CN114666994A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN114666994A CN114666994A CN202011538227.3A CN202011538227A CN114666994A CN 114666994 A CN114666994 A CN 114666994A CN 202011538227 A CN202011538227 A CN 202011538227A CN 114666994 A CN114666994 A CN 114666994A
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- solder mask
- target circuit
- forming
- substrate
- mask layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a circuit board and a manufacturing method thereof, relating to the technical field of electronic circuit manufacturing; the manufacturing process of the circuit board comprises the following steps: selecting a substrate; forming a target circuit on at least one surface of the substrate; forming a first solder resist layer covering the target circuit on the base material; and selectively exposing partial area of the first solder mask layer, and forming a pad windowing used for exposing the target circuit pad and a concave mark used for indicating the target circuit information on the first solder mask layer after developing. In the embodiment of the invention, the silk-screen mark and the solder mask windowing are integrally formed in a concave mark mode, so that the plate making process is simplified, the plate making efficiency of the circuit board is improved, and the plate making cost is favorably reduced.
Description
Technical Field
The invention belongs to the technical field of rapid manufacturing of electronic circuits, and particularly relates to a circuit board and a manufacturing method thereof.
Background
The printed circuit board is used as a support body of the electronic component and provides electrical connection for the electronic component, and the conventional production process flow of the printed circuit board generally comprises the following steps: the method comprises the steps of cutting material → copper coating → etching → developing → solder mask → silk screen character → surface treatment → molding processing, wherein although the type of the current plate making process of the printed circuit board is complicated along with the continuous iteration of the plate making process, important plate making links of the current printed circuit board cannot be replaced, such as a solder mask process and a silk screen character process, the solder mask process is to form a solder mask layer exposing a pad on the circuit board so as to reduce the subsequent welding difficulty and protect the circuit board, and the silk screen character process is to print marks of electronic components on the solder mask layer so as to indicate the position and specification information of each component on the circuit board of a user. At present, the manufacture of a solder mask layer and a silk-screen layer still needs to be completed in sequence, and the problems of low plate-making efficiency, high cost and the like due to the need of matching silk-screen equipment exist.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method for manufacturing a circuit board, so as to solve the problem of low efficiency of circuit board making in the prior art.
In some illustrative embodiments, the method of manufacturing a circuit board includes: selecting a substrate; forming a target circuit on at least one surface of the substrate; forming a first solder resist layer covering the target circuit on the base material; and selectively exposing partial area of the first solder mask layer, and forming a pad windowing used for exposing the target circuit pad and a concave mark used for indicating the target circuit information on the first solder mask layer after developing.
In some optional embodiments, before the selectively exposing the partial region of the first solder resist layer, further comprising: acquiring a first exposure pattern of the pad windowing and a second exposure pattern of the concave mark; fusing the first exposure pattern and the second exposure pattern to obtain an integrated exposure pattern; and selectively exposing the first solder mask layer according to the integrated exposure pattern.
In some optional embodiments, before forming the target circuit on at least one surface of the substrate, the method further comprises: forming a second solder mask layer on the surface of the base material; the target circuit is formed on the second solder resist layer; the solder mask window of the first solder mask layer exposes the target circuit pad and a portion of the second solder mask layer.
In some optional embodiments, forming a target circuit on at least one surface of the substrate specifically includes: forming target circuits on both sides of the base material; forming a first solder mask layer covering the target circuit on the substrate specifically includes: first solder resist layers covering the target circuit are formed on both surfaces of the base material, respectively.
In some optional embodiments, before forming the target circuits on both sides of the substrate, the method further includes: and forming a light blocking layer on the surface of the substrate to prevent light from penetrating through the substrate.
In some optional embodiments, before forming the target circuit on at least one surface of the substrate, the method further comprises: and forming a marking layer with a color different from that of the first solder mask layer on the surface of the base material so as to form a concave mark taking the color of the marking layer as a background color.
In some optional embodiments, the target circuit is formed from a conductive ink.
In some optional embodiments, the first solder mask layer is a dry solder mask film.
In some optional embodiments, the selective exposure of the first solder mask layer is achieved by a digital mask.
Another objective of the present invention is to provide a circuit board to solve the technical problems in the prior art.
In some illustrative embodiments, the circuit board is obtained by the method for manufacturing a circuit board according to any one of the above-mentioned claims.
Compared with the prior art, the invention has the following advantages:
in the embodiment of the invention, the silk-screen mark and the solder mask windowing are integrally formed in a concave mark mode, so that the plate making process is simplified, the plate making efficiency of the circuit board is improved, and the plate making cost is favorably reduced.
Drawings
FIG. 1 is a flow chart of a circuit board fabrication in an embodiment of the present invention;
FIG. 2 is a schematic diagram of a manufacturing process of a circuit board according to an embodiment of the invention;
fig. 3 is a schematic illustration of photocuring in an embodiment of the present invention.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments of the invention may be referred to, individually or collectively, herein by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
The embodiment of the invention discloses a method for manufacturing a circuit board, and particularly, as shown in fig. 1-2, fig. 1 is a flow chart for manufacturing the circuit board in the embodiment of the invention; fig. 2 is a schematic diagram of a manufacturing process of a circuit board according to an embodiment of the invention. The manufacturing method of the circuit board comprises the following steps:
step S11, selecting a substrate;
step S12, forming a target circuit on at least one side surface of the substrate;
step S13, forming a first solder resist layer covering the target circuit on the base material; the first solder mask layer is photosensitive, and the covering size of the first solder mask layer is larger than that of the target circuit and smaller than or equal to that of the base material.
And step S14, selectively exposing partial area of the first solder mask layer, and forming a pad window used for exposing the target circuit pad and a concave mark used for indicating the target circuit information on the first solder mask layer after developing.
The concave mark in the embodiment of the invention is formed by exposing the bottom layer color of the concave pattern after the first solder mask layer is exposed and developed, and is used for indicating the information of the target circuit. The electronic components are not limited to the local structures (such as vias, lines, pads, etc.) on the target circuit body or the components that need to be mounted on the circuit board subsequently.
In the embodiment of the invention, the silk-screen mark and the solder mask windowing are integrally formed in a concave mark mode, so that the plate making process is simplified, the plate making efficiency of the circuit board is improved, and the plate making cost is favorably reduced.
The substrate in the embodiment of the present invention is not limited to a conventional PCB substrate, glass substrate, paper substrate, fabric substrate, polyimide substrate, PE substrate, PET substrate, PU substrate, and the like.
The material used for the target circuit in the embodiment of the present invention is not limited to copper foil, aluminum foil, or composite electronic paste such as silver paste, copper paste, aluminum paste, or liquid metal.
The first solder mask layer in the embodiment of the invention can be a photosensitive solder mask or a photosensitive solder mask dry film; the photosensitive solder resist and the photosensitive dry solder resist film are not limited to positive materials or negative materials, and the exposure and development of a uniform pattern or an opposite pattern of a target area of the first solder resist layer can be realized by utilizing a selective patterning exposure technology.
In the step S14 of the embodiment of the present invention, the selective exposure of the partial region of the first solder resist layer may be realized by a curing light source in combination with a mask (e.g., film) to realize a selective patterning exposure technique. Specifically, a mask for combined exposure can be formed by laminating and combining a mask for forming the solder mask opening exposure and a mask for forming the exposure of the concave logo, and the exposure of the solder mask opening and the exposure of the concave logo can be simultaneously realized by using the masks. In another mode, a mask used for forming the soldermask windowing exposure and a mask used for forming the concave logo exposure can be subjected to fusion design and processing to obtain an integrally exposed mask. As shown in fig. 3, G1 is a light source, G2 is a substrate covered with a first solder resist layer, and G3 is a mask.
In the embodiment, selective exposure to the first solder mask layer is realized in a mask (such as a film) mode, but the film needs to be processed and manufactured independently and cannot meet the requirement for rapid plate making of a personalized circuit of a user, so that the inventor proposes a mode of replacing a traditional film mask with a digital mask technology to realize rapid manufacturing of a mask plate required by the user, thereby improving plate making efficiency and meeting personalized user requirements.
The digital mask technology is to realize local light transmission and covering of the screen body by an electronic display technology, a light source (such as ultraviolet light) penetrates through the screen body, and irradiation of selective patterning is realized due to the local light transmission and covering of the screen body. For example, digital masking techniques based on LCD screens, the user controls the software to display black (or other opaque colors) in the area of the otherwise transparent screen, where the black areas in the screen constitute the blocked areas for the light source and the other transparent areas allow light to penetrate and strike the target substrate.
Compared with the traditional film mask, the digital mask technology has the advantages of simple operation, low cost, high efficiency, high personalization degree and the like, and is more suitable for the user population in the fields of education, research and the like in the current electronic information era.
Further, before selectively exposing the partial region of the first solder resist layer by using the digital mask in step S14 in the embodiment of the present invention, the method may further include:
step S141, acquiring a first exposure pattern of the pad windowing and a second exposure pattern of the concave mark; wherein, the first exposure pattern and the second exposure pattern are electronic patterns.
Step S142, fusing the first exposure pattern and the second exposure pattern to obtain an integrated exposure pattern;
and S143, selectively exposing the first solder mask layer according to the integrated exposure pattern.
In the embodiment, the first exposure pattern of the pad windowing and the second exposure pattern of the concave mark are fused through computer software to obtain the integrated exposure pattern, so that compared with the traditional film mask, the reduction of the precision caused by combination errors is avoided, the accuracy of the exposure pattern is ensured, and the implementation is easier.
In some optional embodiments, before forming the target circuit on at least one surface of the substrate in step S12, the method may further include:
step A, forming a second solder mask layer on the surface of the base material;
the target circuit is formed on the second solder resist layer; the resistance welding windowing area of the first resistance welding layer comprises the target circuit pad and a second resistance welding layer around the target circuit pad.
The second solder mask layer can be thermosetting or photo-curing solder mask or dry solder mask film, and can be coated on the surface of the substrate in a full-page manner or selectively coated on the pad area of the target circuit.
In the embodiment, the solder mask layer is firstly formed on the substrate, so that the windowing accuracy of windowing the subsequent first solder mask layer is ensured, and the periphery of the target circuit pad is surrounded by the second solder mask layer, so that the subsequent welding assembly of the electronic device is not influenced, and an ideal welding assembly space can be reserved for the subsequent welding assembly of the electronic device.
On the other hand, it should be understood by those skilled in the art that in the case where the size of the pad window is equal to or smaller than the target circuit pad, the second solder resist layer may not be formed on the surface of the substrate.
In some embodiments, the circuit board in the embodiments of the present invention may be a single-sided circuit or a double-sided circuit; when a single-sided circuit is manufactured, a target circuit can be formed on only one of two sides of the substrate, and the first solder mask layer can also cover only one side of the substrate where the target circuit is formed; when a double-sided circuit is manufactured, target circuits are formed on two sides of a base material respectively, first solder mask layers cover the two sides of the base material respectively, and then selective patterning exposure is carried out on the first solder mask layers on the two sides of the base material respectively or simultaneously.
For the non-transparent substrate, the first solder mask layers on both sides of the substrate can be selectively patterned and exposed, respectively or simultaneously, and when the transparent substrate is used as the substrate, the light source on one side of the substrate can penetrate through the substrate to affect the patterning of the first solder mask layer on the other side of the substrate.
Therefore, in the case that the substrate is a light-transmitting substrate, the step S14 in the embodiment of the present invention may further include, before the step of forming the target circuit on at least one surface of the substrate:
and step B, forming a light blocking layer for preventing light from penetrating through the substrate on the surface of the substrate. The light-blocking layer may be formed on only one surface of the substrate, or may be formed on both surfaces of the substrate. The light-blocking layer can be any curable shading paint or film material.
In the embodiment, the transparent substrate is subjected to shading treatment, so that exposure influence in the preparation process of the double-sided circuit is avoided, and the preparation reliability of the double-sided board is ensured.
In some optional embodiments, the concave mark in the embodiments of the present invention does not overlap with the target circuit body, so as to avoid the problem that the target circuit body is exposed, which reduces the protection of the target circuit and affects the subsequent soldering.
In other alternative embodiments, the solder can be placed in the non-pad areas by designing the female mark as a hollow mark comprised of discrete tiny cavities that collectively comprise a patterned mark that, due to the tiny pores, does not allow solder to enter the pores due to surface tension during subsequent soldering processes. In the embodiment, the hollow marks can be distributed on the target circuit body, so that the mark layout design difficulty is reduced and the plate making efficiency is improved compared with the mark layout design difficulty arranged in a non-target circuit body region.
Further, before forming the target circuit on at least one surface of the substrate, the method further comprises:
and step C, forming a marking layer with a color different from that of the first solder mask layer on the surface of the base material to form a concave mark taking the color of the marking layer as a background color.
In the embodiment, the mark layer with the color different from that of the first solder mask layer is arranged, so that the concave mark can be highlighted, and the mark is convenient for a user or electronic identification.
Preferably, the functions of the second solder mask layer, the light blocking layer and the marking layer in the embodiment of the present invention may be implemented by only one or two of the above-mentioned functions, for example, the second solder mask layer which is non-transparent and has a color different from that of the first solder mask layer is selected, and all the above-mentioned functions may be implemented simultaneously; for example, the marking layer which is non-transparent and has the color different from that of the first solder mask layer is selected, and the functions of light resistance and highlighted identification can be realized at the same time; for example, the second solder mask layer with a color different from that of the first solder mask layer is selected, and the functions of highlighting and soldering resistance can be realized at the same time. In addition, other combinations are possible and will not be described in detail herein.
Preferably, the target circuit in the embodiment of the present invention may adopt composite electronic paste (for example, silver paste, copper paste, aluminum paste, liquid metal composite electronic paste, and the like) composed of materials such as resin, conductive filler, and the like, and the composite electronic paste has strong adhesion performance, has low requirement for selectivity of the substrate, can be stably attached to the surface of the substrate after curing, and can meet personalized plate making requirements by making a patterned circuit in printing, and the like, and can greatly improve plate making efficiency by cooperating with integrated molding of solder resist and a mark in the embodiment of the present invention.
Preferably, the first solder mask in the embodiment of the present invention may be formed on the surface of the substrate by using a photosensitive dry film through a film laminating machine and covered on the target circuit, and compared with using a solder mask, the dry film has more excellent structural stability, and can be attached to a mask (a film or a digital mask) as close as possible, so as to reduce the exposure difficulty of selective patterning, reduce the possibility of light scattering, improve the exposure accuracy, and ensure the development effect.
Example 1
The embodiment of the invention discloses a manufacturing method of a circuit board, which comprises the following steps:
step S21, selecting a substrate;
step S22, printing on one side of the base material by using the composite electronic paste to form a target circuit;
step S23, forming a first solder resist layer covering the target circuit on the side of the substrate where the target circuit is formed;
step S24, selectively exposing the first solder mask layer by using a digital mask;
and step S25, carrying out development processing on the exposed first solder mask layer to obtain a solder mask windowing window and a concave mark.
This embodiment is suitable for making single panels.
Example 2
The embodiment of the invention discloses a manufacturing method of a circuit board, which comprises the following steps:
step S31, selecting a substrate;
step S32, printing on both sides of the substrate by using the composite electronic paste to form a target circuit;
step S33 of forming first solder resist layers covering the target circuit on both surfaces of the base material, respectively;
step S34, selectively exposing the first solder mask layer by using a digital mask;
and step S35, carrying out development processing on the exposed first solder mask layer to obtain a solder mask windowing window and a concave mark.
This embodiment is suitable for making double-sided boards.
Example 3
The embodiment of the invention discloses a manufacturing method of a circuit board, which comprises the following steps:
step S41, selecting a substrate;
step S42, forming a second solder resist layer on one surface of the base material;
step S43, printing and forming a target circuit on the second solder mask layer by using the composite electronic paste;
step S44, forming a first solder resist layer covering the target circuit on the side of the substrate where the target circuit is formed;
step S45, selectively exposing the first solder resist layer using a digital mask;
and step S46, carrying out development processing on the exposed first solder mask layer to obtain a solder mask windowing window and a concave mark.
This embodiment is suitable for making single panels.
Example 4
The embodiment of the invention discloses a manufacturing method of a circuit board, which comprises the following steps:
step S51, selecting a substrate;
step S52, forming a light-blocking layer on one surface of the substrate;
step S53, respectively printing a target circuit on the light-blocking layer and the base material on the other side by using the composite electronic paste;
step S54, forming first solder resist layers covering the target circuit on both sides of the base material;
step S55, selectively exposing the first solder mask layer by using a digital mask;
and step S56, carrying out development processing on the exposed first solder mask layer to obtain a solder mask windowing window and a concave mark.
This embodiment is suitable for making double sided boards.
Example 5
The embodiment of the invention discloses a manufacturing method of a circuit board, which comprises the following steps:
step S61, selecting a substrate;
step S62, forming a light-blocking layer with a color different from that of the first solder mask layer on one surface of the base material;
step S63, printing the light-blocking layer and the base material on the other side by using the composite electronic paste to form a target circuit;
step S64, forming first solder resist layers covering the target circuit on both sides of the base material;
step S65, selectively exposing the first solder resist layer using a digital mask;
and step S66, carrying out development processing on the exposed first solder mask layer to obtain a solder mask windowing window and a concave mark.
This embodiment is suitable for making double-sided boards.
Example 6
The embodiment of the invention discloses a manufacturing method of a circuit board, which comprises the following steps:
step S71, selecting a substrate;
step S72, a second solder mask layer with a color different from that of the first solder mask layer is arranged on one surface of the base material;
step S73, printing and forming a target circuit on the second solder mask layer by using the composite electronic paste;
step S74, forming a first solder resist layer covering a target circuit on the base material;
step S75, selectively exposing the first solder resist layer using a digital mask;
and step S76, carrying out development processing on the exposed first solder mask layer to obtain a solder mask windowing window and a concave mark.
This embodiment is suitable for making single panels.
In the embodiments of the present invention, only the actual scope of the present invention can be quickly understood by those skilled in the art, the method for manufacturing the circuit board is only an example for manufacturing a single-sided board or a double-sided board, and the method can also realize the corresponding plate making of the single-sided board or the double-sided board.
The embodiment of the invention also discloses a circuit board which can be obtained through the embodiment of the invention, and the circuit board obtained through the method has the effects of simple structure, high preparation efficiency, capability of meeting the personalized manufacturing requirements of users and the like.
In some embodiments, the circuit board in embodiments of the present invention comprises: the circuit comprises a base material, a target circuit formed on the surface of the base material and a first solder mask layer covering the target circuit; and a pad window and a concave mark are formed on the first solder mask layer relative to the target circuit.
In some embodiments, the circuit board in embodiments of the present invention comprises: the device comprises a substrate, a light-blocking layer formed on the surface of the substrate, and a first solder mask layer formed on the light-blocking layer; and a pad window and a concave mark are formed on the first solder mask layer relative to the target circuit.
In some embodiments, a circuit board in embodiments of the present invention, comprises: the solder mask comprises a substrate, a second solder mask layer formed on the surface of the substrate, and a first solder mask layer formed on the second solder mask layer; and a pad window and a concave mark are formed on the first solder mask layer relative to the target circuit.
The circuit board in the embodiment of the invention comprises: the device comprises a substrate, a marking layer formed on the surface of the substrate, and a first solder mask layer formed on the marking layer; and a pad window and a concave mark are formed on the first solder mask layer relative to the target circuit.
The circuit board in the embodiment of the invention comprises: the mask comprises a substrate, a second solder mask layer and a first solder mask layer, wherein the second solder mask layer is formed on the surface of the substrate, is shading and has a color different from that of the first solder mask layer, and the first solder mask layer is formed on the second solder mask layer; and a pad window and a concave mark are formed on the first solder mask layer relative to the target circuit.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (10)
1. A method for manufacturing a circuit board is characterized by comprising the following steps:
selecting a substrate;
forming a target circuit on at least one surface of the substrate;
forming a first solder resist layer covering the target circuit on the base material;
selectively exposing a partial area of the first solder mask layer, and forming a pad window for exposing the target circuit pad and a concave mark for indicating the target circuit information on the first solder mask layer after developing.
2. The method of manufacturing according to claim 1, further comprising, before said selectively exposing a partial region of said first solder resist layer:
acquiring a first exposure pattern of the pad windowing and a second exposure pattern of the concave mark;
fusing the first exposure pattern and the second exposure pattern to obtain an integrated exposure pattern;
and selectively exposing the first solder mask layer according to the integrated exposure pattern.
3. The method of claim 1, further comprising, prior to forming the target circuit on at least one surface of the substrate:
forming a second solder mask layer on the surface of the base material;
the target circuit is formed on the second solder resist layer;
the solder mask window of the first solder mask layer exposes the target circuit pad and a portion of the second solder mask layer.
4. The method of claim 1, wherein forming a target circuit on at least one surface of the substrate comprises: forming target circuits on both sides of the base material;
the forming of the first solder resist layer covering the target circuit on the base material specifically includes: first solder resist layers covering the target circuit are formed on both surfaces of the base material, respectively.
5. The method of claim 4, further comprising, before forming the target circuit on each of the two sides of the substrate:
and forming a light blocking layer on the surface of the substrate to prevent light from penetrating through the substrate.
6. The method of claim 1, further comprising, prior to forming the target circuit on at least one surface of the substrate:
and forming a marking layer with a color different from that of the first solder mask layer on the surface of the base material so as to form a concave mark taking the color of the marking layer as a background color.
7. The method of manufacturing according to claim 1, wherein the target circuit is formed of a conductive ink.
8. The method of claim 1, wherein the first solder mask layer is a dry film solder mask.
9. A method of manufacturing according to claim 1, characterized in that selective exposure of the first solder mask layer is achieved by means of a digital mask.
10. A circuit board obtained by the method for manufacturing a circuit board according to any one of claims 1 to 9.
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| CN202011538227.3A CN114666994A (en) | 2020-12-23 | 2020-12-23 | Circuit board and manufacturing method thereof |
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| CN202011538227.3A CN114666994A (en) | 2020-12-23 | 2020-12-23 | Circuit board and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321781A (en) * | 2023-05-25 | 2023-06-23 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
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| CN107148157A (en) * | 2017-06-08 | 2017-09-08 | 深圳市信维通信股份有限公司 | A kind of preparation method of PCB |
| CN110248463A (en) * | 2019-05-28 | 2019-09-17 | 江门荣信电路板有限公司 | A kind of method of printed circuit board and preparation method thereof and its printing identification |
| CN110536564A (en) * | 2019-08-30 | 2019-12-03 | 宁波华远电子科技有限公司 | A kind of production method of the circuit board of boss as pad |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321781A (en) * | 2023-05-25 | 2023-06-23 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
| CN116321781B (en) * | 2023-05-25 | 2023-08-04 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
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