CN114643223B - Cleaning device - Google Patents
Cleaning device Download PDFInfo
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- CN114643223B CN114643223B CN202210333213.0A CN202210333213A CN114643223B CN 114643223 B CN114643223 B CN 114643223B CN 202210333213 A CN202210333213 A CN 202210333213A CN 114643223 B CN114643223 B CN 114643223B
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- cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a cleaning device which is used for cleaning wafer transmission equipment, wherein the wafer transmission equipment comprises a wafer supporting arm, and the cleaning device comprises a first cleaning block and a second cleaning block; wherein: at least one of the first cleaning block and the second cleaning block is provided with a medium inlet, and the first cleaning block and the second cleaning block are provided with a plurality of medium outlets; the first cleaning block and the second cleaning block can move relatively to form a cleaning space in a butt joint mode, the cleaning space is used for accommodating the wafer supporting arm, the structure formed by the first cleaning block and the second cleaning block is used for encircling the wafer supporting arm, and a plurality of medium outlets are arranged along the inner wall of the cleaning space and are used for encircling the wafer supporting arm. The scheme can solve the problem that the cleaning device can only clean the wafer supporting arm from one side and the problem that the cleaning of the wafer supporting arm is incomplete exists.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment cleaning, in particular to a cleaning device.
Background
Wafers are precision semiconductor devices, and in order to prevent the wafers from being polluted or damaged during the process of transporting, the wafer supporting arms of the wafer transporting equipment for carrying the wafers need to be cleaned before transporting the wafers, so as to prevent the wafers from being polluted or damaged due to the dirt of the wafer supporting arms when the wafer supporting arms carry the wafers.
In the related art, the apparatus for cleaning the wafer support arm generally includes a cleaning shower bar and a dry purge bar. The drying blowing rod and the cleaning spraying rod are distributed up and down, and the cleaning spraying rod and the drying blowing rod are arranged in a row due to the fact that the wafer supporting arm is longer. When the wafer supporting arm is cleaned, the wafer supporting arm sequentially moves to the position close to the cleaning spray rod and the drying blowing rod for cleaning. When moving to being close to the department of wasing the spray bar, wash the spray bar and distribute in the side of the axis of wafer support arm, wash the spray bar and can only spray the washing to the wafer support arm in one side, when moving to being close to dry purge bar department, dry purge bar also distributes in the side of the axis of wafer support arm, dry purge bar also can only dry and sweep one side of wafer support arm, consequently, wash spray bar and dry purge bar only can wash one side of wafer support arm when wasing the wafer support arm, and to the one side of deviating from of wasing spray bar and dry purge bar of wafer support arm can't wash, thereby there is the incomplete problem of wasing the wafer support arm, wash spray bar and dry purge bar are many poles, and arrange the setting in one row, thereby lead to wasing spray bar and dry purge bar holistic occupation space great.
Disclosure of Invention
The invention discloses a cleaning device, which aims to solve the problem that the cleaning device can only clean a wafer supporting arm from one side and the cleaning of the wafer supporting arm is incomplete.
In order to solve the technical problems, the invention is realized as follows:
the invention discloses a cleaning device which is used for cleaning wafer transmission equipment, wherein the wafer transmission equipment comprises a wafer supporting arm, and the cleaning device comprises a first cleaning block and a second cleaning block; wherein:
at least one of the first cleaning block and the second cleaning block is provided with a medium inlet, and a plurality of medium outlets are arranged on the first cleaning block and the second cleaning block;
the first cleaning block and the second cleaning block can move relatively to form a cleaning space in a butt joint mode, the cleaning space is used for accommodating the wafer supporting arm, the structure formed by the first cleaning block and the second cleaning block is used for encircling the wafer supporting arm, and the medium outlets are arranged along the inner wall of the cleaning space and used for encircling the wafer supporting arm.
The technical scheme adopted by the invention can achieve the following technical effects:
according to the cleaning device, the cleaning device comprises the first cleaning block and the second cleaning block, the first cleaning block and the second cleaning block can move relatively to form the cleaning space in a butt joint mode, when the cleaning device cleans the wafer supporting arm, the cleaning space can accommodate the wafer supporting arm to provide a cleaning place for the wafer supporting arm, at least one of the first cleaning block and the second cleaning block is provided with the medium inlet, the first cleaning block and the second cleaning block are provided with the plurality of medium outlets, the cleaning medium can enter through the medium inlet, and is sprayed out from the medium outlets to be used for cleaning the wafer supporting arm, the plurality of medium outlets are arranged along the inner wall of the cleaning space and are used for encircling the wafer supporting arm, when the cleaning space accommodates the wafer supporting arm, the plurality of medium outlets encircle the wafer supporting arm, and further the cleaning medium sprayed out of the medium outlets can encircle the wafer supporting arm, so that when the wafer supporting arm is cleaned, the problem that cleaning is incomplete due to the fact that the wafer supporting arm can only be cleaned from a single side is solved, and finally, the cleaning capacity of the cleaning device to the wafer supporting arm is effectively improved.
Drawings
FIG. 1 is a schematic view of the cooperation of a cleaning apparatus with a wafer support arm in a first cooperation state between a first cleaning block and a second cleaning block;
FIG. 2 is a schematic structural view of the cleaning device in a second mating state of the first cleaning block and the second cleaning block;
FIG. 3 is a schematic view of FIG. 1 at a first viewing angle;
FIG. 4 is a schematic view of the cleaning apparatus and the wafer transfer device at a first viewing angle and in a second mated state with the first cleaning block and the second cleaning block;
FIG. 5 is a schematic view of the mating structure of the guide link and the second drive mechanism;
FIG. 6 is a schematic diagram of the structure of the second driving mechanism at a view angle;
fig. 7 is a schematic structural view of the second driving mechanism at another view angle (the hollow arrow in fig. 7 is a schematic sliding direction of the slider 830);
FIG. 8 is a partial cross-sectional view of the first cleaning block and the second cleaning block in a first mated state;
FIG. 9 is a schematic diagram of the mating structure of the guide link, the first link and the second link;
FIG. 10 is a partial cross-sectional view of the mating structure of the guide link, the first link and the second link;
FIG. 11 is a schematic view of the guiding connection piece and the first connecting rod.
Reference numerals illustrate:
100-wafer transfer apparatus, 110-wafer support arm, 111-support sub-arm, 120-connection bracket,
200-a first cleaning block,
300-a second cleaning block,
410-media outlet, 420-media channel, 430-isolation protrusion, 440-purge tab,
500-cleaning space, 510-sub-cleaning space,
600-first driving mechanism, 610-first driving piece, 620-second driving piece, 630-first connecting rod, 640-second connecting rod, 650-bar-shaped hole,
700-guiding connecting piece, 710-supporting bottom plate, 720-guiding block, 730-guiding gap, 740-fixing bolt, 750-shaft sleeve,
800-second driving mechanism, 810-base, 820-slide rail, 830-slider, 840-third driving piece.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The technical scheme disclosed by each embodiment of the invention is described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 11, an embodiment of the present invention discloses a cleaning apparatus for cleaning a wafer transfer apparatus 100, wherein the wafer transfer apparatus 100 includes a wafer support arm 110, and the wafer support arm 110 is a member for clamping and transferring a wafer. For example, in the pod cleaning apparatus, the number of wafers transferred by the wafer transfer apparatus 100 at a time is plural (for example, 50 sheets), and plural wafers may be held on the wafer support arm 110 along the extending direction of the wafer support arm 110. The wafer transfer apparatus 100 may further include a connection bracket 120, the connection bracket 120 providing a mounting base for the wafer support arm 110, and the wafer support arm 110 may be mounted on the connection bracket 120.
The cleaning device is used for cleaning the wafer supporting arm 110 to prevent the wafer supporting arm 110 from being polluted or damaged due to dirt of the wafer supporting arm 110 when the wafer supporting arm 110 clamps the wafer. The cleaning apparatus includes a first cleaning block 200 and a second cleaning block 300.
At least one of the first and second cleaning blocks 200 and 300 is provided with a medium inlet through which cleaning medium can enter. The first cleaning block 200 and the second cleaning block 300 are each provided with a plurality of medium outlets 410, and the cleaning medium entering from the medium inlets can be sprayed onto the surface of the wafer support arm 110 through the medium outlets 410 to clean the wafer support arm 110. The cleaning medium may be a cleaning fluid, a gas (which may be used to purge the surface of the wafer support arm 110 to effect drying), or the like.
Specifically, when one of the first cleaning block 200 and the second cleaning block 300 is provided with a medium inlet, the medium inlet may be communicated with a plurality of medium outlets on the first cleaning block 200 and the second cleaning block 300 through a connection pipe, and of course, hollow channels (for example, a medium channel 420 described later) may be respectively provided in the first cleaning block 200 and the second cleaning block 300, and the hollow channels of the first cleaning block 200 and the hollow channels of the second cleaning block 300 may be communicated with each other, and the medium inlet may be communicated with the plurality of medium outlets 410 through the hollow channels. Of course, the first cleaning block 200 and the second cleaning block 300 may be provided with medium inlets, and the medium inlets of the first cleaning block 200 and the second cleaning block 300 may be respectively communicated with a plurality of corresponding medium outlets.
The first and second cleaning blocks 200 and 300 may be relatively moved to be butted to form the cleaning space 500. The relative movement of the first and second cleaning blocks 200 and 300 may be that one of the first and second cleaning blocks 200 and 300 is fixed and the other is moved or rotated, but of course, the relative movement of the first and second cleaning blocks 200 and 300 may be that the first and second cleaning blocks 200 and 300 are moved or rotated together.
The first cleaning block 200 and the second cleaning block 300 may each be provided with an inner recess, and when the first cleaning block 200 and the second cleaning block 300 are abutted, the open end of the inner recess of the first cleaning block 200 is abutted with the open end of the inner recess of the second cleaning block 300 to form the cleaning space 500. Of course, the first cleaning block 200 and the second cleaning block 300 may be arc structures, and when the ends of the two arc structures are butted, the inner walls of the two arc structures are opposite, and the inner wall of the arc structure is the side where the center of the arc structure is located.
The cleaning space 500 is used to accommodate the wafer support arm 110, and the first cleaning block 200 and the second cleaning block 300 are configured to surround the wafer support arm 110. The plurality of medium outlets 410 are disposed along the inner wall of the cleaning space 500 and are used to surround the wafer support arm 110, and the cleaning medium can be sprayed onto the surface of the wafer support arm 110 through the plurality of medium outlets 410 to clean the wafer support arm 110.
In a specific implementation process, when the cleaning device cleans the wafer support arm 110, the first cleaning block 200 and the second cleaning block 300 relatively move to form the cleaning space 500 in a butt joint manner, the wafer support arm 110 is accommodated in the cleaning space 500, so that the structure formed by the first cleaning block 200 and the second cleaning block 300 surrounds the wafer support arm 110, the plurality of medium outlets 410 arranged on the inner wall of the cleaning space 500 surround the wafer support arm 110, and the cleaning medium can enter through the medium inlets and be sprayed from the plurality of medium outlets 410 to the surface of the wafer support arm 110 in a surrounding manner so as to clean the whole circumference of the wafer support arm 110.
According to the embodiment of the invention, the cleaning device is arranged to comprise the first cleaning block 200 and the second cleaning block 300, the first cleaning block 200 and the second cleaning block 300 can relatively move to butt-joint to form the cleaning space 500, so that when the cleaning device cleans the wafer supporting arm 110, the cleaning space 500 can accommodate the wafer supporting arm 110, so as to provide a cleaning place for the wafer supporting arm 110, at least one of the first cleaning block 200 and the second cleaning block 300 is provided with a medium inlet, the first cleaning block 200 and the second cleaning block 300 are provided with a plurality of medium outlets 410, so that cleaning medium can enter through the medium inlet, be sprayed out from the medium outlets 410 for cleaning the wafer supporting arm 110, and the plurality of medium outlets 410 are arranged along the inner wall of the cleaning space 500 and are used for encircling the wafer supporting arm 110, so that when the cleaning space 500 accommodates the wafer supporting arm 110, the plurality of medium outlets 410 encircle the wafer supporting arm 110, and further the cleaning medium sprayed out from the medium outlets 410 can encircle the wafer supporting arm 110, thereby effectively solving the problem that when the wafer supporting arm 110 is cleaned, the final cleaning device cannot clean the wafer supporting arm 110 completely, and the problem that the cleaning device cannot be cleaned completely because the wafer supporting arm 110 is cleaned from a single side.
In some embodiments, the cleaning apparatus has no access to the cleaning space for the wafer support arm 110, and one end of the wafer support arm 110 extends into the cleaning space 500 from the end of the cleaning space 500 when the wafer support arm 110 enters the cleaning space 110, which requires the wafer support arm 110 to have a free end, whereas in the related art, the wafer support arm 110 may not have a free end, resulting in limited application of the cleaning apparatus. To make the cleaning apparatus more widely used, the cleaning apparatus may further include a first driving mechanism 600, and each of the first cleaning block 200 and the second cleaning block 300 may be connected to the first driving mechanism 600, and the first driving mechanism 600 may be used to drive the first cleaning block 200 and the second cleaning block 300 to move so as to switch the first cleaning block 200 and the second cleaning block 300 between the first mating state and the second mating state. Of course, the cleaning apparatus may be provided without the first driving mechanism 600, and the first cleaning block 200 and the second cleaning block 300 may be manually moved to switch the first cleaning block 200 and the second cleaning block 300 between the first engagement state and the second engagement state.
In the first coupling state, the first cleaning block 200 and the second cleaning block 300 form a cleaning space 500 by a relative movement, and in the second coupling state, the first cleaning block 200 and the second cleaning block 300 are separated, and an inlet and an outlet for the wafer support arm 110 to pass through are formed between the first cleaning block 200 and the second cleaning block 300. Specifically, the first cleaning block 200 and the second cleaning block 300 are separated to form a cleaning solution for the wafer support arm 110 before it is ready to enter the cleaning spaceThe wafer support arm 110 enters the inlet and outlet, when the wafer support arm 110 enters the space between the first cleaning block 200 and the second cleaning block 300 from the inlet and outlet, the first cleaning block 200 and the second cleaning block 300 are in butt joint so that the wafer support arm 110 is accommodated in the cleaning space 500, and after the cleaning is finished, the first cleaning block 200 and the second cleaning block 300 are separated to form the inlet and outlet, so that the wafer support arm 110 can be moved out of the cleaning space 500 from the inlet and outlet. For example, as shown in FIG. 1, the wafer support arm 110 may be moved in a positive direction along the Z-axis to move out of the cleaning volume 500, and the wafer support arm 110 may be moved in a negative direction along the Z-axis to enter the cleaning volume 500, wherein Z + Indicating the positive direction of the Z axis, and Z + The opposite direction is the negative direction of the Z-axis. The positive direction of the Z axis and the negative direction of the Z axis are opposite to each other. The penetrating direction of the cleaning space 500 is perpendicular to the Z axis.
According to the cleaning device, the first driving mechanism 600 is arranged, the first driving mechanism 600 is respectively connected with the first cleaning block 200 and the second cleaning block 300, so that the first driving mechanism 600 can drive the first cleaning block 200 and the second cleaning block 300 to move, the first cleaning block 200 and the second cleaning block 300 can be switched between a first matching state and a second matching state, the first cleaning block 200 and the second cleaning block 300 are in butt joint with each other in the first matching state, the first cleaning block 200 and the second cleaning block 300 are separated in the second matching state, an inlet and an outlet for the wafer supporting arm 110 to pass through are formed between the first cleaning block 200 and the second cleaning block 300, the wafer supporting arm 110 can directly enter or move out of the cleaning space 500 through the inlet and the outlet, the problem that the wafer supporting arm 110 cannot enter the cleaning space 500 due to the fact that the free end does not exist is solved effectively, the cleaning device is widely applied, the wafer supporting arm 110 is used for supplying the wafer 110, the wafer supporting arm is prevented from moving into the cleaning space 500, and the wafer supporting arm 110 is prevented from moving in the second matching state, the wafer supporting arm 110 is prevented from moving into the cleaning space, and the cleaning device is suitable for the wafer supporting arm 110 is improved in the cleaning device.
The first driving mechanism 600 may be a hydraulic expansion element, an air expansion element, or the like, and the first driving mechanism 600 is not particularly limited herein. The first actuating mechanism can include driving motor, the lead screw, driving motor and lead screw connection, the screw has the screw thread section of different spiral directions, the screw hole has all been seted up on first washing piece 200 and the second washing piece 300, screw hole on first washing piece 200 and the second washing piece 300 respectively with the screw thread section screw thread fit of different spiral directions on the lead screw, in this way, when driving motor drive screw rotates along first direction of rotation, first washing piece 200 and second washing piece 300 pass through screw hole respectively with corresponding screw thread section screw fit, can realize that first washing piece 200 and second washing piece 300 are close to each other until forming cleaning space 500, when driving motor drive screw rotates along the second direction of rotation, first washing piece 200 and second washing piece 300 pass through the screw hole respectively with corresponding screw thread section screw fit, can realize that first washing piece 200 and second washing piece 300 keep away from each other and form the exit.
Of course, in some embodiments, one of the first and second cleaning blocks 200, 300 may be stationary and the other movable, in which case the first drive mechanism 600 need only be coupled to the movable one of the first and second cleaning blocks 200, 300.
In some cases, the wafer conveying apparatus 100 has a plurality of wafer supporting arms 110, the plurality of wafer supporting arms 110 may form a space for clamping a wafer, when the first cleaning block 200 and the second cleaning block 300 are all one, the plurality of wafer supporting arms 110 need to be cleaned in sequence, in order to improve the cleaning efficiency of the cleaning device, the plurality of first cleaning blocks 200 and the plurality of second cleaning blocks 300 are optionally all multiple, and the plurality of first cleaning blocks 200 and the plurality of second cleaning blocks 300 are respectively in one-to-one correspondence, the plurality of first cleaning blocks 200 and the plurality of second cleaning blocks 300 are respectively arranged along the first direction, the plurality of first cleaning blocks 200 and the plurality of second cleaning blocks 300 form a plurality of cleaning spaces 500, and the plurality of cleaning spaces 500 are distributed at intervals along a direction perpendicular to the penetrating direction of the cleaning spaces 500. Specifically, when the plurality of wafer support arms 110 are cleaned, the plurality of wafer support arms 110 may enter the plurality of cleaning spaces 500 in a one-to-one correspondence.
Through setting up a plurality of first cleaning blocks 200 and a plurality of second cleaning blocks 300 for a plurality of first cleaning blocks 200 and a plurality of second cleaning blocks 300 one-to-one butt joint can form a plurality of cleaning spaces 500, thereby make a plurality of cleaning spaces 500 can hold a plurality of wafer support arms 110, and then make when needs wash a plurality of wafer support arms 110, a plurality of cleaning spaces 500 can wash a plurality of wafer support arms 110 simultaneously, thereby can improve belt cleaning device's cleaning efficiency effectively. Of course, at this time, the plurality of wafer supporting arms 110 are arranged in the first direction, and two adjacent wafer supporting arms 110 are spaced apart.
In an alternative embodiment, the first driving mechanism 600 may include a first driving member 610, a second driving member 620, a first connection rod 630, and a second connection rod 640. The first driving member 610 may be connected to the first cleaning block 200 through a first connection rod 630 for driving the first cleaning block 200 to move, and the second driving member 620 may be connected to the second cleaning block 300 through a second connection rod 640 for driving the second cleaning block 300 to move. In case that the first cleaning block 200 and the second cleaning block 300 are plural, the first driving member 610 is connected to the plurality of first cleaning blocks 200 through the first connection rod 630 for driving the plurality of first cleaning blocks to move, and the second driving member 620 is connected to the plurality of second cleaning blocks 300 through the second connection rod 640 for driving the plurality of second cleaning blocks to move.
The first driving member 610 is used for driving the first cleaning block 200 to move in one of a first direction and a second direction, and the second driving member 620 is used for driving the second cleaning block 300 to move in the other of the first direction and the second direction, so that the first cleaning block 200 and the second cleaning block 300 are in a first matching state or a second matching state, and the first direction and the second direction are opposite to each other and are perpendicular to the penetrating direction.
When the first cleaning block 200 and the second cleaning block 300 are plural, the first driving member 610 is used to drive the plurality of first cleaning blocks 200 to move in one of the first direction and the second direction, and the second driving member 620 is used to drive the plurality of second cleaning blocks 300 to move in the other of the first direction and the second direction, so that the first cleaning blocks 200 and the second cleaning blocks 300 are in the first engagementIn the state or the second mating state, the first direction and the second direction are opposite to each other and are perpendicular to the penetrating direction of the cleaning space 500. As shown in FIG. 1, X + Representing the positive direction of the X axis, and X + The opposite direction is the negative direction of the X-axis. The positive direction of the X-axis may be the first direction, the negative direction of the X-axis may be the second direction, and of course, the positive direction of the X-axis may also be the second direction, and the negative direction of the X-axis may be the first direction.
Specifically, when the first driving member 610 drives the first cleaning block 200 to move along the first direction, the second driving member 620 drives the second cleaning block 300 to move along the second direction, and at this time, the first cleaning block 200 and the second cleaning block 300 are relatively close to each other until being abutted, so as to form the cleaning space 500; when the first driving member 610 drives the first cleaning block 200 to move along the second direction, the second driving member 620 drives the second cleaning block 300 to move along the first direction, and the first cleaning block 200 and the second cleaning block 300 are relatively far apart, so as to form an inlet and an outlet for the wafer supporting arm 110 to pass through. Of course, when the first driving member 610 drives the first cleaning block 200 to move along the first direction and the second driving member 620 drives the second cleaning block 300 to move along the second direction, the first cleaning block 200 and the second cleaning block 300 may be relatively far apart, so as to form an inlet and an outlet for the wafer supporting arm 110 to pass through, when the first driving member 610 drives the first cleaning block 200 to move along the second direction and the second driving member 620 drives the second cleaning block 300 to move along the first direction, the first cleaning block 200 and the second cleaning block 300 may be relatively close to each other until abutting each other, so as to form the cleaning space 500. The first driver 610 and the second driver 620 may each be a driving motor, a driving cylinder, or the like.
When the first cleaning block 200 and the second cleaning block 300 are all plural, by arranging the first driving mechanism 600 as the first driving member 610, the second driving member 620, the first connecting rod 630 and the second connecting rod 640, the first driving member 610 may be connected with the first cleaning blocks 200 through the first connecting rod 630, the second driving member 620 may be connected with the second cleaning blocks 300 through the second connecting rod 640, so that the first driving member 610 may drive the first cleaning blocks 200 to move in one of the first direction and the second direction, the second driving member 620 may drive the second cleaning blocks 300 to move in the other of the first direction and the second direction, so that the first cleaning blocks 200 and the second cleaning blocks 300 may be in the first matching state or the second matching state, and the second driving member 620 may drive the second cleaning blocks 300 to move through the first driving member 610, so that the second cleaning blocks 300 may be driven to move through fewer driving members, which may reduce the number of cleaning blocks and make it easier to manufacture the cleaning apparatus more compact.
The movement of the first and second cleaning blocks 200 and 300 may be synchronous movement, or the first cleaning block 200 may be moved first, the second cleaning block 300 may be moved later, or the second cleaning block 300 may be moved first, and the first cleaning block 200 may be moved later. The embodiment of the present application is not limited as long as it can satisfy that both can be switched in the first mating state and the second mating state.
In an alternative embodiment, the cleaning device may further include a guide connection member 700, the guide connection member 700 may include a support base 710 and a plurality of guide blocks 720, the plurality of guide blocks 720 may be connected to the support base 710 and spaced apart, two adjacent guide blocks 720 form a guide gap 730, and an extension direction of the guide gap 730 is parallel to the first direction or the second direction. The first driving member 610 and the second driving member 620 may be mounted on the supporting base 710, and the first connecting rod 630, the second connecting rod 640, the first cleaning block 200 and the second cleaning block 300 are movably disposed on the supporting base 710, and portions of the first connecting rod 630 and portions of the second connecting rod 640 are disposed in the corresponding guide gaps 730 and are in guide fit with the corresponding guide gaps 730.
Through setting up supporting baseplate 710 and a plurality of guide block 720 for supporting baseplate 710 can provide the basis of installation for first cleaning block 200, second cleaning block 300, first drive piece 610, second drive piece 620, a plurality of guide blocks 720 all connect in supporting baseplate 710, and the interval sets up, make adjacent two guide blocks 720 can form guide gap 730, and the extending direction of guide gap 730 is parallel with first direction or second direction, and then make the part of first connecting rod 630 and the part of second connecting rod 640 can establish in corresponding guide gap 730, and with corresponding guide gap 730 guide cooperation, thereby make the accurate removal of direction along guide gap 730 of first connecting rod 630 and second connecting rod 640, and then make the direction of movement that first cleaning block 200 and second cleaning block 300 are driven respectively to first connecting rod 630 and second connecting rod 640, thereby make first cleaning block 200 and second cleaning block 300 more accurate in position when docking and separating.
The plurality of guide blocks 720 may be fixedly connected to the middle of the support base 710, the first driving member 610 and the second driving member 620 may be disposed at both sides of the guide blocks 720, the first cleaning block 200 and the second cleaning block 300 may be disposed at both sides of the guide blocks 720, the first driving member 610 and the first cleaning block 200 may be disposed at both sides of the guide blocks 720, and the second driving member 620 and the second cleaning block 300 may be disposed at both sides of the guide blocks 720. Of course, the first driving member 610, the second driving member 620, the first cleaning block 200 and the second cleaning block 300 may be disposed on the supporting base 710 in other manners, which are not particularly limited herein.
In some cases, when the first connecting rod 630 and the second connecting rod 640 move in the guide gap 730, the first connecting rod 630 and the second connecting rod 640 have a risk of being separated from the guide gap 730, in order to solve the problem that the first connecting rod 630 and the second connecting rod 640 are separated from the guide gap 730, optionally, the guide connecting member 700 further includes a fixing bolt 740 and a shaft sleeve 750, the fixing bolt 740 penetrates through the plurality of guide blocks 720, the shaft sleeve 750 is sleeved on a portion of the fixing bolt 740 located in the guide gap 730, the shaft sleeve 750 can rotate on the fixing bolt 740, the first connecting rod 630 and the second connecting rod 640 are provided with strip-shaped holes 650, the extending direction of the strip-shaped holes 650 is consistent with that of the guide gap 730, and the first connecting rod 630 and the second connecting rod 640 can be sleeved on the corresponding shaft sleeve 750 through the respective strip-shaped holes 650, so that when the first connecting rod 630 and the second connecting rod 640 move in the extending direction of the guide gap 730, the strip-shaped holes 650 on the first connecting rod 630 and the second connecting rod 640 can be in rolling fit with the corresponding shaft sleeve, and the shaft sleeve can rotate relative to the fixing bolt 740. Specifically, one side of the bar-shaped hole 650 of the first and second connection bars 630 and 640 may contact the boss 750 to achieve a rolling fit as the first and second connection bars 630 and 640 move in the guide gap 730.
Through penetrating the fixing bolt 740 through the plurality of guide blocks 720, the shaft sleeve 750 is sleeved on the part, located in the guide gap 730, of the fixing bolt 740, the strip-shaped holes 650 are respectively formed in the first connecting rod 630 and the second connecting rod 640, the extending direction of the strip-shaped holes 650 is consistent with that of the guide gap 730, the first connecting rod 630 and the second connecting rod 640 can be sleeved on the corresponding shaft sleeve 750 through the respective strip-shaped holes 650, and then the first connecting rod 630 and the second connecting rod 640 are limited in the guide gap 730 through the matching of the strip-shaped holes 650 and the shaft sleeve 750, so that the first connecting rod 630 and the second connecting rod 640 are effectively prevented from being separated from the guide gap 730 in the moving process, meanwhile, the strip-shaped holes 650 and the shaft sleeve 750 are in rolling fit, the friction force born by the moving process can be reduced, the abrasion of the first connecting rod 630 and the second connecting rod 640 is effectively reduced, and the plurality of guide blocks 720 can be connected through the fixing bolt 740 more stably.
In some embodiments, the first cleaning block 200 and the second cleaning block 300 only can surround a portion of the wafer support arm 110 after being docked, and cannot cover the entire extension direction of the wafer support arm 110. In order to enable cleaning of the wafer support arm 110 in the entire extension direction, the cleaning apparatus may optionally further comprise a second drive mechanism 800. The second driving mechanism 800 may be connected to the support base 710, and in case the first and second cleaning blocks 200 and 300 are butted to form the cleaning space 500, the second driving mechanism 800 may be used to drive the support base 710 to drive the first and second cleaning blocks 200 and 300 to move in a penetrating direction of the cleaning space 500. When the wafer support arm 110 is located in the cleaning space 500, the extending direction of the wafer support arm 110 coincides with the penetrating direction of the cleaning space 500. As shown in FIG. 1, Y + Representing the positive direction of the Y axis, and Y + The opposite direction of the positive direction of the Y axis is the negative direction of the Y axis, and the penetration direction of the cleaning space 500 may be both the positive direction and the negative direction along the Y axis.
Through setting up second actuating mechanism 800, second actuating mechanism 800 is connected with supporting baseplate 710, make second actuating mechanism 800 can drive first washing piece 200 and second washing piece 300 through driving supporting baseplate 710 and follow the through direction of wasing space 500 and remove, thereby make the structure that first washing piece 200 and second washing piece 300 formed can remove wash the whole extending direction of wafer support arm 110, thereby effectively improve the cleaning device's cleaning ability to wafer support arm 110, and, moreover, the structure of cleaning device need not set up to the size with the length looks adaptation of wafer support arm 110 in the extending direction, cleaning device can set up to the size that only encircles partial wafer support arm 110, can realize the washing to the whole extending direction of wafer support arm 110 through second actuating mechanism 800, thereby can effectively reduce cleaning device's volume, make cleaning device's structure compacter.
The second driving mechanism 800 may be a hydraulic driving mechanism, an air driving mechanism, or the like, and the second driving mechanism 800 is not particularly limited herein.
Further, the second driving mechanism 800 may include a base 810, a sliding rail 820, a sliding block 830, and a third driving member 840, where the third driving member 840 and the sliding rail 820 may be disposed on the base 810, the sliding block 830 may be slidably matched with the sliding rail 820 in a penetrating direction, the supporting base 710 may be connected with the sliding block 830, the third driving member 840 may be used to drive the sliding block 830 to drive the guiding connecting member 700 to move, and the guiding connecting member 700 may drive the first cleaning block 200 and the second cleaning block 300 to move along the penetrating direction. Of course, the second driving mechanism 800 may be directly connected to the first cleaning block 200 and the second cleaning block 300, for driving the first cleaning block 200 and the second cleaning block 300 to move in the penetrating direction.
The second driving mechanism 800 is configured to include a base 810, a sliding rail 820, a sliding block 830 and a third driving member 840, where the third driving member 840 and the sliding rail 820 are both disposed on the sliding table base 810, and the sliding block 830 and the sliding rail 820 are slidably matched in a penetrating direction, so that the third driving member 840 can drive the sliding block 830 to move along the sliding rail 820 to drive the guiding connecting member 700 to move, so that the guiding connecting member 700 can drive the first cleaning block 200 and the second cleaning block 300 to move along the penetrating direction, and the sliding block 830 and the sliding rail 820 are slidably matched, so that the sliding of the sliding block 830 relative to the sliding rail 820 is relatively stable, and the movement of the guiding connecting member 700 can be more stable.
The third driving member 840 may be a linear driving motor, a spring, etc., and the third driving member 840 is not particularly limited herein.
In some embodiments, the wafer supporting arm 110 includes a plurality of supporting sub-arms 111, the plurality of supporting sub-arms 111 are spaced apart, the plurality of supporting sub-arms 111 may have wafer clamping portions thereon, and the wafer clamping portions on the plurality of supporting sub-arms 111 may be used to clamp different areas of the wafer edge respectively to support the wafer. In order to adapt to the structure of the wafer supporting arm 110, optionally, the first cleaning block 200 and the second cleaning block 300 are provided with a plurality of isolation protrusions 430, where the first cleaning block 200 and the second cleaning block 300 are butted to form the cleaning space 500, the plurality of isolation protrusions 430 divide the cleaning space 500 into a plurality of spaced sub-cleaning spaces 510, the plurality of sub-cleaning spaces 510 are used for accommodating the supporting sub-arms 111 of the wafer supporting arm 110 in a one-to-one correspondence manner, the inner wall of each sub-cleaning space 510 is provided with a plurality of medium outlets 410, the plurality of medium outlets 410 on the inner wall of each sub-cleaning space 510 are used for surrounding the supporting sub-arm 111, and the penetrating direction of each sub-cleaning space 510 is consistent with the penetrating direction of the cleaning space.
Specifically, when the plurality of support sub-arms 111 are cleaned, the plurality of isolation protrusions 430 are separated to form a plurality of inlets and outlets through which the support sub-arms pass, and the plurality of support sub-arms 111 sequentially pass through the plurality of inlets and outlets from the support sub-arms 111 positioned at the ends, so that the plurality of support sub-arms 111 are accommodated in the plurality of spaced sub-cleaning spaces 510 in a one-to-one correspondence.
Through the plurality of isolation protrusions 430 provided on the first cleaning block 200 and the second cleaning block 300, in the case that the cleaning space 500 is formed by abutting the first cleaning block 200 and the second cleaning block 300, the plurality of isolation protrusions 430 divide the cleaning space 500 into a plurality of spaced sub-cleaning spaces 510, so that the plurality of sub-cleaning spaces 510 can be accommodated in the supporting sub-arms 111 of the wafer supporting arm 110 in a one-to-one correspondence manner, and each supporting sub-arm 111 can be cleaned in the circumferential direction, thereby effectively improving the cleaning capability and the cleaning efficiency of the wafer supporting arm 110.
In an alternative embodiment, the first cleaning block 200 and the second cleaning block 300 may be provided with a medium passage 420 therein, and the medium inlet communicates with the plurality of medium outlets 410 through the medium passage 420. By providing the medium channel 420 inside the first cleaning block 200 and the second cleaning block 300, the medium inlet can be communicated with the plurality of medium outlets 410, so that the arrangement of the peripheral channels to connect the medium inlet and the plurality of medium outlets 410 is avoided, the structure of the cleaning device is more compact, and the weight of the first cleaning block 200 and the second cleaning block 300 is lighter due to the provided medium channels.
The medium inlet may be provided with a cleaning connection 440, through which cleaning medium may reach the medium inlet through the cleaning connection 440 and then through the medium channel 420 to the plurality of medium outlets 410.
In an alternative embodiment, the cleaning device may include an air inlet line, a liquid inlet line, and a three-way valve, the liquid inlet line may be in communication with a first inlet end of the three-way valve, the air inlet line may be in communication with a second inlet end of the three-way valve, and the cleaning connector 440 may be in communication with an outlet end of the three-way valve. In a spraying state, the first inlet end is opened, and the second inlet end is closed; in the blowing state, the first inlet end is closed, the second inlet end is opened, and the cleaned wafer supporting arm 110 is dried by blowing.
When the wafer support arm 110 is cleaned, the first inlet end is opened, the second inlet end is closed, the liquid inlet pipeline is communicated with the cleaning joint 440 so as to spray cleaning liquid to the wafer support arm 110, after the cleaning of the wafer support arm 110 by the cleaning liquid is finished, the first inlet end is closed, the second inlet end is opened, the air inlet pipeline is communicated with the cleaning joint 440, so that air can be blown to the wafer support arm 110, and the wafer support arm 110 can be dried and purged, so that the cleaning of the wafer support arm 110 is realized.
The foregoing embodiments of the present invention mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in view of brevity of line text, no further description is provided herein.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.
Claims (8)
1. The cleaning device is used for cleaning wafer transmission equipment and comprises a wafer supporting arm and is characterized by comprising a plurality of first cleaning blocks, a plurality of second cleaning blocks, a first driving piece, a second driving piece, a first connecting rod and a second connecting rod, wherein the first cleaning blocks and the second cleaning blocks are in one-to-one correspondence, at least one of the first cleaning blocks and the second cleaning blocks is provided with a medium inlet, and the first cleaning blocks and the second cleaning blocks are provided with a plurality of medium outlets;
the first driving piece is connected with a plurality of first cleaning blocks through the first connecting rod; the second driving piece is connected with a plurality of second cleaning blocks through the second connecting rod;
the first driving piece is used for driving the first cleaning blocks to move along one of a first direction and a second direction, and the second driving piece is used for driving the second cleaning blocks to move along the other of the first direction and the second direction, so that the first cleaning blocks and the second cleaning blocks can relatively move to be butted to form a plurality of cleaning spaces or separated to form an inlet and an outlet for the wafer supporting arm to pass through; the cleaning space is used for accommodating the wafer supporting arm, the first cleaning block and the second cleaning block form a structure used for encircling the wafer supporting arm, and the plurality of medium outlets are arranged along the inner wall of the cleaning space and used for encircling the wafer supporting arm; the first direction and the second direction are opposite to each other.
2. The cleaning apparatus according to claim 1, wherein the plurality of first cleaning blocks and the plurality of second cleaning blocks are arranged in a first direction, and the plurality of cleaning spaces are spaced apart in a direction perpendicular to a penetrating direction of the cleaning spaces.
3. The cleaning device according to claim 2, further comprising a guide connection member, wherein the guide connection member comprises a support base plate and a plurality of guide blocks, the plurality of guide blocks are connected to the support base plate and are distributed at intervals, two adjacent guide blocks form a guide gap, and the extending direction of the guide gap is parallel to the first direction or the second direction;
the first driving piece and the second driving piece are both installed on the supporting bottom plate, the first connecting rod, the second connecting rod, the first cleaning block and the second cleaning block are both movably arranged on the supporting bottom plate, and part of the first connecting rod and part of the second connecting rod are arranged in the corresponding guide gaps and are in guide fit with the corresponding guide gaps.
4. The cleaning device according to claim 3, wherein the guide connecting member further comprises a fixing bolt and a sleeve, the fixing bolt penetrates through the plurality of guide blocks, the sleeve is sleeved on a portion, located in the guide gap, of the fixing bolt, the first connecting rod and the second connecting rod are provided with strip-shaped holes, the extending direction of the strip-shaped holes is consistent with that of the guide gap, and the first connecting rod and the second connecting rod are sleeved on the corresponding sleeve through the strip-shaped holes respectively.
5. The cleaning apparatus of claim 3 or 4, further comprising a second driving mechanism connected to the support base, the second driving mechanism being configured to drive the first cleaning block and the second cleaning block to move in a penetrating direction of the cleaning space by driving the support base in a case where the first cleaning block and the second cleaning block are butted to form the cleaning space.
6. The cleaning device of claim 5, wherein the second driving mechanism comprises a base, a sliding rail, a sliding block and a third driving member, the third driving member and the sliding rail are both arranged on the base, the sliding block is in sliding fit with the sliding rail in the penetrating direction, the supporting base plate is connected with the sliding block, and the third driving member is used for driving the guiding connecting member to move by driving the sliding block.
7. The cleaning device according to claim 1, wherein the first cleaning block and the second cleaning block are each provided with a plurality of isolation protrusions, the isolation protrusions divide the cleaning space into a plurality of spaced sub-cleaning spaces for accommodating the supporting sub-arms of the wafer supporting arm in one-to-one correspondence, the medium outlets are formed in the inner wall of each sub-cleaning space so as to surround the supporting sub-arms, and the penetrating direction of each sub-cleaning space is identical to that of the cleaning space.
8. The cleaning device of claim 1, wherein the first cleaning block and the second cleaning block have media channels defined therein, the media inlets communicating with the plurality of media outlets through the media channels.
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| CN202210333213.0A CN114643223B (en) | 2022-03-31 | 2022-03-31 | Cleaning device |
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| CN202210333213.0A CN114643223B (en) | 2022-03-31 | 2022-03-31 | Cleaning device |
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