CN114599204A - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
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- CN114599204A CN114599204A CN202210112789.4A CN202210112789A CN114599204A CN 114599204 A CN114599204 A CN 114599204A CN 202210112789 A CN202210112789 A CN 202210112789A CN 114599204 A CN114599204 A CN 114599204A
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- air guide
- air
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 238000005245 sintering Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 239000006260 foam Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000006262 metallic foam Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the application discloses heat abstractor and electronic equipment, heat abstractor includes: the body is provided with a first accommodating cavity, a first opening and a second opening and is used for radiating heat of the heating assembly; the air guide body is arranged in the first accommodating cavity and is provided with a first air guide channel; at least part of the first air guide channel is bent; gas can flow within the first opening, the first wind-directing channel, and the second opening. According to the heat dissipation device provided by the embodiment of the application, the air guide body is provided with the first bent air guide channel, so that the path and the flowing time of air in the body can be increased, the air and the body can exchange heat more sufficiently, and the heat dissipation capacity of the heat dissipation device is greatly improved.
Description
Technical Field
The application relates to a heat dissipation device and an electronic device.
Background
Heat sinks are devices that people often use; however, the heat dissipation capability of the current heat dissipation device is poor.
Disclosure of Invention
In view of the above, embodiments of the present disclosure are directed to a heat dissipation device and an electronic apparatus.
In order to achieve the purpose, the technical scheme of the application is realized as follows:
an embodiment of the present application provides a heat dissipation device, the heat dissipation device includes:
the body is provided with a first accommodating cavity, a first opening and a second opening and is used for radiating heat for the heating assembly;
the air guide body is arranged in the first accommodating cavity and is provided with a first air guide channel; at least part of the first air guide channel is bent;
gas can flow within the first opening, the first wind-directing channel, and the second opening.
In some optional implementations, the body includes:
the first wall body is connected with the air guide body and is used for being connected with the heating component;
the second wall body is arranged at intervals with the first wall body;
the air guide body is positioned between the first wall body and the second wall body, and a second air guide channel is formed between the air guide body and the second wall body.
In some optional implementations, the body further includes:
the third wall body is respectively connected with the first wall body and the second wall body, and a third air guide channel is formed between the third wall body and the air guide body;
and the fourth wall body is respectively connected with the first wall body and the second wall body, is arranged opposite to the third wall body, and forms a fourth air guide channel with the air guide body.
In some optional implementations, the wind guide body and the body form an integral structure through a sintering manner;
the body and the air guide body are made of copper.
In some optional implementation modes, the wind guide body is formed by sintering metal powder; and/or the presence of a gas in the gas,
the air guide body is formed by sintering metal wires.
In some optional implementations, the wind guide body includes:
the first strip-shaped part is provided with a first strip-shaped part,
the second strip-shaped part is different from the first strip-shaped part in cross section and forms the air guide body with the first strip-shaped part in a staggered mode.
An embodiment of the present application further provides an electronic device, where the electronic device includes the heat generating component of the heat dissipation apparatus in the embodiment of the present application:
the heat dissipation device is used for dissipating heat of the heating component.
In some optional implementations, the electronic device further includes:
the shell is provided with a second accommodating cavity, a first air outlet and a second air outlet; the heat dissipation device and the heating component are positioned in the second accommodating cavity;
the fan is arranged in the second accommodating cavity, is used for driving a first part of gas to be led out from the first air outlet and is used for driving a second part of gas to be led out through the first opening, the first air guide channel, the second opening and the second air outlet;
the air guide body is used for absorbing noise of the electronic equipment.
In some optional implementations, the electronic device further includes: the first end of the heat pipe is respectively connected with the heating component and the body, and the second end of the heat pipe is positioned at the first air outlet; or the like, or, alternatively,
the electronic device further includes: a first end of the heat pipe is connected with a first heating element in the heating assembly, and a second end of the heat pipe is positioned at the first air outlet; the body is connected with a second heating piece in the heating assembly.
In some optional implementations, the electronic device further includes:
the shell is provided with a second accommodating cavity, a first air outlet and a first air inlet; the heat dissipation device and the heating component are positioned in the second accommodating cavity;
the fan is arranged in the second accommodating cavity and used for driving gas to pass through the first air inlet, the second opening, the first wind guide channel and the first opening, and the fan is used for driving the guided gas to be guided out from the first air outlet.
The heat dissipation device in the embodiment of the present application includes: the body is provided with a first accommodating cavity, a first opening and a second opening and is used for radiating heat of the heating assembly; the air guide body is arranged in the first accommodating cavity and is provided with a first air guide channel; at least part of the first air guide channel is bent; gas can flow in the first opening, the first wind-guiding channel and the second opening; the air guide body is provided with the first bent air guide channel, so that the path and the flowing time of air in the body can be increased, the air and the body can exchange heat more fully, and the heat dissipation capacity of the heat dissipation device is greatly improved.
Drawings
Fig. 1 is a schematic structural diagram of an alternative heat dissipation device in an embodiment of the present application;
fig. 2 is a schematic structural diagram of an alternative heat dissipation device in the embodiment of the present application;
FIG. 3 is a schematic view of an alternative structure of the heat dissipation device in the embodiment of the present application;
FIG. 4 is a schematic view of an alternative structure of the heat dissipation device in the embodiment of the present application;
FIG. 5 is a schematic view of an alternative structure of the heat dissipation device in the embodiment of the present application;
FIG. 6 is a schematic diagram of an alternative configuration of an electronic device in an embodiment of the present application;
FIG. 7 is a schematic diagram of an alternative configuration of an electronic device in an embodiment of the present application;
FIG. 8 is a schematic diagram of an alternative configuration of an electronic device in an embodiment of the present application;
fig. 9 is an alternative structural schematic diagram of an electronic device in an embodiment of the present application.
Reference numerals: 110. a body; 101. a first accommodating chamber; 102. a second air guide channel; 103. a third air guide channel; 104. a fourth air guide channel; 105. a fifth air guide channel; 106. a sixth air guiding channel; 107. a seventh air guide channel; 111. a first opening; 112. a second opening; 114. a first wall body; 115. a second wall body; 116. a third wall body; 117. a fourth wall body; 118. a fifth wall body; 119. a sixth wall body; 120. an air guide body; 210. a housing; 201. a second accommodating chamber; 211. a first air outlet; 212. a second air outlet; 213. a first air inlet; 220. a fan; 230. a heat pipe.
Detailed Description
The technical solution of the present application is further described in detail with reference to the drawings and specific embodiments of the specification.
In the description of the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connected" should be interpreted broadly, for example, as an electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate, and the specific meaning of the terms may be understood by those skilled in the art according to specific situations.
It should be noted that the terms "first \ second \ third" referred to in the embodiments of the present application are only used for distinguishing similar objects, and do not represent a specific ordering for the objects, and it should be understood that "first \ second \ third" may exchange a specific order or sequence order if allowed. It should be understood that "first \ second \ third" distinct objects may be interchanged under appropriate circumstances such that the embodiments of the application described herein may be implemented in an order other than those illustrated or described herein.
The heat sink according to the embodiment of the present application will be described in detail below with reference to fig. 1 to 5.
The heat dissipating device includes: a body 110 and a wind guide 120. The body 110 has a first accommodating cavity 101, a first opening 111 and a second opening 112, and the body 110 is used for dissipating heat of the heat generating component; the air guide body 120 is arranged in the first accommodating cavity 101, and the air guide body 120 is provided with a first air guide channel; at least part of the first air guide channel is bent; gas can flow in the first opening 111, the first wind guide channel and the second opening 112; the air guide 120 having the first curved air guide passage can increase the flow path and flow time of the air in the main body 110, so that the air and the main body 110 can exchange heat more sufficiently, and the heat dissipation capability of the heat dissipation device is greatly improved.
In the embodiment of the present application, the structure of the body 110 is not limited. For example, as shown in fig. 1, the body 110 may have a rectangular parallelepiped structure. For another example, the body 110 may have an irregular shape.
Here, the first opening 111 and the second opening 112 communicate with the first accommodating chamber 101, respectively, and the positions where the first opening 111 and the second opening 112 are provided are not limited. For example, as shown in fig. 1, the first opening 111 and the second opening 112 may be disposed at adjacent sides of the body 110. Of course, the first opening 111 and the second opening 112 may also be disposed at opposite sides of the body 110.
Here, the material of the body 110 is not limited. For example, the material of the body 110 may be copper for increasing the thermal conductivity of the body 110.
In the embodiment of the present application, the structure of the wind guide 120 is not limited. For example, the wind guide 120 may have a mesh structure. For another example, the wind guide 120 may have a foam structure, and the wind guide 120 may be a metal foam, for example.
As an example, the wind guide 120 may include: the first strip-shaped part and the second strip-shaped part. The second strip-shaped portions and the first strip-shaped portions are staggered to form the air guide body 120.
Here, the cross-sectional shapes of the second strip portion and the first strip portion may be the same or different. For example, the cross sections of the second strip portion and the first strip portion may be both circular or elliptical, and the diameter of the second strip portion is different from that of the first strip portion, so as to form a first wind guiding channel with a larger cross section area between the second strip portion and the first strip portion.
Here, the wind guide 120 may include: the foam part can be adhered to the surfaces of the second strip part and the first strip part so as to further increase the contact area of the gas and the second strip part and the first strip part and enable the gas and the second strip part and the first strip part to exchange heat more fully.
Here, the structure of the foam part is not limited. For example, the foam portion may be a metal foam.
Here, the first air guiding duct is provided in the air guiding body 120, and the first air guiding duct may be all curved or partially curved. When the air guide body 120 has a mesh structure or a foam structure, a first air guide passage having a curved shape may be formed in the mesh structure or the foam structure.
As an example, the wind guide body 120 may further have a fifth wind guide channel 105.
Here, the sectional area of the fifth air guiding passage 105 is larger than that of the first air guiding passage, so that more air is guided into the air guiding body 120 through the fifth air guiding passage 105.
Here, the fifth wind guide passage 105 may have a straight structure as shown in fig. 5. Of course, the fifth air guiding channel 105 may also have a curved structure, as shown in fig. 4.
Here, the fifth air guiding passage 105 may communicate with the first opening 111 and the second opening 112, respectively, as shown in fig. 4, or the first air guiding passage may communicate with only the first opening 111, as shown in fig. 5; at this time, the air can enter the fifth wind guiding channel 105 through the first opening 111, and then is guided out from the second opening 112 through the first wind guiding channel. Of course, the air may also enter the fifth wind guiding channel 105 through the first wind guiding channel via the second opening 112, and then be guided out via the first opening 111.
Here, the manner in which the air guide 120 is disposed in the first accommodation chamber 101 is not limited. For example, the air guide 120 is in contact with the wall forming the first housing chamber 101, but the air guide 120 is not connected to the wall forming the first housing chamber 101. For another example, the air guide body 120 is connected to a wall body forming the first accommodating chamber 101 by a heat conductive adhesive. For another example, the wind guide 120 and the body 110 are integrally formed by sintering, so that the heat of the heating element can be more rapidly transmitted to the wind guide 120.
Here, the material of the wind guide 120 is not limited. For example, the material of the wind guide 120 may be copper.
In some optional implementations of the embodiments of the present application, as shown in fig. 2, the body 110 may include: a first wall 114 and a second wall 115. The first wall body 114 is connected with the air guide body 120, and the first wall body 114 is used for connecting with a heating component; the second wall 115 is spaced apart from the first wall 114; the air guide body 120 is located between the first wall body 114 and the second wall body 115, and the second air guide channel 102 is formed between the air guide body 120 and the second wall body 115, so that air can flow in the second air guide channel, and resistance of the air flowing between the first opening 111 and the second opening 112 is reduced.
In this implementation, the first wall 114 is connected to the air guide 120, so that heat of the heat generating component can be quickly transferred to the air guide 120.
Here, the manner of connecting the first wall 114 to the air guide 120 and the manner of connecting the air guide 120 to the wall forming the first accommodating chamber 101 are not described in detail herein.
Here, the second air guiding passage 102 may be in communication with at least one of the first opening 111 and the second opening 112, and the second air guiding passage 102 may not be in communication with both the first opening 111 and the second opening 112.
In this implementation, as shown in fig. 3, the body 110 may further include: a third wall 116 and a fourth wall 117. The third wall 116 is connected to the first wall 114 and the second wall 115, and the third wall 116 and the air guide 120 form a third air guide passage 103; the fourth wall 117 is connected to the first wall 114 and the second wall 115, respectively, the fourth wall 117 is disposed opposite to the third wall 116, and the fourth wall 117 and the air guide 120 form a fourth air guide channel 104; so that the air can also flow in the third wind guiding channel 103 and the fourth wind guiding channel 104, and the resistance of the air flowing between the first opening 111 and the second opening 112 is reduced.
Here, the third air guiding passage 103 may be in communication with at least one of the first opening 111 and the second opening 112, and the third air guiding passage 103 may not be in communication with both the first opening 111 and the second opening 112.
Here, the fourth air guiding passage 104 may be in communication with at least one of the first opening 111 and the second opening 112, and the fourth air guiding passage 104 may not be in communication with both the first opening 111 and the second opening 112.
As an example, as shown in fig. 3, the body 110 may further include: a fifth wall 118 and a sixth wall 119. The fifth wall 118 is connected to the first wall 114 and the second wall 115, respectively, the fifth wall 118 is connected to the third wall 116 and the fourth wall 117, respectively, and the sixth air guiding channel 106 is formed between the fifth wall 118 and the air guiding body 120; the sixth wall 119 is connected to the first wall 114 and the second wall 115, the sixth wall 119 is connected to the third wall 116 and the fourth wall 117, the sixth wall 119 is disposed opposite to the fifth wall 118, and the seventh air guiding channel 107 is formed between the sixth wall 119 and the air guiding body 120.
Here, the first opening 111 may be disposed on the fifth wall 118, and the second opening 112 may be disposed on the sixth wall 119.
Here, the second wind guide passage 102, the third wind guide passage 103, the fourth wind guide passage 104, the sixth wind guide passage 106, and the seventh wind guide passage 107 are respectively communicated so as to reduce resistance to the flow of the gas between the first opening 111 and the second opening 112.
Of course, at least one or at least two of the second air guiding channel 102, the third air guiding channel 103, the fourth air guiding channel 104, the sixth air guiding channel 106 and the seventh air guiding channel 107 may be provided; at this time, at least one or at least two of the second wall 115, the third wall 116, the fourth wall 117, the fifth wall 118, and the sixth wall 119 may form a gap with the air guide 120, and the remaining walls may be connected to the air guide 120.
The heat abstractor of the embodiment of this application includes: a body 110 having a first receiving cavity 101, a first opening 111 and a second opening 112 for dissipating heat from the heat generating component; the air guide body 120 is arranged in the first accommodating cavity 101 and is provided with a first air guide channel; at least part of the first air guide channel is bent; gas can flow in the first opening 111, the first wind guide channel and the second opening 112; the air guide body 120 has the first curved air guide channel, so that the path and the flowing time of the air flowing in the body 110 can be increased, the air and the body 110 can exchange heat more sufficiently, and the heat dissipation capability of the heat dissipation device is greatly improved.
The embodiment of the present application further describes an electronic device, which includes the heat generating component of the heat dissipation apparatus implemented in the present application: the heat dissipation device is used for dissipating heat of the heating component.
Here, the heat sink may be in direct contact with the heat generating component, or may be in contact with the heat generating component through a heat conductive pad.
In the embodiments of the present application, the structure of the electronic device is not limited. For example, the electronic device may be a computer or a mobile phone.
In some optional implementations of embodiments of the present application, as shown in fig. 6, the electronic device may further include: a housing 210 and a fan 220. The housing 210 has a second accommodating chamber 201, a first air outlet 211 and a second air outlet 212; the heat dissipation device and the heat generating component are located in the second accommodating cavity 201; the fan 220 is disposed in the second accommodating cavity 201, the fan 220 is configured to drive a first portion of air to be discharged from the first air outlet 211, and the fan 220 is configured to drive a second portion of air to be discharged through the first opening 111, the first air guiding channel, the second opening 112, and the second air outlet 212; so that the fan 220 can drive the first part of air to realize heat dissipation with other structures, and can drive the second part of air to dissipate heat from the heat dissipation device to the heat generation component.
In the present implementation, the structure of the housing 210 is not limited. For example, the housing 210 may have a rectangular parallelepiped structure.
In this implementation, the first outlet 211 and the second outlet 212 may be disposed on the same side of the housing 210, as shown in fig. 6. Of course, the first outlet 211 and the second outlet 212 may also be disposed on different sides of the housing 210.
In this implementation, the structure of the fan 220 is not limited, as long as the fan 220 can drive the first portion of air to be guided out from the first air outlet 211 and drive the second portion of air to be guided out through the first opening 111, the first air guiding channel, the second opening 112 and the second air outlet 212. For example, the fan 220 may be provided with a first outlet and a second outlet, the first outlet corresponds to the first air outlet 211, the second outlet corresponds to the first opening 111, and the first outlet and the second outlet may be provided on the same side of the fan 220 or on different sides of the fan 220.
In this implementation manner, as shown in fig. 8, the electronic device may further include: a heat pipe 230, a first end of the heat pipe 230 is connected to a first heat-generating element in the heat-generating component, and a second end of the heat pipe 230 is located at the first air outlet 211; the body 110 is connected to a second heat generating component of the heat generating assembly, so that the fan 220 can dissipate heat for the first heat generating component through the heat pipe 230 and also dissipate heat for the second heat generating component through the body 110.
Of course, the heat pipe 230 and the body 110 can also dissipate heat for the same heat generating member. As shown in fig. 7, the electronic device may further include: a heat pipe 230, a first end of the heat pipe 230 is connected to the heat generating component and the body 110, respectively, and a second end of the heat pipe 230 is located at the first air outlet 211; at this time, the heat of the heat generating component can be transferred to both the heat pipe 230 and the body 110.
In some optional implementations of embodiments of the present application, as shown in fig. 9, the electronic device may further include: a housing 210 and a fan 220. The housing 210 has a second receiving chamber 201, a first air outlet 211, and a first air inlet 213; the heat dissipation device and the heat generating component are located in the second accommodating cavity 201; the fan 220 is disposed in the second accommodating cavity 201, the fan 220 is configured to drive air to be introduced through the first air inlet 213, the second opening 112, the first air guiding channel and the first opening 111, and the fan 220 is configured to drive the introduced air to be discharged from the first air outlet 211; so that the fan 220 can lead the air into the heat sink through the first air inlet 213 and dissipate the heat of the heat generating component based on the heat sink; meanwhile, the fan 220 can also dissipate heat for other structures through the first air outlet 211.
In the present implementation, the structure of the housing 210 is not limited. For example, the housing 210 may have a rectangular parallelepiped structure.
In this implementation, the first air outlet 211 and the first air inlet 213 may be disposed on the same side of the housing 210, as shown in fig. 9. Of course, the first outlet 211 and the first inlet 213 may be disposed on different sides of the housing 210.
In this implementation, the structure of the fan 220 is not limited as long as the fan 220 can drive air to be introduced into the heat sink from the first air inlet 213. For example, the housing 210 may be further provided with a second air inlet, and the fan 220 may drive air to be introduced from the first air inlet 213 and the second air inlet. The first air inlet 213 and the second air inlet may be disposed on the same side of the fan 220, or may be disposed on different sides of the fan 220.
In this implementation, the electronic device may further include: a heat pipe 230, a first end of the heat pipe 230 is connected to a first heat-generating element in the heat-generating component, and a second end of the heat pipe 230 is located at the first air outlet 211; the body 110 is connected to a second heat generating component of the heat generating assembly, so that the fan 220 can dissipate heat for the first heat generating component through the heat pipe 230 and also dissipate heat for the second heat generating component through the body 110.
Of course, the heat pipe 230 and the body 110 can also dissipate heat for the same heat generating member. For example, the electronic device may further include: a heat pipe 230, a first end of the heat pipe 230 is connected to the heat generating component and the body 110, respectively, and a second end of the heat pipe 230 is located at the first air outlet 211; at this time, the heat of the heat generating component can be transferred to both the heat pipe 230 and the body 110.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A heat dissipation device, the heat dissipation device comprising:
the body is provided with a first accommodating cavity, a first opening and a second opening and is used for radiating heat of the heating assembly;
the air guide body is arranged in the first accommodating cavity and is provided with a first air guide channel; at least part of the first air guide channel is bent;
gas can flow within the first opening, the first wind-directing channel, and the second opening.
2. The heat dissipation device of claim 1, the body comprising:
the first wall body is connected with the air guide body and is used for being connected with the heating component;
the second wall body is arranged at intervals with the first wall body;
the air guide body is positioned between the first wall body and the second wall body, and a second air guide channel is formed between the air guide body and the second wall body.
3. The heat dissipation device of claim 2, the body further comprising:
the third wall body is respectively connected with the first wall body and the second wall body, and a third air guide channel is formed between the third wall body and the air guide body;
and the fourth wall body is respectively connected with the first wall body and the second wall body, is arranged opposite to the third wall body, and forms a fourth air guide channel with the air guide body.
4. The heat dissipating device as claimed in claim 1, wherein the air guide body and the main body are formed as an integral structure by sintering;
the body and the air guide body are made of copper.
5. The heat dissipating device as claimed in claim 4, wherein the air guide body is formed by sintering metal powder; and/or the presence of a gas in the gas,
the air guide body is formed by sintering metal wires.
6. The heat dissipating device as claimed in any one of claims 1 to 5, wherein the air guide member includes:
the first strip-shaped part is provided with a first strip-shaped part,
the second strip-shaped part is different from the first strip-shaped part in cross section and forms the air guide body with the first strip-shaped part in a staggered mode.
7. An electronic device comprising the heat generating component of the heat dissipating apparatus of any of claims 1 to 6:
the heat dissipation device is used for dissipating heat of the heating component.
8. The electronic device of claim 7, further comprising:
the shell is provided with a second accommodating cavity, a first air outlet and a second air outlet; the heat dissipation device and the heating component are positioned in the second accommodating cavity;
the fan is arranged in the second accommodating cavity, is used for driving a first part of gas to be led out from the first air outlet and is used for driving a second part of gas to be led out through the first opening, the first air guide channel, the second opening and the second air outlet;
the air guide body is used for absorbing noise of the electronic equipment.
9. The electronic device of claim 8, further comprising: the first end of the heat pipe is respectively connected with the heating component and the body, and the second end of the heat pipe is positioned at the first air outlet; or the like, or, alternatively,
the electronic device further includes: a first end of the heat pipe is connected with a first heating element in the heating assembly, and a second end of the heat pipe is positioned at the first air outlet; the body is connected with a second heating piece in the heating assembly.
10. The electronic device of claim 7, further comprising:
the shell is provided with a second accommodating cavity, a first air outlet and a first air inlet; the heat dissipation device and the heating assembly are positioned in the second accommodating cavity;
the fan is arranged in the second accommodating cavity and used for driving gas to pass through the first air inlet, the second opening, the first wind guide channel and the first opening, and the fan is used for driving the guided gas to be guided out from the first air outlet.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210112789.4A CN114599204A (en) | 2022-01-29 | 2022-01-29 | Heat dissipation device and electronic equipment |
| CN202410177171.5A CN117979649A (en) | 2022-01-29 | 2022-01-29 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210112789.4A CN114599204A (en) | 2022-01-29 | 2022-01-29 | Heat dissipation device and electronic equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410177171.5A Division CN117979649A (en) | 2022-01-29 | 2022-01-29 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114599204A true CN114599204A (en) | 2022-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210112789.4A Pending CN114599204A (en) | 2022-01-29 | 2022-01-29 | Heat dissipation device and electronic equipment |
| CN202410177171.5A Pending CN117979649A (en) | 2022-01-29 | 2022-01-29 | Electronic equipment |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410177171.5A Pending CN117979649A (en) | 2022-01-29 | 2022-01-29 | Electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208188562U (en) * | 2018-04-28 | 2018-12-04 | 深圳暴风统帅科技有限公司 | A kind of projection device and its cooling system |
| CN110601046A (en) * | 2019-09-16 | 2019-12-20 | 广州供电局有限公司 | Heat dissipation mechanism and electric energy quality control device |
| CN210959282U (en) * | 2019-12-06 | 2020-07-07 | 深圳伊莱克电子有限公司 | Air duct system |
| CN214376276U (en) * | 2021-09-08 | 2021-10-08 | 深圳华储信息技术开发有限公司 | Heat dissipation device for server case and server case |
-
2022
- 2022-01-29 CN CN202210112789.4A patent/CN114599204A/en active Pending
- 2022-01-29 CN CN202410177171.5A patent/CN117979649A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208188562U (en) * | 2018-04-28 | 2018-12-04 | 深圳暴风统帅科技有限公司 | A kind of projection device and its cooling system |
| CN110601046A (en) * | 2019-09-16 | 2019-12-20 | 广州供电局有限公司 | Heat dissipation mechanism and electric energy quality control device |
| CN210959282U (en) * | 2019-12-06 | 2020-07-07 | 深圳伊莱克电子有限公司 | Air duct system |
| CN214376276U (en) * | 2021-09-08 | 2021-10-08 | 深圳华储信息技术开发有限公司 | Heat dissipation device for server case and server case |
Also Published As
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|---|---|
| CN117979649A (en) | 2024-05-03 |
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