CN114635134B

CN114635134B - Acid etching system

Info

Publication number: CN114635134B
Application number: CN202210194665.5A
Authority: CN
Inventors: 郭炜; 杨洪广; 何长水; 袁晓明; 王玮; 韩志博; 白宪璐; 丁卫东
Original assignee: China Institute of Atomic of Energy
Current assignee: China Institute of Atomic of Energy
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2023-10-27
Anticipated expiration: 2042-03-01
Also published as: CN114635134A

Abstract

The embodiment of the application discloses an acid etching system, which comprises: the acid etching device comprises a first groove body, a second groove body, a flow divider, a liquid inlet and a liquid outlet; the second groove body is provided with a second accommodating cavity; the diverter is arranged in the second accommodating cavity; the first groove body is arranged on the shunt to form a first accommodating cavity; the liquid inlet is communicated with the flow divider, and the liquid outlet is communicated with the second accommodating cavity; the liquid storage device is respectively communicated with the liquid inlet and the liquid outlet and is used for storing acid etching liquid; a liquid pump; a flow control device; the acid etching liquid in the liquid storage device flows into the liquid inlet through the liquid drawing pump, enters the first accommodating cavity through the flow divider, overflows from the first accommodating cavity to flow into the second accommodating cavity, and flows out from the liquid outlet to return to the liquid storage device. The acid etching system provided by the embodiment of the application can solve the problem of independent acid etching of a plurality of pipe fittings or a single pipe fitting.

Description

Acid etching system

Technical Field

The application relates to the technical field of acid etching, in particular to an acid etching system.

Background

In the treatment process before acid etching, acid etching cleaning is generally required to be carried out on the acid etched original piece for a certain time, so that the purpose of eliminating the oxide film on the surface of the acid etched original piece is achieved. In addition, in the acid etching process, a layer of complex is generated on the surface of the acid etched original, and the complex layer plays a role in promoting the growth of an electroplated layer in the subsequent electroplating process link. The uniformity of acid etching is a prerequisite for uniform growth of the plating layer. In the related art, the acid etching ring system is still immature, for example, independent acid etching of a single pipe fitting cannot be realized, and the stability control of the flow rate of acid etching liquid is poor, the uniformity of acid etching is poor, and the like.

Disclosure of Invention

Accordingly, it is desirable to provide an acid etching system to solve the problem of independent acid etching of multiple pipes or a single pipe.

In order to achieve the above object, the technical solution of the embodiment of the present application is as follows:

an acid etching system comprising: the acid etching device comprises at least one first groove body, at least one second groove body, at least one diverter, at least one liquid inlet and at least one liquid outlet; the second groove body is provided with a second accommodating cavity for accommodating the acid etching solution and the first groove body; the diverter is arranged at the bottom end of the second accommodating cavity; the first groove body is arranged on the diverter so as to form a first accommodating cavity for accommodating the acid etching solution and the pipe fitting, and one end of the first accommodating cavity, which is far away from the diverter, is opened; the liquid inlet is communicated with the flow divider, and the liquid outlet is communicated with the second accommodating cavity; the liquid storage device is respectively communicated with the liquid inlet and the liquid outlet and is used for storing the acid etching liquid; the liquid pump is communicated between the liquid storage device and the liquid inlet; one end of the flow control device is communicated with the liquid inlet, and the other end of the flow control device is communicated with the liquid suction pump; the acid etching liquid in the liquid storage device flows into the liquid inlet through the liquid suction pump, enters the first accommodating cavity through the flow divider, overflows from the first accommodating cavity to flow into the second accommodating cavity, and flows out of the liquid outlet to return to the liquid storage device.

Further, the acid etching system comprises a transition device, wherein the transition device is communicated between the liquid storage device and the liquid outlet and is used for filtering the acid etching liquid flowing out of the liquid outlet.

Further, the acid etching system comprises a fluid supplementing device, and the fluid supplementing device is communicated with the transition device.

Further, the acid etching system comprises a monitoring device, wherein the monitoring device is positioned in the liquid storage device; and/or the monitoring device is located within the transition device.

Further, the monitoring device comprises an F-monitor and a pH monitor.

Further, the acid etching system comprises a filtering device which is detachably communicated between the liquid storage device and the liquid inlet.

Further, the diverter comprises a baffle plate and a plurality of groups of liquid spraying units uniformly distributed on the baffle plate; the partition board is horizontally erected at the bottom end of the second groove body; the first groove body is arranged on the liquid spraying unit to form a first accommodating cavity for accommodating the acid etching liquid and the pipe fitting; the liquid spraying unit can enable the flow velocity of the acid etching liquid on the inner surface and the outer surface of the pipe fitting to be equal.

Further, the liquid spraying unit comprises a body, and an inner liquid flow channel and an outer liquid flow channel which are arranged on the body; the inner liquid channel is used for plugging the bottom end of the pipe fitting, the first groove body is arranged on the body, the area of the body between the first groove body and the pipe fitting is a limited area, and the outer liquid channel is arranged in the limited area; the liquid inlet is respectively communicated with the outer liquid flow channel and the inner liquid flow channel; the cross-sectional area of the outer liquid flow channel is equal to the cross-sectional area of the inner liquid flow channel; the cross-sectional area of the defined area is equal to the cross-sectional area of the tube.

Further, the acid etching system comprises a temperature control device, and the temperature control device can control the temperature of the acid etching liquid.

Further, the temperature control device comprises a first heating device, wherein the first heating device is used for heating the acid etching liquid in the second accommodating cavity; and/or the temperature control device comprises a second heating device, wherein the second heating device is used for heating the acid etching liquid in the liquid storage device; and/or the temperature control device comprises a third heating device, and the third heating device is positioned between the liquid inlet and the liquid pump and is used for heating the acid etching liquid entering the flow divider.

Further, the first heating device is a water bath circulation heating device; and/or the second heating device is a water bath circulation heating device; and/or the third heating device is a water bath circulation heating device or an electric heating device.

Further, the acid etching device comprises a fixing part for fixing the top end of the pipe fitting, and the fixing part is fixed at one end of the first accommodating cavity far away from the flow divider.

Further, the second groove body comprises an opening communicated with the second accommodating cavity and a groove cover covered on the opening, and the groove cover is provided with an exhaust valve.

According to the acid etching system, an acid etching device, a liquid storage device, a liquid pump and a flow control device are arranged; the acid etching device comprises at least one first groove body, a second groove body, a flow divider, a liquid inlet and a liquid outlet; the second groove body is provided with a second accommodating cavity; the diverter is arranged at the bottom end of the second accommodating cavity; the first groove body is arranged on the shunt to form a first accommodating cavity; the pipe fitting is arranged in the semi-closed first accommodating cavity independently, so that the influence of other pipe fittings on the acid etching effect of the pipe fitting is effectively isolated. The acid etching solutions in the first groove bodies can not interfere with each other, the acid etching solution in each first groove body can perform acid etching on one pipe fitting, the condition that a plurality of pipe fittings or a single pipe fitting can accept the acid etching solution under the same condition to perform acid etching is ensured, and the acid etching effect is uniform.

Drawings

FIG. 1 is a schematic diagram of an acid etching system according to an embodiment of the present application;

FIG. 2 is a schematic diagram showing a structure of a liquid ejecting unit according to an embodiment of the present application;

FIG. 3 is a schematic structural view of a fixing portion according to an embodiment of the present application;

FIG. 4 is a schematic diagram showing an assembly structure of a liquid spraying unit, a first tank and a pipe according to an embodiment of the present application;

fig. 5 is a schematic diagram illustrating an assembly structure of a liquid spraying unit, a first tank and a pipe according to another embodiment of the present application.

Detailed Description

It should be noted that, in the case of no conflict, the embodiments of the present application and the technical features of the embodiments may be combined with each other, and the detailed description in the specific embodiments should be construed as illustrating the present application and should not be construed as unduly limiting the present application.

In the description of the embodiments of the present application, the terms "upper," "lower," "left," "right," "top," "bottom," or positional relationships are based on those shown in fig. 1, and it should be understood that these terms are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

An acid etching system, as shown in fig. 1 to 5, comprising: acid etching device 200, liquid storage device 20, liquid pump 30, and flow control device 60.

The acid etching device 200 comprises at least one first tank body 100, a second tank body 110, a flow divider 120, a liquid inlet 130 and a liquid outlet 140; the second tank 110 has a second accommodation chamber 111 for accommodating the acid etching solution and the first tank 100; the flow divider 120 is disposed at the bottom end of the second accommodating chamber 111; the first tank 100 is disposed on the flow divider 120 to form a first accommodating chamber 101 for accommodating the acid etching solution and the pipe, and an end of the first accommodating chamber 101 remote from the flow divider 120 is opened; the liquid inlet 130 communicates with the flow divider 120, and the liquid outlet 140 communicates with the second accommodating chamber 111.

The liquid storage device 20 is respectively communicated with the liquid inlet 130 and the liquid outlet 140 and is used for storing acid etching liquid. The reservoir 20 includes a tank, it being understood that the reservoir 20 may include a tank and other containers capable of storing the etching solution. The liquid pump 30 is communicated between the liquid storage device 20 and the liquid inlet 130, and is used for conveying the acid etching liquid in the liquid storage device 20 to the liquid inlet 130.

One end of the flow control device 60 is communicated with the liquid inlet 130, and the other end is communicated with the liquid pump 30; for controlling the flow of acid etching solution into the inlet 130.

The flow control device 60 may be a valve port-adjustable switch valve, for example, a flow valve, and the flow rate of the acid etching solution in the acid etching system is controlled by adjusting the opening and closing degree of the valve, one end of the flow control device 60 is communicated with the liquid inlet 130, and the other end of the flow control device is communicated with the liquid pumping pump 30, so that the flow rate of the acid etching solution entering the liquid inlet 130 can be controlled, the stability of the acid etching solution entering the first accommodating cavity 101 is improved, and the uniformity of the acid etching on the inner surface and the outer surface of the pipe fitting 9 is improved.

The acid etching solution in the liquid storage device 20 flows into the liquid inlet 130 through the liquid drawing pump 30, enters the first accommodating cavity 101 through the flow divider 120, overflows from the first accommodating cavity 101 to flow into the second accommodating cavity 111, and flows out from the liquid outlet 140 back to the liquid storage device 20.

Specifically, the acid etching apparatus 200 includes: at least one first tank body 100, a second tank body 110, a flow divider 120, a liquid inlet 130 and a liquid outlet 140, wherein the first tank body 100 is accommodated in a second accommodating cavity 111 of the second tank body 110, the flow divider 120 is arranged at the bottom end of the second accommodating cavity 111, the first tank body 100 is arranged on the flow divider 120, and a pipe fitting 9 is arranged in a first accommodating cavity 101 of the first tank body 100; the height of the pipe fitting 9 is generally lower than the height of the first tank body 100, and the height of the first tank body 100 is generally lower than the height of the second tank body 110, so that the pipe fitting 9 can be integrally immersed in the acid etching liquid in the acid etching process, and uneven acid etching is avoided.

The acid etching solution may circulate between the liquid inlet 130 and the liquid outlet 140. During the flow of the acid etching solution, the acid etching solution in the liquid storage device 20 flows into the liquid inlet 130 through the liquid drawing pump 30, flows into the first accommodating cavity 101 through the flow divider 120, overflows from the first accommodating cavity 101 into the second accommodating cavity 111, and flows out from the liquid outlet 140. Referring to fig. 1, the acid etching solution enters from the liquid inlet 130 at the bottom end, is distributed into the first accommodating cavity 101 through the diverter 120 to etch the inner and outer surfaces of the pipe 9, and it is understood that, because the pipe 9 is located in the first accommodating cavity 101, the inner and outer surfaces of the pipe 9 are still substantially in the first accommodating cavity 101, the acid etching solution gradually fills the first accommodating cavity 101 upwards until overflowing from the top end opening of the first accommodating cavity 101, at this time, the acid etching solution completely covers the pipe 9 in the first accommodating cavity 101, so that the pipe 9 can be entirely etched, the overflowed acid etching solution flows into the second accommodating cavity 111, and is gradually filled again from the bottom upwards until reaching the height of the liquid outlet 140, at this time, the acid etching solution flows out from the liquid outlet 140, and the circulation of the acid etching solution is completed.

By arranging the first accommodating cavity 101 of the first groove body 100, the pipe fitting 9 is independently arranged in the semi-closed first accommodating cavity 101, so that the influence of other pipe fittings 9 on the acid etching effect of the pipe fitting 9 is effectively isolated. When a plurality of pipe fittings 9 are required to be subjected to acid etching at the same time, the pipe fittings 9 are directly and independently placed in the first accommodating cavity 100 of one first groove body 100, the volume of each first accommodating cavity 100 and the flow rate of the acid etching liquid flowing into the first accommodating cavity 100 from the flow divider 120 are designed in advance, so that the acid etching liquid is prevented from being mixed, and the acid etching effect is good. When only a single or a small number of pipe fittings 9 need to be subjected to acid etching, the pipe fittings 9 are independently placed in the first accommodating cavity 100 of the first tank body 100, a plurality of first tank bodies 100 are empty, acid etching liquid is pumped by the liquid pumping pump 30 and is sent into the liquid inlet 130 under a certain pressure, the acid etching liquid passes through the flow divider 120 and is distributed into each first tank body 100, the acid etching liquid in each first tank body 100 cannot interfere with each other, the acid etching liquid in each first tank body 100 can be used for carrying out acid etching on one pipe fitting 9, the condition that a plurality of pipe fittings 9 or single pipe fitting 9 can accept the acid etching liquid under the same condition is ensured, and the acid etching effect is uniform.

In one possible embodiment, as shown in fig. 1, the acid etching system includes a transition device 80, wherein the transition device 80 is in communication between the liquid storage device 20 and the liquid outlet 140, for filtering the acid etching liquid flowing from the liquid outlet 140. It will be appreciated that when the acid etching solution flowing out of the liquid outlet 140 flows through the transition device 80, the acid etching solution can be filtered, and then flows into the transition device 80, so that some impurities in the acid etching solution after the pipe fitting 9 is etched can be removed, the stability of the acid etching solution components can be maintained, the acid etching solution after the acid etching flows into the liquid storage device 20 from the transition device 80, specifically, the transition device 80 includes a transition tank, and it will be appreciated that the transition device 80 may also include a transition tank and other containers capable of containing the acid etching solution.

Referring to fig. 1, a filter 81 is connected to an inlet of the transition device 80, and an acid etching liquid flowing out of the liquid outlet 140 passes through the filter 81, so that the acid etching liquid can be filtered, and then flows into the transition device 80, so that some impurities in the acid etching liquid after the pipe fitting 9 is acid etched can be removed, and the stability of the components of the acid etching liquid is maintained.

In one possible embodiment, as shown in FIG. 1, the acid etch system includes a fluid replacement device 90, the fluid replacement device 90 being in communication with the transition device 80. The acid etching agent is replenished to the transition device 80 through the fluid replenishing device 90, specifically, the fluid replenishing device 90 comprises a fluid replenishing pipe, the fluid replenishing pipe is communicated with the top of the transition tank, the acid etching agent flows into the transition tank through the fluid replenishing pipe, wherein when the component deviation in the acid etching agent exceeds 5%, the acid etching agent is replenished through the fluid replenishing pipe, and the acid etching agent after the acid etching agent replenishment flows into the liquid storage device 20 from the transition tank.

In one possible embodiment, as shown in fig. 1, the acid etching system comprises a monitoring device 10, wherein the monitoring device 10 is positioned in a liquid storage device 20; the change of the components of the acid etching liquid in the liquid storage device 20 can be monitored in real time, and when the effective components of the acid etching liquid in the liquid storage device 20 do not meet the requirements, all the acid etching liquid is replaced, so that the change of the components of the acid etching liquid in the liquid storage device 20 can be monitored in real time through the monitoring device 10, the stability of the components of the acid etching liquid can be maintained, and the stability of the acid etching can be improved. Specifically, the monitoring device 10 includes an F-monitor 10b and a pH monitor 10a, the F-monitor being capable of detecting the concentration of fluoride ions, the pH monitor 10a being capable of detecting the pH.

In one possible embodiment, as shown in FIG. 1, an acid etch system includes a monitoring device 10, the monitoring device 10 being located within a transition device 80; the change in the composition of the acid etch within the transition device 80 can be monitored in real time,

when the monitoring result of the monitoring device 10 shows that the component deviation of the acid etching solution in the transition device 80 exceeds 5%, the acid etching agent is replenished through the fluid replenishing pipe of the fluid replenishing device 90, so that the change of the component of the acid etching solution in the transition device 80 can be monitored in real time by the monitoring device 10, the acid etching agent can be timely replenished in the transition device 80, the flow rate and the component of the acid etching solution can be controlled, and the stability of acid etching can be further improved. Specifically, the monitoring device 10 includes an F-monitor 10b and a pH monitor 10a, the F-monitor being capable of detecting the concentration of fluoride ions, the pH monitor 10a being capable of detecting the pH.

In one possible embodiment, as shown in fig. 1, the acid etching system includes a filter device 50, the filter device 50 being removably connected between the reservoir 20 and the inlet 130. The filtering device 50 is used for filtering the acid etching solution to be flowed into the solution inlet 130 from the solution storage device 20, so that the stability of the acid etching solution component can be ensured.

The filter device 50 and the filter 81 of the transition device 80 can respectively filter the acid etching liquid flowing into the liquid inlet 130 and the acid etching liquid flowing out of the liquid outlet 140, so that the components of the acid etching liquid in the circulating process are kept stable and pure, and the acid etching effect is good and stable.

In one possible embodiment, as shown in fig. 1 to 5, the diverter 120 includes a partition 122 and a plurality of sets of liquid spraying units 121 uniformly distributed on the partition 122. The partition 122 is horizontally installed at the bottom end of the second tank 110. The first tank 100 is provided on the liquid spraying unit 121 to form a first accommodating chamber 101 for accommodating the acid etching liquid and the pipe. The liquid spraying unit 121 can equalize the flow rates of the acid etching liquid on the inner and outer surfaces of the pipe member 9.

Specifically, the bottom end of the second tank 110 is opened, and a partition 122 is disposed at the bottom end of the second tank 110 to form a semi-closed second receiving chamber 111; the second accommodation chamber 111 accommodates the acid etching solution and the first tank 100. The second tank 110 may be a transparent plastic pipe, such as an acrylic pipe, which is corrosion resistant and easy to observe. The partition 122 is detachably connected with the liquid spraying unit 121, for example, by bolting or clamping, and the partition 122 and the liquid spraying unit 121 can be fixedly connected by welding. The partition 122 and the spray unit 121 may be made of corrosion-resistant metal, and a seepage-proof and corrosion-proof material is coated on the surfaces. The partition 122 and the liquid spraying unit 121 may also be made of plastic, such as acrylic material.

A plurality of liquid spraying units 121 can be arranged on one partition plate 122, 4-20 liquid spraying units 121 can be arranged on one partition plate 122 according to the size of the second tank body 110 and the size of the first tank body 100, each liquid spraying unit 121 corresponds to one first tank body 100, the pipe fitting 9 can be respectively placed into the first accommodating cavity 101 of the first tank body 100 according to the requirement, and acid etching liquid flowing in from the liquid inlet 130 enters the first accommodating cavity 101 through the flow divider 120, overflows from the first accommodating cavity 101 to flow into the second accommodating cavity 111 and flows out from the liquid outlet 140.

In a possible embodiment, as shown in fig. 1 to 5, the liquid ejecting unit 121 includes a body 1221, and an inner liquid flow passage 123 and an outer liquid flow passage 124 provided on the body 1221. The inner fluid channel 123 is used for plugging and fixing the bottom end of the pipe 9, the first tank body 100 is disposed on the body 1221, the area of the body 1221 between the first tank body 100 and the pipe 9 is a limited area, and the outer fluid channel 124 is disposed in the limited area. The liquid inlets 130 are respectively communicated with the outer liquid flow channel 124 and the inner liquid flow channel 123. The acid etching solution in the liquid storage device 20 flows into the liquid inlet 130 through the liquid drawing pump 30, and the acid etching solution flowing in from the liquid inlet 130 enters the first accommodating cavity 101 through the outer liquid flow channel 124 and the inner liquid flow channel 123 so as to be respectively contacted with the inner surface and the outer surface of the pipe fitting 9.

The body 1221 may be a cylinder or a polygonal cylinder with a certain thickness, and may be made of plastic, such as acryl material, or corrosion-resistant metal, and may be coated with an anti-seepage and anti-corrosion material. The top end surface 122a of the body 1221 facing the pipe member 9 may be a conical surface, so that burrs of the top end surface 122a are reduced, noise from the acid etching solution is small, and the flow rate is stable.

The inner liquid flow channel 123 penetrates the body 1221 along the vertical direction, and the bottom end of the pipe fitting 9 is inserted into the inner liquid flow channel 123 so as to realize the fixation of the bottom end; the inner diameter size and shape of the inner flow channel 123 should be adapted to the inner diameter size and shape of the pipe member 9. That is, the shape of the pipe fitting 9 and the shape of the inner liquid channel 123 should be the same or similar, and the joint of the pipe fitting 9 and the inner liquid channel 123 should have no oversized gap; the inner diameter of the inner flow channel 123 and the inner diameter of the tube 9 should be sized so that they are in mating abutment. Referring to fig. 4, the inner liquid flow channel 123 may have an inner step 123a, and the bottom end of the pipe 9 is inserted into the inner liquid flow channel 123 and abuts against the inner step 123a to achieve a limit in the vertical direction. Referring to fig. 5, a top end surface 122a of the body 1221 is formed with a raised step 122b, and a bottom end of the pipe 9 is sleeved on an outer side of the raised step 122b and abuts against the top end surface 122a to achieve limiting along a vertical direction.

The pipe member 9 is generally a circular pipe, so the inner liquid flow passage 123 is generally a circular through hole, and if the pipe member 9 is a square pipe, the inner liquid flow passage 123 is also a square through hole correspondingly.

The inner flow channel 123 may be disposed in the middle of the body 1221. The area of the body 1221 between the first tank 100 and the pipe 9 is a defined area, and the outer liquid flow passage 124 is provided in the defined area. One liquid spraying unit 121 may have a plurality of outer liquid flow channels 124, and the plurality of outer liquid flow channels 124 may be one or more of circular holes, kidney-shaped holes, or square holes. In order to equalize the flow rate of the etching solution around the outer surface of the pipe member 9, a plurality of outer liquid flow passages 124 should be circumferentially uniformly distributed around the inner liquid flow passage 123.

The first tank 100 is provided on the body 1221. Referring to fig. 4, the body 1221 may be formed with a positioning step 122c, and the first groove 100 is sleeved on the first groove 100 and abuts against the positioning step 122 c. Referring to fig. 5, the first groove 100 may be sleeved on the outer peripheral side of the body 1221, and the two may be fastened by screwing, bonding, welding, or clamping.

During the flow of the acid etching solution, the acid etching solution in the liquid storage device 20 is pumped by the liquid pump 30 to flow into the liquid inlet 130, and the acid etching solution entering from the liquid inlet 130 flows into the first accommodating cavity 101 through the flow divider 120, wherein part of the acid etching solution flows into the space area between the first groove body 100 and the pipe fitting 9 from the outer liquid flow channel 124, flows from bottom to top, thereby performing acid etching on the outer surface of the pipe fitting 9, and the other part of the acid etching solution flows into the inner cavity of the pipe fitting 9 from the inner liquid flow channel 123, flows from bottom to top, thereby performing acid etching on the inner surface of the pipe fitting 9; thereby, the etching solution on the inner and outer surfaces of the pipe member 9 is contained in the first containing chamber 101, and overflows from the first containing chamber 101 to flow into the second containing chamber 111.

Along with the progress of the acid etching process, the acid etching solution in the liquid storage device 20 is continuously pumped into the first accommodating cavity 101 through the liquid pumping pump 30, overflows from the first accommodating cavity 101 and flows into the second accommodating cavity 111, the liquid level of the acid etching solution in the second accommodating cavity 111 is continuously increased until reaching the level of the liquid outlet 140, and therefore the acid etching solution can flow out of the liquid outlet 140 and return to the liquid storage device 20 through the transition device 80, and circulation of the acid etching solution is completed.

The inner and outer surfaces of the tube 9 are both subjected to acid etching during the cycle described above. The bubbles generated by acid etching move from bottom to top under the action of buoyancy, finally float out into the first accommodating cavity 101 along with the acid etching liquid from the top end of the pipe fitting 9 and then enter the second accommodating cavity 111, so that the movement direction of the bubbles generated by acid etching is consistent with the flow direction of the acid etching liquid, namely, the bubbles move from bottom to top along the vertical direction, the bubbles are prevented from being blocked in the inner cavity of the pipe fitting 9 to block the flow of the acid etching liquid, and the acid etching effect of the inner surface and the outer surface of the pipe fitting 9 is ensured.

The liquid spraying unit 121 can equalize the flow rates of the acid etching liquid on the inner and outer surfaces of the pipe member 9. Specifically, the cross-sectional area of the outer liquid flow passage 124 may be designed to be equal to the cross-sectional area of the inner liquid flow passage 123; the cross-sectional area of the defined area is equal to the cross-sectional area of the tube 9. Thus, the acid etching liquid in the liquid storage device 20 flows into the liquid inlet 130 under suction of the liquid pump 30, and then is distributed to each first tank body 100 through each liquid spraying unit 121 of the flow divider 120, the acid etching liquid in each first tank body 100 is not interfered with each other, the acid etching liquid in each first tank body 100 flows to the outer surface and the inner surface of the pipe fitting 9 through the outer liquid flow channel 124 and the inner liquid flow channel 123 respectively under the condition of equal initial pressure and flow velocity, the velocity v1 of the acid etching liquid flowing in the inner cavity of the pipe fitting 9 in the vertical direction, the velocity v2 of the acid etching liquid flowing in the cavity area between the pipe fitting 9 and the first tank body 100 in the vertical direction is ensured to be uniform by ensuring that the cross sectional area of the outer liquid flow channel 124 is equal to the cross sectional area of the inner liquid flow channel 123, and controlling the cross sectional area of the limiting area is equal to the cross sectional area of the pipe fitting 9 so that v1 is equal to v2, and finally, the inner surface and outer surface of each pipe fitting 9 can receive the acid etching liquid at the same flow velocity to perform acid etching, and uniform acid etching effect is ensured.

In one possible embodiment, the etching apparatus 200 may further include a sensor (not shown) capable of testing the flow rate of the etching solution in the first receiving chamber 100. Specifically, the sensor may be disposed on the inner wall of the first tank body 100 or in the outer liquid flow passage 124 of the liquid spraying unit 121 to detect the flow velocity v1 of the acid etching liquid on the outer surface of the pipe member 9; the sensor may also be disposed in the inner liquid flow channel 123 of the liquid spraying unit 121 to detect the flow velocity v2 of the acid etching liquid on the inner surface of the pipe fitting 9, and when the detection v1 is unequal to the detection v2, a signal is sent to remind the operator to adjust in time, so as to ensure that the acid etching effect on the inner and outer surfaces of the pipe fitting 9 is uniform.

In one possible embodiment, as shown in fig. 1, the acid etching system includes a temperature control device 150, where the temperature control device 150 is capable of stabilizing the temperature of the acid etching solution.

The temperature of the acid etching liquid flowing in the acid etching system is controlled, on one hand, the temperature of the inner and outer surfaces of the pipe 9 in the first accommodating cavity 101 can be kept constant when the acid etching is performed, and further uniformity of the acid etching can be improved, on the other hand, the acid etching liquid can be kept at a set temperature after flowing into the liquid inlet 130 and flowing out of the liquid outlet 140, and the acid etching liquid component is prevented from being changed when the temperature is too low, so that stability of the acid etching liquid is ensured.

In one possible embodiment, as shown in fig. 1, the temperature control device 150 includes a first heating device 150a, where the first heating device 150a is used to heat the etching solution in the second accommodating cavity 111, so as to ensure that the temperature of the etching solution in the first accommodating cavity 101 is kept constant during etching, and further improve uniformity of etching, and specifically, the first heating device 150a is used to heat the etching solution in the second accommodating cavity 111, and heat is transferred to the first accommodating cavity 101 to control the temperature of the etching solution in the first accommodating cavity 101 to be stable at 30-50 ℃.

The first heating device 150a may be an electrical heating device, such as a resistance wire heater.

The first heating device 150a may be a water bath circulation heating device, and the first heating device 150a is enclosed on the periphery of the second tank 110; the first heating means 150a includes a water bath inlet 152 and a water bath outlet 153 in communication with each other; the water bath liquid circulates through the water bath inlet 152 and the water bath outlet 153 under the driving of the water pump 151, and the heater 154 is connected in series on the pipeline of the water pump 151 to heat the water. So that the acid etching solution in the second accommodating cavity 111 is at a proper temperature, and the acid etching solution in the second accommodating cavity 111 transfers heat to the acid etching solution in the first accommodating cavity 101, so that the temperature of the acid etching solution circulating through the liquid inlet 130 and the liquid outlet 140 is gradually kept at a proper acid etching temperature, and the acid etching solution at the acid etching temperature performs acid etching on the pipe fitting 9, thereby ensuring good acid etching effect. In the heating process of the first heating device 150a, when the pipe fitting 9 in any one of the first tanks 100 is mounted and dismounted, the first heating device 150a is not required to be closed, and acid etching of other pipe fittings 9 can be not affected.

In one possible embodiment, the temperature control device 150 includes a second heating device (not shown) for heating the acid etching solution in the liquid storage device 20; the acid etching liquid in the liquid storage device 20 can be kept at a set temperature, and the component of the acid etching liquid is prevented from being changed when the temperature is too low, so that the stability of the acid etching liquid is ensured.

The second heating means may be an electrical heating means, such as a resistance wire heater.

The second heating device may also be a water bath circulation heating device, and the water bath circulation heating device is installed on the outer wall of the liquid storage device 20 to heat the acid etching liquid in the liquid storage device 20, so that the acid etching liquid in the liquid storage device 20 can be ensured to be kept at a set temperature, and the water bath circulation heating device is located on the outer wall of the liquid storage device 20 and does not influence the acid etching liquid in the liquid storage device 20 and the flow of the acid etching liquid.

In one possible embodiment, as shown in fig. 1, the temperature control device 150 includes a third heating device 70, where the third heating device 70 is located between the liquid inlet 130 and the liquid pump 30, and is used to heat the acid etching solution entering the diverter 120.

Thus, the acid etching solution entering the liquid inlet 130 can be kept at a set temperature, on one hand, the temperature of the acid etching solution to be entering the liquid inlet 130 can be close to the temperature of the acid etching solution in the first accommodating cavity 101, so that the stability of the temperature of the acid etching solution in the first accommodating cavity 101 can be kept, further, the uniformity of acid etching on the inner surface and the outer surface of the pipe fitting 9 can be improved, and on the other hand, the stability of the components of the acid etching solution can be kept.

The third heating device 70 is a water bath circulation heating device or an electric heating device, and when the temperature deviation of the acid etching solution between the liquid inlet 130 and the liquid drawing pump 30 exceeds a certain value, for example, 2 ℃, the third heating device 70 is started to perform auxiliary heating so as to ensure the stability of the temperature of the acid etching solution.

In one possible embodiment, as shown in fig. 1 to 5, the pickling device 200 includes a fixing portion 160 for fixing the top end of the pipe member 9, and the fixing portion 160 is fixed to the end of the first accommodating chamber 101 remote from the flow divider 120. The fixing portion 160 may be connected to the first accommodating chamber 101 by a clamping connection or a bolt connection.

Specifically, the fixing portion 160 includes a barrel 161 through which the pipe 9 can pass, and a plurality of support rods 162 extending radially outward from the outside of the barrel 161; the support bar 162 can be supported on the inner wall of the first tank 100. The outer diameter of the tube 9 corresponds to the inner diameter of the barrel 161, preferably the tube 9 can be inserted into the barrel 161 without wobble.

The top end of the pipe fitting 9 is positioned through the fixing part 160, the bottom end of the pipe fitting 9 is positioned through the inner liquid flow channel 123, so that the slender pipe fitting 9 is positioned, the pipe fitting 9 is ensured to be concentric with the first accommodating cavity 100 as much as possible and vertically arranged, namely, the pipe fitting 9 is enabled to be overlapped with the central axis of the vertically arranged first groove body 100 through the fixing part 160 and the inner liquid flow channel 123, the concentration distribution of the acid etching liquid on the inner surface and the outer surface of the pipe fitting 9 is enabled to be uniform as much as possible, the inner cavity of the pipe fitting 9 is prevented from being blocked by bubbles generated by acid etching inside the pipe fitting 9, and the acid etching liquid is ensured to uniformly react with the pipe fitting 9.

In one possible embodiment, as shown in fig. 1, the second tank 110 includes an opening communicating with the second receiving chamber 111 and a tank cover 112 covering the opening, and the tank cover 112 has an exhaust valve 113 thereon.

Through setting up the capping 112 on the opening, prevent that the acid etching liquid from spilling over or volatilizing, simultaneously, form discharge valve 113 on capping 112, more be favorable to the effective discharge of bubble that the acid etching in-process produced, and then improve the acid etching effect of pipe fitting 9.

In addition, the upper ends of the liquid storage device 20 and the transition device 80 are provided with sealing covers 21 to form a seal for reducing volatilization of acid etching liquid in the acid etching station (10), and meanwhile, the sealing covers 21 are provided with exhaust valves 22 for exhausting gas in the liquid storage device 20 and the transition device 80, that is, the acid etching system of the embodiment of the application keeps sealing, so that volatilization of the acid etching liquid can be reduced, and stability and uniformity of acid etching liquid components are improved.

In a specific acid etching process embodiment, the acid etching system of the embodiment of the application is utilized to carry out acid etching on the pipe fitting 9 with large length-diameter ratio, for example, the pipe fitting 9 to be acid etched with the inner diameter of 8mm and the length-diameter ratio of 1000, and the acid etching solution comprises 0.2mL/L sulfuric acid and 9mg/L hydrogen fluoride. Before the acid etching, the acid etching liquid is heated by the first heating device 150a, the second heating device and the third heating device 70, when the temperature is stabilized at 29-31 ℃, the flow rate of the acid etching liquid is controlled at 5L/min by the flow control device 60, and then the pipe fitting 9 is inserted into the first accommodating cavity 101 for acid etching. The overflowed acid etching liquid after reaction flows into the second accommodating cavity 111 and flows out from the liquid outlet 140, enters the transition device 80 for filtering and component monitoring, the F-monitor 10b and the pH monitor 10a which are arranged in the transition device 80 monitor the component change of the acid etching liquid in the transition device 80 in real time, when the component deviation in the acid etching liquid exceeds 5%, the acid etching agent is replenished through the liquid replenishing pipe of the liquid replenishing device 90, the acid etching liquid after replenishing the acid etching agent flows back to the liquid storing device 20 from the transition device 80, the F-monitor 10b and the pH monitor 10a are also arranged in the liquid storing device 20, and when the effective components of the acid etching liquid in the liquid storing tank do not meet the requirement, all the acid etching liquid is replaced.

And 5 batches of acid etching processes are repeated, and three sections of sampling analysis including front, middle and rear are carried out in the sample after the acid etching of the pipe 9, wherein the thickness of the acid etching layer is about 3 mu m, and the relative error is not more than 5%, so that the engineering requirement is met.

The various embodiments/implementations provided by the application may be combined with one another without contradiction.

The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An acid etching system, comprising:

the acid etching device (200), wherein the acid etching device (200) comprises at least one first groove body (100), a second groove body (110), a flow divider (120), a liquid inlet (130) and a liquid outlet (140);

the second tank body (110) is provided with a second accommodating cavity (111) for accommodating the acid etching solution and the first tank body (100); the diverter (120) is arranged at the bottom end of the second accommodating cavity (111); the first groove body (100) is arranged on the shunt (120) to form a first accommodating cavity (101) for accommodating acid etching liquid and a pipe fitting, and one end of the first accommodating cavity (101) away from the shunt (120) is opened; the liquid inlet (130) is communicated with the flow divider (120), and the liquid outlet (140) is communicated with the second accommodating cavity (111);

the liquid storage device (20) is respectively communicated with the liquid inlet (130) and the liquid outlet (140) and is used for storing the acid etching liquid;

a liquid pump (30) communicated between the liquid storage device (20) and the liquid inlet (130);

and a flow control device (60), wherein one end of the flow control device (60) is communicated with the liquid inlet (130), and the other end is communicated with the liquid pump (30);

the acid etching solution in the liquid storage device (20) flows into the liquid inlet (130) through the liquid suction pump (30), enters the first accommodating cavity (101) through the flow divider (120), overflows from the first accommodating cavity (101) to flow into the second accommodating cavity (111), and flows back to the liquid storage device (20) from the liquid outlet (140).

2. The acid etching system according to claim 1, characterized in that the acid etching system comprises a transition device (80), the transition device (80) being in communication between the liquid storage device (20) and the liquid outlet (140) for filtering the acid etching liquid flowing out from the liquid outlet (140).

3. The acid etching system according to claim 2, characterized in that the acid etching system comprises a fluid replacement device (90), the fluid replacement device (90) being in communication with the transition device (80).

4. An acid etching system according to claim 2, characterized in that the acid etching system comprises a monitoring device (10), the monitoring device (10) being located within the liquid storage device (20); and/or the number of the groups of groups,

the monitoring device (10) is located within the transition device (80).

5. The acid etching system according to claim 4, characterized in that the monitoring device (10) comprises an F-monitor and a pH monitor.

6. The acid etching system according to any one of claims 1 to 5, characterized in that the acid etching system comprises a filter device (50), the filter device (50) being detachably connected between the liquid storage device (20) and the liquid inlet (130).

7. The acid etching system according to any one of claims 1 to 5, wherein the flow divider (120) comprises a partition plate (122) and a plurality of sets of liquid spraying units (121) uniformly distributed on the partition plate (122);

the partition board (122) is horizontally erected at the bottom end of the second groove body (110);

the first groove body (100) is arranged on the liquid spraying unit (121) to form a first accommodating cavity (101) for accommodating the acid etching liquid and the pipe fitting;

the liquid spraying unit (121) can make the flow velocity of the acid etching liquid on the inner surface and the outer surface of the pipe equal.

8. The acid etching system according to claim 7, wherein the liquid spray unit (121) includes a body (1221), and an inner liquid flow passage (123) and an outer liquid flow passage (124) provided on the body (1221);

the inner liquid flow channel (123) is used for being inserted into the bottom end of the pipe fitting, the first groove body (100) is arranged on the body (1221), the body (1221) is defined by a region between the first groove body (100) and the pipe fitting, and the outer liquid flow channel (124) is arranged in the defined region;

the liquid inlet (130) is respectively communicated with the outer liquid flow channel (124) and the inner liquid flow channel (123);

the cross-sectional area of the outer liquid flow channel (124) is equal to the cross-sectional area of the inner liquid flow channel (123); the cross-sectional area of the defined area is equal to the cross-sectional area of the tube.

9. An acid etching system according to any one of claims 1 to 5, characterized in that the acid etching system comprises a temperature control device (150), the temperature control device (150) being capable of controlling the temperature of the acid etching liquid.

10. The acid etching system according to claim 9, characterized in that the temperature control device (150) comprises a first heating device (150 a), the first heating device (150 a) being adapted to heat the acid etching liquid in the second receiving chamber (111); and/or the number of the groups of groups,

the temperature control device (150) comprises a second heating device, and the second heating device is used for heating the acid etching liquid in the liquid storage device (20); and/or the number of the groups of groups,

the temperature control device (150) comprises a third heating device (70), and the third heating device (70) is positioned between the liquid inlet (130) and the liquid pumping pump (30) and is used for heating the acid etching liquid entering the flow divider (120).

11. The pickling system according to claim 10, wherein the first heating device (150 a) is a water bath circulation heating device; and/or the number of the groups of groups,

the second heating device is a water bath circulation heating device; and/or the number of the groups of groups,

the third heating device (70) is a water bath circulation heating device or an electric heating device.

12. An acid etching system according to any one of claims 1 to 5, characterized in that the acid etching device (200) comprises a fixing portion (160) for fixing the top end of the pipe, the fixing portion (160) being fixed at the end of the first accommodation chamber (101) remote from the flow divider (120).

13. The acid etching system according to any one of claims 1 to 5, characterized in that the second tank (110) comprises an opening communicating with the second accommodation chamber (111) and a tank cover (112) covering the opening, the tank cover (112) having an exhaust valve (113) thereon.