CN114530430A - Package and method for manufacturing the same - Google Patents

Package and method for manufacturing the same Download PDF

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Publication number
CN114530430A
CN114530430A CN202111626922.XA CN202111626922A CN114530430A CN 114530430 A CN114530430 A CN 114530430A CN 202111626922 A CN202111626922 A CN 202111626922A CN 114530430 A CN114530430 A CN 114530430A
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CN
China
Prior art keywords
package
region
conductive layer
welding
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111626922.XA
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Chinese (zh)
Inventor
顾夏茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tongfu Microelectronics Co Ltd
Original Assignee
Tongfu Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tongfu Microelectronics Co Ltd filed Critical Tongfu Microelectronics Co Ltd
Priority to CN202111626922.XA priority Critical patent/CN114530430A/en
Publication of CN114530430A publication Critical patent/CN114530430A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The application discloses a package and a preparation method thereof, the package comprises: packaging the main body; connecting terminal, including the first end and the second end that set up back to the back, first end is connected with the encapsulation main part, is connected with the face of weld between first end and the second end, and the at least part of the terminal surface of second end is provided with the conducting layer of being connected with the face of weld, and wherein, the material of conducting layer is the same with the welding material, and the welding material is used for welding the encapsulation body to the circuit board. The application provides a packaging body can improve the welding reliability of packaging body and circuit board to and be convenient for visual inspection.

Description

Package and method for manufacturing the same
Technical Field
The present disclosure relates to the field of semiconductor technologies, and in particular, to a package and a method for manufacturing the package.
Background
Along with the development of science and technology, electronic products have become an indispensable part in daily life, and the prerequisite that electronic products can normally work is that the electrical connection between the internal device is reliable, but at present the connection between electronic device and the circuit board is unstable, still exists to connect the phenomenon of opening a way to influence the normal work of whole electronic products.
Disclosure of Invention
The application provides a package and a preparation method thereof, which can improve the welding reliability of the package and a circuit board and facilitate visual inspection.
A first aspect of an embodiment of the present application provides a package, including: a package body; connecting terminal, including the first end and the second end that set up back to the back, the first end with the encapsulation main part is connected, the first end with be connected with the face of weld between the second end, at least part of the terminal surface of second end be provided with the conducting layer that the face of weld is connected, wherein, the material of conducting layer is the same with the welding material, the welding material be used for with the encapsulation body welds on the circuit board.
The end face of the second end portion comprises a first area and a second area, the first area is provided with the conducting layer, and the first area is a sunken area connected with the welding face.
The conductive layer is arranged in the region of the connecting terminal surface, except the region connected with the packaging main body and the first region.
Wherein, the material of the conducting layer is tin.
Wherein the package body includes: the connecting terminal is connected with the supporting part, and the welding surface of the connecting terminal is opposite to the supporting surface; the electronic device is fixed on the supporting surface and is electrically connected with the connecting terminal through the supporting part; and the plastic package body wraps the electronic device on the supporting part.
Wherein the package body further comprises: and the heat sink is connected with the packaging main body.
A second aspect of the embodiments of the present application provides a method for manufacturing a package, including: form encapsulation main part and connecting terminal, wherein, connecting terminal is including carrying on the back first end and the second tip that sets up mutually, first end with encapsulation main part is connected, first end with be connected with the face of weld between the second end, at least part of the terminal surface of second end be provided with the conducting layer that the face of weld is connected, wherein, the material of conducting layer is the same with the welding material, the welding material be used for with the encapsulation body welds on the circuit board.
Wherein, the step of forming the package body and the connection terminal includes: providing a frame, wherein the frame comprises a supporting part and a connecting part connected with the supporting part, the supporting part is provided with a supporting surface, the connecting part is provided with a welding surface, and the welding surface is arranged opposite to the supporting surface; pre-cutting the connecting part to form a concave area connected with the welding surface; forming the conductive layer at least on the surface of the recessed region; mounting an electronic device and a plastic package body wrapping the electronic device on the supporting part; the connecting portion is cut along a cutting line passing through the recessed region.
Wherein the step of precutting the connection portion comprises: and pre-cutting the connecting part by adopting a stamping process or an etching process.
Wherein the step of forming the conductive layer at least on the surface of the recess region comprises: and forming the conductive layer on at least the surface of the recessed region by adopting an electroplating process.
The beneficial effects are that: this application sets up the conducting layer of being connected with the face of weld at the terminal surface of connecting terminal's second tip, and the material of conducting layer is the same with the welding material, thereby at the in-process of welding the packaging body at the circuit board, the welding material is infiltratable in the region that is equipped with the conducting layer, particularly, the welding material can upwards stretch along the terminal surface of second tip, after the welding, the terminal surface of connecting terminal is formed with the welding material, finally the welding reliability of connecting terminal and circuit board on the one hand can be guaranteed, on the other hand when carrying out visual inspection to the packaging body of welding on the circuit board, can be through the content of the welding material that forms at the terminal surface, judge whether be connected reliably between packaging body and the circuit board, thereby can improve visual inspection's convenience.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic diagram of a simple structure of an embodiment of the package of the present application;
FIG. 2 is a schematic cross-sectional view of the package body of FIG. 1;
FIG. 3 is a schematic view of a portion of the package of FIG. 1 soldered to a circuit board;
FIG. 4 is a schematic diagram of a prior art package soldered to a circuit board;
FIG. 5 is a schematic flow chart diagram illustrating one embodiment of a method for making a package according to the present application;
FIG. 6 is a flow chart of a manufacturing process corresponding to the manufacturing method of FIG. 5;
FIG. 7 is a flow chart of a process for manufacturing another embodiment of the package of the present application;
FIG. 8 is a schematic view of a portion of a package prepared by the packaging method of FIG. 7 soldered to a circuit board;
FIG. 9 is a schematic diagram of a simplified structure of another embodiment of the package of the present application;
fig. 10 is a schematic view of a portion of the package of fig. 9 soldered to a circuit board.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a package of the present application, and the package 100 includes a package body 110 and a connection terminal 120.
The package body 110 is a core of the package body 100. Referring to fig. 2, in the present embodiment, the package body 110 includes a support portion 111, an electronic device 112, and a plastic package body 113. The supporting portion 111 is provided with a supporting surface 1111, the electronic device 112 is fixed on the supporting surface 1111, and the plastic package body 113 wraps the electronic device 112 on the supporting portion 111 to protect the electronic device 112. The electronic device 112 may be, for example, a bare chip, a capacitor, or a resistor, and is not limited herein. The plastic package body 113 may be made of epoxy resin or the like. The structure of the package body 110 is not limited in this application, and in other embodiments, the package body 110 may also have other structures.
The connection terminal 120 is connected to the package body 110, and in the present embodiment, the connection terminal 120 is specifically connected to a support portion 111 in the package body 110, wherein the materials of the support portion 111 and the connection terminal 120 are both metals, the electronic device 112 fixed on the support portion 111 is electrically connected to the support portion 111, and the connection terminal 120 is electrically connected to the support portion 111, so that the connection terminal 120 is electrically connected to the support portion 111, and the connection terminal 120 transmits a communication signal transmitted by the electronic device 112 to the outside.
With reference to fig. 1 and fig. 3, the connection terminal 120 includes a first end 121 and a second end 122 that are opposite to each other, the first end 121 is connected to the package body 110, the second end 122 is far away from the package body 110, and a welding surface 123 is connected between the first end 121 and the second end 122, the welding surface 123 is opposite to the supporting surface 1111, in this embodiment, the package body 100 is welded on the circuit board B in a patch manner, and the welding process specifically includes: the solder C is coated on the circuit board B, and then the package 100 is placed on the solder C with the soldering surface 123 of the connection terminal 120 facing the circuit board B, and after reflow, the package 100 is fixed on the circuit board B.
In the present embodiment, at least a portion of the end surface 1221 of the second end 122 of the connection terminal 120 is provided with the conductive layer 130 connected to the soldering surface 123, wherein the material of the conductive layer 130 is the same as that of the solder C used for soldering the package 100 to the circuit board B.
Referring to fig. 4, in the prior art, an end surface 1 of a connection terminal a is a cut surface and is made of bare copper, and when the connection terminal a is welded on a circuit board B by using a welding material C, the welding material C cannot infiltrate the surface of the copper, so that the welding material C cannot climb onto the end surface 1 of the connection terminal a, and thus the connection terminal a may not be welded with the circuit board B, and the connection reliability between the connection terminal a and the circuit board B cannot be ensured.
In the present embodiment, referring to fig. 3, since at least a portion of the end surface 1221 of the second end portion 122 is provided with the conductive layer 130 connected to the soldering surface 123, during the soldering process, the solder C may climb up along the end surface 1221, that is, the solder C may be wet in the area of the end surface 1221 where the conductive layer 130 is provided, so that after the soldering process, the solder C is formed in at least a portion of the area of the second end portion 122, which can ensure the soldering reliability between the connection terminal 120 and the circuit board B, on the one hand, and on the other hand, when the package 100 soldered on the circuit board B is visually inspected, whether the connection between the package 100 and the circuit board B is reliable or not can be determined by the content of the solder C formed in the end surface 1221, thereby improving the convenience of the visual inspection.
Here, considering that the solder C is generally a solder paste, the material for providing the conductive layer 130 is tin. Of course, in other embodiments, the material of the conductive layer 130 may be other, as long as the material of the conductive layer 130 is ensured to be the same as the solder C.
Referring to fig. 1, in order to improve the heat dissipation performance of the package 100, the package body 110 is connected to a heat sink 140 to conduct the heat generated inside the package body 110, so as to improve the lifetime of the package 100.
Referring to fig. 1, 3 and 5, a method for manufacturing the package 100 is described, the method including:
s110: forming a package body 110 and a connection terminal 120, wherein the connection terminal 120 includes a first end portion 121 and a second end portion 122 that are opposite to each other, the first end portion 121 is connected to the package body 110, a soldering surface 123 is connected between the first end portion 121 and the second end portion 122, at least a portion of an end surface 1221 of the second end portion 122 is provided with a conductive layer 130 connected to the soldering surface 123, the material of the conductive layer 130 is the same as that of a solder C, and the solder C is used for soldering the package body 100 to a circuit board B.
Referring to fig. 6, step S110 specifically includes:
(a1) the frame 300 is provided, the frame 300 includes a supporting portion 310 and a connecting portion 320 connected to the supporting portion 310, the supporting portion 310 has a supporting surface 311, the connecting portion 320 has a welding surface (not shown), and the welding surface is opposite to the supporting surface 311.
The number of the connection portions 320 connected to the support portion 310 may be one or more, and when the number of the connection portions 320 is more, an opening is formed between two adjacent connection portions 320.
In the process of subsequently soldering the obtained package on the circuit board, the soldering surface of the connecting portion 320 is soldered to the circuit board, that is, the soldering surface faces the circuit board, and the supporting surface 311 faces away from the circuit board.
(b1) An electronic device (not shown) and a plastic package body (not shown) for wrapping the electronic device are mounted on the supporting surface 311.
Electronic devices such as bare chips, capacitors, resistors, etc. are mounted on the supporting surface 311 of the supporting part 310, and then the electronic devices are subjected to plastic encapsulation, and are protected by a plastic encapsulation body.
(c1) The connection portion 320 is cut along the cutting line L of the frame 300 to form a connection terminal 321 connected to the support portion 310.
After the electronic device is molded, the connection portion 320 is cut along the cutting line L, and the connection portion 320 connected to the support portion 310 is formed as a connection terminal 321.
(d1) A conductive layer (not shown) is formed on at least a portion of the end surface 3211 of the connection terminal 321 remote from the support portion 310.
A conductive layer is formed on at least a portion of the end surface 3211 of the connection terminal 321, so that during a subsequent process of soldering a circuit board to the package, solder wets on the conductive layer, and the solder between the connection terminal 321 and the circuit board spreads upward along the conductive layer, thereby enhancing the soldering reliability between the connection terminal 321 and the circuit board, and determining the soldering reliability of the package through the solder formed on the conductive layer during visual inspection.
A conductive layer connected to the bonding surface may be formed on at least a partial region of the end surface 3211 of the connection terminal 321 by plating, vapor deposition, or the like, and the conductive layer may be made of tin in consideration of the fact that solder paste is the most widely used solder paste.
In the above-mentioned manufacturing process, since the conductive layer is formed after the molding compound, there is a risk that the conductive material contaminates the molding compound in the process of forming the conductive layer, and thus in another embodiment of the present application, referring to fig. 7, the package is manufactured by the following method:
(a2) the frame 400 is provided, the frame 400 includes a supporting portion 410 and a connecting portion 420 connected to the supporting portion 410, the supporting portion 410 has a supporting surface 411, the connecting portion 420 has a welding surface, and the welding surface (not shown) is opposite to the supporting surface 411.
The frame 400 has the same structure as the frame 300, and the details can be found in the above description.
(b2) The connection part 420 is pre-cut to form a recess region 4201 connected to the bonding surface.
The connecting portion 420 may be pre-cut by laser cutting, etching, stamping, etc. to form the concave area 4201 connected to the bonding surface. Wherein the pre-cutting process is not limited by the present application.
The recessed area 4201 may be a groove, a through groove, or the like, as long as the recessed area 4201 is connected to the welding surface, and the specific shape thereof is not limited in the present application.
(c2) A conductive layer (not shown) is formed on at least the surface of the recess 4201.
In this embodiment, a conductive layer may be formed on at least the surface of the concave region 4201 by electroplating, vapor deposition, or the like. The conductive layer is made of the same material as the solder, such as tin.
In an application scenario, step (c2) may specifically form a conductive layer on both surfaces of the connection portion 420.
(d2) The electronic device and the plastic package body wrapping the electronic device are mounted on the support portion 410.
The same as in the above step (b 1).
(e2) The connection portion 420 is cut along a cutting line L passing through the depression region 4201.
After being cut, the connection portion 420 connected with the support portion 410 forms a connection terminal 421.
In this embodiment, since the connection part 420 is pre-cut, referring to fig. 8, the end surface 4211 of the connection terminal 421 away from the support part 410 includes a first region 42111 and a second region 42112, the second region 42112 is a cut surface, the first region 42111 is a recessed region connected to the welding surface, and first area 42111 is provided with conductive layer 430, at this time during soldering of the resulting package to circuit board B, since the first region 42111 is provided with the conductive layer 430 to which the solder is to be soldered, the solder C wets on the conductive layer 430, the solder C between the connection terminal 421 and the circuit board B spreads upward along the conductive layer 430, so that, on the one hand, the soldering reliability of the connection terminals 421 with the circuit board B can be enhanced, and, on the other hand, the soldering reliability of the package can be judged by the content of the solder C formed on the conductive layer 430.
Through this embodiment, the package 500 shown in fig. 9 and 10 is finally obtained, and specifically, the package 500 includes a package main body 510 and a connection terminal 520.
The package body 510 has the same structure as the package body 110 in the previous embodiment, which can be seen in detail in the foregoing.
The connection terminal 520 includes a first end 521 and a second end 522 that are opposite to each other, the first end 521 is connected to the package body 510, a soldering surface (not shown) is connected between the first end 521 and the second end 522, an end surface 5221 of the second end 522 includes a first region 52211 and a second region 52212, the first region 52211 is provided with a conductive layer 530, the first region 52211 is a recessed region connected to the soldering surface, the conductive layer 530 is made of the same material as a solder, and the solder is used for soldering the package body 500 to a circuit board.
In an application scenario, if the conductive layer 530 is formed on the surface of the connection portion 420 in step (c2) during the process of manufacturing the package 500, the conductive layer 530 is provided on the surface of the connection terminal 520 of the package 500 obtained at this time, except for the region connected to the package body 510 and the first region 52211.
The above description is only an embodiment of the present application, and is not intended to limit the scope of the present application, and all equivalent structures or equivalent processes performed by the present application and the contents of the attached drawings, which are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. A package, comprising:
a package body;
connecting terminal, including the first end and the second end that set up back to the back, the first end with the encapsulation main part is connected, the first end with be connected with the face of weld between the second end, at least part of the terminal surface of second end be provided with the conducting layer that the face of weld is connected, wherein, the material of conducting layer is the same with the welding material, the welding material be used for with the encapsulation body welds on the circuit board.
2. The package of claim 1, wherein the end surface of the second end portion comprises a first region and a second region, the first region is provided with the conductive layer, and the first region is a recessed region connected to the soldering surface.
3. The package according to claim 2, wherein the regions of the connecting terminal surfaces, except the region connected to the package body and the first region, are provided with the conductive layer.
4. The package of claim 1, wherein the material of the conductive layer is tin.
5. The package of claim 1, wherein the package body comprises:
the connecting terminal is connected with the supporting part, and the welding surface of the connecting terminal is opposite to the supporting surface;
the electronic device is fixed on the supporting surface and is electrically connected with the connecting terminal through the supporting part;
and the plastic package body wraps the electronic device on the supporting part.
6. The package of claim 1, further comprising:
and the heat sink is connected with the packaging main body.
7. A method for manufacturing a package, comprising:
form encapsulation main part and connecting terminal, wherein, connecting terminal is including carrying on the back first end and the second tip that sets up mutually, first end with encapsulation main part is connected, first end with be connected with the face of weld between the second end, at least part of the terminal surface of second end be provided with the conducting layer that the face of weld is connected, wherein, the material of conducting layer is the same with the welding material, the welding material be used for with the encapsulation body welds on the circuit board.
8. The method of claim 7, wherein the step of forming the package body and the connection terminals comprises:
providing a frame, wherein the frame comprises a supporting part and a connecting part connected with the supporting part, the supporting part is provided with a supporting surface, the connecting part is provided with a welding surface, and the welding surface is arranged opposite to the supporting surface;
pre-cutting the connecting part to form a concave area connected with the welding surface;
forming the conductive layer at least on the surface of the recessed region;
mounting an electronic device and a plastic package body wrapping the electronic device on the supporting part;
the connecting portion is cut along a cutting line passing through the recessed region.
9. The method of claim 8, wherein the step of pre-cutting the connection comprises:
and pre-cutting the connecting part by adopting a stamping process or an etching process.
10. The method of claim 8, wherein the step of forming the conductive layer on at least the surface of the recessed region comprises:
and forming the conductive layer on at least the surface of the recessed region by adopting an electroplating process.
CN202111626922.XA 2021-12-28 2021-12-28 Package and method for manufacturing the same Pending CN114530430A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111626922.XA CN114530430A (en) 2021-12-28 2021-12-28 Package and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111626922.XA CN114530430A (en) 2021-12-28 2021-12-28 Package and method for manufacturing the same

Publications (1)

Publication Number Publication Date
CN114530430A true CN114530430A (en) 2022-05-24

Family

ID=81620927

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111626922.XA Pending CN114530430A (en) 2021-12-28 2021-12-28 Package and method for manufacturing the same

Country Status (1)

Country Link
CN (1) CN114530430A (en)

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