CN114531830A - Power module and power cabinet - Google Patents

Abstract

The invention discloses a power module which comprises a radiator, a power semiconductor device, a conductive bar and a power module structure main body, wherein the radiator comprises at least one condenser and at least one evaporator, the evaporator is arranged on the lower layer of the power module structure main body, the condenser is arranged on the upper layer of the power module structure main body, the device mounting surface of the evaporator is a vertical plane, the condenser is provided with at least two air inlet surfaces, and the air inlet surfaces of the condenser and the device mounting surface of the evaporator form a Y-shaped structure layout together. The power module has the advantages of compact structure and high space utilization rate, and can improve the heat exchange capacity of the power module, improve the power density of equipment and reduce the comprehensive cost of a system.

Description

Power module and power cabinet

Technical Field

The invention relates to the technical field of heat dissipation of power electronic equipment, in particular to a power module power cabinet.

Background

The high-power electronic equipment mainly comprises a power semiconductor, a radiator, a capacitor, an inductor, a distribution switch device and other parts. The radiator mainly takes charge of transferring heat generated by power conversion of the power semiconductor in the working process. For maintenance, electrical performance and other factors, it is now common practice to integrate an IGBT, a heat sink and a capacitor into a module, called a power module.

With the development of the industry, the larger the power of the power electronic equipment is, the larger the heat productivity is, but due to the limitations of installation volume and cost, the size of the equipment needs to be further reduced, the power density is further increased, and the development of the heat dissipation technology gradually becomes a bottleneck restricting the development of the industry.

The traditional heat dissipation technology mainly comprises two types of air cooling heat dissipation and water cooling heat dissipation. The water cooling heat dissipation is a proper and ideal choice for heat dissipation of high-power electronic equipment because of large medium density and heat capacity and high heat carrying capacity. However, for maintenance, reliability and cost reasons and considerations, air-cooled heat dissipation has its irreplaceable advantages and status in many applications.

The layout of the existing power module and its cabinet is shown in fig. 1. One or more power modules form a cabinet. The radiator adopts a fin type structure. The adopted air-cooled radiator mainly adopts common radiators such as aluminum extruded sections, inserting sheets and welding fins, and in order to further improve the power density, the heat pipe is added on the basis of the radiator to further enhance the heat conduction and heat dissipation capacity of the radiator. And an air opening is formed in the position of the module radiator corresponding to the air guide cavity, and heat generated in the working process of the power semiconductor device is transferred out of the cabinet by the driving of the fan.

The heat radiator adopted by the power module in the prior art has low heat radiation efficiency, and the structure is large in size due to the requirement of a large heat exchange area.

The addition of heat pipes also fails to meet the heat dissipation requirements with further increases in power density. In order to further improve the heat exchange efficiency of the radiator, the radiator is replaced by a two-phase flow radiator. The prior art two-phase flow heat dissipation system generally includes: the evaporator, the condenser and the steam pipe and the liquid pipe which are communicated with the evaporator and the condenser, and the hollow loop formed by the communication of the components is filled with the condensable working medium. After the evaporator absorbs heat of a heat source, the working medium in the evaporator is boiled and vaporized and enters the condenser through the steam pipe, and after the condenser releases heat to other media, the vaporized working medium in the condenser is condensed into liquid; then the liquid pipe flows back to the evaporator, and the circulation is continued, so that the continuous transmission and emission of heat flow of the heat source are realized. The driving working medium flow mode mainly includes two modes of pump driving and thermal siphon principle. The evaporator and the condenser can be heat exchangers directly exchanging heat with air, such as copper pipe aluminum fins, parallel flow heat exchangers and the like, and can also be heat exchangers exchanging heat to secondary refrigerant in various forms. Thermosiphon is simply a process in which fluid in a closed system or an open system expands with heat and contracts with cold, and the heat moves upwards and the cold moves downwards. The two-phase flow radiator adopted by the invention is a thermosiphon radiator.

The area of the condenser of the radiator of the two-phase flow heat dissipation system in the prior art is not enough, the area of the condenser is increased, so that the cabinet is enlarged, the occupied structural space is large, and the power density is not favorably improved.

Disclosure of Invention

The technical problem to be solved by the invention is to provide a power module which has a compact structure and a high space utilization rate, improves the heat exchange capacity of the power module, improves the power density of equipment and reduces the comprehensive cost of a system.

In order to solve the technical problem, the invention provides a power module which comprises a radiator, a power semiconductor device, a conductive bar and a power module structure main body, wherein the radiator comprises at least one condenser and at least one evaporator, the evaporator is arranged on the lower layer of the power module structure main body, the condenser is arranged on the upper layer of the power module structure main body, the device mounting surface of the evaporator is a vertical plane, the condenser is provided with at least two air inlet surfaces, and the at least two air inlet surfaces of the condenser and the evaporator device mounting surface form a Y-shaped structural layout together.

Preferably, the evaporator and the condenser are connected through a pipeline, a refrigerant is filled in the sealed cavity and sealed to form a sealed system, the pipeline for connecting the evaporator and the condenser is provided with a special evaporation gas pipe and a special reflux liquid pipe, and the refrigerant forms a uniform circulating flow direction in the sealed system.

Preferably, evaporimeter and condenser pass through the tube coupling, fill the refrigerant and seal in airtight cavity and form closed system, the inside refrigerant of the pipeline of connecting evaporimeter and condenser forms opposite flow direction, the inside refrigerant evaporation of evaporimeter passes through the pipeline and upwards gets into the condenser, and steam gets into the condenser condensation back through the pipeline simultaneously backward flow and gets into the evaporimeter downwards.

Preferably, the condenser may consist of one or more condensers.

Preferably, the power semiconductor devices are respectively disposed at both sides of the evaporator.

Preferably, a heat dissipation fan is arranged in the middle of the power module structure body where the condenser is placed, and the heat dissipation fan may be an axial flow fan or a centrifugal fan.

Preferably, the condenser of the radiator is a tube fin or parallel flow heat exchanger.

Preferably, the power module further includes a capacitor disposed at a middle portion, a lower portion, or a rear portion of the heat sink.

The invention also discloses a power cabinet, which comprises at least one power module.

After adopting above-mentioned structure, a power module, including radiator, power semiconductor device, electrically conductive row and power module structure main part, the radiator includes at least one condenser and at least one evaporimeter, the evaporimeter sets up in the lower floor of power module structure main part, the condenser sets up in the upper strata of power module structure main part, the device installation face of evaporimeter is vertical plane, the condenser is provided with has two air inlet faces at least, the condenser have two air inlet faces at least and evaporimeter device installation face to constitute Y type structural configuration jointly, this power module and power rack compact structure, space utilization are high, promote power module's heat exchange capacity, improve equipment's power density, reduce system's comprehensive cost.

Drawings

Fig. 1 is a diagram of a prior art power module and cabinet layout;

FIG. 2 is an overall block diagram of the power module of the present invention;

fig. 3 is a structural diagram of a power module according to a third embodiment of the present invention;

fig. 4 is a layout diagram of a power module in a power cabinet according to a fourth embodiment of the present invention;

fig. 5 is a structural diagram of a power module according to a fifth embodiment of the present invention;

fig. 6 is a layout diagram of a power module in a power cabinet according to a fourth embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example one

Referring to fig. 2, fig. 2 is an overall structural diagram of a power module according to the present invention; the embodiment discloses a power module, including radiator, power semiconductor device 13, electrically conductive row and power module structure main part, the radiator includes at least one condenser 11 and at least one evaporimeter 12, evaporimeter 12 sets up in power module structure main part's lower floor, and condenser 11 sets up in power module structure main part's upper strata, and the device installation face of evaporimeter 12 is vertical plane, and condenser 11 is provided with two at least air inlet faces, and condenser 11 has two at least air inlet faces and evaporimeter 12's device installation face to constitute Y type structural configuration jointly.

In this embodiment, the heat sink is a thermosiphon heat sink.

The condenser 11 may consist of one or more condensers 11.

In this embodiment, the power semiconductor device 13 is an IGBT module or a discrete device, the power semiconductor devices 13 are respectively disposed on two sides of the evaporator 12, the power semiconductor device transfers heat to the coolant in the evaporator 12 during operation, the coolant is heated and then undergoes phase change gasification, the coolant changes into a gaseous state when heated, the gas density is reduced and naturally rises, the coolant enters the condenser 11 and then transfers the heat to the condenser 11, the condenser 11 exchanges heat with air, the coolant is cooled, and the coolant flows back again under the action of gravity to enter the evaporator 12 for heat exchange.

In this embodiment, the evaporator 12 and the condenser 11 are connected by a pipeline, a refrigerant is filled in the sealed cavity and sealed to form a sealed system, the pipeline connecting the evaporator 12 and the condenser 11 is provided with an evaporation gas pipe and a reflux liquid pipe, and the refrigerant forms a uniform circulation flow direction in the sealed system.

The top of the power module structure main body is provided with a heat radiation fan, and the heat radiation fan can be an axial flow fan or a centrifugal fan.

Example two

The present embodiment is based on the first embodiment, except that: the evaporator 12 is connected with the condenser 11 through a pipeline, a refrigerant is filled in the sealed cavity and sealed to form a sealed system, the refrigerant inside the pipeline connecting the evaporator 12 and the condenser 11 forms opposite flow directions, the refrigerant inside the evaporator 12 evaporates and upwards enters the condenser 11 through the pipeline, and steam flows back and downwards enters the evaporator 12 through the pipeline after entering the condenser 11 for condensation.

EXAMPLE III

Referring to fig. 3 and 4, fig. 3 is a structural diagram of a power module according to a third embodiment of the present invention, in this embodiment, based on the first embodiment, the condenser 11 is a two-phase flow condenser 11, the two-phase flow condenser 11 is a tube fin or parallel flow heat exchanger, the evaporator 12 is an aluminum plate or a copper plate with a hollow inner cavity, the condenser 11 and the evaporator 12 are connected to form a closed cavity through a pipeline, and the closed cavity is evacuated and then filled with a refrigerant. The refrigerant may be a common refrigerant such as R134a, R410A, R22, R12, etc.

Referring to fig. 3, the layout of the capacitor 14 added to the power module of the present embodiment is shown in the figure, and the capacitor 14 is disposed in the middle of the thermosyphon.

In this embodiment, the evaporator 12 or the condenser 11 may be made of a metal material such as aluminum or copper.

The condenser 11 and the evaporator 12 may have a definite gas line and liquid line for circulating flow, or may have only a gas pipe and a gas-liquid mixed flow.

A heat dissipation fan is arranged in the middle of the power module structure body where the condenser 11 is placed, and the heat dissipation fan may be an axial flow fan or a centrifugal fan.

Example four

The embodiment discloses a power cabinet, which includes at least one power module according to the third embodiment, please refer to fig. 4, fig. 4 is a layout diagram of a power module in a power cabinet according to the fourth embodiment of the present invention; the layout of the power modules in the power cabinet of the embodiment is shown in fig. 4, one or more power modules are arranged in each power cabinet, and heat generated in the working process of the power semiconductor is brought to the air to be taken away through forced air draft or blowing of a fan.

EXAMPLE five

Referring to fig. 5, fig. 5 is a structural diagram of a power module according to a fifth embodiment of the present invention.

In the present embodiment, the capacitor 14 is disposed at the rear of the thermosyphon radiator.

EXAMPLE six

The embodiment discloses a power cabinet, which includes at least one power module according to the fifth embodiment, referring to fig. 6, the layout of the power modules in the power cabinet of the embodiment is as shown in fig. 6, and one or more power modules are disposed in each power cabinet.

The power module and the power cabinet have compact structures and high space utilization rate, improve the heat exchange capacity of the power module, improve the power density of equipment and reduce the comprehensive cost of a system.

It should be understood that the above is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures or equivalent flow transformations made by the present specification and drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.

Claims (9)

1. The utility model provides a power module, includes radiator, power semiconductor device, leads electrical drainage and power module structure main part, its characterized in that, the radiator includes at least one condenser and at least one evaporimeter, the evaporimeter sets up in power module structure main part's lower floor, the condenser sets up in power module structure main part's upper strata, the device installation face of evaporimeter is vertical plane, the condenser is provided with two at least air inlet faces, two at least air inlet faces of condenser and the device installation face of evaporimeter constitute Y type structural configuration jointly.

2. The power module according to claim 1, wherein the evaporator and the condenser are connected through a pipeline, a refrigerant is filled in the sealed cavity and sealed to form a sealed system, the pipeline connecting the evaporator and the condenser is provided with a special evaporation gas pipe and a special reflux liquid pipe, and the refrigerant forms a uniform circulating flow direction in the sealed system.

3. The power module according to claim 1, wherein the evaporator and the condenser are connected by a pipeline, a refrigerant is filled in the sealed cavity and sealed to form a sealed system, the refrigerant in the pipeline connecting the evaporator and the condenser forms opposite flow directions, the refrigerant in the evaporator evaporates and enters the condenser through the pipeline, and the steam flows back and enters the evaporator through the pipeline after entering the condenser for condensation.

4. A power module according to claim 1, characterized in that the condenser may consist of one or more condensers.

5. The power module according to claim 1, wherein the power semiconductor devices are respectively disposed on both sides of the evaporator.

6. The power module as claimed in claim 1, wherein a heat dissipation fan is disposed at a middle position of the power module structure body where the condenser is disposed, and the heat dissipation fan may be an axial flow fan or a centrifugal fan.

7. The power module of claim 1, wherein the condenser of the heat sink is a tube fin or parallel flow heat exchanger.

8. The power module of claim 1, further comprising a capacitor disposed in a middle, lower, or rear portion of the heat sink.

9. A power cabinet, characterized by comprising a power module according to any one of claims 1 to 9.

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