CN114583545A

CN114583545A - Mechanism suitable for butterfly laser lead wire takes shape

Info

Publication number: CN114583545A
Application number: CN202210200522.0A
Authority: CN
Inventors: 廖定波; 胡岚; 杜连芳; 唐香琼
Original assignee: CETC 34 Research Institute
Current assignee: CETC 34 Research Institute
Priority date: 2022-03-03
Filing date: 2022-03-03
Publication date: 2022-06-03

Abstract

The invention discloses a mechanism suitable for forming a butterfly laser lead, which comprises a base, a lower die, a U-shaped fixing block, an upper die and a pressing plate which are sequentially overlapped from bottom to top, wherein a stepped laser placing concave table is arranged in the middle of the lower die, a first base and a second base which are the same in specification are respectively arranged on the lower die on two sides of the laser placing concave table, a group of lead guide holes with central hole lines vertical to the axis of the laser placing concave table are arranged in the lower die between the first base and the laser placing concave table, the fixing block is arranged above the lead guide holes, a first base and a second base are respectively arranged on two side edges of the upper die, and the axis of the pressing plate is vertical to the axis of the laser placing concave table. The mechanism effectively reduces the damage of the component during lead forming and improves the coplanarity problem of the device leads; moreover, the mechanism changes the welding method of the butterfly laser, so that the welding reliability is effectively improved; and the structure is simple, the processing is easy, the operation is simple and convenient, the cost is low, and the carrying is easy.

Description

Mechanism suitable for butterfly laser lead wire takes shape

Technical Field

The invention relates to a lead forming tool in the electronic assembly technology, in particular to a mechanism suitable for forming a lead of a butterfly laser.

Background

The butterfly laser is also called DFB laser and DFB butterfly laser. The laser is a specific wavelength laser, and is generally sealed and packaged by a 14-pin butterfly-shaped tube shell, and a thermoelectric refrigerator, a thermistor, a monitoring photodiode, an optical isolator and the like are arranged in the laser. The laser has the characteristics of selectable ITU wavelength, high output power, lower temperature coefficient, accurate wavelength selection and built-in optical isolator. Since the laser has the advantages as above, the laser is generally applied to a long-distance dense wavelength division multiplexing system, a local area network, a wide area network, a domain area network, and the like.

The butterfly laser is a type of generally 14-pin butterfly-shaped tube shell sealing packaging component, and its lead wire can reserve length when leaving the factory, and the lead wire is softer, and it need fasten in the structure just can weld usually moreover, and this has just led to easily to have the unable complete laminating condition of pin and pad, so need carry out shaping processing to the lead wire under the ordinary condition before the device installation. The conventional lead forming method generally comprises the steps of clamping a butterfly laser device body by using a common tool such as flat tongs or tweezers, bending and forming leads at two sides to a certain point between starting points by using the tweezers, and finally, visually observing whether pins conform to the size of a bonding pad or not. The disadvantages of this conventional method are:

the device body or the lead is often damaged by indentation or deformation due to the fact that tools such as flat tongs and tweezers are used for clamping the device body and bending the device lead in the operation process.

Secondly, the method does not have a proper measuring tool, only depends on the traditional manual method for forming, and often cannot ensure that the conditions of the distance from the bending starting point to the sealing position of the device body terminal, the bending radius of a lead, the installation height of a component and the like meet the relevant process standard requirements;

the butterfly laser lead wire is softer and has certain elasticity, and the lead wire warp and the poor condition of lead wire coplanarity after the lead wire shaping can appear owing to the lead wire characteristics of device in traditional mode, this problem that just leads to the device to be difficult to handle the accuse to printed circuit board installation pad assorted demand after shaping.

The traditional surface-mounted device welding mode is generally adopted by the butterfly laser, the forming effect of the lead of the butterfly laser is poor, and the problem of poor reliability of the welding spot of the device can occur after a long time.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provides a butterfly laser lead forming mechanism, so that a butterfly laser is converted from a device surface-mount welding mode to a device through hole welding mode. The damage of the component during lead forming is effectively reduced and the problem of coplanarity of the device leads is improved through the mechanism; moreover, the mechanism changes the welding method of the butterfly laser, so that the welding reliability is effectively improved; and the structure is simple, the processing is easy, the operation is simple and convenient, the cost is low, and the carrying is easy.

The technical scheme for realizing the purpose of the invention is as follows:

a mechanism suitable for forming a butterfly laser lead comprises a base, a lower die, a U-shaped fixed block, an upper die and a pressing plate which are sequentially overlapped from bottom to top, the middle part of the lower die is provided with a stepped laser placing concave station, the lower die at the two sides of the laser placing concave station is respectively provided with a first base and a second base with the same specification, the first base and the laser placing concave station are in the same direction, a group of lead guide holes with central hole lines vertical to the axis of the laser placing concave table are arranged in the lower die between the first base and the laser placing concave table, the fixing block is arranged above the lead guide holes, the edges of two sides of the upper die are respectively provided with a first base station and a second base station, when the upper die is arranged on the lower die, the first base station and the second base station respectively extend into the first base and the second base to form a crimping area, and the axis of the pressing plate is perpendicular to the axis of the laser placing concave table.

The number of the lead guide holes is the same as that of the leads of the butterfly laser, so that inconsistency in lead forming is avoided.

The inner sides of the first base station and the second base station are provided with chamfers, so that the lead is prevented from generating indentation.

The laser placing concave table comprises a first ladder and two second ladders which are symmetrical by taking the first ladder as a central line, the first ladder penetrates through the lower die, and the butterfly laser is prevented from being damaged.

When the butterfly laser lead is formed, the base and the lower die are fixed into a forming lower die through a fastener, the upper die and the pressing plate are fixed into a forming upper die through a fastener, the butterfly laser is placed in a laser placing concave table of the lower die, the lead correspondingly penetrates through the lead guide hole, the fixing block and the forming lower die are fixed through the fastener, and a U-shaped opening of the fixing block corresponds to the tail fiber position of the butterfly laser.

First base station, second base station, first base and second base corner all polish.

The working and using process is as follows:

step 1, fixing an upper die and a pressure plate through a fastener to finish preparation of a forming upper die;

step 2, fixing the lower die and the base through a fastener to complete preparation of a forming lower die in advance;

step 3, horizontally placing the butterfly laser on a laser placing concave table of the lower die, correspondingly placing the butterfly laser lead into a lead guide hole, then placing a fixing block, enabling a U-shaped opening of the fixing block to correspond to the butterfly laser tail fiber, avoiding the damage of the butterfly laser tail fiber caused by wrong installation, and finally fixing the fixing block and the lower die through a fastener to finish the preparation of the lower die;

step 4, placing the forming lower die in equipment which can apply stress, such as bench clamp or bench drilling machine, operating the equipment to enable the forming upper die to be opposite to the forming lower die, and pressing the forming lower die downwards until the forming upper die is attached to the forming lower die;

and 5, loosening the crimping equipment, taking down the forming upper die and the fixing block, and taking out the butterfly laser to finish the forming of the butterfly laser lead.

Compared with a common forming tool, the technical scheme has the following beneficial aspects: the technical scheme has a novel and simple structure, and the butterfly laser is converted from a surface-mounted welding device into a through-hole welding device by forming an upper die and a lower die and pressing the upper die and the lower die, so that the reliability of a welded welding point is effectively improved, the device and the lead are not obviously indented or deformed by using a model with good coplanar consistency of the lead in a pressing and forming mode, and the forming consistency and safety of the device are improved; then, the safety distance of the formed lead is effectively increased through the lead guide hole by the tool, and the lead at the sealing position of the device terminal is prevented from being damaged by stress in the forming operation process; the most important thing is that the tool can ensure that the formed lead spacing is matched with the mounting hole of the printed circuit board, the occurrence of lead reshaping caused by unmatched forming spacing is reduced, and the tool is simple in structure, easy to process, low in cost compared with large-scale equipment and convenient to carry.

The mechanism effectively reduces the damage of the device when the lead is formed and solves the problem of coplanarity of the device leads, and has the advantages of simple structure, easy processing, simple and convenient operation, low cost and easy carrying.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment;

FIG. 2 is a schematic structural view of an upper forming die in an embodiment;

FIG. 3 is a schematic structural view of a lower forming die in an embodiment;

FIG. 4 is a schematic structural view of a lower mold in the embodiment.

In the figure, 1, a base 2, a lower die 21, a laser placing concave table 211, a first step 212, a second step 22, a first base 23, a second base 24, a lead guide hole 3, a fixing block 4, an upper die 41, a first base 42, a second base 5, a pressing plate 6 and a butterfly laser are arranged.

Detailed Description

The invention is described in further detail below with reference to the following figures and specific examples, but the invention is not limited thereto.

Example (b):

the butterfly laser 6 of the present embodiment is a radial lead component, and the device body is long: 30mm, width: 15mm, height: 8 mm's rectangle structure, its lead length 25mm, the lead wire interval is 2.5mm, and the lead wire diameter is 1.2mm, and printed circuit board sets up that the welding hole diameter is 1.5mm, and the mounting hole interval is 22.5mm, and the crooked starting point of components and parts should be greater than 0.75mm to the distance of terminal seal department.

Referring to fig. 1, a mechanism suitable for forming a butterfly laser lead comprises a base 1, a lower die 2, a U-shaped fixing block 3, an upper die 4 and a pressing plate 5 which are sequentially overlapped from bottom to top, wherein a stepped laser placing concave table 21 is arranged in the middle of the lower die 2, a first base 22 and a second base 23 which are the same in specification are respectively arranged on the lower die 2 at two sides of the laser placing concave table 21, the first base 22 and the laser placing concave table 21 are in the same direction, a group of lead guide holes 24 with central hole lines perpendicular to the axis of the laser placing concave table are arranged in the lower die 2 between the first base 22 and the laser placing concave table 21 and between the second base 23 and the laser placing concave table 21, as shown in fig. 4, the fixing block 3 is arranged above the lead guide holes 24, the edges at two sides of the upper die 4 are respectively provided with a first base 41 and a second base 42, when the upper die 4 is arranged on the lower die 2, the first base 41 and the second base 42 respectively extend into the first base 22 and the second base 23, the crimping zone is formed with the platen 5 axis perpendicular to the laser placement pocket 21 axis.

The number of the lead guide holes 24 is the same as that of the butterfly laser 6.

Chamfers are arranged on the inner sides of the first base 41 and the second base 42.

The laser placing concave 21 includes a first step 211 and two second steps 212 symmetrical about the first step 211 as a central line, and the first step 211 penetrates the lower mold 2.

When the butterfly laser lead is formed, the base 1 and the lower die 2 are fixed into a forming lower die through a fastening piece, the upper die 4 and the pressing plate 5 are fixed into a forming upper die through a fastening piece, the butterfly laser 6 is placed in a laser placing concave table 21 of the lower die 2, the lead correspondingly penetrates through a lead guide hole 24, the fixing block 3 and the forming lower die are fixed through a fastening piece, and a U-shaped opening of the fixing block 3 corresponds to the tail fiber position of the butterfly laser 6.

The corners of the first base 41, the second base 42, the first base 22 and the second base 23 are polished.

The laser placing concave table 21 is used for horizontally placing the butterfly laser 6, wherein the second step 212 of the laser placing concave table 21 sinks by 1.6mm, the heights of the first base table 41 and the second base table 42 of the upper die 4 are both 15mm, the butterfly laser 6 can be effectively prevented from being damaged due to close contact with the upper die 4, 14 lead guide holes 24 are used for placing device leads, the length of each lead guide hole 24 is 1.45mm, the width of each lead guide hole 24 is 1.3mm, the chamfer grinding distance between the first base 22 and the second base 23 is 2.3mm, and the distance from the bending starting point of the device to the sealing position of a terminal is 1.45mm (more than 0.75 mm); in addition, the chamfer grinding distance of the first base 22 and the second base 23 and the setting length of the lead guide hole 24 are 3.75mm and are matched with the designed hole spacing of the printed board.

The working and using process is as follows:

step 1, fixing an upper die 4 and a pressure plate 5 through a fastener to finish preparation of a forming upper die, as shown in fig. 2;

step 2, fixing the lower die 2 and the base 1 through a fastener to complete the preparation of a forming lower die;

step 3, horizontally placing the butterfly laser 6 on a laser placing concave table 21 of the lower die 2, correspondingly placing a lead of the butterfly laser 6 in a lead guide hole 24, then placing a fixing block 3, wherein a U-shaped opening of the fixing block corresponds to a tail fiber of the butterfly laser, so as to avoid damaging the tail fiber of the butterfly laser, fixing the fixing block 3 and the lower die 2 through a fastener, and completing preparation of a lower die to be formed, as shown in fig. 3;

step 4, placing the forming lower die in equipment which can apply stress, such as bench clamp or bench drilling machine, operating the equipment to enable the forming upper die to be opposite to the forming lower die, and pressing the forming lower die downwards until the forming upper die is attached, as shown in fig. 1;

and 5, loosening the crimping equipment, taking down the forming upper die and the fixing block, and taking out the butterfly laser 6 to complete the forming of the butterfly laser lead.

Claims

1. A mechanism suitable for forming a butterfly laser lead is characterized by comprising a base, a lower die, a U-shaped fixed block, an upper die and a pressing plate which are sequentially overlapped from bottom to top, the middle part of the lower die is provided with a stepped laser placing concave station, the lower die at the two sides of the laser placing concave station is respectively provided with a first base and a second base with the same specification, the first base and the laser placing concave station are in the same direction, a group of lead guide holes with central hole lines vertical to the axis of the laser placing concave table are arranged in the lower die between the first base and the laser placing concave table, the fixing block is arranged above the lead guide holes, the edges of two sides of the upper die are respectively provided with a first base station and a second base station, when the upper die is arranged on the lower die, the first base station and the second base station respectively extend into the first base and the second base to form a crimping area, and the axis of the pressing plate is perpendicular to the axis of the laser placing concave table.

2. The mechanism as claimed in claim 1, wherein the number of the lead guide holes is the same as the number of the leads of the butterfly laser.

3. The mechanism as claimed in claim 1, wherein said first and second pedestals have chamfers on their inner sides.

4. The mechanism as claimed in claim 1, wherein said laser placement recess comprises a first step and two second steps symmetrical about the first step.

5. The mechanism as claimed in claim 1, wherein when the butterfly laser lead is formed, the base and the lower die are fixed to form the lower die by a fastening member, the upper die and the pressing plate are fixed to form the upper die by a fastening member, the butterfly laser is placed in the laser placement concave table of the lower die, the lead correspondingly passes through the lead guide hole, the fixing block and the lower forming die are fixed by a fastening member, and the U-shaped opening of the fixing block corresponds to the position of the tail fiber of the butterfly laser.