CN114542425A - Semiconductor processing technology, vacuumizing device and semiconductor processing equipment - Google Patents
Semiconductor processing technology, vacuumizing device and semiconductor processing equipment Download PDFInfo
- Publication number
- CN114542425A CN114542425A CN202011344666.0A CN202011344666A CN114542425A CN 114542425 A CN114542425 A CN 114542425A CN 202011344666 A CN202011344666 A CN 202011344666A CN 114542425 A CN114542425 A CN 114542425A
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- Prior art keywords
- vacuum pump
- heating
- pump body
- semiconductor processing
- motor rotor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000005516 engineering process Methods 0.000 title claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 61
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 52
- 238000005530 etching Methods 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims description 4
- 239000006227 byproduct Substances 0.000 abstract description 8
- 238000005086 pumping Methods 0.000 description 9
- 238000009825 accumulation Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
- F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
- F04B39/06—Cooling; Heating; Prevention of freezing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Applications Or Details Of Rotary Compressors (AREA)
Abstract
The invention discloses a semiconductor processing technology, a vacuumizing device and semiconductor processing equipment, which are applied to the field of semiconductors and comprise the following steps: vacuum pump body and heating device, heating device includes: the external power supply is arranged outside the vacuum pump body; the charging plate is arranged in the vacuum pump body and is charged by an external power supply; the heating structure is arranged on the motor rotor of the vacuum pump body and is connected with the charging plate, and the charging plate is used for providing power input for heating the heating structure. By the invention, the deposition of by-products in the pump is inhibited.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a semiconductor processing technology, a vacuumizing device and semiconductor processing equipment.
Background
Recently, as the use of information media has increased, the demand for semiconductor memory devices has also increased greatly. The equipment for producing the semiconductor products is stable in operation, and the requirements on batch production of high-quality products and the like are provided. In order to ensure the quality of products, a process chamber in which a semiconductor process is performed should be maintained at a certain pressure.
In order to maintain a constant pressure in the process chamber of the semiconductor processing apparatus, it is necessary to keep the ability of the pump to generate a vacuum stable. However, by-products generated by reactions occurring in the process chamber may be deposited in the pump, which may degrade the performance of the vacuum pump. This can cause the chamber pressure to become unstable and result in poor film quality.
Disclosure of Invention
In view of the above problems in the prior art, embodiments of the present invention provide a semiconductor processing technology, a vacuum pumping device and a semiconductor processing apparatus.
In a first aspect, an embodiment of the present invention provides an evacuation apparatus applied to a semiconductor process, including a vacuum pump body and a heating apparatus, where the heating apparatus includes:
the external power supply is arranged outside the vacuum pump body;
the charging plate is arranged in the vacuum pump body and is charged by the external power supply;
the heating structure is arranged in the vacuum pump body, connected with the charging plate and used for providing power input for heating the heating structure.
Optionally, the apparatus further comprises:
and the temperature controller is arranged in the vacuum pump body and used for controlling the heating temperature of the heating structure.
Optionally, the temperature controller is used for controlling the heating temperature of the heating structure within a range of 80-250 ℃.
Optionally, the charging plate is specifically: and the wireless charging panel is wirelessly connected with the external power supply.
Optionally, the heat generating structure is disposed on a motor rotor of the vacuum pump body.
Optionally, the heating structure is specifically: a heating coil surrounding the motor rotor, or
The heating structure specifically comprises: and the heating sheet or the heating wire extends along the length direction of the motor rotor.
In a second aspect, an embodiment of the present invention provides a semiconductor processing apparatus, including: a main body device and the vacuum-pumping device according to any one of the implementation manners of the first aspect;
the main body equipment comprises a process cavity, and the vacuumizing device is used for vacuumizing the process cavity to form a constant vacuum degree in the process cavity.
In a third aspect, an embodiment of the present invention provides a semiconductor processing method performed by the semiconductor processing apparatus according to the second aspect, including:
when a target processing technology is carried out on a wafer in a process cavity of main body equipment, vacuumizing the process cavity through the vacuum pump body; and in the process of vacuumizing the vacuum pump body, the motor rotor of the vacuum pump body is synchronously heated by the heating device.
Optionally, when the target processing process is performed on the wafer in the process chamber of the main body device, the vacuum pumping is performed on the process chamber through the vacuum pump body, and the method includes:
and when the wafer is subjected to deposition treatment or etching treatment in the process cavity, vacuumizing the process cavity through the vacuum pump body.
Optionally, heating the motor rotor of the vacuum pump body by the heating device includes:
and heating the motor rotor of the vacuum pump body to 80-250 ℃ through the heating device.
One or more technical solutions provided by the embodiments of the present invention at least achieve the following technical effects or advantages:
through this internal heating device that sets up of vacuum pump directly produces the heat, make the inside temperature rise of pump to the by-product that prevents the process chamber and the accumulation on motor rotor in the vacuum pump, then can prevent that the by-product from gathering and leading to the vacuum performance of vacuum pump body to descend, thereby kept the ability invariant that the vacuum pump body produced the vacuum, just also can guarantee that process chamber internal pressure keeps invariable, and then the technology stability of going on in the assurance process chamber, in order to prevent the product defect that the technology unstability leads to.
And, by controlling the accumulation of the by-products in the vacuum pump and on the motor rotor, the automatic pump stop of the vacuum pump body can be prevented to reduce power consumption and extend the life cycle of the pump.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an evacuation device in an embodiment of the present invention.
In fig. 1, 1 is a vacuum pump body, 2 is an external power supply, 3 is a charging plate, 4 is a heat generating structure, and 5 is a temperature controller.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The embodiments of the present invention and the technical features in the embodiments may be combined with each other without conflict. All other embodiments, which can be obtained by a person skilled in the art based on the embodiments of the present invention without any creative work, fall within the protection scope of the present invention.
In a first aspect, an embodiment of the present invention provides an evacuation apparatus applied to a semiconductor process, and referring to fig. 1, the evacuation apparatus includes a vacuum pump body 1 and a heating apparatus, where the heating apparatus includes: the external power supply 2 is arranged outside the vacuum pump body 1; the charging plate 3 is arranged in the vacuum pump body 1, and the charging plate 3 is charged by the external power supply 2; the heating structure 4 is arranged in the vacuum pump body 1, the heating structure 4 is connected with the charging plate 3, and power input for heating the heating structure 4 is provided through the charging plate 3.
In order to accurately control the heat generation temperature of the heat generation structure 4, the temperature for heating the inside of the vacuum pump body 1 is then accurately controlled. The vacuum-pumping device provided by the embodiment of the invention further comprises: and the temperature controller 5 is arranged in the vacuum pump body 1 and used for controlling the heating temperature of the heating structure 4.
Specifically, the heating temperature of the heating structure 4 is controlled within the range of 80-250 ℃ by the temperature controller 5. Or the heating temperature of the heating structure 4 is controlled by the temperature controller 5 to be maintained above 100 ℃.
Specifically, the charging plate 3 in the embodiment of the present invention specifically uses a wireless charging plate, and the wireless charging plate is wirelessly connected to the external power supply 2, so that the external power supply 2 wirelessly charges the charging plate 3 disposed in the vacuum pump body 1.
Specifically, the charging plate 3 may be disposed at an end position in the vacuum pump body 1 and sleeved on the motor rotor 11, so as to reasonably place the charging plate 3 in the vacuum pump body 1.
Further, for the wireless charging effect, the external power source 2 is disposed at an end of the vacuum pump body 1, and the wireless charging pad is disposed at the same end of the vacuum pump body 1.
For example, the external power supply 2 may be a power supply for supplying power to the motor of the vacuum pump body 1, or a newly added power supply different from the power supply for supplying power to the motor of the vacuum pump body 1.
The heating structure 4 in the embodiment of the present invention may be a heating coil or a heating sheet, so as to ensure that the motor rotor 11 is heated integrally. If the heat-generating structure 4 is a heat-generating coil, the heat coil is wound around the motor rotor 11. If the heat generating structure 4 is a heat generating sheet, the heat generating sheet extends along the motor rotor 11.
In a second aspect, based on the same inventive concept, an embodiment of the present invention provides a semiconductor processing apparatus, including a main body apparatus and the vacuum pumping device described in the foregoing embodiment, wherein the main body apparatus includes a process chamber, and the vacuum pumping device is configured to vacuum the process chamber of the main body apparatus to form a constant vacuum degree in the process chamber.
Specifically, the air inlet 12 of the vacuum pump body 1 of the vacuum pumping device is connected with the process chamber of the main body equipment so as to vacuumize the process chamber. The structure of the vacuum pumping device has been described in detail in the embodiment of the first aspect, and is not described herein again for the sake of brevity of the description. In particular, the main body equipment can be equipment for carrying out deposition processing or etching processing on the wafer.
In a third aspect, based on the same inventive concept, embodiments of the present invention provide a semiconductor processing method, which performs semiconductor processing based on the semiconductor processing apparatus of the second aspect. The semiconductor processing method comprises the following steps: when a target treatment process is carried out on the wafer in the process cavity, the vacuum pump body 1 is used for carrying out vacuum pumping treatment on the process cavity of the main body equipment; in the process of vacuumizing the vacuum pump body 1, the motor rotor 11 of the vacuum pump body 1 is heated by the heating device. Specifically, when the deposition treatment or the etching treatment is performed on the wafer in the process chamber, the process chamber is vacuumized through the vacuum pump body 1 to form a constant vacuum degree in the process chamber. Specifically, the motor rotor 11 of the vacuum pump body 1 is heated to 80-250 ℃ by the heating device.
According to one or more technical schemes provided by the embodiment of the invention, the heating device is arranged in the vacuum pump body to directly generate heat, so that the temperature in the vacuum pump is increased, the accumulation of byproducts generated in the process cavity in the vacuum pump and on the motor rotor is prevented, the decrease of the vacuum performance of the vacuum pump body caused by the accumulation of the byproducts can be prevented, the capability of the vacuum pump body for generating vacuum is kept constant, the pressure in the process cavity can be kept constant, the stability of the process performed in the process cavity is further ensured, and the product defect caused by the unstable process is prevented. And, by controlling the accumulation of the by-products in the vacuum pump and on the motor rotor, the automatic pump stop of the vacuum pump body can be prevented to reduce power consumption and extend the life cycle of the pump.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. An evacuating device applied to a semiconductor process is characterized by comprising a vacuum pump body and a heating device, wherein the heating device comprises:
the external power supply is arranged outside the vacuum pump body;
the charging plate is arranged in the vacuum pump body and is charged by the external power supply;
the heating structure is arranged in the vacuum pump body, connected with the charging plate and used for providing power input for heating the heating structure.
2. The evacuation device of claim 1, further comprising:
and the temperature controller is arranged in the vacuum pump body and is used for controlling the heating temperature of the heating structure.
3. The vacuum extractor as claimed in claim 1, wherein the temperature controller is configured to control a heating temperature of the heating structure within a range of 80 to 250 ℃.
4. The evacuation device according to claim 1, wherein the charging plate is embodied as: and the wireless charging panel is wirelessly connected with the external power supply.
5. The evacuation device according to claim 1, wherein the heat generating structure is provided on a motor rotor of the vacuum pump body.
6. The evacuation device of claim 5, wherein the heat generating structure is specifically:
a heating coil surrounding the motor rotor, or
And the heating sheet or the heating wire extends along the length direction of the motor rotor.
7. A semiconductor processing apparatus, comprising: a body apparatus and a vacuum evacuation apparatus as claimed in any one of claims 1 to 6;
the main body equipment comprises a process cavity, and the vacuumizing device is used for vacuumizing the process cavity to form a constant vacuum degree in the process cavity.
8. A method of semiconductor processing performed based on the semiconductor processing equipment of claim 7, comprising:
when a target processing technology is carried out on a wafer in a process cavity of main body equipment, vacuumizing the process cavity through the vacuum pump body; and in the process of vacuumizing the vacuum pump body, the motor rotor of the vacuum pump body is synchronously heated by the heating device.
9. The semiconductor processing method according to claim 8, wherein the evacuating the process chamber by the vacuum pump body when performing the target process on the wafer in the process chamber of the main body apparatus comprises:
and when the wafer is subjected to deposition treatment or etching treatment in the process cavity, vacuumizing the process cavity through the vacuum pump body.
10. The semiconductor processing process according to claim 8 or 9, wherein heating the motor rotor of the vacuum pump body by the heating means includes:
and heating the motor rotor of the vacuum pump body to 80-250 ℃ through the heating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011344666.0A CN114542425A (en) | 2020-11-26 | 2020-11-26 | Semiconductor processing technology, vacuumizing device and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011344666.0A CN114542425A (en) | 2020-11-26 | 2020-11-26 | Semiconductor processing technology, vacuumizing device and semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114542425A true CN114542425A (en) | 2022-05-27 |
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ID=81659396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011344666.0A Pending CN114542425A (en) | 2020-11-26 | 2020-11-26 | Semiconductor processing technology, vacuumizing device and semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114542425A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6126425A (en) * | 1997-05-22 | 2000-10-03 | T. D. Engineering Co., Ltd. | Positive displacement pump |
| JP2003297762A (en) * | 2002-04-03 | 2003-10-17 | Hitachi Ltd | Method for manufacturing semiconductor integrated circuit device |
| CN1656316A (en) * | 2002-05-20 | 2005-08-17 | Ts株式会社 | Vacuum pump |
| JP2009097341A (en) * | 2007-10-12 | 2009-05-07 | Nabtesco Corp | Vacuum pump and its control method |
| JP2014141925A (en) * | 2013-01-24 | 2014-08-07 | Ebara Corp | Vacuum pump device and operation method of the same |
| JP2016118100A (en) * | 2014-12-18 | 2016-06-30 | 株式会社荏原製作所 | Dry vacuum pump and manufacturing method of dry vacuum pump |
| US20200105509A1 (en) * | 2018-09-28 | 2020-04-02 | Lam Research Corporation | Vacuum pump protection against deposition byproduct buildup |
-
2020
- 2020-11-26 CN CN202011344666.0A patent/CN114542425A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6126425A (en) * | 1997-05-22 | 2000-10-03 | T. D. Engineering Co., Ltd. | Positive displacement pump |
| JP2003297762A (en) * | 2002-04-03 | 2003-10-17 | Hitachi Ltd | Method for manufacturing semiconductor integrated circuit device |
| CN1656316A (en) * | 2002-05-20 | 2005-08-17 | Ts株式会社 | Vacuum pump |
| JP2009097341A (en) * | 2007-10-12 | 2009-05-07 | Nabtesco Corp | Vacuum pump and its control method |
| JP2014141925A (en) * | 2013-01-24 | 2014-08-07 | Ebara Corp | Vacuum pump device and operation method of the same |
| JP2016118100A (en) * | 2014-12-18 | 2016-06-30 | 株式会社荏原製作所 | Dry vacuum pump and manufacturing method of dry vacuum pump |
| US20200105509A1 (en) * | 2018-09-28 | 2020-04-02 | Lam Research Corporation | Vacuum pump protection against deposition byproduct buildup |
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