CN114660715B - Preparation method of waveguide module - Google Patents
Preparation method of waveguide module Download PDFInfo
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- CN114660715B CN114660715B CN202210313546.7A CN202210313546A CN114660715B CN 114660715 B CN114660715 B CN 114660715B CN 202210313546 A CN202210313546 A CN 202210313546A CN 114660715 B CN114660715 B CN 114660715B
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- 238000002360 preparation method Methods 0.000 title abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims description 30
- 230000008569 process Effects 0.000 claims description 26
- 238000005259 measurement Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000000523 sample Substances 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 238000004556 laser interferometry Methods 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 230000009974 thixotropic effect Effects 0.000 claims description 3
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- 238000005516 engineering process Methods 0.000 description 13
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- 230000003287 optical effect Effects 0.000 description 8
- 239000004005 microsphere Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000002313 adhesive film Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000003190 augmentative effect Effects 0.000 description 2
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- 238000004080 punching Methods 0.000 description 2
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- 238000001228 spectrum Methods 0.000 description 2
- -1 acrylic ester Chemical class 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
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- 230000005540 biological transmission Effects 0.000 description 1
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- 238000010168 coupling process Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/0101—Head-up displays characterised by optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The invention provides a preparation method of a waveguide module. Comprises the following steps of S1: acquiring a first waveguide sheet, and performing a dispensing treatment step on the edge part of one side surface of the first waveguide sheet; s2: acquiring a second waveguide sheet, and placing the second waveguide sheet on a corresponding attaching platform so that the second waveguide sheet is positioned on one side of the first waveguide sheet with glue; step S3: adjusting the distance between the first waveguide sheet and the second waveguide sheet by using a laser interferometer, starting a height measuring module of the laser interferometer, adjusting a bonding platform of the first waveguide sheet to move towards the direction close to the second waveguide sheet, and stopping moving the bonding platform of the first waveguide sheet when the height measuring module detects that the distance between the first waveguide sheet and the second waveguide sheet is a preset distance; step S4: and curing the first waveguide sheet and the second waveguide sheet by ultraviolet rays to form the waveguide module. The invention solves the problems that the alignment precision and the adhesive thickness are difficult to ensure in the preparation of the waveguide module in the prior art.
Description
Technical Field
The invention relates to the technical field of photoelectrons, in particular to a preparation method of a waveguide module.
Background
The augmented reality AR (Augmented Reality) technology is a technology of skillfully fusing virtual information with a real world, and applies computer-generated virtual information such as characters, images, three-dimensional models, music, videos and the like to the real world after simulation, wherein the two kinds of information are mutually complemented, so that the 'enhancement' of the real world is realized. AR glasses are one of the most promising products for AR technology, and most of the optical parts thereof are reflected, refracted and diffracted by the optical waveguide module, and finally imaged on the retina of the user. The types of waveguide modules are various, taking AR optical waveguide glasses as an example, the AR optical waveguide glasses currently require RGB three-color superposition and superposition of protective covers, the utilization ratio of diffracted optical waveguides to light is low, and the problem is aggravated by the offset of the coupling region and the parallelism between the waveguide sheets, so that high-precision alignment and control of glue thickness are required.
That is, the preparation of the waveguide module in the prior art has the problem that alignment accuracy and glue thickness are difficult to ensure.
Disclosure of Invention
The invention mainly aims to provide a preparation method of a waveguide module, which aims to solve the problem that alignment accuracy and glue thickness are difficult to guarantee in the preparation of the waveguide module in the prior art.
In order to achieve the above object, the present invention provides a method for manufacturing a waveguide module, including: step S1: acquiring a first waveguide sheet, performing dispensing treatment on the edge part of one side surface of the first waveguide sheet, and then placing the first waveguide sheet on a corresponding bonding platform; step S2: acquiring a second waveguide sheet, and placing the second waveguide sheet on a corresponding attaching platform so that the second waveguide sheet is positioned on one side of the first waveguide sheet with glue; step S3: adjusting the distance between the first waveguide sheet and the second waveguide sheet by using a laser interferometer, starting a height measuring module of the laser interferometer, adjusting a bonding platform of the first waveguide sheet to move towards the direction close to the second waveguide sheet, and stopping moving the bonding platform of the first waveguide sheet when the height measuring module detects that the distance between the first waveguide sheet and the second waveguide sheet is a preset distance; step S4: and curing the first waveguide sheet and the second waveguide sheet by ultraviolet rays to form the waveguide module.
Further, before the dispensing process in step S1, the method further includes: and (3) cleaning: the first waveguide sheet is placed in an acidic or alkaline chemical solution to be subjected to ultrasonic treatment of 35KHZ-45KHZ, and the time of the cleaning treatment is adjusted to be more than 10 minutes.
Further, the step S4 further includes a heating assist process performed simultaneously with the curing process: and adjusting the temperature to be within the range of 50-80 ℃ and performing heating auxiliary treatment on the first waveguide sheet and the second waveguide sheet.
Further, in step S4, an ultraviolet LED lamp with the wavelength of 365nm-400nm and the power of 200W-2000W is selected for curing, and the curing time is adjusted to be in the range of 1S-300S.
Further, in step S3, the altimeter module includes at least three measurement probes having a standard speed, the at least three measurement probes being spaced apart.
Further, in step S1: and adjusting the distance between the dispensing head and the first waveguide sheet to be within a range of less than or equal to 1 millimeter by adopting a laser interferometry altimeter, and forming a glue layer with a thickness of more than or equal to 20 micrometers, less than or equal to 100 micrometers and a width of less than or equal to 1.2 millimeters through dispensing treatment, wherein the dispensing head is a dispensing head with an adjustable caliber.
Further, in step S3, a laser interferometer with a measuring range of more than 5 cm and a sensitivity of 0.1 μm is used for measurement.
Further, in step S3, the preset distance is in the range of (20 μm-100 μm). + -0.5 μm.
Further, in step S1, a waveguide sheet having a thickness of 0.3 mm or more and 1.0mm or less and a size of 40 mm or more and 80 mm or less is selected as the first waveguide sheet; and/or in the step S2, selecting the waveguide sheet with the thickness of more than or equal to 0.3 mm and less than or equal to 1.0mm and the size of more than or equal to 40 mm and less than or equal to 80 mm as the second waveguide sheet.
Further, in step S1, a transparent or black glue is selected for dispensing treatment; and/or in the step S1, selecting thermosetting or photosensitive glue for dispensing treatment; and/or in the step S1, glue with viscosity of 10000cp-50000cp and thixotropic property of more than 3.0 is selected for dispensing treatment.
By applying the technical scheme of the invention, the preparation method of the waveguide module comprises the following steps of S1: acquiring a first waveguide sheet, performing dispensing treatment on the edge part of one side surface of the first waveguide sheet, and then placing the first waveguide sheet on a corresponding bonding platform; step S2: acquiring a second waveguide sheet, and placing the second waveguide sheet on a corresponding attaching platform so that the second waveguide sheet is positioned on one side of the first waveguide sheet with glue; step S3: adjusting the distance between the first waveguide sheet and the second waveguide sheet by using a laser interferometer, starting a height measuring module of the laser interferometer, adjusting a bonding platform of the first waveguide sheet to move towards the direction close to the second waveguide sheet, and stopping moving the bonding platform of the first waveguide sheet when the height measuring module detects that the distance between the first waveguide sheet and the second waveguide sheet is a preset distance; step S4: and curing the first waveguide sheet and the second waveguide sheet by ultraviolet rays to form the waveguide module.
The distance between the first waveguide sheet and the second waveguide sheet is adjusted by adopting the laser interferometry altimeter, so that the accurate control of the distance between the first waveguide sheet and the second waveguide sheet in the lamination process is facilitated, the high-precision control of the glue thickness between the first waveguide sheet and the second waveguide sheet is facilitated, the consistency of the glue thickness at each position between the first waveguide sheet and the second waveguide sheet can be ensured, the lamination process precision is ensured, and the imaging stability of the waveguide module is ensured. According to the invention, the laser interference height measurement technology and the waveguide superposition technology are well matched, so that the gap between the first waveguide sheet and the second waveguide sheet can be controlled to be in a micrometer-scale error, the consistency of the glue thickness of the waveguide module is greatly improved, and the process precision of the waveguide module is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:
FIG. 1 shows a flow chart of a method of fabricating a waveguide module in accordance with an alternative embodiment of the present invention;
FIG. 2 shows a schematic diagram of one state of the waveguide module of the present invention during fabrication;
fig. 3 shows a schematic view of another state of the waveguide module of the present invention during the fabrication process.
Wherein the above figures include the following reference numerals:
10. a first waveguide sheet; 20. a second waveguide sheet; 30. a glue layer; 40. a measurement probe.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
It is noted that all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless otherwise indicated.
In the present invention, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present invention.
It will be apparent that the embodiments described above are merely some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the application described herein may be implemented in sequences other than those illustrated or otherwise described herein.
The invention provides a preparation method of a waveguide module, which aims to solve the problem that alignment precision and glue thickness are difficult to ensure in the preparation of the waveguide module in the prior art.
As shown in fig. 1 to 3, the preparation method of the waveguide module includes step S1: acquiring a first waveguide sheet 10, performing dispensing treatment on the edge part of one side surface of the first waveguide sheet 10, and then placing the first waveguide sheet 10 on a corresponding bonding platform; step S2: acquiring a second waveguide sheet 20, and placing the second waveguide sheet 20 on a corresponding bonding platform, wherein the bonding platform must leave three holes (the positions of the holes are not limited) with the diameter of 1cm for placing the measuring probe 40, so that the second waveguide sheet 20 is positioned on one side of the first waveguide sheet 10 with glue; step S3: adjusting the distance between the first waveguide sheet 10 and the second waveguide sheet 20 by using a laser interferometer, starting a height measuring module of the laser interferometer, adjusting a bonding platform of the first waveguide sheet 10 to move towards a direction close to the second waveguide sheet 20, and stopping moving the bonding platform of the first waveguide sheet 10 when the height measuring module detects that the distance between the first waveguide sheet 10 and the second waveguide sheet 20 is a preset distance; step S4: the first waveguide sheet 10 and the second waveguide sheet 20 are cured with ultraviolet rays to form a waveguide module.
Specifically, the predetermined distance is within a range of (20 μm-100 μm). + -. 0.5. Mu.m.
The distance between the first waveguide sheet 10 and the second waveguide sheet 20 is adjusted by adopting the laser interferometer altimeter, so that the accurate control of the distance between the first waveguide sheet 10 and the second waveguide sheet 20 in the superposition process is facilitated, the high-precision control of the glue thickness between the first waveguide sheet 10 and the second waveguide sheet 20 is facilitated, the consistency of the glue thickness at each position between the first waveguide sheet 10 and the second waveguide sheet 20 can be ensured, the superposition process precision is ensured, and the imaging stability of the waveguide module is ensured. According to the invention, the laser interference height measurement technology and the waveguide superposition technology are well matched, so that the gap between the first waveguide sheet 10 and the second waveguide sheet 20 can be controlled to be in a micrometer-scale error, the consistency of the adhesive thickness of the waveguide module is greatly improved, and the process precision of the waveguide module is improved.
For such waveguide modules, the prior art generally requires preparation with OCA glue. The selected OCA material is a solid adhesive film, and has higher thickness uniformity. The process has an inherent problem, and the solid adhesive film needs to be punched and cut into the same shape as the waveguide sheet in advance, and only the width of about 0.8mm to 1.5mm can be used, so that the utilization rate of materials is only 10 to 20 percent, and the materials are wasted greatly. And when the adhesive film is attached to the waveguide sheet, a large number of small bubbles exist in the contact area, and the bubbles can interfere the propagation of light rays, so that the imaging effect is affected.
Specifically, in the dispensing treatment process of step S1, glue is uniformly coated on a circle of edge part of the first waveguide sheet 10 by using a pneumatic or piezoelectric injection valve, and the application performs a dispensing process by selecting liquid glue, so that on one hand, the punching and film tearing procedures of OCA glue are avoided, and the probability of poor introduction is reduced; meanwhile, the manufacturing equipment of a cutting die, punching and film tearing process of OCA is omitted, and the cost is reduced; in addition, the dispensing shape of the liquid glue is controlled by a program, so that the shape adaptation range of the product is greatly expanded, the efficiency is greatly improved, and the dispensing time is far faster than the OCA glue coating time in the prior art. The application well cooperates the laser interference height measurement technology and the superposition technology, and effectively improves the control precision of the gap between the two waveguide sheets. In the application, the liquid glue is uniformly coated on the first waveguide sheet 10 by using a spray dispensing mode, and the glue quantity and the glue width can be achieved by changing the caliber (50-200 mu m) of a dispensing head; the pattern of the spot gluing can be selected by the program, so that there is no limitation on the shape of the waveguide sheet. Its advantages are high precision and speed of spraying adhesive, and high application speed. The application aims at the gap with a certain thickness, and the gap is 10-100 mu m.
Specifically, in step S1, transparent or black glue is selected for dispensing treatment; the glue is thermosetting or photosensitive. The arrangement is such that glue can bond the edges of the two waveguide sheets together, the middle portion forming a gap. In the application, epoxy resin glue or acrylic ester glue is generally selected for dispensing treatment. In addition, in the step S1, glue with viscosity of 10000cp-50000cp and thixotropic property more than 3.0 is selected for dispensing treatment. The viscosity can ensure the integrity of the glue which is normally dispensed, and the thixotropy ensures the good stability of the glue in the storage and transportation process, so that the glue has the advantages of easy stirring, easy smearing and no falling.
The dispensing process in step S1 further includes: and (3) cleaning: the first waveguide plate 10 is placed in an acidic or alkaline chemical solution and subjected to ultrasonic treatment at 40KHZ, and the time for the cleaning treatment is adjusted to 10 minutes or longer. The arrangement can ensure that the defect of more than 5 mu m is avoided under the condition of amplifying and detecting the bright field by 10 times within the range of 1.5mm at the edge of the first waveguide sheet 10, so that the dispensing treatment process is not interfered by surface dirt. In the invention, the surface cleanliness of the waveguide sheet is detected by the 10X multiplying power of the AOI equipment, and the defect that the surface cleanliness is more than 5 mu m is not allowed to exist; the surface shape of the waveguide sheet is also measured by MSP equipment and is less than 10 mu m; the pick-and-place of the waveguide sheet must only contact the range of the edge of at most 1.5mm so as to ensure that the grating area of the waveguide sheet is not polluted and damaged, and the contact area during lamination is the same; meanwhile, a circle of black glue with an OD value larger than 3.5 is coated on the side edge of the waveguide sheet so as to ensure that optical signals cannot escape from the side edge to interfere with other optical signals; the surface of the waveguide sheet may be coated with an AR film layer for improving the transmittance of the waveguide sheet.
Specifically, the glue coating process must be highly controllable, in step S1: the distance between the dispensing head and the first waveguide sheet 10 is adjusted to be within a range of 1mm or less by using a laser interferometer altimeter, that is, the dispensing head is also provided with an altimeter module to ensure that the height tolerance is less than 0.1mm. The glue layer 30 having a thickness of less than 0.1mm, preferably a thickness of 20 μm or more and 100 μm or less (the thickness tolerance of different positions is controlled within + -5%) and a width of 1.2 mm or less, preferably a width of 0.5mm or less is formed by the dispensing treatment. Meanwhile, the glue line cannot be sealed, and at least one air escape hole needs to be reserved so as to ensure the consistency of the internal and external pressure differences of the waveguide module. The arrangement is favorable for ensuring consistency of glue thickness, and can keep two waveguide sheets parallel and synchronously couple out optical signals. The caliber of the dispensing head is 50-200 mu m, so that the width of the glue meets the requirement; meanwhile, the dispensing head has an automatic cleaning function, so that the stable shape of the adhesive line is ensured.
Specifically, in step S4, when the attaching platform stops moving, the LED ultraviolet curing lamp is automatically turned on, and the ultraviolet LED lamp with the wavelength of 365nm-400nm and the power of 200W-2000W is selected for curing, so that the curing time is adjusted to be within the range of 1S-300S. Meanwhile, in step S4, a heating assist process performed simultaneously with the curing process is also included: the heating temperature is adjusted within the range of 50-80 ℃ to perform the heating auxiliary treatment on the first waveguide sheet 10 and the second waveguide sheet 20. The cured glue layer 30 may be supported between the first waveguide sheet 10 and the second waveguide sheet 20 with a fixed spacing therebetween; the process well cooperates the laser interference height measurement technology and the superposition technology, and effectively improves the consistency of the glue thickness prepared by the waveguide module.
As shown in fig. 3, a schematic working diagram of a measuring probe 40 of the laser interferometer is shown, in step S3, a gap between two waveguide plates is determined by the laser interferometer, and the laser interferometer with a measuring range greater than 5 cm and a sensitivity up to 0.1 μm is used for measurement. And the altimeter module of the laser interferometer comprises at least three measuring probes 40 with standard speed, and the at least three measuring probes 40 are arranged at intervals. It should be noted that three measurement probes 40 must be calibrated once a week with a standard block (note: standard block, i.e., standard sample, as a reference for calibration). The interference signal of the laser interferometer is a frequency spectrum, and the thickness of the sample (or the thickness of the air gap) is calculated according to the spectrum phase of the signal.
As shown in fig. 3, the laser interference height measurement technology is used to determine the gap between two waveguide sheets, and then curing and laminating are performed after the gap meets the process requirement. Such gap control is commonly done by solid glue or by reinforcing microspheres of a fixed diameter inside liquid glue. The disadvantages of solid glue have been described in detail above. The process of adding the microspheres into the liquid glue has the inherent defect that firstly, the cost of the microspheres is very high, and even the cost of the glue is higher than that of the glue; meanwhile, the microspheres have the problem of sedimentation in the liquid glue, and the problems of blockage of a dispensing head and uneven distribution of the microspheres are easily caused; the microsphere can also introduce bubbles into the glue in the mixing process, and the existence of the bubbles can not only lead to the weakening of the reliability of the glue, but also cause interference to the light transmission. The laser interference height measurement technology is used, no secondary treatment is needed for glue, and the use cost of the glue and various problems caused by adding microspheres are greatly reduced. Meanwhile, the precision of the laser interferometer can reach 0.1 mu m, and the control precision of the gap is greatly improved.
Specifically, in step S1, a waveguide sheet having a thickness of 0.3 mm or more and 1.0 mm or less and a size of 40 mm or more and 80 mm or less is selected as the first waveguide sheet 10; the second waveguide sheet 20 is the same size and thickness as the first waveguide sheet 10. By reasonably planning the thickness and the size of the two waveguide sheets, signals are transmitted in the waveguide sheets along the transverse direction by total reflection of light and are coupled out longitudinally; the waveguide sheet is cut into the desired shape by a laser, and the cutting process must ensure that the edge chipping is < 10 μm to ensure the uniformity of the appearance of the laminated glue layer 30.
In the present application, the material of both the first waveguide 10 and the second waveguide 20 is glass.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A method of making a waveguide module comprising:
Step S1: acquiring a first waveguide sheet (10), performing dispensing treatment on the edge part of one side surface of the first waveguide sheet (10), and then placing the first waveguide sheet (10) on a corresponding bonding platform;
step S2: acquiring a second waveguide sheet (20), and placing the second waveguide sheet (20) on a corresponding attaching platform so that the second waveguide sheet (20) is positioned on one side of the first waveguide sheet (10) with glue;
Step S3: adjusting the distance between the first waveguide sheet (10) and the second waveguide sheet (20) by using a laser interferometer, starting a height measuring module of the laser interferometer, adjusting a bonding platform of the first waveguide sheet (10) to move towards a direction close to the second waveguide sheet (20), and stopping moving the bonding platform of the first waveguide sheet (10) when the height measuring module detects that the distance between the first waveguide sheet (10) and the second waveguide sheet (20) is a preset distance;
step S4: curing the first waveguide sheet (10) and the second waveguide sheet (20) by ultraviolet rays to form a waveguide module;
In the step S3, the height measurement module comprises at least three measuring probes (40) with standard blocks, and at least three measuring probes (40) are arranged at intervals; in the step S1, glue with viscosity of 10000 cp-50000 cp and thixotropic property more than 3.0 is selected for dispensing treatment;
in the step S3, the preset distance is in the range of (20 μm-100 μm). + -. 0.5 μm.
2. The method of manufacturing a waveguide module according to claim 1, further comprising, prior to the dispensing process in step S1:
and (3) cleaning: the first waveguide sheet (10) is placed in an acidic or alkaline chemical solution to carry out ultrasonic treatment of 35KHZ-45KHZ, and the time of the cleaning treatment is adjusted to be more than 10 minutes.
3. The method of manufacturing a waveguide module according to claim 1, further comprising a heat assist process performed simultaneously with the curing process in step S4:
and adjusting the temperature to be within a range of 50-80 ℃, and performing the heating auxiliary treatment on the first waveguide sheet (10) and the second waveguide sheet (20).
4. The method of manufacturing a waveguide module according to claim 1, wherein,
In the step S4, an ultraviolet LED lamp with the wavelength of 365nm-400nm and the power of 200W-2000W is selected for curing treatment, and the curing treatment time is adjusted to be in the range of 1S-300S.
5. The method of manufacturing a waveguide module according to claim 1, wherein in the step S1:
And adjusting the distance between the dispensing head and the first waveguide sheet (10) within the range of less than or equal to 1 millimeter by adopting a laser interferometry altimeter, and forming a glue layer (30) with the thickness of more than or equal to 20 micrometers, less than or equal to 100 micrometers and the width of less than or equal to 1.2 millimeters through the dispensing treatment, wherein the dispensing head is a dispensing head with an adjustable caliber.
6. The method according to claim 1, wherein in the step S3, a laser interferometer with a measuring range of more than 5 cm and a sensitivity of 0.1 μm is used for the measurement.
7. The method of manufacturing a waveguide module according to claim 1, wherein,
In the step S1, a waveguide sheet having a thickness of 0.3 mm or more and 1.0 mm or less and a size of 40 mm or more and 80 mm or less is selected as the first waveguide sheet (10); and/or
In the step S2, a waveguide sheet having a thickness of 0.3 mm or more and 1.0 mm or less and a size of 40 mm or more and 80 mm or less is selected as the second waveguide sheet (20).
8. The method of manufacturing a waveguide module according to claim 1, wherein,
In the step S1, transparent or black glue is selected for the dispensing treatment; and/or
In the step S1, the dispensing treatment is performed by using thermosetting or photosensitive glue.
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