper water cooling structure 63 and the upper heat sink 62.
Fig. 5 is an exploded view of the lower temperature control module 70 of the temperature controlled clamp device 100 according to one embodiment of the present invention. As shown in fig. 5, in one embodiment, the lower temperature control module 70 includes a lower water-cooling head upper cover 71, a lower heat sink 72, a second semiconductor cooling sheet 73, a lower water-cooling structure 74 and a lower water-cooling head lower cover 75, which are sequentially disposed. The lower water cooling head upper cover 71 is provided with an opening 711 penetrating in the vertical direction. A heat conducting boss 721 is disposed on the top surface of the lower heat sink 72, the heat conducting boss 721 is matched with the opening 711, and the top surface of the heat conducting boss 721 is a second heat conducting surface for conducting heat to the lower surface of the optical module 200. The top surface of the second semiconductor chilling plate 73 is in contact with the lower heat sink 72. The lower water-cooling structure 74 is in contact with the bottom surface of the second semiconductor chilling plate 73. The lower water-cooling head lower cover 75 is fixedly connected with the lower water-cooling head upper cover 71 and forms a second cavity together with the lower water-cooling head upper cover 71, and the second cavity is used for accommodating the lower heat sink 72, the second semiconductor refrigeration sheet 73 and the lower water-cooling structure 74.
Of course, as shown in fig. 4 and 5, the upper water-cooling structure 63 and the lower water-cooling structure 74 also include a first water pipe 65 and a second water pipe 76, respectively, which are wrapped with insulation cotton, for conveying cooling liquid to the upper water-cooling structure 63 and the lower water-cooling structure 74.
FIG. 6 is a cross-sectional view of the temperature controlled clamping device 100 at the third fastener 105, in accordance with one embodiment of the present invention. In one embodiment, as shown in fig. 6, the temperature-controlled clamping device 100 further includes a third fastening member 105 having a third cap portion and a third pillar portion, the third pillar portion is fixedly connected to the fixed substrate 10 after passing through the lower temperature-controlled module 70, the lower temperature-controlled module 70 can move relative to the third pillar portion, a third spring 106 is sleeved on the third pillar portion, and two ends of the third spring 106 respectively abut against the third cap portion and the top surface of the lower temperature-controlled module 70.
The third spring 106 can buffer the pressure applied by the lower temperature control module 70 to the optical module 200, which is beneficial to protecting the lower surface quality of the optical module 200.
Correspondingly, the limiting plate 50 is further provided with a second abdicating hole 503 aligned with the third fastening member 105.
As shown in fig. 2, the limiting plate 50 is provided with a mounting through hole 501 for penetrating the optical module 200, and a part of the mounting through hole 501 penetrates through the upper surface and the lower surface of the limiting plate 50 so that the optical module 200 is in contact with the upper temperature control module 60 and the lower temperature control module 70.
In one embodiment, as shown in fig. 2, the bottom of the two sides of the mounting through hole 501 is provided with a limiting protruding strip 502 for limiting the height of the bottom surface of the optical module 200, so that the position where the optical module 200 is inserted into the mounting through hole 501 is aligned with an interface on a DUT (device under test) circuit board for plugging the optical module 200, and the plugging precision of the optical module 200 is ensured.
As shown in fig. 3, in one embodiment, the temperature-controlled clamping device 100 further includes a supporting column 107 fixedly connected to the fixing base plate 10, and a top portion of the supporting column 107 abuts against a bottom surface of the cylinder pallet 30 and is locked by a fourth fastening member 108. This achieves the fixation of the cylinder block 30.
Further, as shown in fig. 3, a second guide sleeve 112 and a third guide sleeve 113 are respectively disposed in the through holes of the supporting column 107 through which the movable push plate 40 and the compact structure 80 are inserted, so that the movable push plate 40 and the compact structure 80 are not easily damaged during movement.
Fig. 7 is a schematic view of the internal structure of a crimp box according to an embodiment of the present invention. The present invention further provides a crimping box, as shown in fig. 7, in one embodiment, the crimping box comprises a housing 210 and the temperature-controlled clamping device 100 of any one or a combination of the above embodiments, wherein the temperature-controlled clamping device 100 is disposed in the housing 210.
The housing 210 may further be provided with a first air connector 201 for introducing air, and is connected to each air cylinder 20 through an air pipe 202 to provide air for the air cylinders 20. The housing 210 may be further provided with a second air connector 203 for introducing dry air to dry the inside of the housing 210, so as to solve the problem of condensation during low temperature testing.
Of course, handles 204 may be provided on both sides of the outer surface of the housing 210 to facilitate operation of the crimp box.
Fig. 8 is a schematic structural diagram of an error code testing device (an upper cover of a splice case is hidden) according to an embodiment of the present invention. The invention also provides an error code testing device, as shown in fig. 8, the error code testing device comprises an error code meter 300, a DUT circuit board 400 and the crimping box, the crimping box and the error code meter 300 form a detachable connection, the DUT circuit board 400 is provided with an interface for plugging the optical module 200, and the circuit board is connected with a testing chip of the error code meter 300 through a radio frequency connector.
In this embodiment, the error code testing device is designed to be in a structural form that the DUT circuit board 400 and the crimp box can be replaced, so that the corresponding DUT circuit board 400 and the corresponding crimp box can be replaced according to different optical modules 200, thereby improving the testing efficiency.
Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been illustrated and described in detail herein, many other variations or modifications consistent with the principles of the invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should be understood and interpreted to cover all such other variations or modifications.
Claims (9)
1. A temperature control clamping device for crimping and temperature control of an optical module, comprising:
fixing the substrate;
a cylinder having a retractable plunger rod;
the cylinder supporting plate is fixedly connected with the fixed base plate and used for fixing the cylinder;
the movable push plate is positioned below the cylinder supporting plate and is fixedly connected with the plunger rod;
the limiting plate is fixedly connected with the fixed substrate and is used for penetrating through the optical module;
the upper temperature control module is positioned above the optical module and is hung at the movable push plate through a first fastener, and the upper temperature control module is used for gradually pressing the upper surface of the optical module when the movable push plate moves downwards;
the lower temperature control module is positioned below the optical module;
the pressing block structure is hung at the movable push plate through a second fastening piece and is used for moving downwards when the movable push plate moves downwards;
the lever plate is rotatably connected with the fixed base plate through a rotating shaft, the axis of the rotating shaft is horizontally arranged, and the upper surfaces of two ends of the lever plate are respectively opposite to the bottom of the briquetting structure and the bottom surface of the lower temperature control module, so that the lower temperature control module is tilted through the lever plate when the briquetting structure moves downwards, and the lower temperature control module is gradually pressed against the lower surface of the optical module;
the first fastening piece comprises a first cap part and a first column part, the first cap part is positioned above the movable push plate, the first column part penetrates through the movable push plate and then is fixedly connected with the upper temperature control module, the first column part can move relative to the movable push plate, and a first spring is sleeved on the part, positioned between the movable push plate and the upper temperature control module, of the first column part;
the second fastener comprises a second cap part and a second column part, the second cap part is positioned above the movable push plate, the second column part penetrates through the movable push plate and then is fixedly connected with the briquetting structure, the second column part can move relative to the movable push plate, and a second spring is sleeved on the part, positioned between the movable push plate and the briquetting structure, of the second column part;
the upper temperature control module comprises an upper water cooling structure, a first semiconductor refrigeration sheet and an upper heat sink which are sequentially arranged in a stacked mode, a first heat conduction surface is arranged on the bottom surface of the upper heat sink and used for conducting heat to the upper surface of the optical module, and cooling liquid flows through the upper water cooling structure;
the lower temperature control module comprises a lower heat sink, a second semiconductor refrigeration sheet and a lower water cooling structure which are sequentially arranged in a stacked mode, a second heat conduction surface is arranged on the top surface of the lower heat sink and used for conducting heat to the lower surface of the optical module, and cooling liquid flows through the lower water cooling structure.
2. The temperature controlled clamping device of claim 1,
go up temperature control module's top surface department and be equipped with guide pin, the cylinder layer board with the activity push pedal is equipped with first guiding hole and second guiding hole respectively for wear to establish guide pin.
3. The temperature controlled clamp device of claim 2, wherein said upper temperature control module further comprises:
the upper water-cooling head cover is used for arranging the guide pin and the first fastener;
the upper heat sink is fixedly connected with the upper water-cooling head cover and forms a first cavity together with the upper water-cooling head cover;
the upper water cooling structure is arranged in the first containing cavity;
the first semiconductor refrigeration piece is arranged in the first containing cavity.
4. The temperature controlled clamping device of any one of claims 1-3, wherein said lower temperature control module further comprises:
the upper cover of the lower water cooling head is provided with an opening which is communicated in the vertical direction, the top surface of the lower heat sink is provided with a heat conduction boss, the heat conduction boss is matched with the opening, and the top surface of the heat conduction boss is the second heat conduction surface;
and the lower water-cooling head lower cover is fixedly connected with the lower water-cooling head upper cover and forms a second containing cavity together with the lower water-cooling head upper cover, and the second containing cavity is used for containing the lower heat sink, the second semiconductor refrigeration piece and the lower water-cooling structure.
5. The temperature controlled clamping device of claim 4, further comprising:
and the third fastening piece is provided with a third cap part and a third column part, the third column part penetrates through the lower temperature control module and then is fixedly connected with the fixed base plate, the lower temperature control module can move relative to the third column part, a third spring is sleeved on the third column part, and two ends of the third spring are respectively abutted against the third cap part and the top surface of the lower temperature control module.
6. The temperature controlled clamping device of claim 1,
the limiting plate is provided with a mounting through hole for penetrating the optical module, and part of the mounting through hole penetrates through the upper surface and the lower surface of the limiting plate so that the optical module is in contact with the upper temperature control module and the lower temperature control module; and the bottoms of the two sides of the mounting through hole are provided with limiting convex strips for limiting the height of the bottom surface of the optical module.
7. The temperature controlled clamping device of claim 1, further comprising:
the supporting column, with fixed baseplate fixed connection, the top of supporting column with the bottom surface butt of cylinder layer board just locks through the fourth fastener.
8. A crimp cassette comprising a housing and a temperature controlled clamping device according to any one of claims 1 to 7, the temperature controlled clamping device being disposed within the housing.
9. An error code testing device, comprising an error code tester, a DUT circuit board and the crimping box of claim 8, wherein the crimping box is detachably connected to the error code tester, the DUT circuit board is provided with an interface for plugging the optical module, and the circuit board is connected to a testing chip of the error code tester through a radio frequency connector.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210581783.1A CN114670151B (en) | 2022-05-26 | 2022-05-26 | Temperature control clamping device, crimping box and error code testing device |
| CN202210828243.9A CN115122256B (en) | 2022-05-26 | 2022-05-26 | Temperature control clamping device for optical module, compression joint box and error code testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210581783.1A CN114670151B (en) | 2022-05-26 | 2022-05-26 | Temperature control clamping device, crimping box and error code testing device |
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| CN202210828243.9A Division CN115122256B (en) | 2022-05-26 | 2022-05-26 | Temperature control clamping device for optical module, compression joint box and error code testing device |
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| CN114670151A CN114670151A (en) | 2022-06-28 |
| CN114670151B true CN114670151B (en) | 2022-08-16 |
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| CN202210581783.1A Active CN114670151B (en) | 2022-05-26 | 2022-05-26 | Temperature control clamping device, crimping box and error code testing device |
| CN202210828243.9A Active CN115122256B (en) | 2022-05-26 | 2022-05-26 | Temperature control clamping device for optical module, compression joint box and error code testing device |
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Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
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| DE3104274C2 (en) * | 1981-02-07 | 1982-12-02 | Skf Kugellagerfabriken Gmbh, 8720 Schweinfurt | Intermediate component to increase the pressing force |
| CN2855624Y (en) * | 2005-12-30 | 2007-01-10 | 比亚迪股份有限公司 | Piece welding machine |
| CN101879674B (en) * | 2010-06-30 | 2015-08-19 | 重庆建设摩托车股份有限公司 | Frame part welding hold-down gear |
| CN202517230U (en) * | 2012-04-10 | 2012-11-07 | 开封空分集团有限公司 | Welding positioning machine with heating temperature control device |
| CN204235437U (en) * | 2014-11-19 | 2015-04-01 | 苏州博众精工科技有限公司 | A kind of product carrier |
| CN105834799A (en) * | 2015-01-16 | 2016-08-10 | 四川航达机电技术开发服务中心 | Three-way clamping device |
| KR101640473B1 (en) * | 2015-04-10 | 2016-07-19 | 주식회사 티에프이 | Auto alignment contact connecting unit for test handler |
| CN108393711B (en) * | 2018-05-22 | 2020-01-03 | 天津市汇通仪器设备公司 | Clamp for precision machining of columnar workpiece |
| CN211029699U (en) * | 2019-09-23 | 2020-07-17 | 杨春 | L ED electronic touch screen processing fixing device |
| CN211804717U (en) * | 2019-12-27 | 2020-10-30 | 绍兴中科通信设备有限公司 | Crimping mechanism of optical device TO crimping machine in 100G optical module |
| US11454666B2 (en) * | 2020-04-20 | 2022-09-27 | Aem Singapore Pte Ltd | Thermal test head for an integrated circuit device |
| CN114325293B (en) * | 2020-09-29 | 2024-03-01 | 苏州联讯仪器股份有限公司 | High-reliability laser chip testing system |
| CN112296576A (en) * | 2020-10-26 | 2021-02-02 | 温州沿笙信息科技有限公司 | Welding tool for temperature sensing probe |
| CN113092994B (en) * | 2021-06-08 | 2021-09-10 | 上海菲莱测试技术有限公司 | High-power optical chip detection platform |
| CN113500545B (en) * | 2021-06-21 | 2022-10-04 | 浙江先导热电科技股份有限公司 | Self-adaptive positioning and clamping device |
| CN216449140U (en) * | 2021-12-15 | 2022-05-06 | 苏州联讯仪器有限公司 | Adjustable temperature control assembly and modular error code tester |
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| CN115122256A (en) | 2022-09-30 |
| CN115122256B (en) | 2023-11-17 |
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Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Patentee after: Suzhou Lianxun Instrument Co.,Ltd. Address before: 215129 Building 1, No. 1508, Xiangjiang Road, Suzhou high tech Zone, Suzhou, Jiangsu Province Patentee before: STELIGHT INSTRUMENT Inc. |
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