CN114585251A - Binding device and binding method - Google Patents
Binding device and binding method Download PDFInfo
- Publication number
- CN114585251A CN114585251A CN202210140264.1A CN202210140264A CN114585251A CN 114585251 A CN114585251 A CN 114585251A CN 202210140264 A CN202210140264 A CN 202210140264A CN 114585251 A CN114585251 A CN 114585251A
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- binding
- anisotropic conductive
- conductive adhesive
- pin
- magnetic plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Abstract
The application provides a binding device and a binding method, which are used for binding at least two binding pieces with anisotropic conductive adhesive as binding media. The binding method comprises the following steps: arranging a first binding piece, anisotropic conductive adhesive and a second binding piece between the pressure head and the magnetic plate, so that the anisotropic conductive adhesive is positioned between the first pin and the second pin, the second binding piece is positioned on one side of the first binding piece close to the pressure head, and the magnetic attraction part is aligned with the first pin and/or the second pin; starting the heating component and the magnetic plate to enable the conductive particles in the anisotropic conductive adhesive to gather towards the magnetic attraction part; and opening the pressure head, and pressing the first binding piece, the anisotropic conductive adhesive and the second binding piece. The binding device and the binding method can achieve high-conduction low-impedance binding.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a binding apparatus and a binding method.
Background
Currently, a commonly used bonding medium for bonding a Flexible Printed Circuit board (FPC) or a Chip On Film (COF) On a display screen is Anisotropic Conductive Film (ACF). During binding, the conductive particles in the anisotropic conductive adhesive are connected with an upper pin (Lead) and a lower pin (Lead) to be conducted, so that the binding region is conducted in the upper and lower directions and is not conducted in the horizontal direction, and one-to-one input of signals is realized. Generally, the binding quality is measured by the binding impedance, which is related to the number of effective conductive particles. The larger the number of conductive particles in the lead region and the smaller the number of conductive particles in the non-lead region, the lower the binding impedance. In order to reduce the binding impedance, a known method is to use an array-type anisotropic conductive adhesive, in which conductive particles of the array-type anisotropic conductive adhesive are densely distributed, and a sufficient number of conductive particles can be captured in a small connection area, so that the number of conductive particles of each pin is increased, thereby improving the conductivity and reducing the heat generation in the binding area. However, the current array anisotropic conductive adhesive is monopolized by a material manufacturer, the material cost is very high, and no second supplier is reserved, which is not beneficial to the mass production of display screens. Therefore, there is a need for a new bonding apparatus and bonding method that reduces the bonding impedance.
Disclosure of Invention
The application provides a binding device and a binding method capable of reducing binding impedance.
The application provides a binding apparatus for binding of at least two binding pieces of anisotropic conductive adhesive as a binding medium, which includes:
a magnetic plate including a magnetic attraction portion configured to attract the conductive particles in the anisotropic conductive paste;
the pressure head is arranged on one side of the electromagnetic substrate and is configured to press the at least two binding pieces and the anisotropic conductive adhesive; and
a heating part configured to heat the anisotropic conductive paste.
In one embodiment, the magnetic plate includes a plurality of the magnetic attraction portions and at least one non-attraction portion, and each non-attraction portion is located between two adjacent magnetic attraction portions.
In one embodiment, the magnetic plate is a magnetic attraction portion as a whole.
In one embodiment, the magnetic plate is further configured to carry the at least two bindings or;
the binding device further comprises a carrying table, the carrying table is used for bearing the binding piece, the magnetic plate is arranged on one side of the carrying table far away from the pressure head or inside the carrying table, or the magnetic plate is the carrying table.
In one embodiment, the heating element is located in the ram.
The present application further provides a binding method for binding at least two binding members using anisotropic conductive adhesive as a binding medium, the at least two binding members including a first binding member and a second binding member, the first binding member including a first pin, the second binding member including a second pin, which is performed using the binding apparatus as described above, the binding method including the steps of:
arranging the first binding piece, the anisotropic conductive adhesive and the second binding piece between the pressure head and the magnetic plate, so that the anisotropic conductive adhesive is positioned between the first pin and the second pin, the second binding piece is positioned on one side of the first binding piece close to the pressure head, and the magnetic attraction part is aligned with the first pin and/or the second pin;
opening the heating component and the magnetic plate to enable the conductive particles in the anisotropic conductive adhesive to gather to the magnetic attraction part; and
and opening the pressure head, and pressing the first binding piece, the anisotropic conductive adhesive and the second binding piece.
In one embodiment, after the step of opening the pressing head, pressing the first binding member, the anisotropic conductive adhesive, and the second binding member, the method further includes:
and starting the heating part, and heating and curing the anisotropic conductive adhesive.
In one embodiment, the heating member is kept in an open state for a period of time from opening the magnetic plate to pressing the first binding member, the anisotropic conductive adhesive, and the second binding member.
In one embodiment, the first binding is a display panel, and the second binding is a flexible circuit board or a chip on film.
In one embodiment, the binding is performed using a binding device in which the magnetic plate is entirely a magnetically attractive part, and the first pin and/or the second pin comprise soft magnetic metal.
The binding device and the binding method adopt the magnetic field to assist the orientation of the conductive particles, the conductive particles are gathered in the pin area of the binding piece, and the non-pin area is sparsely distributed. The method can replace array anisotropic conductive adhesive, and can realize the aggregation of high-density conductive particles on a very small connection area by using the traditional low-cost distributed anisotropic conductive adhesive, thereby realizing the binding of high conduction and low resistance, reducing the cost and improving the yield.
Drawings
Fig. 1 is a diagram of a state of use of a binding apparatus according to an embodiment of the present application in binding a binding.
Fig. 2 is a state view of a binding apparatus according to another embodiment of the present application in use for binding a binding.
Fig. 3 is a diagram of a state of use of a binding apparatus according to still another embodiment of the present application in binding a binding.
Fig. 4 is a flow chart of a binding method of the present application.
Fig. 5 is a schematic diagram illustrating a step of pressing the first binding member, the anisotropic conductive adhesive, and the second binding member in the binding method of the present application.
Detailed Description
The technical solutions in the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application, are within the scope of protection of the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features directly, or may comprise the first and second features not being directly connected but being in contact with each other by means of further features between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.
Referring to fig. 1, the present application provides a binding apparatus 100 for binding at least two binding members using an anisotropic conductive adhesive 400 as a binding medium. The at least two binding pieces comprise any two of a display panel, an FPC and a COF. That is, the binding device 100 may be used for binding the display panel to the FPC, binding the display panel to the COF, or binding the FPC to the COF. For convenience of explanation, fig. 1 shows a first binding member 200, a second binding member 300, and an anisotropic conductive adhesive 400 in addition to the binding apparatus 100. Wherein the first binding 200 includes a plurality of first pins 210 spaced apart from each other, and the second binding 300 includes a plurality of second pins 310 spaced apart from each other. Optionally, the first pins 210 and the second pins 310 are arranged in a one-to-one correspondence. The first lead 210 and the second lead 310 are bonded by the anisotropic conductive adhesive 400.
The binding apparatus 100 includes a magnetic plate 10, a pressing head 20, and a heating member 30. The magnetic plate 10 includes a magnetic attraction portion 11, and the magnetic attraction portion 11 is configured to attract the conductive particles in the anisotropic conductive paste 400. The anisotropic conductive paste 400 contains irregularly arranged conductive particles, which are metal particles. Optionally, the periphery of the metal particles is high-hardness nickel-iron alloy with magnetism affinity. The pressing head 20 is disposed at one side of the magnetic plate 10, and configured to press at least two binding members (a first binding member 200 and a second binding member 300) and the anisotropic conductive adhesive 400. The heating member 30 is configured to heat the anisotropic conductive adhesive 400.
When the binding is performed, the first binding member 200 and the second binding member 300 are disposed on the magnetic plate 10, and the magnetic attraction portions 11 correspond to the first pins 210 and/or the second pins 310 one to one. The magnetic attraction portion 11 on the magnetic plate 10 is used for attracting the conductive particles in the anisotropic conductive adhesive 400 to move to the first pin 210 and/or the second pin 310 of the first binding member 200. Alternatively, the magnetic plate 10 includes a plurality of magnetically attracted portions 11 and at least one non-attracted portion 12, and each non-attracted portion 12 is located between two adjacent magnetically attracted portions 11. The magnetic field strength in the magnetic attraction part 11 is enough to generate a sufficient magnetic force with the conductive particles in the anisotropic conductive adhesive 400, and the magnetic force is larger than the resistance inside the adhesive, so that the conductive particles can move in the adhesive under the action of the magnetic force. Alternatively, the magnetic attraction portion 11 may be an electrically controlled magnet block. When the magnetic attraction portion 11 is an electrically controlled magnet block, a circuit for controlling the opening and closing of the electrically controlled magnet block is further provided in the magnetic plate 10.
Alternatively, the magnetic attraction 11 corresponds to the shape and size of the first pin 210 and/or the second pin 310 bound by the binding device 100. Further, the shape and size of the magnetic attraction part 11 are the same as the shape and size of the first pin 210 and/or the second pin 310, or the shape of the magnetic attraction part 11 is the same as the shape of the first pin 210 and/or the second pin 310, and the area is slightly larger than the area of the first pin 210 and/or the second pin 310, so as to better attract the conductive particles to the first pin 210 and/or the second pin 310. Alternatively, the first pin 210 and/or the second pin 310 may be rectangular, and the magnetic attraction portion 11 may also be rectangular.
Due to the mutual spacing between the plurality of first pins 210 and/or second pins 310 on the first binding 200, an insulation is provided. The plurality of magnetic attraction portions 11 are also provided at intervals corresponding to the plurality of first pins 210 and/or the second pins 310. In order to avoid attracting the conductive particles in the anisotropic conductive adhesive 400 to between the adjacent magnetic attraction sections 11, the non-attraction section 12 is provided between the adjacent magnetic attraction sections 11. If the magnetically attracting portion 11 is referred to as a strong magnetic region, the non-attracting portion 12 may be a weak magnetic region or a non-magnetic region, as opposed to a strong magnetic region. The non-attracting portion 12 has a weak or no magnetic field strength, and cannot generate a magnetic force between the conductive particles in the anisotropic conductive paste 400, or generate a magnetic force insufficient to cause the conductive particles to move within the paste against the internal resistance of the paste. Alternatively, the magnetic field strength of the weak magnetic region is considered to be more than one order of magnitude less than the magnetic field strength of the strong magnetic region. The difference in magnetic strength between the magnetically attracting portion 11 and the non-attracting portion 12 is due to the difference in material used. Magnetic metals (such as iron) and non-magnetic metals exist in nature, and when the magnetic plate 10 is manufactured, high-purity magnetic metals can be used at the position of the magnetic attraction part 11, and the non-magnetic metals can be used at the non-attraction part 12 or the content of the magnetic metals is reduced to regulate and control weak magnetism.
Alternatively, when the first lead 210 and/or the second lead 310 include soft magnetic metal, the magnetic plate 10 is entirely the magnetic attraction portion 11. When the soft magnetic metal approaches the ferromagnetic body, the magnetic property is strengthened, and the magnetic property disappears after the ferromagnetic body leaves. The soft magnetic metal may be an alloy of molybdenum titanium and iron cobalt nickel, or the like. In the energized state, the magnetic plate 10 may magnetize the soft magnetic metal of the first lead 210 and/or the second lead 310, so that the first lead 210 and/or the second lead 310 are magnetized, and the conductive particles of the anisotropic conductive adhesive 400 are attracted to be gathered at the first lead 210 and/or the second lead 310. The magnetic plate 10 may be formed as a strong magnetic region in its entirety without distinguishing the magnetically attracting portion 11 from the non-attracting portion 12. In addition, the binding process does not need to align the magnetic plate 10, and the process is simpler.
Optionally, the magnetic plate 10 also serves as a carrier for at least two binding members. That is, the magnetic plate 10 not only plays a role of magnetically attracting the conductive particles, but also plays a role of carrying at least two binding members. When the magnetic plate 10 is used as a carrier, the magnetic attraction portion 11 is only required to be disposed on a part of the magnetic plate 10 corresponding to the first lead 210 and/or the second lead 310, and the rest part is used for carrying at least two binding members.
Referring to fig. 2, in another embodiment of the present application, the binding apparatus 100 may further include a carrier 40 for carrying the binding member, and the magnetic plate 10 is disposed inside the carrier 40. Specifically, the carrier 40 is provided with an opening 40a, and the magnetic plate 10 is fitted in the opening 40a of the carrier 40.
Referring to fig. 3, in another embodiment of the present application, the binding device 100 may further include a carrier 40 for carrying the binding member, and the magnetic plate 10 is disposed on a side of the carrier 40 away from the pressing head 20. The magnetic plate 10 magnetically attracts conductive particles through the stage 40. The magnetic plate 10 may be made of glass, plastic, etc., and will not be magnetized by the magnetic plate 10.
Referring to fig. 1 again, the heating member 30 is used for heating the anisotropic conductive adhesive 400 before lamination, so as to improve the flowability of the anisotropic conductive adhesive 400. On the other hand, the anisotropic conductive paste 400 is cured at a high temperature during the pressing process to form a stable connection of the anisotropic conductive paste 400. The heating member 30 is also used for thermal curing of the anisotropic conductive adhesive 400 during the pressing process. Alternatively, the heating member 30 may be integrated into the ram 20. Specifically, a heating wire may be provided in the indenter 20 as the heating member 30. In another embodiment of the present application, the heating member 30 may be provided separately from the indenter 20. Optionally, the binding device 100 further comprises a temperature control device (not shown) coupled to the heating device 30, which can detect the temperature of the indenter 20 and control the temperature of the indenter 20 by adjusting the power of the heating device 30.
It is understood that the binding device 100 of the present application may further include a ram control assembly (not shown), etc. The ram control assembly is used to control the movement of the ram 20, for example, to control the movement of the ram 20 in a plane perpendicular to the magnetic plate 10, and to apply pressure to the first binding member 200, the second binding member 300, and the anisotropic conductive adhesive 400 on the magnetic plate 10.
Referring to fig. 4, the present application also provides a binding method for binding at least two binding members using the anisotropic conductive paste 400 as a binding medium, which is performed using the binding apparatus 100 as above. The at least two binding pieces comprise any two of a display panel, an FPC and a COF. That is, the binding device 100 may be used for binding the display panel to the FPC, binding the display panel to the COF, or binding the FPC to the COF. Specifically, the at least two bindings include a first binding 200 and a second binding 300. The first binding 200 includes a plurality of first pins 210 spaced apart from each other, and the second binding 300 includes a plurality of second pins 310 spaced apart from each other. The first pins 210 and the second pins 310 are arranged in a one-to-one correspondence. The first lead 210 and the second lead 310 are bonded by the anisotropic conductive adhesive 400.
The binding method comprises the following steps:
101: referring to fig. 1 again, the first binding member 200, the anisotropic conductive adhesive 400 and the second binding member 300 are disposed between the pressure head 20 and the magnetic plate 10, such that the anisotropic conductive adhesive 400 is located between the first pins 210 and the second pins 310, the second binding member 300 is located on a side of the first binding member 200 close to the pressure head 20, and the magnetic attraction portion 11 is aligned with the first pins 210 and/or the second pins 310.
Optionally, the first bonding member 200 is a display panel, and the second bonding member 300 is a flip-chip film.
In step 101, after the anisotropic conductive adhesive 400 is attached and the first binding member 200 and the second binding member 300 are aligned, the binding apparatus 100 may be aligned, specifically, the following steps may be performed:
1011: the anisotropic conductive adhesive 400 is disposed on the first pin 210 of the first binding member 200 (i.e., a pre-attaching step of the anisotropic conductive adhesive 400).
1012: a second binding 300 is disposed on a side of the anisotropic conductive paste 400 away from the first lead 210 such that the second lead 310 is opposite to the first lead 210 (i.e., a pre-binding/pre-pressing step).
1013: the first binding member 200, the anisotropic conductive adhesive 400, and the second binding member 300 are disposed between the indenter 20 and the magnetic plate 10 and aligned.
In one embodiment, the magnetic plate 10 can be used as a carrier 40 for binding the material, in another embodiment, the magnetic plate 10 is located inside the carrier 40, and in yet another embodiment, the magnetic plate 10 is disposed on a side of the carrier 40 away from the first binding 200.
Alternatively, in one embodiment, the magnetic plate 10 includes a plurality of magnetically attracted portions 11 and non-attracted portions 12 located between adjacent magnetically attracted portions 11. The magnetic attraction portion 11 is aligned with the first lead 210 and/or the second lead 310.
Alternatively, in another embodiment, the first pin 210 and/or the second pin 310 include soft magnetic metal, and the magnetic plate 10 is entirely made of the magnetic attraction portion 11, so that the alignment between the magnetic attraction portion 11 and the first pin 210 and/or the second pin 310 is not required, or the alignment between the magnetic attraction portion 11 and the first pin 210 and/or the second pin 310 is completed only by disposing the first binding member 200 on the magnetic plate 10.
It should be understood that the steps in step 101 are not limited to 1011 to 1013 described above, and the first binding member 200 may be first disposed on the magnetic plate 10, and then the anisotropic conductive adhesive 400 and the second binding member 300 may be disposed.
102: the heating member 30 and the magnetic plate 10 are turned on to gather the conductive particles in the anisotropic conductive paste 400 toward the magnetic attraction section 11.
In one embodiment, the magnetic plate 10 is an electrically controlled magnet, and the magnetic plate 10 needs to be turned on by turning on a control circuit connected to the magnetic plate 10.
In step 102, the heating member 30 is turned on to heat the anisotropic conductive adhesive 400, so as to improve the fluidity of the anisotropic conductive adhesive 400 and facilitate the movement of the conductive particles. The magnetic plate 10 may be turned on before, after, or simultaneously with the heating member 30. In order to save energy, the magnetic plate 10 may be turned on after the heating member 30 is turned on for a certain period of time. After the magnetic plate 10 is turned on, the magnetic attraction portion 11 on the magnetic plate 10 can attract the conductive particles in the anisotropic conductive adhesive 400 to the position of the anisotropic conductive adhesive 400 corresponding to the magnetic attraction portion 11, and since the magnetic attraction portion 11 is aligned with the first lead 210, the conductive particles are attracted to the position of the magnetic attraction portion 11, that is, the position of the anisotropic conductive adhesive 400 corresponding to the first lead 210 and/or the second lead 310. Alternatively, the magnetic attraction portion 11 on the magnetic plate 10 magnetizes the first pin 210 and/or the second pin 310, and the magnetized first pin 210 and/or second pin 310 attract the conductive particles in the anisotropic conductive paste 400 to the position corresponding to the first pin 210 and/or the second pin 310 in the anisotropic conductive paste 400. As a result, the conductive particles are collected in the lead area of the bonding member and sparsely distributed in the non-lead area.
103: referring to fig. 5, the pressing head 30 is opened, and the first binding member 200, the anisotropic conductive adhesive 400, and the second binding member 300 are pressed.
In step 103, the pressing head control assembly may move the pressing head 20 toward the magnetic plate 10 and press the first binding member 200, the anisotropic conductive adhesive 400, and the second binding member 300. When the conductive particles move to the right position, the pressure head 20 applies pressure, and the conductive particles penetrate into the first pin 210 and the second pin 310, so as to complete conduction.
Optionally, in one embodiment, the heating member 30 is integrated into the indenter 20, and in step 102, the indenter 20 is attached to or adjacent to the second binding 300, thereby heating the anisotropic conductive adhesive 400. In step 103, the pressing head 20 is moved further toward the magnetic plate 10 to perform the pressing.
After step 103, further comprising:
104: the heating member 30 is turned on to heat and cure the anisotropic conductive adhesive 400.
In step 104, the resin in the anisotropic conductive adhesive 400 is cured at a high temperature by heating at a high temperature, so that the first binding member 200 and the second binding member 300 are stably connected.
Optionally, in steps 102 to 104, the heating member 30 is kept in the on state. In other words, the heating member 30 is always turned on for a period of time from turning on the magnetic plate 10 to pressing the first binding member 200, the anisotropic conductive adhesive 400, and the second binding member 300.
According to the binding method, the magnetic field is adopted to assist the orientation of the conductive particles, the conductive particles are gathered in the pin area of the binding piece, and the non-pin area is sparsely distributed. The method can replace array anisotropic conductive adhesive, and can realize the aggregation of high-density conductive particles on a very small connection area by using the traditional low-cost distributed anisotropic conductive adhesive, thereby realizing the binding of high conduction and low resistance, reducing the cost and improving the yield.
Moreover, the organic light emitting diode display screen has higher impedance relative to the liquid crystal display screen, the binding area generates heat seriously, and the risk of burning exists. When the organic light emitting diode display screen and the COF/FPC are bound by adopting the binding mode, the binding impedance is reduced, and the burn risk of the COF/FPC can be reduced.
The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A binding apparatus for binding at least two binding members with an anisotropic conductive adhesive as a binding medium, comprising:
a magnetic plate including a magnetic attraction portion configured to attract the conductive particles in the anisotropic conductive paste;
the pressure head is arranged on one side of the electromagnetic substrate and is configured to press the at least two binding pieces and the anisotropic conductive adhesive; and
a heating member configured to heat the anisotropic conductive paste.
2. The binding apparatus of claim 1, wherein the magnetic plate comprises a plurality of the magnetically attractive portions and at least one non-attractive portion, each non-attractive portion being located between two adjacent magnetically attractive portions.
3. The binding apparatus of claim 1, wherein the magnetic plate is entirely a magnetically attractable portion.
4. The binding apparatus of claim 1, wherein the magnetic plate is further configured to carry the at least two binding members or;
the binding device further comprises a carrying platform, the carrying platform is used for bearing the binding piece, and the magnetic plate is arranged on one side, away from the pressure head, of the carrying platform or inside the carrying platform.
5. The binding apparatus of claim 1, wherein the heating element is located in the indenter.
6. A binding method for binding at least two bindings with an anisotropic conductive glue as a binding medium, the at least two bindings including a first binding and a second binding, the first binding including a first pin and the second binding including a second pin, characterized in that it is performed using a binding apparatus according to any of claims 1 to 5, the binding method comprising the steps of:
arranging the first binding piece, the anisotropic conductive adhesive and the second binding piece between the pressure head and the magnetic plate, so that the anisotropic conductive adhesive is positioned between the first pin and the second pin, the second binding piece is positioned on one side of the first binding piece close to the pressure head, and the magnetic attraction part is aligned with the first pin and/or the second pin;
opening the heating component and the magnetic plate to enable the conductive particles in the anisotropic conductive adhesive to gather to the magnetic attraction part; and
and opening the pressure head, and pressing the first binding piece, the anisotropic conductive adhesive and the second binding piece.
7. The method of claim 6, further comprising, after the activating the ram and pressing the first binding member, the anisotropic conductive adhesive, and the second binding member together:
and starting the heating part, and heating and curing the anisotropic conductive adhesive.
8. The binding method according to claim 7, wherein the heating member is kept in an on state for a period of time from when the magnetic plate is turned on to when the first binding member, the anisotropic conductive adhesive, and the second binding member are pressed.
9. The bonding method according to claim 6, wherein the first bonding member is a display panel, and the second bonding member is a flexible circuit board or a chip on film.
10. The binding method according to claim 6, performed using the binding apparatus according to claim 3, wherein the first pin and/or the second pin comprises a soft magnetic metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210140264.1A CN114585251A (en) | 2022-02-16 | 2022-02-16 | Binding device and binding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210140264.1A CN114585251A (en) | 2022-02-16 | 2022-02-16 | Binding device and binding method |
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| CN114585251A true CN114585251A (en) | 2022-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210140264.1A Pending CN114585251A (en) | 2022-02-16 | 2022-02-16 | Binding device and binding method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117440613A (en) * | 2023-10-24 | 2024-01-23 | 东莞市德普特电子有限公司 | MFOF binding back pressure method and structure of OLED wearing product |
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| CN113199134A (en) * | 2021-06-23 | 2021-08-03 | 昆山国显光电有限公司 | Bonding device and bonding method |
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| JPH0669643A (en) * | 1992-08-19 | 1994-03-11 | Sony Corp | Connecting method and connector of conductor and anisotropic conductive film for use therein |
| TW200408037A (en) * | 2002-11-07 | 2004-05-16 | Au Optronics Corp | Fixing device and method of integrated circuit chip |
| US20140205851A1 (en) * | 2013-01-23 | 2014-07-24 | Ravindranath V. Mahajan | Magnetic contacts for electronics applications |
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| CN117440613A (en) * | 2023-10-24 | 2024-01-23 | 东莞市德普特电子有限公司 | MFOF binding back pressure method and structure of OLED wearing product |
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