CN114579386A - Temperature regulation test unit of memory module and memory module test device using the same - Google Patents

Abstract

The invention relates to a temperature regulation test unit of a memory module and a memory module test device using the same, the invention comprises: a test board part installed in the test space, divided into a plurality of memory module installation regions, and capable of installing a plurality of memory modules in the plurality of memory module installation regions; a test box part formed in a manner of surrounding the memory module mounting area; a control box part which is configured at the upper part of the test box part, can move up and down and is used for covering the memory module installation area together with the test box part; a drive section; a rotation shaft portion that rotates in accordance with rotation of the drive portion; a pinion gear part rotating with the rotation of the rotation shaft part; a rack gear part installed to move the control box part up and down by receiving a rotational force of the rotational shaft; and a temperature control unit for detecting the internal temperature of the control box unit and setting the temperature, the temperature control unit including a Peltier element.

Description

Temperature regulation test unit of memory module and memory module test device using the same

Technical Field

The invention relates to a memory module temperature regulation test unit and a memory module test device using the same. And more particularly, to a memory module temperature adjustment test unit capable of controlling temperature and a memory module testing apparatus using the same.

Background

In general, a general server computer uses a relatively large amount of Memory as compared with a desktop computer or a notebook computer, and mainly uses a Memory such as a Registered Dual In-line Memory Module (R-DIMM).

In particular, the server computer is provided with a memory area (zone) including a plurality of memory slots for mounting a plurality of memories, and a memory module including a memory and a temperature sensing element (e.g., a Thermal diode) is mounted in the memory area.

The memory module performs a data processing operation of reading and writing or storing data by being controlled by a Central Processing Unit (CPU) installed in a main board of the server computer.

Further, as is well known, memory modules recently used in Personal Computers (PCs) or servers (servers) are used to process complicated and important data, and thus a high degree of reliability is required. Therefore, in order to satisfy the above-mentioned requirements, it is necessary to previously troubleshoot defects of all active and passive chips (chips) including a memory used in a memory Module and general problems that may occur during Module Assembly (Module Assembly) by performing Burn-in (aging) test at a certain high temperature.

A temperature control device for performing a memory test for a server computer is disclosed in korean registered patent No. 10-1940223 (2019.04.11 publication, hereinafter referred to as patent document 1).

However, in patent document 1, when a plurality of memories are tested simultaneously, even when the target control temperature value is reached, the temperatures at the respective positions are different from each other due to the difference in the positions of the plurality of memories, and the reliability of the test result is further lowered.

Further, patent document 1 requires a considerable time to change from the preset temperature to the initial temperature before the test, and therefore it is difficult to quickly perform the test to which other conditions are applied, resulting in a problem that it is difficult to perform the test within the preset time.

Prior art documents

Patent document

(patent document 0001) Korean registered patent No. 10-1940223

Disclosure of Invention

The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a temperature adjustment test unit for a memory module, which can more accurately control the temperature of the memory module by a plurality of lower fans by dividing a position where the memory module is mounted into a plurality of regions, and a memory module test apparatus using the same.

Another object of the present invention is to provide a temperature adjustment testing unit for a memory module, which enables a user to quickly and real-timely confirm a temperature corresponding to each memory region using a temperature display part exposed to the outside without using a separate display module, thereby quickly controlling the temperature of each memory region, and a memory module testing apparatus using the same.

It is still another object of the present invention to provide a temperature adjustment test unit for a memory module, which can quickly complete initialization after a certain test is completed, i.e., quickly change the temperature thereof, thereby shortening the time until the next test is performed, and a memory module testing apparatus using the same.

To achieve the above-mentioned objectives of the present invention, a temperature adjustment testing unit of a memory module to which an embodiment of the present invention is applied includes: a test board part installed in the test space and partitioned to form a plurality of memory module installation regions for independently installing the memory modules; a test box part which is arranged on the upper part of the test board part and forms a test space by selectively surrounding more than one of the plurality of memory module installation areas; a storage unit for storing a process and a result of testing the memory module in the test space by the test board unit and the test box unit; and a control unit for controlling the test board unit, the test box unit, and the storage unit; wherein, above-mentioned test box portion includes: a support plate part, which is provided with a through hole for the penetration of the memory modules mounted on the test plate part, and is arranged on the upper part of the test plate part; a covering portion for covering the plurality of memory modules penetrating the through holes of the support plate portion together with the support plate portion; and a Peltier part including a thermoelectric element for performing heat exchange for adjusting the temperature of the test space; the control part can control the temperatures of the memory module mounting areas according to the selection of a user.

In the temperature adjustment testing unit of a memory module to which an embodiment of the present invention is applied, the covering portion may include: a control box part which is configured at the upper part of the test box part, can move up and down and is used for covering the memory module installation area together with the test box part; a driving part for receiving external power supply and rotating; a rotation shaft portion that is attached to the driving portion and rotates in accordance with rotation of the driving portion; a pinion gear portion through which the rotation shaft portion penetrates and which is rotatable in accordance with rotation of the rotation shaft portion; a rack gear part installed to move the control box part up and down by receiving a rotational force of the rotational shaft; and a temperature control unit for detecting the internal temperature of the control box unit and setting the temperature, the temperature control unit including a Peltier element.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the test board portion may further include: the memory slot is used for installing the memory module; and a locking member for preventing the memory module mounted in the memory slot from being detached.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the test box unit may further include: and a radiator part for absorbing or radiating heat in the test space.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the test box unit may further include: and a blower fan unit for circulating air in the test space by forming a flow of air downward from an upper portion of the memory module mounting region to induce temperature conversion in the test space.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the test box unit may further include: a cooling part which is configured on the upper part of the Peltier part and can be moved by cooling water.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the cooling unit may further include: a cooling water inlet through which cooling water flows from the outside; a cooling pipe, one end of which is communicated with the cooling water inlet and is formed by bending for multiple times in a U shape; and a cooling water discharge port which is communicated with the other end of the cooling pipe and is used for discharging the cooling water in the cooling pipe.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the temperature adjustment test unit may further include: a cooling water measuring device for measuring the flow of the cooling water supplied to the cooling unit; and a cooling water filter for filtering out foreign matters contained in the cooling water supplied to the cooling part.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the control unit may select a test condition that has been executed last time from the storage unit and set the test condition, without a user changing the test condition.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the control unit may select a test condition required by a user from a plurality of test conditions stored in the storage unit and set the test condition.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the test condition required by the user may be a test condition that is preset according to an expected location or environment where a model of the corresponding memory module is actually installed.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the storage unit may store a condition that changes during a test execution of the memory module.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the control unit may stop a test being performed when an abnormality or an error occurs in the memory module while setting any one of the test conditions and testing the memory module, record a test condition or a change process of the test condition until the abnormality or the error occurs in the storage unit, and then perform a test again on the memory module in which the abnormality or the error occurs under the same test condition.

In the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, the control unit may suspend a test in progress when an abnormality or an error occurs in the memory module during a process of setting any one of the test conditions and testing the memory module, record a test condition or a change process of the test condition until the abnormality or the error occurs in the storage unit, and may reset the test condition or the change process of the test condition until the abnormality or the error occurs and then test the memory module when a corresponding model of the memory module in which the abnormality or the error occurs is tested.

To achieve the above-mentioned objects of the present invention, a memory module testing apparatus using a temperature adjustment testing unit of a memory module according to an embodiment of the present invention may include: a case unit in which the test space for testing the memory module is provided; a temperature adjustment test unit which is arranged inside the housing unit, includes a test board section arranged in the test space, a test box section arranged on an upper portion of the test board section and formed so as to surround the memory module mounting area, a storage section for storing a process and a result of testing the memory module in the test space by the test board section and the test box section, and a control section for controlling the test board section, the test box section, and the storage section, and is used for testing the memory module; a cooling water supply unit disposed at one side of the housing unit, for supplying cooling water to the test space or the test unit to reduce an increased temperature; an air supply unit disposed at one side of the housing unit and supplying air for temperature rise and fall of the test space or the test unit; an alarm unit which is arranged at one side of the shell unit and informs the outside of the testing state in the testing space in a sound or visual mode; a Universal Serial Bus (USB) port unit disposed at one side of the housing unit and electrically connected to an external electronic device for data transmission; a display unit disposed at one side of the case unit to display the memory module test status or the internal status of the case by visual means for a user to recognize with naked eyes; and a Keyboard, Video, Monitor (KVM) switch unit disposed at one side of the housing unit for controlling the plurality of test units.

In the memory module testing apparatus using the temperature adjustment testing unit of the memory module according to an embodiment of the present invention, the cooling water supply unit may further include: a cooling water measuring device attached to the housing unit for measuring a flow of the supplied cooling water; and a cooling water filter installed at the housing unit for filtering out foreign matters when the cooling water is supplied.

In the memory module testing apparatus using the temperature adjustment testing unit of the memory module according to an embodiment of the present invention, the alarm unit may include: an emergency stop button which is composed of an emergency off (EMO) switch for stopping all functions when a user presses the emergency stop button in a critical condition; an alarm setting button for setting an alarm by a user; and an alarm reset button for resetting the alarm set by the user.

In the memory module testing apparatus using the temperature adjustment testing unit of the memory module according to an embodiment of the present invention, the testing space may further include: and a shelf for supporting the test unit at a lower side of the test unit and sliding to an outside of the housing according to a user's selection.

The invention divides the position for installing the memory module into a plurality of areas and can independently adjust the temperature of each area, thereby simultaneously executing tests under different conditions.

The present invention uses the peltier element in each memory module mounting region, and thus can more accurately realize temperature control.

The invention can quickly finish initialization after finishing a certain test, namely quickly change the temperature and shorten the time until the next test is executed, thereby obtaining more test opportunities in a preset period and realizing quick test by improving the test speed.

Drawings

Fig. 1 is a schematic perspective view of a memory module testing apparatus using a temperature adjustment testing unit of a memory module according to an embodiment of the present invention.

Fig. 2 is a front view of fig. 1.

Fig. 3 is a front view of a temperature adjustment test unit of a memory module to which an embodiment of the invention is applied.

Fig. 4 is an internal perspective view of a temperature regulation test unit of a memory module to which an embodiment of the present invention is applied.

Fig. 5 is a schematic diagram illustrating a sliding operation state of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

Fig. 6 is a schematic diagram illustrating an operating state of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

Fig. 7 is a schematic diagram illustrating a front state when the control box in fig. 6 slides up and down.

Fig. 8 is a schematic diagram illustrating a test board to which a temperature adjustment test unit of a memory module according to an embodiment of the invention is applied.

Fig. 9 is a diagram illustrating a state in which a test item is mounted on an upper portion of a test board to which a temperature adjustment test unit of a memory module according to an embodiment of the present invention is applied.

FIG. 10 is a perspective view of a temperature adjustment test unit of a memory module to which an embodiment of the invention is applied.

Fig. 11 is a back view of a cover portion of a temperature regulating test cell of a memory module to which an embodiment of the invention is applied.

Fig. 12 is a side view illustrating the inside of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

FIG. 13 is a bottom oblique view of a temperature regulation test unit of a memory module to which an embodiment of the present invention is applied.

Fig. 14 is a plan view illustrating a cooling part of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

Description of the reference numerals

100: housing unit

200: temperature regulation test unit

210: test board part

211: memory module mounting area

212: 1 st memory module mounting area

212 a: memory slot

212 b: locking member

213: 2 nd memory module mounting area

213 a: memory slot

213 b: locking member

214: no. 3 memory module mounting area

214 a: memory slot

214 b: locking member

220: test box part

221: support plate part

221 a: support rod

221 b: through hole

222: radiator part

223: air supply fan part

224: cooling part

224 a: cooling water inlet

224 b: cooling pipe

224 c: cooling water discharge port

224 d: cooling water measuring device

224 e: cooling water filter

225: temperature display unit

225 a: no. 1 internal memory temperature display part

225 b: no. 2 internal memory temperature display part

225 c: no. 3 internal storage temperature display part

226: lower side blowing fan

227: peltier part

230: control box part

240: driving part

250: rotating shaft part

260: pinion gear part

270: rack gear part

280: temperature control unit

290: shelf board

291: handle bar

300: cooling water supply unit

400: gas supply unit

500: alarm unit

510: emergency stop button

520: alarm setting unit

530: alarm reset unit

600: universal Serial Bus (USB) port unit

700: display unit

800: keyboard display mouse (KVM) switching unit

Detailed Description

Next, a part of embodiments to which the present invention is applied will be described in detail with reference to the accompanying exemplary drawings. Note that, in assigning reference symbols to components of each drawing, the same reference symbols are assigned to the same components as much as possible even if they are illustrated in different drawings. In addition, in the description of the embodiments to which the present invention is applied, when it is determined that detailed description on related well-known configurations or functions may hinder understanding of the embodiments to which the present invention is applied, detailed description thereof will be omitted.

In the description of the components to which the embodiments of the present invention are applied, terms such as (1), (2), (A, B), (a) and (b) may be used. However, the terms described above are only used to distinguish the above-mentioned components from other components, and the nature, order, sequence, and the like of the corresponding components are not limited by the terms. When it is described that a certain component is "connected", "coupled" or "in contact with" another component, the component may be directly connected or in contact with the other component, but it should be understood that other components may be "connected", "coupled" or "in contact with" another component.

Next, a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied will be described with reference to the drawings.

In the description of the embodiment of the invention, the contents related to the memory module testing unit will be included in the description of the memory module testing apparatus.

Fig. 1 is a schematic oblique view of a memory module testing apparatus to which a temperature adjustment testing unit of a memory module according to an embodiment of the present invention is applied, fig. 2 is a front view of fig. 1, fig. 3 is a front view of the temperature adjustment testing unit of the memory module according to the embodiment of the present invention, fig. 4 is an internal perspective view of the temperature adjustment testing unit of the memory module according to the embodiment of the present invention, fig. 5 is a schematic view illustrating a sliding operation state of the temperature adjustment testing unit of the memory module according to the embodiment of the present invention, fig. 6 is a schematic view illustrating an operation state of the temperature adjustment testing unit of the memory module according to the embodiment of the present invention, fig. 7 is a schematic view illustrating a front state when a control box in fig. 6 slides up and down, fig. 8 is a schematic view illustrating a testing board to which the temperature adjustment testing unit of the memory module according to the embodiment of the present invention is applied, fig. 9 is a diagram illustrating a state in which a test item is mounted on an upper portion of a test board to which a temperature adjustment test unit of a memory module according to an embodiment of the present invention is applied.

Referring to fig. 1 to 2, a memory module testing apparatus using a temperature regulation test unit of a memory module to which an embodiment of the present invention is applied may include a housing unit 100, a temperature regulation test unit 200, a cooling water supply unit 300, a gas supply unit 400, an alarm unit 500, a Universal Serial Bus (USB) port unit 600, a display unit 700, and a keyboard, video and mouse (KVM) switch unit.

In an embodiment to which the present invention is applied, a reliability test may be performed while controlling temperature using a Registered Dual In-line Memory Module (R-DIMM) used In a server-level Personal Computer (PC) as an object.

The housing unit 100 has a hexahedral shape, and may be provided with a test space therein for testing the memory module.

In the test space, a temperature adjustment test unit 200, which will be described later, may be disposed, and the temperature adjustment test unit 200 may be exposed at the front side.

In the drawings, the case where 6 test spaces and the temperature-adjusting test unit 200 are provided, respectively, is illustrated, but this is only an embodiment, and the number thereof is not particularly limited, but may be provided in different numbers according to the intention of a manufacturer.

The temperature regulation test unit 200 may be disposed inside the housing unit 100, i.e., in the test space described above.

Referring to fig. 3 to 4, the temperature adjustment test unit 200 may include a test board part 210, a test box part 220, a control box part 230, a driving part 240, a rotation shaft part 250, a pinion part 260, a rack-and-pinion part 270, and a temperature control part 280.

The temperature adjustment test unit 200 may include a test board part 210, and may perform a reliability test by configuring a memory module at an upper portion of the test board part 210. In this case, the test Board section 210 is preferably an ethylene/vinyl acetate copolymer Board (Eva Board).

Referring to fig. 5, at least 3 memory module mounting regions 212, 213, 214 may be formed in the test board part 210. The memory module mounting region 211 may be divided into 1 st to 3 rd memory module mounting regions 212, 213, 214, and a plurality of memory slots 212a, 213a, 214a for mounting memory modules may be respectively provided in the 1 st to 3 rd memory module mounting regions 212, 213, 214. As shown in fig. 5, 3 memory slots 212a and 214a may be provided in the 1 st and 3 rd memory module mounting regions 212 and 214, and 6 memory slots 213a may be provided in the 2 nd memory module mounting region 213 a.

Referring to fig. 4 and 6, the locking members 212b, 213b, 214b may fix the memory modules by being disposed in the respective memory module mounting regions 212, 213, 214 of the test board part 210. The locking parts 212b, 213b, 214b may prevent the memory module from being detached by being disposed at the ends of the respective slots in the length direction.

Referring back to fig. 4, the lower blower fan 226 may be disposed between the 1 st and 2 nd memory module mounting regions 212 and 213 and between the 2 nd and 3 rd memory module mounting regions 213 and 214. The lower side blowing fan 226 may inject air flowing from an air supply unit 400 described later.

Referring to fig. 6, the test box part 220 may be disposed at an upper portion of the test plate part 210. The test box section 220 may be formed to surround the memory module mounting regions 212, 213, and 214, respectively.

A temperature display section 225 may be disposed in a part of the test box section 220, i.e., a part of the frame (no reference numeral).

As the temperature display portion 225, the 1 st to 3 rd temperature display portions 225a, 225b, 225c corresponding to the positions of the 1 st to 3 rd memory module mounting regions 212, 213, 214 may be arranged.

As shown in fig. 3, the temperature display section 225 may be disposed above the test board section 210, but may be attached to various positions as a matter of choice by the manufacturer. However, in consideration of visibility of a user, the mounting positions of the memory modules are preferably set to positions corresponding to the 1 st to 3 rd memory module mounting regions 212, 213, and 214, respectively.

Referring back to fig. 3 and 4, the temperature regulation test unit 200 may include a control box part 230. The control box section 230 may be disposed above the test box section 220.

The control box unit 230 may be provided so as to correspond to the memory module mounting regions 212, 213, and 214, respectively. That is, when 3 memory module mounting areas are provided in a certain test board section 210, 3 control box sections 230 may be provided so as to correspond to the size of the memory module mounting area. Thus, when the number of memory modules to be tested is relatively small, if there is a memory module mounting region where no memory module is mounted, it is possible to mount a memory module only in a part of the memory module mounting region and to perform testing only by using the corresponding control box unit 230 while leaving the region vacant. In the drawing, the case where the control box unit 230 covers all of the 3 memory module mounting regions 212, 213, and 214 is illustrated, but this is merely an example, and the present invention is not limited thereto, and it should be understood that the control box unit 230 is provided corresponding to each of the memory module mounting regions 212, 213, and 214.

The control box portion 230 can be moved up and down by interlocking with the rotation shaft portion 250, the pinion gear 260, and the rack and pinion portion 270 by the drive portion 240 described later. When the control box part 230 is raised, the memory module mounting region 221 is exposed to the outside and opened upward, and when the control box part 230 is lowered, the memory module mounting region 221 may be closed or covered with the test box part 220.

In describing an embodiment to which the present invention is applied, detailed information about the test board part 210 and the test box part 220 of the temperature-adjusting test unit 200 will be described later.

The driving part 240 may receive power supply and perform a rotational motion.

One end of the rotation shaft portion 250 may receive the transmitted rotation motion of the driving portion 240 by being connected to the driving portion 240. That is, the rotation shaft 250 may rotate according to the rotation of the driving part 240.

A pinion gear portion 260 may be mounted in the rotation shaft portion 250. In other words, the rotation shaft 250 may pass through the pinion gear 260 and rotate with the rotation of the rotation shaft 250.

The other end of the rotation shaft part 250 may be connected to the control box part 230. At this time, the rack and pinion portion 270 may be mounted in the control box portion 230. The rack gear portion 270 may convert the rotational motion of the driving portion 240 and the rotating shaft portion 250 and the pinion gear portion 260 into a linear motion in the vertical direction. That is, the rack and pinion portion 270 has a longitudinal direction that coincides with the vertical direction of the control box portion 230, and the control box portion 230 can be moved up and down by engaging with the pinion portion 260.

A temperature control part 280 may be provided at one side of the control box part 230. The temperature control unit 280 may check the internal temperature of the control box unit 230, that is, the internal temperature of the memory module mounting region 211, and set the temperature according to the user's intention. The temperature control part 280 may include a peltier element. For reference, although not described above, it should be understood that a temperature sensor (not shown) for detecting the temperature of each memory module mounting region 212, 213, 214 is disposed in at least one of the test board section 210, the test box section 220, and the control box section 230. The temperature controller 280 may inject air by the lower blower fan 222 until the temperature of the memory module mounting region 211 reaches a temperature set according to the user's intention.

At this time, the air injected by the lower side blowing fan 22 may be higher or lower than the normal temperature (25 ℃). For example, when a user needs to lower the temperature of the memory module mounting regions 212, 213, and 214, air lower than the normal temperature or cooling water described later may be injected, and when the user needs to raise the temperature of the memory module mounting regions 212, 213, and 214, air higher than the normal temperature may be injected.

For reference, the temperature control part 280 may vary the temperature of the memory module mounting regions 212, 213, 214 within a range of 0 to 90 ℃. In an embodiment to which the present invention is applied, the heating from the room temperature to 85 ℃ may be performed within 5 minutes by the above-described method, and the cooling from the room temperature to 5 ℃ may be performed within 10 minutes.

Further, the temperature controller 280 may check the outflow of the supplied cooling water.

The temperature adjustment test unit 200 may further include a shelf 290.

As shown in fig. 1 and 2, in an embodiment to which the present invention is applied, 6 test spaces may be provided and then 6 temperature-adjustment test units 200 may be provided, and each temperature-adjustment test unit 200 may be slid from the inside to the outside of the housing unit 100 by means of the shelf 290. The shelf may support the temperature regulation test unit 200 at a lower side of the temperature regulation test unit 200 in the test space. At this time, the shelf 290 may be provided with a handle 291, and the user may pull the temperature adjustment testing unit 200 out of the housing unit 100 by holding and pulling the handle 291.

Referring to fig. 7 and 8, after holding the handle 291 and pulling out the shelf 290 to the outside, the user can mount the memory module into the memory slots 212a, 213a, and 214a and fix the memory module by using the locking member 224, thereby preventing the memory module from being detached. After the user holds the handle 291 and pushes the shelf 290 into the housing unit 100, and then the user presses a start button (not shown) to start a test, the control box section 230 is lowered to overlap the test box section 220, thereby forming a 3-dimensional space in the memory module mounting region 211 and covering the space. Next, the temperature control unit 280 may adjust the temperature of the memory module mounting regions 212, 213, and 214 and perform other tests.

The memory module testing apparatus using the temperature adjustment testing unit of the memory module according to an embodiment of the present invention may include a cooling water supply unit 300.

The cooling water supply unit 300 may be provided at one side of the housing unit 100. The purpose of the Cooling Water Supply (PCW) is to cool heat generated during the execution of the memory module test by the temperature-adjusting test unit 200. That is, the rising temperature in the above-described test space or the temperature-adjusting test unit 200 may be reduced by supplying cooling water.

The air supply unit 400 may be provided at one side of the case unit 100. The air supply unit 400 serves to raise or lower the temperature of the memory module mounting region 211 by supplying air to the above-described test space or test unit.

The alarm unit 500 may be provided at one side of the housing unit 100. The temperature adjustment testing unit 200 may notify the outside of the situation in which the memory module is tested in the memory module mounting region 211 by sound or visual means.

The alarm unit 500 may include an emergency stop button, an alarm set button 520, and an alarm reset button 530.

The emergency stop button 510 may stop all functions when pressed by a user in a critical situation that occurs during a memory module test. The Emergency stop button 510 is preferably an Emergency OFF (EMO) switch.

The alarm setting button 520 may select a condition that the user needs to confirm by pressing the button and set a corresponding alarm.

The alarm reset button 530 may reset the alarm preset by the user's pressing.

Although not shown, the alarm unit 500 may be provided with a speaker (not shown), an indicator light (not shown), or the like, so that a sound related to a corresponding situation may be played through the speaker or various lights may be emitted through the indicator light. That is, the alarm unit 500 may allow the user to recognize the test condition of the memory module by an audible or visual manner.

The Universal Serial Bus (USB) port unit 600 is disposed on one side of the housing unit 100, and can perform data transfer with an external electronic device (not shown) having a Universal Serial Bus (USB) terminal electrically connected thereto by being inserted into a Universal Serial Bus (USB) port.

The display unit 700 may be disposed at one side of the housing unit 100. The display unit 700 may visually display in order to facilitate a user to recognize a memory module test condition of the temperature adjustment test unit 200 or an internal condition of the case unit 100 by the naked eye. In addition, the user can confirm only the test result of the memory module by the naked eye through the display unit 700 and display the statistical information in a graph manner.

In addition, the display unit 700 may be formed of a touch panel.

A keyboard, display, mouse (KVM) switch unit 800 may be disposed at one side of the housing unit 100. The Keyboard-Video-Mouse (KVM) switch may transmit and receive data to and from an external electronic device through a Universal Serial Bus (USB) port unit 600.

Fig. 10 is an oblique view of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, fig. 11 is a rear view of a cover portion of the temperature adjustment test unit of the memory module to which an embodiment of the present invention is applied, fig. 12 is a side view illustrating the interior of the temperature adjustment test unit of the memory module to which an embodiment of the present invention is applied, fig. 13 is a bottom oblique view of the temperature adjustment test unit of the memory module to which an embodiment of the present invention is applied, and fig. 14 is a plan view illustrating a cooling portion of the temperature adjustment test unit of the memory module to which an embodiment of the present invention is applied.

Referring to fig. 10 to 14, the temperature adjustment testing unit of the memory module to which an embodiment of the present invention is applied may include a testing board portion 210, a testing box portion 220, a storage portion (not shown), and a control portion (not shown).

The test board part 210 may be installed in the test space. The test board section 210 may be divided into a plurality of memory module mounting regions 212, 213, 214. A plurality of memory modules may be mounted in the plurality of memory module mounting regions 212, 213, 214.

At this time, the memory slots 212a, 213a, 214a and the locking members 212b, 213b, 214b may be arranged in the plurality of memory module mounting regions 212, 213, 214. Memory modules may be installed in the memory slots 212a, 213a, 214 a. The locking unit 212b, 213b, 214b may prevent the memory modules mounted in the memory slots 212a, 213a, 214a from being detached.

The test box section 220 may be disposed above the test board section 210. The test box part 220 may form a test space by surrounding the plurality of memory module mounting regions 212, 213, 214, respectively.

The test box section 220 may include a support plate section 221 and a cover section (no reference symbol) and a peltier section 227.

The support plate portion 221 may be disposed at an upper portion of the test plate portion 210. In the support plate portion 221, through holes 221b corresponding to the shapes and widths of the memory module mounting regions 212, 213, and 214 may be formed so that the test plate portion 210, that is, the memory modules mounted in the memory slots 212a, 213a, and 214a and the locking members 212b, 213b, and 214b penetrate therethrough. Further, a support bar 221a is mounted on the lower side of the support plate portion 221 so as to be supported by the test plate portion 210.

The covering portion may cover the plurality of memory modules penetrating the support plate portion 221 together with the support plate portion 221.

The test box section 220 may also include a heat sink section 222.

The heat sink portion 222 is disposed to face the memory modules mounted in the memory module mounting regions 212, 213, and 214, and can absorb or dissipate heat inside the test space.

The test box part 220 may further include an air blowing fan part 223. The blower fan section 223 is different from the lower blower fan 226 described above, is mounted below the heat sink section 222, and can blow air toward the memory modules mounted in the memory module mounting regions 212, 213, and 214. At this time, the blown air circulates between the supporting plate 221 and the covering portion, that is, inside the test space, thereby reducing the temperature of the memory module. Then, the air having the increased temperature rises along the wall surface of the covering portion and is cooled by coming into contact with the heat sink portion 222, and the heat sink portion 222 can receive the heat transferred from the air.

That is, the blower fan 223 may circulate air in the test space by forming a flow of air downward from the upper portion of the memory module mounting region 212, 213, 214, thereby inducing temperature change in the test space.

The test box section 220 may also include a cooling section 224. The cooling portion 224 may be located at an upper portion of the heat sink portion 222, and particularly, may be located at an upper portion of a peltier portion 227 to be described later. The cooling part 224 may move the cooling water supplied from the cooling water supply unit 300, thereby cooling the temperature inside the test space.

The cooling part 224 may include a cooling water inlet 224a and a cooling pipe 224b and a cooling water discharge port 224 c.

The cooling water may flow in from the outside of the cooling water inlet 224a, i.e., the cooling water supply unit 300.

One end of the cooling pipe 224b may communicate with the cooling water inlet 224 a. In addition, the cooling pipe 224b may be formed by bending it several times in a U-shape, whereby its cooling efficiency may be further improved by maximizing a contact area with the hot gas in a minimum space.

The cooling water discharge port 224c may communicate with the other end of the cooling pipe 224b for discharging the cooling water inside the cooling pipe 224 b.

The cooling unit 224 may further include a cooling water meter 224d and a cooling water filter 224 e. Referring to fig. 1, a cooling water detector 224d and a cooling water filter 224e may be provided inside the housing unit 100.

The cooling water meter 224d can measure the flow of the cooling water supplied from the cooling water supply unit 300 to the cooling unit 224. For example, the cooling water meter 224d may measure a flow rate per unit time.

The cooling water filter 224e may filter out foreign substances contained in the cooling water before the cooling water supplied into the cooling part 224 reaches the cooling water inlet 224 a.

The peltier section 227 may be disposed between the heat sink section 222 and the cooling section 224. The peltier 227 can adjust the temperature of the test space using a thermoelectric element. In an embodiment to which the present invention is applied, the memory module mounting region 211 of any one of the test board sections 210 may be divided into 3 regions and thereby divided into 3 test spaces. Thus, the memory modules disposed in the respective test spaces can be tested under mutually different conditions, and the temperatures of the respective memory module mounting regions 212, 213, 214 can be selectively controlled according to the user's selection.

An embodiment to which the present invention is applied may include a storage unit (not shown) and a control unit (not shown).

The storage unit may store the procedure and result of testing the memory module in the test space by the test board unit 210 and the test box unit 220 as data. That is, the storage unit may store all of the test procedures and results executed a plurality of times as data. The storage unit may store a condition that changes during execution of the test of the memory module.

The control unit may control the test board unit 210, the test box unit 220, and the storage unit. The control unit may control the control box unit 230, the driving unit 240, the rotating shaft unit 250, the pinion unit 260, the rack and pinion unit 270, and the temperature control unit 280 in the memory module testing apparatus using the temperature adjustment testing unit for a memory module according to the embodiment of the present invention described above.

The temperature adjustment test unit of the memory module to which an embodiment of the present invention is applied may set test conditions such as temperature, time, pressure, and the like in advance before the memory module is tested.

However, when the test is repeatedly executed because the test conditions are the same, or when the test conditions are changed because the user does not set individual test conditions, the control unit may directly select the test conditions that have been executed last time and set the test conditions that need to be executed.

The control unit may select a test condition required by a user from a plurality of test conditions stored in the storage unit and set the test condition. That is, the storage unit may store data values of test conditions in different situations, and when a user selects a desired corresponding test condition, the control unit may set the test condition to be executed according to the selected test condition. For example, with respect to a memory module of type B delivered by company a, when the user selects the test condition C, the test condition may be set and the memory module may be measured. At this time, the test conditions required by the user, i.e., the test conditions for testing the type B memory module delivered by the company a, may be test conditions set in advance according to an expected place or environment where the model of the corresponding memory module is actually installed. That is, in the case where the expected location or environment where the type B memory module is installed is the temperature D, the type B memory module may be tested under the test condition C in response to the temperature D.

In addition, the control unit may adjust the test conditions stored in the storage unit even if the test conditions change during the test of the memory module. For example, when it is necessary to change the test condition from the D temperature to the E temperature during the test, the control portion may change the temperature thereof during the execution of the test.

That is, the storage unit stores the test conditions to be executed in the form of a script, and the control unit may read and set the stored test conditions according to a user's selection.

In addition, the control unit may stop the ongoing test when an abnormality or an error occurs in the memory module while the memory module is tested under any test condition.

The control unit may record the test condition or the change procedure of the test condition until the abnormality or the error occurs in the storage unit.

Next, the control unit may retest the memory module in which the abnormality or the error has occurred under the same test condition.

In addition, when testing the corresponding model of the memory module in which the abnormality or the error has occurred, the test condition or the change process of the test condition until the abnormality or the error has occurred may be reset and then the test may be performed.

The contents described in the above are only embodiments for realizing the temperature adjustment test unit of the memory module to which the present invention is applied and the memory module test apparatus using the above test unit, and the present invention is not limited to the above embodiments, and the technical spirit of the present invention should be understood to include various modifications that a person having ordinary knowledge in the technical field to which the present invention pertains can make without departing from the scope of the gist of the present invention claimed in the appended claims.

Claims (18)

1. A temperature regulation test unit for a memory module, comprising:

a test board part installed in the test space and divided to form a plurality of memory module installation regions for independently installing the memory modules;

a test box part which is arranged on the upper part of the test board part and forms a test space by selectively surrounding more than one of the plurality of memory module installation areas;

a storage unit for storing a process and a result of the test of the memory module in the test space by the test board unit and the test box unit; and the number of the first and second groups,

a control unit for controlling the test board unit, the test box unit, and the storage unit;

wherein, above-mentioned test box portion includes:

a support plate part, which is provided with a through hole for the penetration of the memory modules mounted on the test plate part, and is arranged on the upper part of the test plate part;

a covering portion for covering the plurality of memory modules penetrating the through holes of the support plate portion together with the support plate portion; and the number of the first and second groups,

a peltier unit including a thermoelectric element for performing heat exchange to adjust a temperature of the test space;

wherein, the control part controls the temperatures of the memory module mounting areas according to the selection of a user.

2. The temperature regulation test unit of the memory module of claim 1, wherein:

the covering section includes:

a control box part which is configured at the upper part of the test box part, can move up and down and is used for covering the memory module installation area together with the test box part;

a driving part for receiving external power supply and rotating;

a rotation shaft portion that is attached to the driving portion and rotates in accordance with rotation of the driving portion;

a pinion gear portion through which the rotation shaft portion penetrates and which is rotatable in accordance with rotation of the rotation shaft portion;

a rack gear part installed to move the control box part up and down by receiving a rotational force of the rotational shaft; and the number of the first and second groups,

and a temperature control unit for detecting the internal temperature of the control box unit and setting the temperature, wherein the temperature control unit comprises a Peltier element.

3. The temperature regulation test unit of the memory module of claim 1, wherein:

the above test board section further includes:

the memory slot is used for installing the memory module; and the number of the first and second groups,

and a locking component for preventing the memory module installed in the memory slot from being separated.

4. The temperature regulation test unit of the memory module of claim 1, wherein:

above-mentioned test box portion still includes:

a radiator part for absorbing or radiating the heat in the test space.

5. The temperature regulation test unit of the memory module of claim 1, wherein:

above-mentioned test box portion still includes:

and a blower fan unit for circulating air in the test space by forming a flow of air downward from an upper portion of the memory module mounting region to induce temperature conversion in the test space.

6. The temperature regulation test unit of the memory module of claim 1, wherein:

above-mentioned test box portion still includes:

and a cooling part which is arranged on the upper part of the Peltier part and can be moved by cooling water.

7. The temperature regulation test unit of claim 6, wherein:

the cooling unit further includes:

a cooling water inlet through which cooling water flows from the outside;

a cooling pipe, one end of which is communicated with the cooling water inlet and is formed by bending for multiple times in a U shape; and the number of the first and second groups,

and a cooling water discharge port which is communicated with the other end of the cooling pipe and is used for discharging the cooling water in the cooling pipe.

8. The memory module temperature regulation test unit of claim 6, further comprising:

a cooling water measuring device for measuring the flow of the cooling water supplied to the cooling unit; and the number of the first and second groups,

and a cooling water filter for filtering out foreign matters contained in the cooling water supplied to the cooling part.

9. The temperature regulation test unit of the memory module of claim 1, wherein:

the control unit selects the test condition that has been executed last time from the storage unit and sets the test condition when the user does not change the test condition.

10. The temperature regulation test unit of the memory module of claim 1, wherein:

the control unit selects a test condition required by a user from the plurality of test conditions stored in the storage unit and sets the test condition.

11. The temperature conditioning test unit of a memory module of claim 10, wherein:

the test conditions required by the user are preset according to the expected location or environment where the model of the corresponding memory module is actually installed.

12. The temperature regulation test unit of the memory module of claim 1, wherein:

the storage unit stores a condition that changes during execution of the test of the memory module.

13. The temperature regulation test unit of the memory module of claim 1, wherein:

the control unit stops a test being performed when an abnormality or an error occurs in the memory module while any test condition is set and the memory module is tested, records a test condition or a change procedure of the test condition until the abnormality or the error occurs in the storage unit, and then re-tests the memory module in which the abnormality or the error occurs under the same test condition.

14. The temperature regulation test unit of the memory module of claim 1, wherein:

the control unit stops a test being performed when an abnormality or an error occurs in the memory module while any test condition is set and the memory module is tested, records a test condition or a change procedure of the test condition until the abnormality or the error occurs in the storage unit, and resets the test condition or the change procedure of the test condition until the abnormality or the error occurs and performs the test when a model corresponding to the memory module in which the abnormality or the error occurs is tested.

15. A memory module testing apparatus, comprising:

a case unit in which the test space for testing the memory module is provided;

a temperature adjustment test unit which is arranged inside the housing unit, includes a test board section arranged in the test space, a test box section arranged on an upper portion of the test board section and formed so as to surround the memory module mounting area, a storage section for storing a process and a result of testing the memory module in the test space by the test board section and the test box section, and a control section for controlling the test board section, the test box section, and the storage section, and is used for testing the memory module;

a cooling water supply unit disposed at one side of the housing unit, for supplying cooling water to the test space or the test unit to reduce an increased temperature;

an air supply unit disposed at one side of the housing unit and supplying air for temperature rise and fall of the test space or the test unit;

an alarm unit which is arranged at one side of the shell unit and informs the outside of the testing state in the testing space in a sound or visual mode;

a Universal Serial Bus (USB) port unit disposed at one side of the housing unit and electrically connected to an external electronic device for data transmission;

a display unit disposed at one side of the case unit to display the memory module test status or the internal status of the case by visual means for a user to recognize with naked eyes; and the number of the first and second groups,

a Keyboard, Video, and Mouse (KVM) switch unit disposed at one side of the housing unit for controlling the plurality of test units.

16. The memory module testing device of claim 15, wherein:

the cooling water supply unit further includes:

a cooling water measuring device mounted on the housing unit for measuring the flow of the supplied cooling water; and the number of the first and second groups,

and a cooling water filter installed at the housing unit for filtering out foreign matters when the cooling water is supplied.

17. The memory module testing device of claim 15, wherein:

the alarm unit includes:

an emergency stop button which is composed of an emergency off (EMO) switch for stopping all functions when a user presses the emergency stop button in an emergency situation;

an alarm setting button for setting an alarm by a user; and the number of the first and second groups,

and an alarm reset button for resetting the alarm set by the user.

18. The memory module testing device of claim 15, wherein:

the test space further comprises: and a shelf for supporting the test unit at a lower side of the test unit and sliding to an outside of the housing according to a user's selection.

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