CN114603972A - Bonding method and bonding apparatus - Google Patents

Bonding method and bonding apparatus Download PDF

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Publication number
CN114603972A
CN114603972A CN202210188821.7A CN202210188821A CN114603972A CN 114603972 A CN114603972 A CN 114603972A CN 202210188821 A CN202210188821 A CN 202210188821A CN 114603972 A CN114603972 A CN 114603972A
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CN
China
Prior art keywords
die holder
upper die
lower die
controlling
relative
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CN202210188821.7A
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Chinese (zh)
Inventor
纪克宏
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Application filed by Interface Optoelectronics Shenzhen Co Ltd, Interface Technology Chengdu Co Ltd, General Interface Solution Ltd filed Critical Interface Optoelectronics Shenzhen Co Ltd
Priority to CN202210188821.7A priority Critical patent/CN114603972A/en
Publication of CN114603972A publication Critical patent/CN114603972A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Die Bonding (AREA)

Abstract

The application relates to a bonding method and a bonding apparatus. A method of attaching comprising: positioning a first base material on an upper die base, wherein the first base material is provided with a first surface; positioning a second substrate on the lower die base, wherein the second substrate is provided with a second surface which is arranged along the first direction and is opposite to the first surface; controlling one of the upper die holder and the lower die holder to move relative to the other according to the position information of the first surface relative to the second surface so as to enable coordinate values of at least three positions of the first surface relative to the second surface and along the first direction to be equal pairwise; and controlling the upper die holder to move towards the lower die holder along the first direction until the first base material reaches the pre-pasting position. By using the attaching method, the first surface of the first base material can be well aligned and attached to the second surface of the second base material, and the condition that one part of the two base materials is attached to each other and the other part of the two base materials is not attached can be avoided.

Description

Bonding method and bonding apparatus
Technical Field
The application relates to the technical field of laminating, in particular to a laminating method and a laminating device.
Background
In the related art, two kinds of substrates are usually bonded together by using bonding equipment, and in the use process of the conventional bonding equipment, after the two kinds of substrates are usually centered, the two kinds of substrates are bonded together, so that the situation that one part of the two kinds of substrates are bonded with each other and the other part of the two kinds of substrates is not bonded yet can occur.
Disclosure of Invention
Therefore, it is necessary to provide a bonding method and a bonding apparatus for solving the problem that one of two substrates is bonded to another and the other of the two substrates is not bonded in the use process of the conventional bonding apparatus.
According to an aspect of the present application, there is provided a fitting method including:
positioning a first substrate on an upper die base, wherein the first substrate has a first surface;
positioning a second substrate on a lower die holder, wherein the second substrate is provided with a second surface which is arranged along a first direction and is opposite to the first surface;
controlling one of the upper die holder and the lower die holder to move relative to the other according to the position information of the first surface relative to the second surface, so that coordinate values of at least three positions of the first surface relative to the second surface and along the first direction are equal in pairs;
and controlling the upper die holder to move towards the lower die holder along the first direction until the first base material reaches a pre-pasting position.
In one embodiment, the controlling one of the upper die holder and the lower die holder to move relative to the other according to the position information of the first surface relative to the second surface specifically includes:
and controlling the output of a first driving mechanism according to the position information of the first surface relative to the second surface so as to drive one of the upper die holder and the lower die holder to move relative to the other one of the upper die holder and the lower die holder.
In one embodiment, the controlling the output of the first driving mechanism according to the position information of the first surface relative to the second surface to drive one of the upper die holder and the lower die holder to move relative to the other includes:
and judging whether the first surface is parallel to the second surface, if not, controlling the output of a first driving mechanism to drive one of the upper die holder and the lower die holder to move relative to the other one of the upper die holder and the lower die holder so as to enable the first surface to be parallel to the second surface.
In one embodiment, determining whether the first surface is parallel to the second surface, and if not, controlling an output of a first driving mechanism to drive one of the upper die holder and the lower die holder to move relative to the other includes:
selecting at least three first mark points on the first surface;
selecting at least three second marker points on the second surface; the first marking points and the second marking points are in one-to-one correspondence, and the first marking points and the corresponding second marking points are combined to form a group of marking groups; in any two groups of the mark groups, the distance between the first mark point and the corresponding second mark point in one group of the mark groups is D1The distance between the first mark point and the corresponding second mark point in the other group of the mark groups is D2；
Judgment of D1And D2If not, controlling the output of the first driving mechanism to drive one of the upper die holder and the lower die holder to move relative to the other until D1And D2The difference of (d) is equal to zero.
In one embodiment, the method further comprises the following steps: and controlling the distance measuring instrument to move between the first mark point and the corresponding second mark point so as to obtain the distance between the first mark point and the corresponding second mark point.
In one embodiment, the number of the first mark points selected on the first surface is four, wherein a connecting line of two first mark points passes through the center of the first surface and is oppositely arranged along a second direction; the connecting line of the other two first mark points passes through the center of the first surface and is oppositely arranged along a third direction;
the number of the second mark points selected on the second surface is also four;
the second direction and the third direction intersect each other and are both perpendicular to the first direction.
In one embodiment, the second surface of the second substrate is provided with an adhesive part;
the controlling the upper die holder to move towards the lower die holder along the first direction until the first base material reaches a pre-pasting position comprises:
controlling the upper die holder to move towards the lower die holder along the first direction;
and if the distance between the first surface and the second surface is smaller than or equal to a preset value, controlling the upper die base to stop moving so as to enable the first surface of the first base material to be bonded on a bonding part on the second surface.
In one embodiment, the preset value is smaller than the thickness of the bonding part.
In one embodiment, the bonding portion has a thickness of 20 microns;
the preset value is 12-18 microns.
In one embodiment, the upper die holder is connected with a second driving mechanism;
the controlling the upper die holder to move towards the lower die holder along the first direction until the first base material reaches a pre-pasting position specifically comprises:
and controlling the output of the second driving mechanism to drive the upper die holder to move towards the lower die holder along the first direction until the distance between the first surface and the second surface is smaller than or equal to the preset value.
According to another aspect of the present application, there is provided a attaching device including:
the upper die holder is provided with a first base material, and the first base material is provided with a first surface;
the lower die base is provided with a second base material, and the second base material is provided with a second surface which is arranged along the first direction and opposite to the first surface;
the first driving mechanism is connected with one of the upper die holder and the lower die holder so as to drive one of the upper die holder and the lower die holder to move relative to the other of the upper die holder and the lower die holder, and coordinate values of at least three positions of the first surface relative to the second surface and along the first direction are equal in pairs;
and the second driving mechanism is connected with the upper die base so as to drive the upper die base to move towards the lower die base along the first direction until the first base material reaches the pre-pasting position.
In one embodiment, the first driving mechanism comprises a six-degree-of-freedom motion platform, and one side of the lower die holder, which is far away from the upper die holder, is connected with the six-degree-of-freedom motion platform.
According to the laminating method and the laminating device, by utilizing the laminating method, at least three positions of the first surface are enabled to be equal to each other in pairs relative to the second surface and along the first direction, so that the first surface and the second surface are oppositely arranged along the first direction, the distances among the positions of the first surface and the second surface are equal, then the upper die base is controlled to move towards the lower die base along the first direction until the first base material reaches the pre-laminating position, therefore, the first surface of the first base material can be well aligned and laminated to the second surface of the second base material, and the conditions that one positions of the two base materials are mutually laminated and the other position of the two base materials is not laminated can be avoided.
Drawings
Fig. 1 shows a flow chart of a fitting method in a first embodiment of the present application;
FIG. 2 is a schematic structural diagram of a laminating device according to an embodiment of the present application;
FIG. 3 shows a flow chart of a fitting method in a second embodiment of the present application;
fig. 4 shows a flow chart of a fitting method in a third embodiment of the present application;
FIG. 5 shows a schematic structural view of a first substrate and a second substrate in an embodiment of the present application;
FIG. 6 shows a schematic structural diagram of a first substrate in an embodiment of the present application;
fig. 7 shows a flowchart of a fitting method in a fourth embodiment of the present application.
In the figure:
10. a bonding device; 321. A second surface;
210. an upper die holder; b. A second marking point;
220. a lower die holder; 410. A first drive mechanism;
310. a first substrate; 420. A second drive mechanism;
311. a first surface; 500. A range finder;
a. a first marking point; 600. A CCD camera.
320. A second substrate;
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Fig. 1 shows a flowchart of a fitting method in an embodiment of the present application.
In some embodiments, referring to fig. 1 in combination with fig. 2, a bonding method provided in an embodiment of the present application includes the following steps:
s110, the first substrate 310 is positioned on the upper die base 210. The first substrate 310 has a first surface 311.
S120, positioning the second substrate 320 in the lower die holder 220. Wherein the second substrate 320 has a first direction F1A second surface 321 disposed opposite the first surface 311.
S130, controlling one of the upper die holder 210 and the lower die holder 220 to move relative to the other according to the position information of the first surface 311 relative to the second surface 321, so that at least three positions of the first surface 311 are relative to the second surface 321 and along the first direction F1The coordinate values of the two are equal.
According to the three-point surface-fixing principle, if at least three positions of the first surface 311 are opposite to the second surface 321 and along the first direction F1The coordinate values are equal in pairs, and the distances between the first surface 311 and the second surface 321 are equal, which is beneficial for the first surface 311 to be aligned and attached to the second surface 321.
If the first surface 311 and the second surface 321 are both planar, it means that the first surface 311 is parallel to the second surface 321.
According to the position information of the first surface 311 relative to the second surface 321, one of the upper die holder 210 and the lower die holder 220 is controlled to move relative to the other so as to adjust the position of the upper die holder 210 relative to the lower die holder 220, and further adjust the position of the first surface 311 relative to the second surface 321, and the position information of the first surface 311 relative to the second surface 321 can be changed, so that the position information of the first surface 311 relative to the second surface 321 can be changedAt least three positions of the first surface 311 are opposite to the second surface 321 and along the first direction F1The coordinate values of (1) are equal to each other, so that the first surface 311 and the second surface 321 are along the first direction F1The first surface 311 and the second surface 321 are disposed oppositely, and the distances between the first surface 311 and the second surface 321 are equal to each other, so as to ensure that the first surface 311 of the first substrate 310 can be aligned and attached to the second surface 321 of the second substrate 320.
S140, controlling the upper die base 210 to move along the first direction F1Move toward the lower die bed 220 until the first substrate 310 reaches the pre-application position.
It is understood that, by using the attaching method, at least three positions of the first surface 311 can be made to be opposite to the second surface 321 and along the first direction F1Are equal in pairs, so that the first surface 311 and the second surface 321 are along the first direction F1Oppositely arranged, and the distances between the first surface 311 and the second surface 321 are equal, and then the upper die holder 210 is controlled along the first direction F1Move towards the lower die holder 220 until the first substrate 310 reaches the pre-bonding position, so that the first surface 311 of the first substrate 310 can be well aligned and bonded to the second surface 321 of the second substrate 320, and the situation that one of the two substrates is bonded to each other and the other of the two substrates is not bonded can be avoided.
In some embodiments, the step S130 of controlling one of the upper die holder 210 and the lower die holder 220 to move relative to the other one thereof according to the position information of the first surface 311 relative to the second surface 321 specifically includes:
the output of the first drive mechanism 410 is controlled to drive one of the upper die shoe 210 and the lower die shoe 220 to move relative to the other, based on the positional information of the first surface 311 relative to the second surface 321.
It is understood that the position information of the first surface 311 relative to the second surface 321 includes any position of the first surface 311 relative to the second surface 321 along the first direction F1The coordinate values of (2). In the embodiment shown in fig. 2, the first direction F is specific1In the Z-axis direction (longitudinal direction), the position information of the first surface 311 relative to the second surface 321 includes any phase of the first surface 311The ordinate value for the second surface 321. Thus, according to the position information of the first surface 311 relative to the second surface 321, the output of the first driving mechanism 410 is controlled to drive one of the upper die holder 210 and the lower die holder 220 to move relative to the other one thereof until the ordinate values of at least three positions of the first surface 311 relative to the second surface 321 are equal to each other, so that the distances between the first surface 311 and the second surface 321 are equal, and the first surface 311 of the first substrate 310 is aligned and attached to the second surface 321 of the second substrate 320.
In some embodiments, referring to fig. 3, controlling the output of the first driving mechanism 410 according to the position information of the first surface 311 relative to the second surface 321 to drive one of the upper die holder 210 and the lower die holder 220 to move relative to the other includes:
s131, whether the first surface 311 is parallel to the second surface 321 is determined.
S132, if the first surface 311 is not parallel to the second surface 321, controlling the output of the first driving mechanism 410 to drive one of the upper die holder 210 and the lower die holder 220 to move relative to the other, so that the first surface 311 is parallel to the second surface 321.
It is understood that, whether the first surface 311 is parallel to the second surface 321 can be determined according to the position information of the first surface 311 relative to the second surface 321, and if the first surface 311 is not parallel to the second surface 321, the output of the first driving mechanism 410 is controlled to drive one of the upper die holder 210 and the lower die holder 220 to move relative to the other, so as to change the position information of the upper die holder 210 relative to the lower die holder 220, and further change the position information of the first surface 311 relative to the second surface 321, so that at least three positions of the first surface 311 are relative to the second surface 321 and along the first direction F1The coordinate values are equal to each other, so that the first surface 311 is parallel to the second surface 321, and the first surface 311 of the first substrate 310 is aligned and attached to the second surface 321 of the second substrate 320.
It should be noted that, in the present embodiment, the first surface 311 and the second surface 321 are both planar.
Optionally, please refer to the figure3, if the first surface 311 is parallel to the second surface 321, controlling the upper mold base 210 along the first direction F is performed1Moving the substrate to the lower die bed 220 until the first substrate 310 reaches the pre-bonding position in step S140, so that the first surface 311 of the first substrate 310 can be aligned and bonded to the second surface 321 of the second substrate 320.
In some embodiments, referring to fig. 4 in combination with fig. 5, determining whether the first surface 311 is parallel to the second surface 321, and if not, controlling the output of the first driving mechanism 410 to make the first surface 311 parallel to the second surface 321 specifically includes:
s131, selecting at least three first mark points a on the first surface 311.
S132, selecting at least three second mark points b on the second surface 321. The first mark points a and the second mark points b are in one-to-one correspondence, and the first mark points a and the corresponding second mark points b are combined to form a group of mark groups; in any two groups of mark groups, the distance between a first mark point a and a corresponding second mark point b in one group of mark groups is D1The distance between the first mark point a and the corresponding second mark point b in the other group of mark groups is D2. It should be noted that the first mark point a and the corresponding second mark point b are along the first direction F1Are oppositely and alternately arranged.
S133, judgment D1And D2Whether the difference of (d) is equal to zero.
S134, if D1And D2If the difference is not equal to zero, the output of the first driving mechanism 410 is controlled to drive the lower die holder 220 to move relative to the upper die holder 210 until D1And D2The difference of (d) is equal to zero.
Thus, can be according to D1And D2Controls the output of the first driving mechanism 410 to drive the lower die holder 220 to move relative to the upper die holder 210 until D1And D2Is equal to zero in order to finally make the first surface 311 parallel to the second surface 321.
As can be appreciated, decision D1And D2If D is equal to zero1And D2The difference of (c) tends to zero, and can also be considered asD1And D2The difference of (d) is equal to zero.
Specifically, three first mark points a on the first surface 311 are selected, where the three first mark points a are a first mark point a, a second first mark point a, and a third first mark point a. Selecting three second mark points b on the second surface 321, wherein the three second mark points b are a first second mark point b, a second mark point b and a third second mark point b, respectively acquiring a distance between the first mark point a and the first second mark point b, a distance between the second first mark point a and the second mark point b and a distance between the third first mark point a and the third second mark point b, respectively, keeping the distance between the first mark point a and the first second mark point b constant, controlling the output of the first driving mechanism 410 to drive the lower die holder 220 to move relative to the upper die holder 210, and changing the distance between the second first mark point a and the second mark point b so that the distance between the second first mark point a and the second mark point b is equal to the distance between the first mark point a and the first second mark point b. Similarly, the distance between the third first mark point a and the third second mark point b can also be equal to the distance between the first mark point a and the first second mark point b. Thus, according to the three-point surface fixing principle, the first surface 311 is parallel to the second surface 321.
It should be noted that the nth first marker point a and the nth second marker point b are the first marker point a and the corresponding second marker point b.
Alternatively, please refer to FIG. 4, if D1And D2Is equal to zero, the upper die holder 210 is controlled along the first direction F1Moving the substrate to the lower die bed 220 until the first substrate 310 reaches the pre-bonding position in step S140, so that the first surface 311 of the first substrate 310 can be aligned and bonded to the second surface 321 of the second substrate 320.
Controlling the distance measuring instrument 500 to move between the first mark point a and the corresponding second mark point b to obtain the distance between the first mark point a and the corresponding second mark point b so as to obtain D1And D2According to the difference of D1And D2Controls the output of the first driving mechanism 410 to drive the lower die holder 220 to move relative to the upper die holder 210 until D1And D2The difference of (b) is zero, the first surface 311 may be made parallel to the second surface 321.
Alternatively, the distance between the first mark point a and the corresponding second mark point b in the multiple groups of mark groups may be obtained by one distance meter 500, or the distances between the first mark point a and the corresponding second mark point b in the multiple groups of mark groups may be obtained by multiple distance meters 500 respectively.
In some embodiments, referring to fig. 5 and fig. 6, the number of the first marks a selected on the first surface 311 is four, wherein a connection line of two first marks a passes through the center of the first surface 311 and is along the second direction F2Oppositely arranged, the connecting line of the other two first mark points a passes through the center of the first surface 311 and along the third direction F3Are oppositely arranged. The number of the second marker points b selected on the second surface 321 is also four. Wherein the second direction F2And a third direction F3Intersect each other and are all perpendicular to the first direction F1。
In particular, in the embodiment shown in FIG. 5, the first direction F1Is Z-axis direction (longitudinal direction), the first surface 311 is rectangular perpendicular to the Z-axis direction, and the second direction F2A first diagonal, a third direction F parallel to the first surface 3113A second diagonal line parallel to the first surface 311, so that the first mark point a and the corresponding second mark point b in the four selected mark groups can better ensure that the mark D in any two mark groups1And D2When the difference is zero, the first surface 311 can be made parallel to the second surface 321.
In some embodiments, referring to fig. 7, the second surface 321 of the second substrate 320 is provided with an adhesive portion.
Controlling the upper die base 210 to move in a first direction F1The step S140 of moving toward the lower die base 220 until the first substrate 310 reaches the pre-pasting position includes:
s141, controlling the upper die base 210 along the first direction F1Toward the lower die bed 220.
S142, judging whether the distance between the first surface 311 and the second surface 321 is smaller than or equal to a preset value.
S143, if the distance between the first surface 311 and the second surface 321 is less than or equal to the predetermined value, the upper mold base 210 is controlled to stop moving, so that the first surface 311 of the first base material 310 is bonded to the bonding portion on the second surface 321.
It can be understood that when the distance between the first surface 311 and the second surface 321 is less than or equal to the predetermined value, the first substrate 310 reaches the pre-bonding position, and at this time, the first surface 311 of the first substrate 310 is bonded to the bonding portion on the second surface 321, so that the first surface 311 of the first substrate 310 is more firmly bonded to the second surface 321 of the second substrate 320.
In some embodiments, the preset value is less than the thickness of the bonding portion. The bonding portion can be compressed during the process of aligning and bonding the first surface 311 of the first substrate 310 to the second surface 321 of the second substrate 320, so that the first surface 311 of the first substrate 310 is more firmly aligned and bonded to the second surface 321 of the second substrate 320.
In some embodiments, the bond has a thickness of 20 microns, with a preset value of 12-18 microns. An appropriate preset value can be selected according to the thickness of the bonding portion to ensure that the first surface 311 of the first substrate 310 is more firmly aligned and bonded to the second surface 321 of the second substrate 320.
In some embodiments, referring to fig. 2, the upper die base 210 is connected to a second driving mechanism 420. Controlling the upper die base 210 to move in a first direction F1The step S140 of moving toward the lower die base 220 until the first substrate 310 reaches the pre-pasting position includes:
controls the output of the second driving mechanism 420, and the upper die holder 210 is moved in the first direction F1And moves toward the lower die bed 220 until the distance between the first surface 311 and the second surface 321 is less than or equal to a preset value.
It can be determined whether the distance between the first surface 311 and the second surface 321 is less than or equal to a predetermined value, and if not, the output of the second driving mechanism 420 is controlled to drive the upper die base 210 along the first direction F1Toward the lower die bed 220. If the distance between the first surface 311 and the second surface 321 is less than or equal toIf the value is set, the upper mold base 210 is controlled to stop moving. In this way, the movement of the upper mold 210 can be controlled according to whether the distance between the first surface 311 and the second surface 321 is smaller than or equal to the predetermined value, so as to ensure that the distance between the first surface 311 and the second surface 321 is smaller than or equal to the predetermined value, thereby ensuring that the first surface 311 of the first substrate 310 is more firmly aligned and attached to the second surface 321 of the second substrate 320.
An embodiment of the application provides a laminating apparatus 10, which includes an upper die holder 210, a lower die holder 220, a first driving mechanism 410, and a second driving mechanism 420.
The upper die base 210 has a first substrate 310, and the first substrate 310 has a first surface 311. The lower die base 220 is provided with a second substrate 320, and the second substrate 320 is arranged along a first direction F1A second surface 321 disposed opposite the first surface 311. The first driving mechanism 410 is connected to one of the upper mold 210 and the lower mold 220 to drive the other one of the upper mold 210 and the lower mold 220 to move at least three positions of the first surface 311 relative to the second surface 321 and along the first direction F1The coordinate values of the two are equal. The distances between the first surface 311 and the second surface 321 are equal, which is favorable for the first surface 311 to be aligned and attached to the second surface 321.
The second driving mechanism 420 is connected to the upper die base 210 to drive the upper die base 210 along the first direction F1Move toward the lower die bed 220 until the first substrate 310 reaches the pre-application position. The first surface 311 of the first substrate 310 can be attached to the second surface 321 of the second substrate 320.
In some embodiments, the first drive mechanism 410 comprises a six degree-of-freedom motion stage to which the lower die shoe 220 is attached on a side of the lower die shoe 210 remote from the upper die shoe. The six-degree-of-freedom motion platform can be used to more conveniently adjust the position of the lower die holder 220 relative to the upper die holder 210, and further change the position information of the first surface 311 relative to the second surface 321, so that at least three positions of the first surface 311 are opposite to the second surface 321 and along the first direction F1The coordinate values of the two are equal.
In some embodiments, the second driving mechanism 420 includes a voice coil motor, and the upper die holder 210 is coupled to the voice coil motor at a side thereof remote from the lower die holder 220. The position of the upper die holder 210 relative to the lower die holder 220 can be more conveniently adjusted by using a voice coil motor, so that the position information of the first surface 311 relative to the second surface 321 is changed, the upper die holder 210 moves in the Z-axis direction, the camera 600 is combined to realize circulation system control, and the upper die holder 210 is controlled to stop moving according to the distance between the first surface 311 and the second surface 321 acquired by the camera 600 when the distance between the first surface 311 and the second surface 321 is smaller than or equal to a preset value, so that the first surface 311 of the first base material 310 can be better ensured to be aligned and attached to the second surface 321 of the second base material 320.
In some embodiments, the attaching device 10 further includes a CCD camera 600, and the CCD camera 600 is configured to obtain a distance between the first surface 311 and the second surface 321, so that when the distance between the first surface 311 and the second surface 321 is smaller than or equal to a preset value, the upper die base 210 is controlled to stop moving, so as to enable the first surface 311 of the first substrate 310 to be bonded to the bonding portion on the second surface 321.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (12)

1. A bonding method is characterized by comprising:
positioning a first substrate on an upper die base, wherein the first substrate has a first surface;
positioning a second substrate on a lower die holder, wherein the second substrate is provided with a second surface which is arranged along a first direction and is opposite to the first surface;
controlling one of the upper die holder and the lower die holder to move relative to the other according to the position information of the first surface relative to the second surface, so that coordinate values of at least three positions of the first surface relative to the second surface and along the first direction are equal in pairs;
and controlling the upper die holder to move towards the lower die holder along the first direction until the first base material reaches a pre-pasting position.
2. The attaching method according to claim 1, wherein the controlling of the movement of one of the upper die holder and the lower die holder relative to the other one of the upper die holder and the lower die holder according to the position information of the first surface relative to the second surface specifically comprises:
and controlling the output of a first driving mechanism according to the position information of the first surface relative to the second surface so as to drive one of the upper die holder and the lower die holder to move relative to the other one of the upper die holder and the lower die holder.
3. The attaching method according to claim 2, wherein the controlling the output of the first driving mechanism according to the position information of the first surface relative to the second surface to drive one of the upper die holder and the lower die holder to move relative to the other includes:
and judging whether the first surface is parallel to the second surface, if not, controlling the output of a first driving mechanism to drive one of the upper die holder and the lower die holder to move relative to the other one of the upper die holder and the lower die holder so as to enable the first surface to be parallel to the second surface.
4. The attaching method according to claim 3, wherein determining whether the first surface is parallel to the second surface, and if not, controlling an output of the first driving mechanism to drive one of the upper die base and the lower die base to move relative to the other includes:
selecting at least three first mark points on the first surface;
selecting at least three second marker points on the second surface; the first marking points and the second marking points are in one-to-one correspondence, and the first marking points and the corresponding second marking points are combined to form a group of marking groups; in any two groups of the mark groups, the distance between the first mark point and the corresponding second mark point in one group of the mark groups is D1The distance between the first mark point and the corresponding second mark point in the other group of the mark groups is D2；
Judgment of D1And D2If not, controlling the output of the first driving mechanism to drive one of the upper die holder and the lower die holder to move relative to the other until D1And D2The difference of (d) is equal to zero.
5. The fitting method according to claim 4, further comprising: and controlling the distance measuring instrument to move between the first mark point and the corresponding second mark point so as to obtain the distance between the first mark point and the corresponding second mark point.
6. The attaching method according to claim 4, wherein the number of the first mark points selected on the first surface is four, and a connection line of two first mark points passes through a center of the first surface and is oppositely arranged along a second direction; the connecting line of the other two first mark points passes through the center of the first surface and is oppositely arranged along a third direction;
the number of the second mark points selected on the second surface is also four;
the second direction and the third direction intersect each other and are both perpendicular to the first direction.
7. The bonding method according to any one of claims 1 to 6, wherein the second surface of the second base material is provided with an adhesive portion;
the controlling the upper die holder to move towards the lower die holder along the first direction until the first base material reaches a pre-pasting position comprises:
controlling the upper die holder to move towards the lower die holder along the first direction;
and if the distance between the first surface and the second surface is smaller than or equal to a preset value, controlling the upper die base to stop moving so as to enable the first surface of the first base material to be bonded on a bonding part on the second surface.
8. The attaching method according to claim 7, wherein the preset value is smaller than a thickness of the bonding portion.
9. The attaching method according to claim 8, wherein a thickness of the adhesive portion is 20 μm;
the preset value is 12-18 microns.
10. The laminating method according to claim 7, wherein a second driving mechanism is connected to the upper die base;
the controlling the upper die holder to move towards the lower die holder along the first direction until the first base material reaches a pre-pasting position specifically comprises:
and controlling the output of the second driving mechanism to drive the upper die holder to move towards the lower die holder along the first direction until the distance between the first surface and the second surface is smaller than or equal to the preset value.
11. A laminating device, comprising:
the upper die holder is provided with a first base material, and the first base material is provided with a first surface;
the lower die base is provided with a second base material, and the second base material is provided with a second surface which is arranged along the first direction and opposite to the first surface;
the first driving mechanism is connected with one of the upper die holder and the lower die holder so as to drive one of the upper die holder and the lower die holder to move relative to the other of the upper die holder and the lower die holder, and coordinate values of at least three positions of the first surface relative to the second surface and along the first direction are equal in pairs;
the second driving mechanism is connected with the upper die base to drive the upper die base to move towards the lower die base along the first direction until the first base material reaches the pre-pasting position.
12. The laminating device of claim 11, wherein the first drive mechanism comprises a six degree-of-freedom motion platform, and a side of the lower die base remote from the upper die base is connected to the six degree-of-freedom motion platform.
CN202210188821.7A 2022-02-28 2022-02-28 Bonding method and bonding apparatus Pending CN114603972A (en)

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