CN114566448A - Efficient diode dotting device - Google Patents
Efficient diode dotting device Download PDFInfo
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- CN114566448A CN114566448A CN202210157095.2A CN202210157095A CN114566448A CN 114566448 A CN114566448 A CN 114566448A CN 202210157095 A CN202210157095 A CN 202210157095A CN 114566448 A CN114566448 A CN 114566448A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention provides a high-efficiency diode dotting device which comprises a dotting component, a feeding component, a collecting component and a charging barrel, wherein the dotting component is arranged on the charging barrel; the collecting component comprises a connecting plate, a plurality of bearing plates are arranged on the outer side surface of the connecting plate in a circumferential extending mode, the upper surface of each bearing plate is enclosed into a diode storage space through a baffle, an electric telescopic rod is installed at the bottom of each bearing plate, and the power output end of the electric telescopic rod penetrates through the bearing plates and extends out of the diode storage space; the bottom of the charging barrel is coaxially provided with a rotating motor; the dotting assembly comprises a first linear sliding table, a second linear sliding table, a first dotting structure and a second dotting structure, and the first linear sliding table is arranged above the charging barrel; the second linear sliding table is connected with the first linear sliding table through a sliding block, and the first dotting structure and the second dotting structure are arranged in parallel along the length direction of the sliding block respectively. The invention has the beneficial effects that: effectively avoid the accumulational problem of pan feeding to it is efficient to get ready.
Description
Technical Field
The invention relates to the technical field of diodes, in particular to a high-efficiency diode dotting device.
Background
The diode is one of the most commonly used electronic components, and the most important characteristic of the diode is unidirectional conduction, namely, current can only flow through the diode from one direction, and the diode is provided with a rectifying circuit, a detection circuit, a voltage stabilizing circuit and various modulation circuits which are mainly formed by the diode, so that the principle is simple.
The Chinese grant publication number is CN215771080U, the grant publication date is 2022, 02/08, the patent name is an automatic dotting machine based on diodes, and the automatic dotting machine discloses the following technical contents: including base, dotting device and delivery wheel and discharge gate, dotting device fixed connection is in the left side at the base top, delivery wheel fixed connection is at the top on base right side, the discharge gate intercommunication is at the left top of base, the top fixedly connected with installation piece of base, the mounting groove has been seted up in the front of installation piece, the inside swing joint of mounting groove has the screw rod, the surperficial threaded connection of screw rod has the determine module. This patent has possessed and has prevented accumulational advantage, has solved the current circumstances that can appear piling up of getting automatic dotting machine when dotting to the diode, leads to the diode to be piling up and makes wearing and tearing each other, fish tail surface, makes the problem that diode finished product quality reduces, but work efficiency is lower, in view of this kind of circumstances, awaits for improving urgently.
Disclosure of Invention
Based on this, the invention aims to provide an efficient diode dotting device which can effectively avoid the problem of accumulation of feeding materials and has high dotting efficiency.
The invention provides a high-efficiency diode dotting device which comprises a dotting component, a feeding component, a collecting component and a charging barrel, wherein the dotting component is arranged on the charging barrel; the collecting assembly comprises a connecting plate, a plurality of bearing plates extend in the circumferential direction of the outer side surface of the connecting plate, the upper surface of each bearing plate is enclosed into a diode storage space through a baffle, an electric telescopic rod is installed at the bottom of each bearing plate, and the power output end of the electric telescopic rod penetrates through the bearing plates and extends out of the diode storage space; the collecting component is arranged in the charging barrel, a rotating motor is coaxially arranged at the bottom of the charging barrel, and a power output end of the rotating motor extends into the charging barrel and is connected with the lower surface of the connecting plate through a rotating shaft; the bottom of the charging barrel is provided with a discharging hole; the feeding assembly comprises a horizontal conveying section and an inclined conveying section, the inclined conveying section is arranged close to one side of the charging barrel and corresponds to the diode storage space in position; the dotting assembly comprises a first linear sliding table, a second linear sliding table, a first dotting structure and a second dotting structure, the first linear sliding table is arranged above the charging barrel and is positioned on the other side opposite to the feeding assembly, and the moving direction of the first linear sliding table is the same as the feeding direction of the feeding assembly; the second linear sliding table is connected with the first linear sliding table through a sliding block, and the second linear sliding table and the first linear sliding table form a vertical relation; the second linear sliding table is provided with a sliding block, and the first dotting structure and the second dotting structure are arranged in parallel along the length direction of the sliding block respectively.
As a preferred scheme, the number of the baffles arranged on the upper surface of each bearing plate is four, the number of the baffles arranged on each side of the diode storage space is two, and a diode pin abdicating gap is formed between every two adjacent baffles on the same side.
Preferably, a guide inclined plane is formed at the top of one side, close to the abdicating gap of the diode pin, of the baffle plate far away from the axis of the charging barrel on each bearing plate.
As the preferred scheme, the upper parts of the baffles, which are close to one side of the diode storage space, are respectively provided with an anti-slip silica gel cushion layer in an adhering mode.
Preferably, the lower surface of each supporting plate is connected with a scraping soft plate block, and the scraping soft plate block is arranged close to the bottom of the inner cavity of the charging barrel.
As a preferable scheme, one side, close to the inclined conveying section, of the horizontal conveying section is connected with a splash-proof baffle through a support, and the splash-proof baffle is arranged corresponding to a feeding port of the diode storage space.
Preferably, the first dotting structure and the second dotting structure both comprise a telescopic motor A, an ink storage cylinder and a dotting pen, the telescopic motor A is connected with the sliding seat, the ink storage cylinder is connected with a power output end of the telescopic motor A, and the dotting pen is connected with an ink outlet of the ink storage cylinder.
As a preferred scheme, a blowing structure is arranged above the connecting plate; the blowing structure comprises a telescopic motor B, a telescopic shaft, a negative pressure air cylinder and a plurality of negative pressure air nozzles, wherein one end of the telescopic shaft is connected with the power output end of the telescopic motor B, the other end of the telescopic shaft is connected with the negative pressure air cylinder, and the negative pressure air nozzles are circumferentially arranged on the outer side surface of the negative pressure air cylinder in an array manner and are communicated with the inner cavity of the negative pressure air cylinder; the telescopic shaft and the rotating shaft are arranged in a coaxial manner.
As a preferred scheme, the upper surface of the first linear sliding table is provided with an adjusting seat, and an adjusting rod penetrates through the adjusting seat.
As an optimal scheme, the support is located the junction of horizontal transport section and slope transport section installs flexible motor C, flexible motor C's power take off end is connected with the striker plate.
The invention has the beneficial effects that: through setting up subassembly, pan feeding subassembly, the subassembly that gathers materials, the feed cylinder of dotting, by pan feeding subassembly pan feeding, arrange the diode in unison to the subassembly that gathers materials on, carry to the position of dotting the subassembly with rotatory mode again and dotting, the diode correspondence of accomplishing to dotting falls into the feed cylinder, through discharge gate output, full automatic operation, no problem that the pan feeding is piled up, work efficiency is high.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a perspective view of another angle of the present invention.
Fig. 3 is a side view of a side baffle (showing the non-slip silicone cushion).
The reference signs are: the device comprises a first linear sliding table 10, a second linear sliding table 13, an adjusting seat 11, an adjusting rod 12, a telescopic motor B14, a telescopic shaft 15, a negative pressure air storage cylinder 16, a splash-proof baffle 17, a support 18, a telescopic motor C19, a baffle plate 20, a horizontal conveying section 21, an inclined conveying section 22, a negative pressure air nozzle 23, a charging barrel 24, a rotating shaft 25, a connecting plate 26, a discharging port 27, a scraping soft plate 28, an electric telescopic rod 29, a power output end 30 of the electric telescopic rod, a bearing plate 31, a baffle plate 32, a diode pin yielding gap 33, a telescopic motor A36, an ink storage barrel 35, a dotting pen 34, a rotating motor 37, a diode storage space 39, a blowing structure 40, a dotting component 42, a feeding component 41, a guide inclined plane 43, an anti-slip silica gel cushion 44, a first dotting structure 45 and a second dotting structure 46.
Detailed Description
For a better understanding of the features and technical solutions of the present invention, together with the specific objects and functions attained by the invention, reference is made to the following detailed description and accompanying drawings that form a part hereof.
In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Referring to fig. 1-3, the present invention provides a high efficiency diode dotting device, which includes a dotting component 42, a feeding component 41, a collecting component, and a charging barrel 24, wherein the dotting component 42, the feeding component 41, and the collecting component are all connected to a control device.
The aggregate component comprises a connecting plate 26, wherein a plurality of bearing plates 31, in this embodiment, 4 bearing plates 31 are arranged on the outer side surface of the connecting plate 26 in a circumferential extending manner. The upper surface of each supporting plate 31 is enclosed into a diode storage space 39 through a baffle 32, the bottom of each supporting plate 31 is provided with an electric telescopic rod 29, and the power output end 30 of each electric telescopic rod penetrates through the supporting plate 31 and extends out of the diode storage space 39. The number of the baffles 32 arranged on the upper surface of each supporting plate 31 is four, the number of the baffles 32 arranged on each side of the diode storage space 39 is two, a diode pin abdicating gap 33 is formed between two adjacent baffles 32 on the same side, when the operation is implemented, the shells of the diodes are embedded in the diode storage space 39, the pins on two sides of the diodes are respectively and correspondingly inserted into the diode pin abdicating gaps 33, and the diodes can be sequentially stacked in the diode storage space 39 from bottom to top. The top of the baffle 32 of each supporting plate 31 far away from the axis of the charging barrel 24 and close to the diode pin abdicating gap is provided with a guide inclined plane 43, which is convenient for the power output of the electric telescopic rod 29 to push the diodes which are finished the dotting out of the diode storage space 39. The upper part of each baffle 32 close to one side of the diode storage space 39 is provided with an anti-slip silica gel cushion layer 44, so that the diode at the top is prevented from rotating randomly during dotting, and the dotting action can be stably completed. The lower surface of each bearing plate 31 is connected with the material scraping soft plate block 28, the material scraping soft plate block 28 is arranged close to the bottom of the inner cavity of the charging barrel 24, and in actual operation, the rotation of the bearing plates 31 synchronously drives the material scraping soft plate block 28 to rotate at any time, so that the diodes in the inner cavity of the charging barrel 24 are stirred to the discharging port 27.
In a preferred embodiment, a blowing structure 40 is disposed above the connecting plate 26, and the blowing structure 40 is connected to the control device. The blowing structure 40 comprises a telescopic motor B14, a telescopic shaft 15, a negative pressure air storage cylinder 16 and a plurality of negative pressure air nozzles 23, wherein the telescopic motor B14 is installed on a production line, one end of the telescopic shaft 15 is connected with the power output end of a telescopic motor B14, the other end of the telescopic shaft 15 is connected with the negative pressure air storage cylinder 16, and the negative pressure air nozzles 23 are circumferentially arranged on the outer side surface of the negative pressure air storage cylinder 16 in an array manner and are communicated with the inner cavity of the negative pressure air storage cylinder 16; the telescopic shaft 15 and the rotating shaft 25 are coaxially arranged, and the negative pressure air storage cylinder 16 is connected with a negative pressure air source through a pipeline. The operation is implemented, the telescopic shaft 15 is driven by the telescopic motor B14 to drive the negative pressure air storage cylinder 16 to descend to be close to the upper surface of the connecting plate 26, and the diode staying on the upper surface of the connecting plate 26 is blown down into the charging barrel 24 through the negative pressure air nozzle 23.
The aggregate component is arranged in the charging barrel 24, the bottom of the charging barrel 24 is coaxially provided with a rotating motor 37, and the power output end of the rotating motor 37 extends into the charging barrel 24 and is connected with the lower surface of the connecting plate 26 through a rotating shaft 25; the bottom of the charging barrel 24 is provided with a discharge hole 27. The rotating shaft 25 is driven by the rotating motor 37 to drive the connecting plate 26 to rotate in the charging barrel 24, so that different stations can be switched.
The feeding assembly 41 comprises a horizontal conveying section 21 and an inclined conveying section 22, the inclined conveying section 22 is arranged close to one side of the barrel 24 and is positioned corresponding to the diode storage space 39. One side of the horizontal conveying section 21 close to the inclined conveying section 22 is connected with a splash-proof baffle 17 through a bracket 18, and the splash-proof baffle 17 is arranged corresponding to a feeding port of the diode storage space 39.
The dotting assembly 42 comprises a first linear sliding table 10, a second linear sliding table 13, a first dotting structure 45 and a second dotting structure 46, the first linear sliding table 10 is arranged above the charging barrel 24 and is positioned on the other side opposite to the feeding assembly 41, and the moving direction of the first linear sliding table 10 is the same as the feeding direction of the feeding assembly 41; the second linear sliding table 13 is connected with the first linear sliding table 10 through a sliding block, and the second linear sliding table 13 and the first linear sliding table 10 form a vertical relation; the second linear sliding table 13 is provided with a sliding block, and the first dotting structure 45 and the second dotting structure 46 are respectively arranged in parallel along the length direction of the sliding block. The first dotting structure 45 and the second dotting structure 46 both comprise a telescopic motor A36, an ink storage cylinder 35 and a dotting pen 34, the telescopic motor A36 is connected with the sliding base, the ink storage cylinder 35 is connected with the power output end of the telescopic motor A36, and the dotting pen 34 is connected with the ink outlet of the ink storage cylinder 35. During operation, the first linear sliding table 10 can drive the second linear sliding table 13 to realize position adjustment, and the second linear sliding table 13 can realize dotting position conversion of the first dotting structure 45 and the second dotting structure 46 through movement, so that dotting operations of different colors are realized.
In a preferred embodiment, an adjusting seat 11 is disposed on the upper surface of the first linear sliding table 10, an adjusting rod 12 is disposed on the adjusting seat 11 in a penetrating manner, the adjusting rod 12 is installed on the production line, and the position of the dotting assembly 42 can be adjusted by changing the relative position of the adjusting seat 11 on the adjusting rod 12.
In a preferred embodiment, a telescopic motor C19 is installed at the joint of the horizontal conveying section 21 and the inclined conveying section 22 of the bracket 18, the power output end of the telescopic motor C19 is connected with the striker plate 20, and the telescopic motor C19 is connected with the control device. After finishing the predetermined number of blanking actions each time, the retractable motor C19 causes the striker plate 20 to descend to a predetermined position to block the diodes of the horizontal conveying section 21 from falling into the inclined conveying section 22.
The operating principle of the present embodiment is:
1. the diode enters the diode storage space 39 through the feeding assembly 41;
2. the bearing plate 31 with the diodes moves to the position corresponding to the dotting component 42 for dotting operation, after the dotting action of one diode is finished, the electric telescopic rod 29 rises to a preset height, so that the diodes which are dotted are ejected out of the diode storage space 39 on one hand, and the diodes to be dotted are ejected at the highest position to prepare for the dotting operation on the other hand;
3. when the diodes in the diode storage space 39 of one bearing plate 31 are all dotting operation, the connecting plate 26 rotates 90 degrees, the bearing plate 31 with the next diode rotates to the position below the dotting assembly 42, the dotting operation in the step 2 is continuously repeated, and the operation is repeated.
The above-mentioned embodiments only express one embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A high-efficient diode dotting device which characterized in that: comprises a dotting component (42), a feeding component (41), a collecting component and a charging barrel (24);
the aggregate assembly comprises a connecting plate (26), a plurality of supporting plates (31) extend from the outer side surface of the connecting plate (26) in the circumferential direction, a diode storage space (39) is formed by enclosing the upper surface of each supporting plate (31) through a baffle (32), an electric telescopic rod (29) is installed at the bottom of each supporting plate (31), and a power output end (30) of the electric telescopic rod penetrates through each supporting plate (31) and extends out of the diode storage space (39);
the aggregate component is arranged in the charging barrel (24), a rotating motor (37) is coaxially arranged at the bottom of the charging barrel (24), and a power output end of the rotating motor (37) extends into the charging barrel (24) and is connected with the lower surface of the connecting plate (26) through a rotating shaft (25); the bottom of the charging barrel (24) is provided with a discharging hole (27);
the feeding assembly (41) comprises a horizontal conveying section (21) and an inclined conveying section (22), wherein the inclined conveying section (22) is arranged close to one side of the charging barrel (24) and corresponds to the diode storage space (39);
the dotting assembly (42) comprises a first linear sliding table (10), a second linear sliding table (13), a first dotting structure (45) and a second dotting structure (46), the first linear sliding table (10) is arranged above the charging barrel (24) and is positioned on the other side opposite to the feeding assembly (41), and the moving direction of the first linear sliding table (10) is the same as the feeding direction of the feeding assembly (41); the second linear sliding table (13) is connected with the first linear sliding table (10) through a sliding block, and the second linear sliding table (13) and the first linear sliding table (10) form a vertical relation; the second linear sliding table (13) is provided with a sliding block, and the first dotting structure (45) and the second dotting structure (46) are arranged in parallel along the length direction of the sliding block respectively.
2. A high efficiency diode dotting device as recited in claim 1, wherein: the number of baffles (32) arranged on the upper surface of each supporting plate (31) is four, the number of the baffles (32) arranged on each side of the diode storage space (39) is two, and a diode pin abdicating gap (33) is formed between every two adjacent baffles (32) on the same side.
3. A high efficiency diode dotting device as recited in claim 2, wherein: and a guide inclined plane (43) is formed at the top of one side, close to the yielding gap of the diode pin, of a baffle (32) which is far away from the axis of the charging barrel (24) on each bearing plate (31).
4. A high efficiency diode dotting device as recited in claim 2, wherein: and an anti-slip silica gel cushion layer (44) is attached to the upper part of one side of each baffle (32) close to the diode storage space (39).
5. A high efficiency diode dotting device as recited in claim 1, wherein: the lower surface of each bearing plate (31) is connected with a scraping soft plate block (28), and the scraping soft plate block (28) is arranged close to the bottom of the inner cavity of the charging barrel (24).
6. A high efficiency diode dotting device as recited in claim 1, wherein: horizontal transport section (21) by to one side of slope transport section (22) is connected with splashproof baffle (17) through support (18), splashproof baffle (17) with the pan feeding mouth department of diode parking space (39) corresponds the setting.
7. A high efficiency diode striking device as defined in claim 1, wherein: first structure (45) of dotting and second structure (46) of dotting all include flexible motor A (36), store up ink barrel (35), point pen (34), flexible motor A (36) with the slide is connected, store up ink barrel (35) with the power take off end of flexible motor A (36) is connected, point pen (34) with the play china ink mouth of storing up ink barrel (35) is connected.
8. A high efficiency diode dotting device as defined in any one of claims 1-7, wherein: a blowing structure (40) is arranged above the connecting plate (26); the blowing structure (40) comprises a telescopic motor B (14), a telescopic shaft (15), a negative pressure air storage cylinder (16) and a plurality of negative pressure air nozzles (23), one end of the telescopic shaft (15) is connected with the power output end of the telescopic motor B (14), the other end of the telescopic shaft (15) is connected with the negative pressure air storage cylinder (16), and the negative pressure air nozzles (23) are circumferentially arranged on the outer side surface of the negative pressure air storage cylinder (16) in an array mode and are communicated with the inner cavity of the negative pressure air storage cylinder (16); the telescopic shaft (15) and the rotating shaft (25) are coaxially arranged.
9. A high efficiency diode dotting device as recited in claim 8, wherein: the upper surface of the first linear sliding table (10) is provided with an adjusting seat (11), and an adjusting rod (12) penetrates through the adjusting seat (11).
10. A high efficiency diode dotting device as defined in claim 6, wherein: support (18) are located flexible motor C (19) are installed to the junction of horizontal transport section (21) and slope transport section (22), the power take off end of flexible motor C (19) is connected with striker plate (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210157095.2A CN114566448B (en) | 2022-02-21 | 2022-02-21 | Efficient diode dotting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210157095.2A CN114566448B (en) | 2022-02-21 | 2022-02-21 | Efficient diode dotting device |
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| CN114566448A true CN114566448A (en) | 2022-05-31 |
| CN114566448B CN114566448B (en) | 2022-09-23 |
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| DE19517964A1 (en) * | 1995-05-16 | 1996-12-19 | Siemens Ag | Identification device for semiconductor wafers or compact discs during manufacturing processes |
| KR20170051001A (en) * | 2015-11-02 | 2017-05-11 | 주식회사 이오테크닉스 | Laser marking apparatus and laser marking method using the same |
| CN206388683U (en) * | 2017-01-20 | 2017-08-08 | 惠州市骏亚数字技术有限公司 | A kind of contraction type diode automatically dotting mechanism |
| CN206388685U (en) * | 2017-01-20 | 2017-08-08 | 惠州市骏亚数字技术有限公司 | A kind of contraction type diode automatically dotting device |
| CN110246786A (en) * | 2019-06-26 | 2019-09-17 | 深圳市金创图电子设备有限公司 | A kind of IC pallet Automatic-feeding band gets mark function device ready |
| CN110252606A (en) * | 2019-07-31 | 2019-09-20 | 东莞市汇驰纸业有限公司 | A kind of cardboard patch magnetic dot plastic structure |
| CN213533834U (en) * | 2020-09-14 | 2021-06-25 | 武汉鸿镭激光科技有限公司 | Rotating disc type marking welding machine |
| CN213857622U (en) * | 2020-10-24 | 2021-08-03 | 深圳市创科达精密机电有限公司 | Automatic feeding mechanism of crystal laser marking machine |
| CN113182699A (en) * | 2021-05-18 | 2021-07-30 | 湖南健坤激光科技有限公司 | Automatic convertible marking device |
| CN215771080U (en) * | 2021-09-14 | 2022-02-08 | 重庆铭星半导体有限公司 | Automatic dotting machine based on diode |
| CN113851418A (en) * | 2021-09-23 | 2021-12-28 | 先之科半导体科技(东莞)有限公司 | Diode correction positioning seat convenient to adjust direction |
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