CN114604526A - 一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜 - Google Patents
一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜 Download PDFInfo
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Abstract
本发明提供一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜,属于包装膜技术领域,包括包括热封层、位于热封层的下方的芯层、位于芯层下方的电晕层。本发明本发明制备方便,通过原料共混,改变了聚丙烯成膜过程中的结晶度,提高了薄膜的柔软性能、耐低温性能、而且在低温下不易折断、不发硬,达到了既耐125℃的半高温蒸煮、又耐‑25℃冷冻保存且破袋率低的目的;本发明的产品具有流延聚丙烯薄膜透明度好、光泽度高、平整度好、高韧性、抗冲击、抗撕裂、耐穿刺等性能,可满足市场的使用需求。
Description
技术领域
本发明涉及包装膜技术领域,具体涉及一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜。
背景技术
蒸煮膜按耐温情况可分为:半高温蒸煮膜(121℃,时间30min),高温蒸煮膜(135℃,时间30min),蒸煮膜与PA、PET、铝箔等复合,用于包装需要高温蒸煮消毒的产品,如肉类、酱汁、农产品及医疗用品等。现有技术生产的半高温蒸煮膜,理化性能指标较低,只能耐121℃蒸煮,当蒸煮温度高于121℃时,薄膜将会严重变形。
另外,现有的半高温蒸煮膜产品遇低温变脆,对于存在内外袋双层包装的产品,在包装外袋时,内袋的棱角很容易将外袋扎破,从而导致包装破损率居高不下,这是流延聚丙烯薄膜的特性,不能满足低温情况下的包装及储藏要求。而现在市场上的玉米大部分在我国东北种植,要求既要高温蒸煮杀菌,然后流通时又是在低温环境下运输、流通,因此,现有的流延聚丙烯蒸煮薄膜产品已不能满足玉米包装的需求了。
因此,需要提供一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜,以解决上述现有存在的问题。
发明内容
有鉴于此,本发明提供一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜,以解决普通型半高温蒸煮膜存在的低温发脆、破包率高等不能满足玉米包装市场需求的问题。
为解决上述技术问题,本发明提供一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜,包括热封层、位于热封层的下方的芯层、位于芯层下方的电晕层。
所述热封层、芯层和电晕层的总厚度为60—120µm,所述热封层为总厚度的18—22%,所述芯层为总厚度的58—64%,所述电晕层为总厚度的18—20%。
所述热封层为添加爽滑剂和防粘剂的共聚聚丙烯层;所述芯层为共聚聚丙烯与聚烯烃弹性体的共混层;所述电晕层为表面进行火花电晕处理的共聚聚丙烯和均聚聚丙烯共混层。
所述热封层、芯层和电晕层分别由挤出机塑化挤出形成熔体,所述熔体通过一个T型模头流出后通过流延辊骤冷的流延工艺制成。
所述爽滑剂的含量为1600—2500ppm,防粘剂的含量为1600—2500ppm。
所述聚烯烃弹性体含量为芯层重量的30-50%。
所述聚烯烃弹性体为乙烯-α-烯烃共聚物,乙烯-α-烯烃共聚物中乙烯的重量含量10—20%。
本发明的上述技术方案至少包括以下有益效果:
1、本发明制备方便,通过原料共混,改变了聚丙烯成膜过程中的结晶度,提高了薄膜的柔软性能、耐低温性能、而且在低温下不易折断、不发硬,达到了既耐125℃的半高温蒸煮、又耐-25℃冷冻保存且破袋率低的目的。
2、本发明的产品具有流延聚丙烯薄膜透明度好、光泽度高、平整度好、高韧性、抗冲击、抗撕裂、耐穿刺等性能,可满足市场的使用需求。
附图说明
图1为本发明实施例中的结构示意图;
图中:1、热封层;2、芯层; 3、电晕层。
具体实施方式
如图1所示:一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜,包括热封层1、位于热封层的下方的芯层2、位于芯层下方的电晕层3。热封层1、芯层2和电晕层3的总厚度为60—120µm,热封层1为总厚度的18—22%,所述芯层2为总厚度的58—64%,所述电晕层3为总厚度的18—20%。热封层1为添加爽滑剂和防粘剂的共聚聚丙烯层,所述爽滑剂的含量为1600—2500ppm,防粘剂的含量为1600—2500ppm,使薄膜的摩擦系数小于0.18;所述芯层2为共聚聚丙烯与聚烯烃弹性体的共混层,所述聚烯烃弹性体含量为芯层重量的30-50%,所述聚烯烃弹性体为乙烯-α-烯烃共聚物,乙烯-α-烯烃共聚物中乙烯的重量含量10—20%,乙烯-α-烯烃共聚物的密度0.85—0.88g/cm3;所述电晕层3为表面进行火花电晕处理的共聚聚丙烯和均聚聚丙烯共混层,并对其表面进行火花电晕处理,使其表面张力到达38mN/m以上。
热封层1、芯层2和电晕3层分别由挤出机塑化挤出形成熔体,熔体通过一个T型模头流出后通过流延辊骤冷的流延工艺制成。
实施例1:
如图1所示,一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜,包括热封层1、位于热封层的下方的芯层2、位于芯层下方的电晕层3。热封层1选用共聚聚丙烯,并添加爽滑剂及防粘剂,其中,防粘剂含量为2500ppm,爽滑剂含量为1800ppm。芯层2选用共聚聚丙烯和聚烯烃弹性体的共混物,其中,共混物中的聚烯烃弹性体重量含量为50%。电晕层3选用共聚聚丙烯和均聚聚丙烯的共混物。
热封层1、芯层2及电晕层3各原料在240℃条件下通过挤出机塑化挤出,然后经过一个230℃的T型模头流延,由30℃的流延辊骤冷成膜,对电晕层3的表面进行电晕火花处理,使其表面张力大于38mN/m,再以40m/min的速度收卷。薄膜产品的厚度为90μm,其中热封层1占20%,芯层2占59%,电晕层3占21%。
对制备出的薄膜产品进行如下试验:
(1)蒸煮试验:裁取长200mm正方形的样品,在热封试验仪上制成长200mm、宽100mm的口袋,并分别注入50ml水溶剂,并在热封试验仪上封口。将封好口的口袋放置在反压蒸煮锅中,进行125℃、45min的蒸煮,待反压蒸煮锅冷却到90℃以下时,打开减压阀泄压后,取出试验样品进行判断。试验结果见表1。
(2)热变形试验:裁取长100×100mm正方形的样品,放置在反压蒸煮锅中,进行125℃、45min的蒸煮,待反压蒸煮锅冷却到90℃以下时,打开减压阀泄压后,测量正方形样品的尺寸。试验结果见表1。
(3)落镖冲击试验:对制取的薄膜产品放置于-25℃条件不少于4个小时,然后对样品按照GB/T 9639.1-2008《塑料薄膜和薄片抗冲击性能试验方法自由落镖法 第1部分:梯级法》进行落镖冲击试验,测试制备出的薄膜产品的耐低温抗冲击性能。试验结果见表1。
(4)摩擦系数试验:对制取的薄膜产品按照GB10006-88《塑料薄膜和薄片摩擦系数测定方法》进行摩擦系数试验,测试制备出的薄膜产品的摩擦系数。试验结果见表1。
实施例2:
如图1所示,一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜,包括热封层1、位于热封层的下方的芯层2、位于芯层下方的电晕层3。热封层1选用共聚聚丙烯,并添加爽滑剂及防粘剂,其中,防粘剂含量为2500ppm,爽滑剂含量为1800ppm。芯层2选用共聚聚丙烯和聚烯烃弹性体的共混物,其中,共混物中的聚烯烃弹性体的重量含量为50%。电晕层3选用共聚聚丙烯和均聚聚丙烯共混。
热封层1、芯层2及电晕层3各原料在240℃条件下通过挤出机塑化挤出,然后经过一个230℃的T型模头流延,由30℃的流延辊骤冷成膜,对电晕层3的表面进行电晕火花处理,使其表面张力大于38mN/m,再以40m/min的速度收卷。薄膜产品的厚度为80μm,其中热封层1占20%,芯层2占59%,电晕层3占21%。
按照实施例1的试验方法,对制备出的薄膜产品进行试验,试验结果见表1。
实施例3:
如图1所示,一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜,包括热封层1、位于热封层的下方的芯层2、位于芯层下方的电晕层3。热封层1选用共聚聚丙烯,并添加爽滑剂及防粘剂,其中,防粘剂含量为2500ppm,爽滑剂含量为1800ppm。芯层2选用共聚聚丙烯和聚烯烃弹性体的共混物,其中,共混物中的聚烯烃弹性体重量含量为50%。电晕层3选用共聚聚丙烯和均聚聚丙烯共混。
热封层1、芯层2及电晕层3各原料在240℃条件下通过挤出机塑化挤出,然后经过一个230℃的T型模头流延,由30℃的流延辊骤冷成膜,对电晕层3的表面进行电晕火花处理,使其表面张力大于38mN/m,再以40m/min的速度收卷。薄膜产品的厚度为70μm,其中热封层1占20%,芯层2占59%,电晕层3占21%。
按照实施例1的试验方法,对制备出的薄膜产品进行试验,试验结果见表1。
表1:试验结果
通过三种不同厚度本发明产品的性能测试数据分析,本发明的蒸煮性能、热收缩率、摩擦系数这三项性能和市场上的柔软型蒸煮CPP膜一致,但是低温落镖冲击强度要明显好于目前市场上的柔软型蒸煮CPP膜(市场上的柔软型蒸煮CPP膜的低温落镖冲击强度(-25℃,4hr)A法g均在200g以下)。而且通过客户大批量包装玉米长期跟踪统计,本发明的CPP膜做成的玉米包装袋蒸煮前后都非常柔软,破袋率低于1‰,而目前市场上柔软型蒸煮CPP膜做成的玉米袋破袋率基本都在2‰左右。由此,本发明在包装需要蒸煮杀菌,而且需要低温保存的食品上具有极大的性能优势。
以上是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以作出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (7)
1.一种耐低温冷冻耐半高温蒸煮超柔软包装薄膜,其特征在于:包括热封层(1)、位于热封层的下方的芯层(2)、位于芯层下方的电晕层(3)。
2.根据权利要求1所述的耐低温冷冻耐半高温蒸煮超柔软包装薄膜,其特征在于:所述热封层(1)、芯层(2)和电晕层(3)的总厚度为60—120µm,所述热封层(1)为总厚度的18—22%,所述芯层(2)为总厚度的58—64%,所述电晕层(3)为总厚度的18—20%。
3.根据权利要求1所述的耐低温冷冻耐半高温蒸煮超柔软包装薄膜,其特征在于:所述热封层(1)为添加爽滑剂和防粘剂的共聚聚丙烯层;所述芯层(2)为共聚聚丙烯与聚烯烃弹性体的共混层;所述电晕层(3)为表面进行火花电晕处理的共聚聚丙烯和均聚聚丙烯共混层。
4.根据权利要求1所述的耐低温冷冻耐半高温蒸煮超柔软包装薄膜,其特征在于:所述热封层(1)、芯层(2)和电晕层(3)分别由挤出机塑化挤出形成熔体,所述熔体通过一个T型模头流出后通过流延辊骤冷的流延工艺制成。
5.根据权利要求3所述的耐低温冷冻耐半高温蒸煮超柔软包装薄膜,其特征在于:所述爽滑剂的含量为1600—2500ppm,防粘剂的含量为1600—2500ppm。
6.根据权利要求3所述的耐低温冷冻耐半高温蒸煮超柔软包装薄膜,其特征在于:所述聚烯烃弹性体含量为芯层重量的30-50%。
7.根据权利要求3或6所述的耐低温冷冻耐半高温蒸煮超柔软包装薄膜,其特征在于:所述聚烯烃弹性体为乙烯-α-烯烃共聚物,乙烯-α-烯烃共聚物中乙烯的重量含量10—20%。
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