CN114633042B - Ball welding quality monitoring method, controller and system - Google Patents
Ball welding quality monitoring method, controller and system Download PDFInfo
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- CN114633042B CN114633042B CN202210541947.8A CN202210541947A CN114633042B CN 114633042 B CN114633042 B CN 114633042B CN 202210541947 A CN202210541947 A CN 202210541947A CN 114633042 B CN114633042 B CN 114633042B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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Abstract
The invention discloses a ball welding quality monitoring method, a controller and a system, wherein the ball welding quality monitoring method comprises the following steps: obtaining a ball bonding analysis request, wherein the ball bonding analysis request comprises a gold ball identifier; acquiring all ball bonding sampling data corresponding to the gold ball identification, which are acquired within target monitoring time, from a synchronous dynamic memory; and forming a ball bonding quality analysis result based on all ball bonding sampling data. According to the technical scheme, the ball bonding controller can comprehensively and accurately analyze the ball bonding quality problem when the ball bonding quality problem occurs, and the ball bonding quality is ensured.
Description
Technical Field
The invention relates to the technical field of ball bonding, in particular to a ball bonding quality monitoring method, a controller and a system.
Background
The chip ball bonding technology is the most basic and dominant interconnection technology for realizing chips in electronic packaging. In the chip ball bonding technology, the process of gold wire balling occupies an important link in the process of bonding a wire bonding machine. The size, shape, surface oxidation pollution condition, hardness and the like of a ball formed in the gold wire balling process directly determine the bonding quality and reliability of a ball bonding point, so that obtaining a smooth ball with good sphericity and consistent size without oxidation in the ball bonding process is one of important conditions for obtaining a welding point with excellent performance.
However, in the existing chip ball bonding technology, only data of a ball formed at last in a ball bonding process can be monitored, and when the ball bonding quality problem occurs, the ball bonding quality problem cannot be analyzed through the data in the ball bonding process.
Disclosure of Invention
The embodiment of the invention provides a ball bonding quality monitoring method, a controller and a system, which aim to solve the problem that the ball bonding quality problem cannot be analyzed when the ball bonding quality problem occurs.
A ball welding quality monitoring method comprises the following steps:
obtaining a ball bonding analysis request, wherein the ball bonding analysis request comprises a gold ball identifier;
acquiring all ball bonding sampling data corresponding to the gold ball identification, which are acquired within target monitoring time, from a synchronous dynamic memory;
and forming a ball bonding quality analysis result based on all the ball bonding sampling data.
Further, before the obtaining the ball bond analysis request, the ball bond quality monitoring method further includes:
collecting welding data of a target gold ball corresponding to the gold ball identification to form the ball welding sampling data;
and storing the ball welding sampling data in a synchronous dynamic memory in a first-in first-out mode.
Further, the collecting the welding data of the target gold ball corresponding to the gold ball identifier to form ball welding sampling data includes:
collecting first sampling data in real time when a target gold ball corresponding to the gold ball identifier is welded;
performing noise reduction processing on the first sampling data to obtain second sampling data;
and performing ADC conversion processing on the second sampling data to obtain the ball bonding sampling data.
Further, after collecting the welding data of the target gold ball corresponding to the gold ball identifier and forming ball welding sampling data, the ball welding quality monitoring method further includes:
comparing the ball bonding sampling data with a preset alarm threshold value to determine whether the ball bonding sampling data is abnormal or not;
and if the ball bonding sampling data is abnormal, generating abnormal alarm information, storing the abnormal alarm information and the ball bonding sampling data in the synchronous dynamic memory in a correlation manner, and performing alarm operation based on the abnormal alarm information so as to trigger the ball bonding analysis request.
Further, the performing an alarm operation based on the abnormality alarm information so as to trigger the ball bonding analysis request includes:
and based on the abnormal alarm information, controlling the motion control system to stop bonding operation and controlling the alarm prompt lamp to work.
Further, the obtaining, from the synchronous dynamic memory, all ball bonding sampling data corresponding to the gold ball identifier and collected within a target monitoring time includes:
determining an initial time according to the current time and a preset monitoring time;
and acquiring all ball bonding sampling data corresponding to the gold ball identification, which are acquired between the starting time and the current time, from the synchronous dynamic memory.
Further, each of the ball bonding sampling data corresponds to a sampling time, and the forming of the ball bonding quality analysis result based on all the ball bonding sampling data includes:
aligning clock signals of the sampling time of all the ball bonding sampling data to obtain standard sampling data;
forming a sampled data image based on all of the standard sampled data;
and controlling a vision system to carry out ball welding quality analysis on the sampling data image to obtain a ball welding quality analysis result.
Further, the control vision system performs ball bonding quality analysis on the sampled data image to obtain a ball bonding quality analysis result, including:
and controlling the vision system to compare standard sampling data in the sampling data image with a standard quality threshold value to obtain a ball welding quality analysis result.
A ball welding controller comprises a memory, a processor and a quality monitoring program which is stored in the memory and can run on the processor, and is characterized in that the ball welding quality monitoring method is realized when the processor executes the quality monitoring program.
A ball welding quality monitoring system comprises a target terminal and an EFO system; the EFO system comprises a synchronous dynamic memory and the ball bonding controller, wherein the ball bonding controller is connected with the target terminal and the synchronous dynamic memory.
According to the ball bonding quality monitoring method, the ball bonding controller and the ball bonding quality monitoring system, the ball bonding controller firstly obtains a ball bonding analysis request, the ball bonding analysis request comprises the gold ball identification, then all ball bonding sampling data corresponding to the gold ball identification and collected in the target monitoring time are obtained from the synchronous dynamic memory, the obtained ball bonding sampling data are more comprehensive and more reliable, and finally, a ball bonding quality analysis result is formed based on all ball bonding sampling data, so that when the ball bonding quality problem occurs, the ball bonding controller can comprehensively and accurately analyze the ball bonding quality problem, and the ball bonding quality is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a flow chart of a ball bond quality monitoring method in accordance with one embodiment of the present invention;
FIG. 2 is a flow chart of the present invention prior to step S101 in FIG. 1;
FIG. 3 is a flowchart of step S201 in FIG. 2 according to the present invention;
FIG. 4 is a flowchart of the present invention after step S201 of FIG. 2;
FIG. 5 is a flowchart of step S102 of FIG. 1 according to the present invention;
FIG. 6 is a flowchart of step S103 of FIG. 1 according to the present invention;
FIG. 7 is a schematic view of a ball bond quality monitoring system in accordance with an embodiment of the present invention;
FIG. 8 is a schematic diagram of a ball bonding controller in accordance with an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The ball bonding quality monitoring method provided by the embodiment of the invention can be applied to a ball bonding quality monitoring system shown in fig. 7. Specifically, the ball bonding quality monitoring system comprises a target terminal 10 and an EFO system 20, wherein the EFO system 20 comprises a synchronous dynamic memory 21, a ball bonding controller 22 and a ball bonding device 23; the synchronous dynamic memory 21 is used for synchronously refreshing and storing ball bonding sampling data in the ball bonding process, and the ball bonding controller 22 is used for controlling the ball bonding equipment 23 to perform ball bonding and monitoring the ball bonding quality so as to analyze the ball bonding problem when the ball bonding problem occurs in the ball bonding process and ensure the ball bonding quality. The target terminal 10 includes, but is not limited to, various personal computers, notebook computers, smart phones, tablet computers, and portable wearable devices.
In one embodiment, as shown in fig. 1, a method for monitoring the quality of a ball bond is provided, which is illustrated by way of example in the ball bond controller 22 of fig. 7, and comprises the following steps:
s101: and obtaining a ball bonding analysis request, wherein the ball bonding analysis request comprises a gold ball identifier.
The ball bonding analysis request is a request for analyzing a ball bonding problem in the ball bonding equipment 23. The gold ball mark refers to a mark corresponding to a solder ball soldered by the ball soldering device 23. The solder ball bonded by the ball bonding device 23 is formed by a gold bonding wire. The gold ball identifier may be a wire number of a solder ball.
As an example, the ball bonding analysis request may be triggered by the target terminal 10, and the target terminal 10 sends the ball bonding analysis request to the ball bonding controller 22, so that the ball bonding controller 22 monitors and analyzes the ball bonding quality in the subsequent steps according to the ball bonding analysis request. Optionally, the target terminal 10 may issue a ball bonding analysis request to the ball bonding controller 22 through a high-speed internet access communication protocol, so as to improve the efficiency of ball bonding quality monitoring.
Optionally, the EFO system 20 may also include an alarm system 30, the alarm system 30 being configured to alarm when an anomaly occurs in the ball bonding process. Alternatively, the warning operation may be to prompt the user for an abnormality in the ball bonding process. Therefore, the user can trigger the ball bonding analysis request through the target terminal 10 in time so as to analyze the ball bonding problem and ensure the ball bonding quality.
S102: all ball bonding sample data corresponding to the gold ball identifier collected within the target monitoring time are obtained from the synchronous dynamic memory 21.
The synchronous dynamic memory 21 is a memory independent from the ball bonding controller 22. The synchronous dynamic memory 21 is a memory capable of performing data refresh for a long time or performing cyclic refresh of data. Preferably, the synchronous dynamic memory 21 is an SDRAM memory, which has a larger memory, can store more data, and has a power-off saving characteristic, compared to the RAM memory provided in the ball bonding controller 22 itself. The target monitoring time refers to monitoring time for monitoring the ball bonding process of the ball bonding equipment 23, and can be configured in a user-defined manner according to actual requirements. Ball bond sampling data refers to data collected during the ball bonding process. Optionally, the ball bonding sample data includes, but is not limited to, a target current and a target voltage output by the ball bonding apparatus 23. The target current is a current for performing ball bonding. The target voltage is a voltage corresponding to the target current.
As an example, after obtaining the ball bonding analysis request, the ball bonding controller 22 obtains all the ball bonding sampling data corresponding to the gold ball identifier collected in the target monitoring time from the synchronous dynamic memory 21. In this example, since in the related art, limited by the RAM memory of the ball bonding controller 22, the ball bonding sample data that can be stored is limited, only one piece of ball bonding sample data can be stored, and the stored ball bonding sample data is easily lost when power is unexpectedly turned off, the ball bonding quality problem cannot be analyzed when the ball bonding quality problem occurs. In order to solve the above problem, the ball bonding controller 22 in this example obtains all the ball bonding sampling data corresponding to the gold ball identifier collected in the target monitoring time from the synchronous dynamic memory 21 independent of the ball bonding controller 22 after obtaining the ball bonding analysis request, and since the synchronous dynamic memory 21 can store more ball bonding sampling data than the RAM memory in the solder controller itself, the ball bonding controller 22 obtains all the ball bonding sampling data corresponding to the gold ball identifier collected in the target monitoring time from the synchronous dynamic memory 21, and obtains all the ball bonding sampling data corresponding to the gold ball identifier collected in the target monitoring time from all the ball bonding sampling data corresponding to the gold ball identifier collected in the target monitoring time, the obtained ball bonding sampling data is more comprehensive and more reliable, so that the ball bonding controller 22 can analyze the ball bonding quality problem more comprehensively and accurately in the subsequent steps, the ball bonding quality is ensured.
S103: and forming a ball bonding quality analysis result based on all ball bonding sampling data.
The ball bonding quality analysis result refers to an analysis result obtained by analyzing ball bonding sampling data.
As an example, the ball bonding controller 22 forms a ball bonding quality analysis result based on all the ball bonding sampling data after acquiring all the ball bonding sampling data corresponding to the gold ball identifier collected in the target monitoring time from the synchronous dynamic memory 21. Alternatively, the ball bonding controller 22 may analyze the ball bonding sample data based on all the ball bonding sample data by using a preset quality analysis logic to form a ball bonding quality analysis result. The preset quality analysis logic is analysis logic capable of analyzing ball bonding sampling data to form a ball bonding quality analysis result. In this example, the ball bonding controller 22 forms a ball bonding quality analysis result based on all ball bonding sampling data, so that when a ball bonding quality problem occurs, the ball bonding quality problem can be analyzed to ensure the ball bonding quality.
In this embodiment, the ball bonding controller 22 first obtains a ball bonding analysis request including a gold ball identifier, and then obtains all ball bonding sampling data corresponding to the gold ball identifier, which are collected within a target monitoring time, from the synchronous dynamic memory 21, so that the obtained ball bonding sampling data are more comprehensive and more reliable, and finally, a ball bonding quality analysis result is formed based on all ball bonding sampling data, thereby enabling the ball bonding controller 22 to comprehensively and accurately analyze the ball bonding quality problem when the ball bonding quality problem occurs, and ensuring the ball bonding quality.
In one embodiment, as shown in fig. 2, before step S101, that is, before obtaining the ball bonding analysis request, the ball bonding quality monitoring method further includes:
s201: collecting the welding data of the target gold ball corresponding to the gold ball identification to form ball welding sampling data.
The target gold ball is a solder ball obtained by the ball bonding device 23 by bonding with a gold bonding wire. The ball bonding sampling data refers to the bonding data collected during the ball bonding process, i.e. the target gold ball bonding. The welding data includes, but is not limited to, a target current and a target voltage output by the ball bonding device 23.
As an example, the EFO system 20 further includes a sampling module, coupled to the ball bonding controller 22 and the ball bonding apparatus 23, for collecting bonding data for a target gold ball corresponding to the gold ball identification. Illustratively, before obtaining the ball bonding analysis request, the EFO system 20 receives a ball bonding control request of the target terminal 10, where the ball bonding control request is used to control the ball bonding controller 22 to output a ball bonding control signal to the ball bonding device 23, the ball bonding device 23 performs ball bonding according to the ball bonding control signal, and during the ball bonding process, the ball bonding controller 22 controls the sampling module to collect bonding data of the target gold ball corresponding to the gold ball identifier from the ball bonding device 23, so as to form ball bonding sampling data, so as to analyze the ball bonding quality problem when the ball bonding quality problem occurs.
Optionally, after collecting the welding data of the target gold ball corresponding to the gold ball identifier, the ball bonding controller 22 performs optimization processing on the welding data corresponding to the target gold ball to form ball bonding sampling data. Optionally, the optimization process includes, but is not limited to, filtering, denoising, signal amplifying, and signal converting the welding data to ensure the reliability and accuracy of the formed ball bonding sample data.
S202: the ball bond sample data is stored in the synchronous dynamic memory 21 in a first-in-first-out manner.
The first-in first-out mode is a storage mode of storing ball bonding sample data in the sdram 21, that is, the ball bonding sample data stored in the sdram 21 is first read by the ball bonding controller 22. Illustratively, after the ball bonding controller 22 obtains the ball bonding analysis request, the ball bonding controller 22 sequentially obtains the ball bonding sampling data corresponding to the gold ball identifier, which is collected within the target monitoring time, from the synchronous dynamic memory 21 in a first-in first-out order until the ball bonding controller 22 completely reads all the ball bonding sampling data of the synchronous dynamic memory 21, so that the problem that the ball bonding sampling data are stored in disorder, which causes that the ball bonding quality and the ball bonding sampling data cannot be in one-to-one correspondence can be avoided, and the accuracy of the ball bonding sampling data is improved.
In this embodiment, the welding data of the target gold ball corresponding to the gold ball identifier is collected first, the formed ball bonding sampling data is stored in the synchronous dynamic memory 21 in a first-in first-out manner, so that the problem that the ball bonding quality and the ball bonding sampling data cannot be in one-to-one correspondence due to the fact that the ball bonding sampling data are stored in a disordered manner can be avoided, the accuracy of the ball bonding sampling data is improved, and the ball bonding quality problem is analyzed when the ball bonding quality problem occurs.
Further, in order to ensure the safety of the ball bonding sample data, while the ball bonding sample data is stored in the synchronous dynamic memory 21, the ball bonding controller 22 generates a data backup request, which includes the ball bonding sample data, and transmits the data backup request to the vision system 11 of the target terminal 10, where the data backup request is used to instruct the vision system 11 to perform print backup on the ball bonding sample data.
In one embodiment, as shown in fig. 3, in step S201, collecting the bonding data of the target gold ball corresponding to the gold ball identifier, and forming ball bonding sampling data, includes:
s301: and when the target gold ball corresponding to the gold ball identification is welded, acquiring first sampling data in real time.
The first sampling data refers to welding data of a target gold ball corresponding to the gold ball identification.
As an example, the EFO system 20 also includes a sampling module that includes data acquisition circuitry for acquiring the first sampled data in real-time. Illustratively, before obtaining the ball bonding analysis request, the EFO system 20 receives a ball bonding control request of the target terminal 10, the ball bonding controller 22 outputs a ball bonding control signal to the ball bonding device 23 according to the ball bonding control request, the ball bonding device 23 performs ball bonding according to the ball bonding control signal, and during the ball bonding process, the ball bonding controller 22 controls a data acquisition circuit in the sampling module to acquire first sampling data in real time, so as to obtain ball bonding sampling data based on the first sampling data in a subsequent step.
S302: and carrying out noise reduction processing on the first sampling data to obtain second sampling data.
The second sampling data is data obtained by performing noise reduction processing on the first sampling data.
As an example, the sampling module in the EFO system 20 further includes a noise reduction circuit, and the noise reduction circuit is configured to perform noise reduction processing on the first sampled data to obtain the second sampled data. Illustratively, the noise reduction processing circuit may be a second-order low-pass filter circuit. In this example, the second sample data is acquired by performing noise reduction processing on the first sample data to improve the reliability of the second sample data.
S303: and performing ADC conversion processing on the second sampling data to obtain ball bonding sampling data.
As an example, the first sampling data is subjected to noise reduction processing to obtain second sampling data, and the second sampling data is subjected to ADC conversion processing to obtain ball bonding sampling data. In this example, since the first sampling data collected from the ball bonding apparatus 23 is analog signal data, the first sampling data is subjected to noise reduction processing, and the obtained second sampling data is also analog signal data, it is necessary to perform ADC conversion processing on the second sampling data, that is, to convert the analog signal data into digital signal data, even if the obtained ball bonding sampling data is digital signal data, so as to store the ball bonding sampling data in the synchronous dynamic memory 21.
In this embodiment, when a target gold ball corresponding to the gold ball identifier is welded, the first sampling data is collected in real time, noise reduction processing is performed on the first sampling data, the second sampling data is obtained, reliability of the second sampling data is improved, ADC conversion processing is performed on the second sampling data, and the ball bonding sampling data is obtained, so that the reliability of the ball bonding sampling data is ensured while the ball bonding sampling data is stored in the synchronous dynamic memory 21.
In an embodiment, as shown in fig. 4, after step S201, that is, after collecting the solder data of the target gold ball corresponding to the gold ball identifier, and forming the ball bonding sampling data, the ball bonding quality monitoring method further includes:
s401: and comparing the ball bonding sampling data with a preset alarm threshold value to determine whether the ball bonding sampling data is abnormal.
The preset alarm threshold is a self-defined threshold and is used for judging whether the ball bonding sampling data is abnormal or not.
As an example, the ball bonding quality monitoring system further includes an alarm system 30, after the ball bonding controller 22 collects the bonding data of the target gold ball corresponding to the gold ball identifier, and the formed ball bonding sampling data is formed, the ball bonding controller 22 sends the formed ball bonding sampling data to the alarm system 30, and the alarm system 30 compares the ball bonding sampling data with a preset alarm threshold to determine whether the ball bonding sampling data is abnormal or not, so as to prompt a user whether the ball bonding sampling data is abnormal or not, so that the user triggers a ball bonding analysis request through the target terminal 10, and controls the ball bonding controller 22 to analyze the ball bonding quality problem in time.
S402: and if the ball bonding sampling data is abnormal, generating abnormal alarm information, storing the abnormal alarm information and the ball bonding sampling data in the synchronous dynamic memory 21 in a correlation manner, and performing alarm operation based on the abnormal alarm information so as to trigger a ball bonding analysis request.
The abnormal alarm information refers to alarm information generated when the ball bonding sampling data is abnormal.
As an example, the ball bonding sampling data includes a target current and a target voltage, the preset alarm threshold includes an alarm current threshold and an alarm voltage threshold, and if the target current is greater than the alarm current threshold and/or the target voltage is greater than the alarm voltage threshold, the ball bonding sampling data has an abnormality. And if the target current is not greater than the alarm current threshold value and the target voltage is not greater than the alarm voltage threshold value, the ball welding sampling data has no abnormality.
As an example, if there is an abnormality in the ball bonding sample data, the alarm system 30 generates abnormality alarm information, stores the abnormality alarm information and the ball bonding sample data in the synchronous dynamic memory 21 in association, and performs an alarm operation based on the abnormality alarm information so as to trigger a ball bonding analysis request. In this example, the abnormality alarm information of the ball bonding controller 22 and the ball bonding sampling data are stored in the synchronous dynamic memory 21 in association, so that the corresponding ball bonding sampling data can be positioned according to the abnormality alarm information in the subsequent ball bonding quality problem analysis process, and the ball bonding sampling data can be specifically analyzed, thereby improving the accuracy of the ball bonding quality problem analysis.
In the embodiment, whether the ball bonding sampling data is abnormal or not is determined by comparing the ball bonding sampling data with a preset alarm threshold value, when the ball bonding sampling data is abnormal, abnormal alarm information is generated, the abnormal alarm information and the ball bonding sampling data are stored in the synchronous dynamic memory 21 in a related mode, so that the corresponding ball bonding sampling data can be positioned according to the abnormal alarm information in the subsequent ball bonding quality problem analysis process, the ball bonding sampling data is specifically analyzed, the accuracy of ball bonding quality problem analysis is improved, and alarm operation is performed based on the abnormal alarm information so as to trigger a ball bonding analysis request.
In one embodiment, in step S402, performing an alarm operation based on the abnormality warning information to trigger a ball bonding analysis request includes: based on the abnormal alarm information, the motion control system 231 is controlled to stop the bonding operation, and the alarm prompt lamp 232 is controlled to work.
The motion control system 231 is a system for controlling the ball bonding apparatus 23 to bond the gold bonding wire in the EFO system 20, i.e., the ball bonding operation. The alarm warning light is a warning light in the EFO system 20.
As an example, if there is an abnormality in the ball bonding sampling data, the alarm system 30 generates an abnormality alarm message and sends the abnormality alarm message to the ball bonding controller 22, and the ball bonding controller 22 controls the motion control system 231 to stop the bonding operation and controls the alarm lamp 232 to operate based on the abnormality alarm message, so as to prompt the user to trigger a ball bonding analysis request through the target terminal 10.
In this embodiment, the ball bonding controller 22 controls the motion control system 231 to stop bonding operation and controls the alarm lamp 232 to operate based on the abnormal alarm information, so that when a ball bonding quality problem occurs, the bonding operation is stopped in time to ensure reliability in the ball bonding process.
In one embodiment, as shown in fig. 5, in step S102, that is, from the synchronous dynamic memory 21, all the ball bonding sample data corresponding to the gold ball identifier collected in the target monitoring time are obtained, which includes:
s501: and determining the initial time according to the current time and the preset monitoring time.
The preset monitoring time is a time set by a user for monitoring the ball bonding equipment 23. The starting time is a historical time which is earlier than the current time and is separated from the current time by a preset monitoring time length.
In the present embodiment, the ball bonding controller 22 determines the start time according to the current time and the preset monitoring time, so as to read all ball bonding sampling data stored in the preset monitoring time in a cyclic refreshing manner in the subsequent steps, thereby avoiding the situations that the synchronous dynamic memory 21 is saturated in storage and ball bonding sampling data is lost, and improving the safety of the ball bonding sampling data.
S502: all ball bonding sample data corresponding to the gold ball identifier collected between the start time and the current time are obtained from the synchronous dynamic memory 21.
As an example, all the ball bonding sampling data corresponding to the gold ball identifier collected between the start time and the current time, that is, the ball bonding sampling data stored in the synchronous dynamic memory 21 within the preset monitoring time period, are obtained from the synchronous dynamic memory 21 in a first-in first-out manner.
In this embodiment, the ball bonding controller 22 determines the start time according to the current time and the preset monitoring time, and obtains all the ball bonding sampling data corresponding to the gold ball identifier, which is collected between the start time and the current time, from the synchronous dynamic memory 21, so that all the ball bonding sampling data stored in the preset monitoring time can be read in a cyclic refreshing manner, the situations that the synchronous dynamic memory 21 is saturated in storage and the ball bonding sampling data are lost are avoided, and the safety of the ball bonding sampling data is improved.
In one embodiment, as shown in fig. 6, in step S103, each ball bonding sample data corresponds to a sampling time, and a ball bonding quality analysis result is formed based on all ball bonding sample data, including:
s601: and aligning the clock signals of the sampling time of all the ball bonding sampling data to obtain standard sampling data.
Wherein, the sampling time refers to the time for collecting the ball bonding sampling data. The clock signal is the clock signal of the ball bond controller 22. The standard sampling data refers to ball bonding sampling data with sampling time aligned with a clock signal.
As an example, the ball bonding controller 22 performs clock signal alignment on the sampling time of all ball bonding sampling data to obtain standard sampling data, so that when analyzing the ball bonding quality problem, the specific situation of the ball bonding sampling data can be quickly located when the ball bonding quality problem occurs, which is beneficial to analyzing the ball bonding quality problem.
S602: based on all the standard sample data, a sample data image is formed.
The sample data image is a data image formed based on all standard sample data. For example, all standard sample data and clock signal aligned waveforms.
As an example, the ball bonding controller 22 performs clock signal alignment on the sampling times of all the ball bonding sampling data, and after acquiring the standard sampling data, forms a sampling data image based on all the standard sampling data, so as to analyze the ball bonding quality problem in the subsequent steps.
S603: and the control vision system 11 performs ball welding quality analysis on the sampling data image to obtain a ball welding quality analysis result.
The target terminal 10 includes a vision system 11, which is used to perform ball bonding quality analysis on the sampled data image and obtain a ball bonding quality analysis result.
As an example, the ball bonding controller 22 sends all the standard sampling data to the vision system 11 in the target terminal 10, and controls the vision system 11 to perform ball bonding quality analysis on the sampling data image to obtain a ball bonding quality analysis result. Illustratively, the ball bonding controller 22 controls the vision system 11 to perform ball bonding quality analysis on the sampled data image using preset image analysis logic to obtain a result of the ball bonding quality analysis.
In this example, the ball bonding controller 22 obtains the standard sampling data by performing clock signal alignment on the sampling time of all the ball bonding sampling data, forms a sampling data image based on all the standard sampling data, and finally controls the vision system 11 to perform ball bonding quality analysis on the sampling data image to obtain a ball bonding quality analysis result, so that when the ball bonding quality problem occurs, the ball bonding controller 22 can comprehensively and accurately analyze the ball bonding quality problem, and the ball bonding quality is ensured.
In one embodiment, as shown in fig. 7, in step S703, the control vision system 11 performs ball bond quality analysis on the sampled data image to obtain a result of ball bond quality analysis, including: the control vision system 11 compares the standard sampling data in the sampling data image with the standard quality threshold value to obtain the ball bonding quality analysis result.
As an example, the ball bonding controller 22 controls the vision system 11 to perform ball bonding quality analysis on the sampled data image by using a preset image analysis logic, so as to obtain a result of the ball bonding quality analysis. The preset image analysis logic is to control the vision system 11 to compare the standard sampling data in the sampling data image with the standard quality threshold value to obtain the ball bonding quality analysis result.
For example, a comparison is made as to whether a data parameter in each of the standard sample data, optionally including but not limited to a target current or a target voltage, is greater than a standard quality threshold. If the data parameter in the standard sampling data is larger than the standard quality threshold value, the ball welding quality is abnormal, and if the data parameter in the standard sampling data is not larger than the standard quality threshold value, the ball welding quality is normal.
In this embodiment, the ball bonding controller 22 controls the vision system 11 to compare the standard sampling data in the sampling data image with the standard quality threshold value to obtain the ball bonding quality analysis result, so that when the ball bonding quality problem occurs, the ball bonding controller 22 can comprehensively and accurately analyze the ball bonding quality problem, thereby ensuring the ball bonding quality.
The present embodiment provides a ball bonding quality monitoring system, as shown in fig. 7, including a target terminal 10 and an EFO system 20; the EFO system 20 includes a synchronous dynamic memory 21 and the aforementioned ball bond controller 22, the ball bond controller 22 being coupled to the target terminal 10 and the synchronous dynamic memory 21.
Optionally, the target terminal 10 further comprises a vision system 11, the EDO system further comprises a sampling module and an alarm system 30. And the ball welding controller 22 is connected with the vision system 11, the sampling module, the alarm system 30 and the synchronous dynamic memory 21.
In this embodiment, the EFO system 20 of the target terminal 10 receives a ball bonding control request of the target terminal 10, where the ball bonding control request is used to control the ball bonding controller 22 to output a ball bonding control signal to the ball bonding device 23, the ball bonding device 23 performs ball bonding according to the ball bonding control signal, and during the ball bonding process, the ball bonding controller 22 controls the sampling module to collect the bonding data of the target gold ball corresponding to the gold ball identifier from the ball bonding device 23, form ball bonding sampling data, and store the ball bonding sampling data in the synchronous dynamic memory 21 in a first-in first-out manner. Meanwhile, the alarm system 30 compares the ball bonding sampling data with a preset alarm threshold value to determine whether the ball bonding sampling data is abnormal, generates abnormal alarm information if the ball bonding sampling data is abnormal, stores the abnormal alarm information and the ball bonding sampling data in the synchronous dynamic memory 21 in an associated manner, and performs alarm operation based on the abnormal alarm information so as to trigger a ball bonding analysis request. The ball bonding controller 22 obtains the ball bonding analysis request, obtains all the ball bonding sampling data corresponding to the gold ball identifier and collected within the target monitoring time from the synchronous dynamic memory 21, forms a ball bonding quality analysis result based on all the ball bonding sampling data, and displays the ball bonding quality analysis result on the vision system 11, so that when the ball bonding quality problem occurs, the ball bonding controller 22 can comprehensively and accurately analyze the ball bonding quality problem, and the ball bonding quality is ensured.
In this embodiment, as shown in fig. 8, the ball bonding controller 22 includes a memory, a processor, and a quality monitoring program stored in the memory and capable of running on the processor, and the processor implements the ball bonding quality monitoring method when executing the quality monitoring program, which is not described herein again to avoid repetition.
The present embodiment provides a ball bonding quality monitoring system, as shown in fig. 7, including a target terminal 10 and an EFO system 20; the EFO system 20 includes a synchronous dynamic memory 21 and the aforementioned ball bond controller 22, the ball bond controller 22 being coupled to the target terminal 10 and the synchronous dynamic memory 21.
In an embodiment, a computer-readable storage medium is provided, in which a quality monitoring program is stored, and when the quality monitoring program is executed by a processor, the method for monitoring the quality of ball bonding is implemented, and is not described herein again to avoid repetition.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above may be implemented by instructing the relevant hardware by a quality monitoring program, which may be stored in a non-volatile quality monitoring readable storage medium, and when executed, the quality monitoring program may include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-mentioned functions.
The above-mentioned embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (9)
1. A method for monitoring the quality of ball welding is characterized by comprising the following steps:
obtaining a ball bonding analysis request, wherein the ball bonding analysis request comprises a gold ball identifier;
acquiring all ball bonding sampling data corresponding to the gold ball identification, which are acquired within target monitoring time, from a synchronous dynamic memory;
forming a ball bonding quality analysis result based on all the ball bonding sampling data;
wherein each of the ball bonding sample data corresponds to a sampling time, and the forming of the ball bonding quality analysis result based on all of the ball bonding sample data comprises:
aligning clock signals of the sampling time of all the ball bonding sampling data to obtain standard sampling data;
forming a sampled data image based on all of the standard sampled data;
and controlling a vision system to carry out ball welding quality analysis on the sampling data image to obtain a ball welding quality analysis result.
2. The ball bond quality monitoring method of claim 1 wherein prior to said obtaining a ball bond analysis request, the ball bond quality monitoring method further comprises:
collecting welding data of a target gold ball corresponding to the gold ball identification to form the ball welding sampling data;
and storing the ball bonding sampling data in a synchronous dynamic memory in a first-in first-out mode.
3. The ball bonding quality monitoring method according to claim 2, wherein the collecting of the bonding data of the target gold ball corresponding to the gold ball identifier to form ball bonding sampling data comprises:
collecting first sampling data in real time when a target gold ball corresponding to the gold ball identifier is welded;
performing noise reduction processing on the first sampling data to obtain second sampling data;
and performing ADC conversion processing on the second sampling data to obtain the ball bonding sampling data.
4. The ball bonding quality monitoring method according to claim 2, wherein after collecting ball bonding sampling data formed by collecting bonding data of a target gold ball corresponding to the gold ball identifier, the ball bonding quality monitoring method further comprises:
comparing the ball bonding sampling data with a preset alarm threshold value to determine whether the ball bonding sampling data is abnormal or not;
and if the ball bonding sampling data is abnormal, generating abnormal alarm information, storing the abnormal alarm information and the ball bonding sampling data in the synchronous dynamic memory in a correlation manner, and performing alarm operation based on the abnormal alarm information so as to trigger the ball bonding analysis request.
5. The ball bond quality monitoring method of claim 4 wherein said performing an alarm operation based on said anomaly alarm information to trigger said ball bond analysis request comprises:
and based on the abnormal alarm information, controlling the motion control system to stop bonding operation and controlling the alarm prompt lamp to work.
6. The ball bonding quality monitoring method according to claim 1, wherein the obtaining all ball bonding sampling data corresponding to the gold ball identifier collected in a target monitoring time from the synchronous dynamic memory comprises:
determining an initial time according to the current time and a preset monitoring time;
and acquiring all ball bonding sampling data corresponding to the gold ball identification, which is acquired between the starting time and the current time, from the synchronous dynamic memory.
7. The ball bond quality monitoring method of claim 1 wherein the control vision system performs ball bond quality analysis on the sampled data image to obtain ball bond quality analysis results, comprising:
and controlling the vision system to compare standard sampling data in the sampling data image with a standard quality threshold value to obtain a ball welding quality analysis result.
8. A ball bonding controller comprising a memory, a processor, and a quality monitoring program stored in said memory and executable on said processor, wherein said processor implements the ball bonding quality monitoring method of any one of claims 1 to 7 when executing said quality monitoring program.
9. A ball welding quality monitoring system is characterized by comprising a target terminal and an EFO system; the EFO system includes a synchronous dynamic memory and the ball bond controller of claim 8, the ball bond controller coupled to the target terminal and the synchronous dynamic memory.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6660956B1 (en) * | 2000-06-13 | 2003-12-09 | Asm Technology Singapore Pte | Method of and apparatus for monitoring a ball forming process |
| CN1797250A (en) * | 2004-12-30 | 2006-07-05 | C.R.F.阿西安尼顾问公司 | Module with sensor means for monitoring industrial processes |
| CN102017109A (en) * | 2008-02-29 | 2011-04-13 | 库力索法工业公司 | Methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same |
| CN102941395A (en) * | 2012-11-27 | 2013-02-27 | 上海工业自动化仪表研究院 | Welding process parameter recording and welding quality analysis system |
| CN103909325A (en) * | 2014-03-26 | 2014-07-09 | 河海大学 | Welding quality monitoring system |
| CN105940354A (en) * | 2014-02-10 | 2016-09-14 | 欧姆龙株式会社 | Quality management device and method for controlling same |
-
2022
- 2022-05-19 CN CN202210541947.8A patent/CN114633042B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6660956B1 (en) * | 2000-06-13 | 2003-12-09 | Asm Technology Singapore Pte | Method of and apparatus for monitoring a ball forming process |
| CN1797250A (en) * | 2004-12-30 | 2006-07-05 | C.R.F.阿西安尼顾问公司 | Module with sensor means for monitoring industrial processes |
| CN102017109A (en) * | 2008-02-29 | 2011-04-13 | 库力索法工业公司 | Methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same |
| CN102941395A (en) * | 2012-11-27 | 2013-02-27 | 上海工业自动化仪表研究院 | Welding process parameter recording and welding quality analysis system |
| CN105940354A (en) * | 2014-02-10 | 2016-09-14 | 欧姆龙株式会社 | Quality management device and method for controlling same |
| CN103909325A (en) * | 2014-03-26 | 2014-07-09 | 河海大学 | Welding quality monitoring system |
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