CN114531815A - Single-hole double-signal double-sided back plate and manufacturing method thereof - Google Patents
Single-hole double-signal double-sided back plate and manufacturing method thereof Download PDFInfo
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- CN114531815A CN114531815A CN202210078455.XA CN202210078455A CN114531815A CN 114531815 A CN114531815 A CN 114531815A CN 202210078455 A CN202210078455 A CN 202210078455A CN 114531815 A CN114531815 A CN 114531815A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims abstract description 22
- 238000003780 insertion Methods 0.000 claims abstract description 20
- 230000037431 insertion Effects 0.000 claims abstract description 20
- 238000000926 separation method Methods 0.000 claims abstract description 3
- 238000012545 processing Methods 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 10
- 238000004088 simulation Methods 0.000 description 9
- 238000011161 development Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The invention relates to a single-hole double-signal double-sided back plate and a manufacturing method thereof, the single-hole double-signal double-sided back plate comprises a printed board which is connected and matched with connector pins on the end surfaces of two sides of the printed board through jacks, each jack on the printed board is simultaneously connected with two connectors, at least one jack is divided into two insertion cavities which are not communicated with each other by a separation part in the middle of the jack, and each insertion cavity is communicated with a signal layer, so that the jack can realize the transmission of two signals. According to the invention, the middle of the jack on the double-sided back plate is interrupted, so that signals transmitted at two ends of the jack are not conducted, thus double-signal transmission can be realized by a single jack, the node density can be improved on the premise of not changing the original framework, and the use requirements can be met.
Description
Technical Field
The invention belongs to the technical field of double-sided back plates, and particularly relates to a single-hole double-signal double-sided back plate and a manufacturing method thereof.
Background
The double-sided back board is arranged in the middle of the chassis/frame, and daughter boards are arranged at the front and the back of the chassis/frame and are used for realizing communication between the front plugboard and the back plugboard. In a traditional backboard, a front socket and a rear socket are packaged and pressed on the backboard through the same through hole, so that the front socket is communicated with the rear socket, namely, the front plug board and the rear plug board share one pin pi to realize signal connection.
With the development of military electronic equipment miniaturization, high speed and modularization and system expansion, the interface connector nodes of the plug-in components in the chassis are more and more dense, but under the condition of the original limited framework (the interface is unchanged and the size is unchanged), the connector nodes cannot be expanded any more, and the situation that more high-speed nodes are required cannot be adapted.
If the interface needs to be expanded, the size of the original case/rack, the size of the plug-in and the type of the connector need to be changed, namely, the whole system is redesigned, so that not only is the development cost increased, but also the development period is prolonged, the development difficulty is improved, the weight of the equipment is increased, the equipment is very unfavorable for updating and upgrading, and the requirement of model development cannot be met.
Disclosure of Invention
In order to solve the problems, the invention provides a single-hole double-signal double-sided back plate and a manufacturing method thereof, which can realize the transmission of two signals through one jack by breaking the inside of the jack to make signals at two ends of the jack not be communicated, thereby increasing the number of connector nodes and meeting the requirements of more height nodes on the premise of not changing the original size and shape.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. According to the single-hole double-signal double-sided back plate provided by the invention, the single-hole double-signal double-sided back plate comprises a printed board which is connected and matched with connector contact pins on two side end surfaces of the printed board through jacks, each jack on the printed board is simultaneously connected with two connectors, at least one jack is divided into two insertion cavities which are not communicated with each other by a separation part in the middle of the jack, and each insertion cavity is communicated with one signal layer, so that the jack can realize the transmission of two signals.
The object of the present invention and the technical problems solved thereby can be further achieved by the following technical measures.
According to the single-hole double-signal double-sided back plate, the thickness of the printed plate is larger than 3.7mm, and the distance between two signal layers conducted with two insertion cavities which are not conducted with each other in the same insertion hole is not smaller than 1.3 mm.
In the aforementioned single-hole dual-signal dual-sided backplane, the partition is a broken portion in the middle of the jack.
In the single-hole double-signal double-sided back plate, the printed board is further provided with at least one double-sided guide pin for realizing plugging and guiding in cooperation with the connectors on the end surfaces of two sides.
The purpose of the invention and the technical problem to be solved are also realized by adopting the following technical scheme. The invention provides a manufacturing method of a single-hole double-signal double-sided backboard, which comprises the following steps: 1) determining the number of jacks for carrying out double-signal transmission on the printed board and the types of signals transmitted at two ends of the jacks, and designing the positions of a partition part in the jacks and signal layers communicated with two ends of the jacks in the printed board; 2) completing wiring design of the inner layer circuit board and the outer layer circuit board, and performing full link signal integrity simulation;
3) finishing the processing of the inner layer graph on the inner layer circuit board; 4) dividing the inner layer circuit board processed with the inner layer pattern into an upper part and a lower part according to the position of the inner layer circuit board in the printed board, and respectively pressing; 5) drilling holes and copper deposition are carried out on the upper part and the lower part which are respectively pressed, so that the processing of the jacks is completed, and one end of each signal hole for carrying out double-signal transmission, which is far away from the surface of the printed board, is broken; 6) pressing the two parts which are processed together, wherein the signals at the upper end and the lower end of the signal hole for double-signal transmission are not communicated; 7) and processing the outer layer circuit. The object of the present invention and the technical problems solved thereby can be further achieved by the following technical measures.
In the manufacturing method of the single-hole double-signal double-sided back plate, in the step 5), each signal hole for double-signal transmission is broken in a back drilling manner.
According to the manufacturing method of the single-hole double-signal double-sided back plate, the thickness of the printed plate is larger than 3.7mm, and the distance between two signal layers conducted with the same jack for double-signal transmission is not smaller than 1.3 mm.
In the manufacturing method of the single-hole double-signal double-sided back plate, the number of the inner circuit boards of the upper part and the lower part in the step 4) is the same.
Compared with the prior art, the invention has obvious advantages and beneficial effects. By means of the technical scheme, the invention can achieve considerable technical progress and practicability, has wide industrial utilization value and at least has the following advantages:
according to the invention, the middle of the jack on the double-sided back plate is interrupted, so that signals transmitted at two ends of the jack are not conducted, thus double-signal transmission can be realized by a single jack, the node density can be improved on the premise of not changing the original framework, and the use requirement can be met.
Drawings
FIG. 1 is a schematic diagram of a single-hole dual-signal dual-sided backplane of the present invention;
FIG. 2 is a schematic diagram of a single hole of the single hole dual signal dual-sided backplane of the present invention;
FIG. 3 is a cross-sectional view of a single-hole dual-signal dual-sided backplane of the present invention;
FIG. 4 is a schematic view of a stacked structure of the single-hole dual-signal dual-sided backplane of the present invention;
FIG. 5 is an insertion loss simulation of the single-hole dual-signal dual-sided backplane of the present invention;
FIG. 6 is a return loss simulation of the single-hole dual-signal dual-sided backplane of the present invention;
FIG. 7 is a near end crosstalk simulation for the single-hole dual-signal dual-sided backplane of the present invention;
fig. 8 is an eye diagram simulation of the single-hole dual-signal dual-sided backplane of the present invention.
[ description of main element symbols ]
1: front board connector
2: rear socket connector
3: printed board
4: double-sided guide pin
5: jack hole
6: partition part
7: front inter-board signal
8: rear plug-in board signal
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects of the single-hole dual-signal dual-sided backplane according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
Referring to fig. 1-4, which are schematic structural diagrams of various parts of the single-hole dual-signal dual-sided backplane of the present invention, the single-hole dual-signal dual-sided backplane includes a printed board 3, a jack 5 extending in a thickness direction is disposed on the printed board 3, a front interposer connector 1 fixed on a front end surface of the printed board 3 and a rear interposer connector 2 fixed on a rear end surface of the printed board 3 are respectively configured to communicate with the printed board 3 through cooperation of a contact pin extending from the front interposer connector and a corresponding jack 5 on the printed board 3.
The both ends of same jack 5 on the printing board 3 switch on with the contact pin contact of preceding plugboard connector 1 and back plugboard connector 2 respectively, and at least one jack 5 is divided into two parts that do not switch on each other by middle partition portion 6, 5 both ends of jack separated by partition portion 6 switch on with a signal layer respectively, thereby make printing board both sides and the contact pin of this jack adaptation can realize independent signal transmission, realize the transmission of dual signal in the single jack promptly, make under the unchangeable prerequisite of original framework, the signal quantity that this printing board can transmit increases.
The printed board 3 is also provided with at least one double-sided guide pin 4 which is used for being matched with the front plugboard connector 1 and the rear plugboard connector 2 to realize plugging and guiding.
In the embodiment of the invention, the printed board 3 is a 6U printed board, and the 6U printed board is a high-speed multilayer printed backboard and is used for installing electronic components such as a connector and the like to realize the functions of signal transmission, power supply and the like; each slot position of the 6U printed board is provided with 3 double-sided guide pins, and the front and back guide pins share one hole to play the roles of guiding and preventing misplugging; the front plugboard connector 1 is arranged on the front surface of the printed board 3 and switches a front plugboard signal into the printed board 3; the rear plugboard connector 2 is arranged on the back surface of the printed board 3, and the rear plugboard signal is switched to the inside of the printed board 3; the front board connector 1 and the rear board connector 2 share one package, and the front board connector 1 and the rear board connector 2 can realize communication between the front board connector 1 and the rear board connector through conduction of part of jacks 5 shared by the front board connector and the rear board connector, and can also realize transmission of different signals of the same hole site through partitions in the middle of the part of jacks 5 shared by the front board connector and the rear board connector.
In order to realize single-hole double-signal transmission, signal topology needs to be planned during design, a PCB Layout rule is set, and a proper back drilling depth is set; and performing full link signal integrity simulation. When planning the signal topology, this is achieved by designing a special stack of printed boards 3, as shown in fig. 4.
In the embodiment, the printed board 3 is made of S1000-2M material and has 18 layers; in order to ensure that the front board connector 1 and the rear board connector 2 do not interfere with each other after being crimped by sharing a hole, the thickness of the printed board 3 should be greater than 3.7mm, and is designed to be 4mm in the embodiment of the present invention.
In the embodiment of the invention, the manufacture of the printed board 3 comprises the following steps:
1) designing:
firstly, the number and the positions of jacks 5 capable of simultaneously transmitting two signals in the printed board 3 are determined, the types of the signals transmitted in the jacks are determined, in the embodiment of the invention, the signals are high-speed signals, finally, the positions of two signal layers communicated with two ends of the jacks in the printed board are determined, in the embodiment of the invention, the signal layers are respectively an S4 layer and an S16 layer, and the distance between the S4 layer and the S16 layer is not less than 1.3mm, so that the crosstalk resistant requirements of two signals in the same jack and between the signals are met.
Then, wiring design of an inner layer circuit board and an outer layer circuit board which form the printed board is completed, signals 7 between front plugboards of the S4 layer wiring are conducted with an insertion cavity at the front end of the jack 5 for double-signal transmission, signals 8 between rear plugboards of the S16 layer wiring are conducted with an insertion cavity at the rear end of the jack 5 for double-signal transmission, and finally, full link signal integrity simulation is carried out.
2) Making of
Firstly, processing the pattern of the inner layer circuit board according to the design, and equally dividing the inner layer circuit board after processing the inner layer pattern into an upper part and a lower part according to the position on a printed board, wherein the upper part comprises all layers from P2 to G9, and the lower part comprises all layers from S10 to P17. Next, the P2 layers to the G9 were laminated together, the S10 layers to the P17 layers were laminated together, and the insertion holes were processed on the laminated upper and lower portions. Specifically, when the insertion holes are machined, holes are drilled in the upper part and the lower part to form through holes between the layers, and the through holes can reach all the layers; copper is then deposited in the hole to enable signal transmission through the hole.
The position of the jack which is processed with the jack and is used for double-signal transmission in the upper part and the lower part of the jack and positioned in the middle of the printed board is interrupted, so that the upper signal and the lower signal in the jack are not communicated. In the embodiment of the invention, the jack in the upper part is back drilled from G9 to G5 layer by back drilling, so that the upper signal of the jack is only passed to S6 layer; the signal hole in the lower part is back drilled from the S10 layer to the G15 layer so that the jack lower signal only passes to the G13 layer. And then pressing the upper part and the lower part which are processed together, finally processing an outer layer (TOP layer and BOT layer) circuit, and testing the processed printed board.
In other embodiments of the present invention, the signal transmission channel in the middle of the jack may be interrupted in other ways, so that the signals at the upper end and the lower end of the jack are different, thereby performing dual-signal transmission.
In other embodiments of the present invention, when the number of printed board layers is singular, the difference between the numbers of inner layer circuit boards included in the upper and lower portions does not exceed 1. Link simulation is carried out on the invention, and the simulation result is shown in detail in figures 5-8. Wherein, fig. 5 shows the insertion loss, the solid line shows the insertion loss of the signal 7 between the front boards, the dotted line shows the insertion loss of the signal 8 between the rear boards, the insertion loss of the two are basically overlapped within 9GHz, the insertion loss of 6.25Gbps is 5.11dB, which is far lower than the 15.9dB requirement specified in VITA 68.
Fig. 6 shows return loss, the solid line shows return loss of signal 7 between front boards, the dotted line shows return loss of signal 8 between rear boards, the return loss of the two are basically coincident within 16GHz, and return loss of 6.25Gbps is about 17.6dB, which is far better than the 5dB requirement specified in VITA 68.
Fig. 7 shows near-end crosstalk of signals 7 between front boards and signals 8 between rear boards, and within 16GHz, the crosstalk is about 30dB, which can meet the use requirement.
Fig. 8 is a transmission eye diagram of signals 7 between the front board and signals 8 between the rear board, the eye height is 488mV, the eye width is 130ps, and the transmission eye diagram can meet the use requirement within 6.25 Gbps.
The measures enable the signals 7 between the front plugboards and the signals 8 between the rear plugboards to share one hole, the front signal speed and the rear signal speed can reach 6.25Gbps, the expenditure of the connector nodes is saved, meanwhile, the flexible arrangement can be carried out according to actual conditions, the development cost is saved, and the development period is shortened.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. The utility model provides a two-sided backplate of haplopore dual signal, its includes the printing board of connecting the adaptation through the jack rather than the connector contact pin on the both sides terminal surface, and every jack on this printing board all is connected its characterized in that with two connectors simultaneously: at least one jack is divided into two insertion cavities which are not communicated with each other by a separation part in the middle of the jack, and each insertion cavity is communicated with one signal layer, so that the jack can realize the transmission of two signals.
2. The single-hole dual-signal dual-sided backplane of claim 1, wherein: the thickness of the printed board is larger than 3.7mm, and the distance between two signal layers which are conducted with two insertion cavities which are not conducted in the same insertion hole is not smaller than 1.3 mm.
3. The single-hole dual-signal dual-sided backplane of claim 1, wherein: wherein the partition is a broken part in the middle of the jack.
4. The single-hole dual-signal dual-sided backplane of claim 1, wherein: the printed board is also provided with at least one double-sided guide pin which is used for realizing plugging and guiding in cooperation with the connectors on the end surfaces of two sides.
5. The method for manufacturing the single-hole double-signal double-sided back plate of claim 1, wherein the method comprises the following steps: dividing an inner layer circuit board forming the printed board into an upper part and a lower part according to the position of the inner layer circuit board in the printed board, and respectively pressing the two parts;
drilling holes and copper deposition are carried out on the upper part and the lower part which are respectively pressed, so as to finish the processing of the jacks, one end of each signal hole for carrying out double-signal transmission, which is far away from the surface of the printed board, is broken, and then the upper part and the lower part which are finished with the processing are pressed together; and finally, processing the outer layer circuit.
6. The method for manufacturing the single-hole double-signal double-sided back plate according to claim 5, wherein the method comprises the following steps: planning signal layers during printed board design, respectively arranging two signals transmitted through the same jack on the upper part and the lower part of the printed board, wherein the thickness of the printed board is larger than 3.7mm, and the distance between the two signal layers conducted with the same jack for double-signal transmission is not smaller than 1.3 mm.
7. The method for manufacturing the single-hole double-signal double-sided back plate according to claim 6, wherein the method comprises the following steps: the way of interrupting each signal hole for dual signal transmission is back drilling.
8. The method for manufacturing the single-hole double-signal double-sided back plate according to claim 6, wherein the method comprises the following steps: the upper and lower parts comprise the same number of inner layer circuit boards.
9. The method for manufacturing the single-hole double-signal double-sided back plate according to claim 7, wherein the method comprises the following steps: and when the printed board is designed, the setting of the back drilling depth of the upper part and the lower part after being pressed in the jack for double signal transmission is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210078455.XA CN114531815A (en) | 2022-01-24 | 2022-01-24 | Single-hole double-signal double-sided back plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210078455.XA CN114531815A (en) | 2022-01-24 | 2022-01-24 | Single-hole double-signal double-sided back plate and manufacturing method thereof |
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| CN114531815A true CN114531815A (en) | 2022-05-24 |
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|---|---|---|---|
| CN202210078455.XA Pending CN114531815A (en) | 2022-01-24 | 2022-01-24 | Single-hole double-signal double-sided back plate and manufacturing method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207568A (en) * | 2002-12-26 | 2004-07-22 | Nippon Avionics Co Ltd | Multilayer printed wiring board and manufacturing method thereof |
| US20090108872A1 (en) * | 2007-10-31 | 2009-04-30 | Hiroshi Suenaga | interface circuit that can switch between single-ended transmission and differential transmission |
| CN104661427A (en) * | 2015-02-15 | 2015-05-27 | 华为技术有限公司 | Printed circuit board and manufacturing method thereof |
| WO2016165368A1 (en) * | 2015-09-29 | 2016-10-20 | 中兴通讯股份有限公司 | Circuit board with stepped holes on both surfaces and implementing method thereof |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
| CN109379859A (en) * | 2018-10-10 | 2019-02-22 | 广州添利电子科技有限公司 | The residual copper stake manufacture craft of back drill zero in PCB substrate |
| KR20210089474A (en) * | 2020-01-08 | 2021-07-16 | 주식회사 이랜텍 | Electronic device having spacer pcb |
-
2022
- 2022-01-24 CN CN202210078455.XA patent/CN114531815A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207568A (en) * | 2002-12-26 | 2004-07-22 | Nippon Avionics Co Ltd | Multilayer printed wiring board and manufacturing method thereof |
| US20090108872A1 (en) * | 2007-10-31 | 2009-04-30 | Hiroshi Suenaga | interface circuit that can switch between single-ended transmission and differential transmission |
| CN104661427A (en) * | 2015-02-15 | 2015-05-27 | 华为技术有限公司 | Printed circuit board and manufacturing method thereof |
| WO2016165368A1 (en) * | 2015-09-29 | 2016-10-20 | 中兴通讯股份有限公司 | Circuit board with stepped holes on both surfaces and implementing method thereof |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
| CN109379859A (en) * | 2018-10-10 | 2019-02-22 | 广州添利电子科技有限公司 | The residual copper stake manufacture craft of back drill zero in PCB substrate |
| KR20210089474A (en) * | 2020-01-08 | 2021-07-16 | 주식회사 이랜텍 | Electronic device having spacer pcb |
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