CN114525094A - Hot melt adhesive for bonding high-temperature-resistant food bags and preparation method thereof - Google Patents
Hot melt adhesive for bonding high-temperature-resistant food bags and preparation method thereof Download PDFInfo
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- CN114525094A CN114525094A CN202210015159.5A CN202210015159A CN114525094A CN 114525094 A CN114525094 A CN 114525094A CN 202210015159 A CN202210015159 A CN 202210015159A CN 114525094 A CN114525094 A CN 114525094A
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 69
- 239000011347 resin Substances 0.000 claims abstract description 69
- 229920001971 elastomer Polymers 0.000 claims abstract description 37
- 239000005060 rubber Substances 0.000 claims abstract description 37
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000003208 petroleum Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000004169 Hydrogenated Poly-1-Decene Substances 0.000 claims abstract description 23
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 23
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 23
- 235000019383 crystalline wax Nutrition 0.000 claims abstract description 23
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 16
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 16
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 16
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 21
- 238000006243 chemical reaction Methods 0.000 claims description 12
- -1 pentaerythritol ester Chemical class 0.000 claims description 8
- 239000002530 phenolic antioxidant Substances 0.000 claims description 7
- WPMYUUITDBHVQZ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoic acid Chemical compound CC(C)(C)C1=CC(CCC(O)=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-N 0.000 claims description 6
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical group CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 150000008301 phosphite esters Chemical class 0.000 claims description 6
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 claims description 3
- 229920006026 co-polymeric resin Polymers 0.000 claims description 3
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 2
- 150000004678 hydrides Chemical class 0.000 claims description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 8
- 231100000252 nontoxic Toxicity 0.000 abstract description 6
- 230000003000 nontoxic effect Effects 0.000 abstract description 6
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 13
- 239000003292 glue Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000002904 solvent Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 231100000956 nontoxicity Toxicity 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09J157/02—Copolymers of mineral oil hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
- Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A hot melt adhesive for bonding high-temperature resistant food bags and a preparation method thereof relate to the technical field of hot melt adhesives; comprises the following components in percentage by weight: 10-20% of naphthenic oil, 20-30% of SIS rubber, 3-8% of SBS rubber, 30-40% of petroleum resin, 10-30% of rosin resin, 3-8% of crystalline wax, 0.1-1% of phenol antioxidant and 0.1-1% of phosphite antioxidant. According to the invention, the SIS rubber and the SBS rubber are used as base materials, the content of styrene is increased, so that the high temperature resistance is ensured, and meanwhile, the crystalline wax is added, so that the hot melt adhesive can be modified, the high temperature resistance is improved, and the bonding of the hot melt adhesive can resist the high temperature of food. The petroleum resin and the rosin resin are added as the tackifier, so that the adhesion and the stability of the adhesive layer are improved, the hot melt adhesive keeps excellent adhesion performance at high temperature through reasonable collocation of the components, has low-temperature material breaking performance, and is safe and nontoxic.
Description
Technical Field
The invention belongs to the technical field of hot melt adhesives, and particularly relates to a hot melt adhesive for bonding high-temperature-resistant food bags and a preparation method thereof.
Background
The food bag is a paper-plastic composite bag for food packaging, the main raw materials of the plastic film of the food bag are polyethylene, polypropylene and the like, and the food bag is tasteless, nontoxic, corrosion-resistant, safe and harmless to human bodies, but not easy to package. The common adhesive contains a small amount of toxic volatile solvent, which is harmful to human health.
The hot melt adhesive serving as an environment-friendly adhesive has the characteristics of no toxicity, no odor, no solvent, strong plasticity, simple production process and no pollution, and has great development prospect in the field of hot melt adhesives for bonding food bags. However, the general hot melt adhesive is only suitable for being used at normal temperature, and when the hot melt adhesive is used for containing food at high temperature (above 65 ℃) for a long time, the problems of reduced bonding firmness, glue failure and the like are easy to occur; and at low temperature, the water on the surface of the food is frozen and is adhered to the food bag, and if the viscosity of the adhesive colloid is too high, the food is not easy to take out. Therefore, it is necessary to develop a hot melt adhesive having excellent adhesion at high temperature and also having low-temperature rupture properties.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide the hot melt adhesive for bonding the high-temperature-resistant food bag, which keeps excellent adhesive force performance at high temperature, has low-temperature material breaking performance, and is safe and nontoxic.
The invention also aims to provide a preparation method of the hot melt adhesive for bonding the high-temperature-resistant food bags, which has simple preparation process, no toxicity and no pollution.
One of the purposes of the invention is realized by adopting the following technical scheme:
the hot melt adhesive for bonding the high-temperature-resistant food bag comprises the following components in percentage by weight:
further, the paint comprises the following components in percentage by weight:
further, the naphthenic oil has a viscosity of 50 to 500cps at 40 ℃.
Further, the styrene content in the SIS rubber is 15-40%.
Further, the styrene content in the SBS rubber is 20-40%.
Further, the petroleum resin is any one of DCPD resin, C5 petroleum resin, C9 petroleum resin, C5/C9 copolymer resin or hydride thereof, and the softening point of the petroleum tackifying resin is 90-120 ℃;
the softening point of the rosin resin is 90-120 ℃.
Further, the crystalline wax is any one or more of PE wax, PP wax and Fischer-Tropsch wax; the melting point of the crystalline wax is 90-120 ℃.
Further, the phenolic antioxidant is any one or more of 2, 6-di-tert-butyl-p-cresol, tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester and beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid n-octadecyl ester;
the phosphite ester antioxidant is tris [2, 4-di-tert-butylphenyl ] phosphite.
The second purpose of the invention is realized by adopting the following technical scheme:
a preparation method of a hot melt adhesive for bonding high-temperature-resistant food bags comprises the following steps:
1) heating and uniformly stirring the petroleum resin and the rosin resin in the formula amount to obtain tackifying resin;
2) heating a reaction kettle, putting naphthenic oil, SIS rubber, SBS rubber, crystalline wax, a phenol antioxidant, a phosphite antioxidant and part of tackifying resin into the reaction kettle, stirring at a low speed, simultaneously vacuumizing until the materials are completely melted, adding the rest tackifying resin, vacuumizing for the second time until the materials are free of bubbles, and discharging.
Further, in the step 1), the heating temperature is 130-140 ℃, and the stirring speed is 50-120 rpm;
in the step 2), the heating temperature is 150-.
Compared with the prior art, the invention has the beneficial effects that:
the invention relates to a high-temperature-resistant hot melt adhesive for bonding food bags, which comprises naphthenic oil, SIS rubber (styrene-isoprene-styrene copolymer), SBS rubber (styrene-butadiene-styrene copolymer), petroleum resin, rosin resin, crystalline wax, a phenol antioxidant and a phosphite antioxidant. SIS rubber and SBS rubber are adopted, the content of styrene is increased, so that the high temperature resistance is guaranteed, meanwhile, crystalline wax is added, the hot melt adhesive can be modified, the high temperature resistance is improved, and the bonding of the hot melt adhesive can resist the high temperature of food;
the naphthenic oil has high dissolving power and excellent low-temperature performance, can have excellent compatibility with SIS rubber and SBS rubber, improves the dispersibility, and achieves the effect of giving consideration to the low-temperature material breaking performance by controlling the content of the naphthenic oil. Petroleum resin and rosin resin are added as the tackifier, so that the adhesion and stability of the adhesive layer are improved, and the hot melt adhesive is not easy to seep oil; the phenol antioxidant and the phosphite antioxidant can delay the combination and oxidation of high polymers, thereby prolonging the service life of the product; according to the formula, through reasonable matching of the components, the hot melt adhesive keeps excellent adhesive force performance at high temperature, has low-temperature material breaking performance, and is safe and non-toxic.
The preparation method of the hot melt adhesive for bonding the high-temperature-resistant food bags comprises the steps of heating and mixing the raw materials in the formula, adding no solvent or toxic and harmful substances in the preparation process, wherein the finally produced hot melt adhesive belongs to an environment-friendly and nontoxic adhesive, and simultaneously, two-stage vacuumizing treatment is adopted, so that the materials can be uniformly stirred at a lower stirring speed by stirring under vacuum, the blending degree is improved, bubbles are removed, the product keeps enough cohesive force, the stability is high, and the oil is not easy to leak; the preparation method has simple process and no pollution, and is suitable for batch production.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
Example 1
The hot melt adhesive for bonding the high-temperature-resistant food bag comprises the following components in percentage by weight:
the naphthenic oil has a viscosity of 120-160cps at 40 ℃.
The styrene content in the SIS rubber is 30%.
The styrene content in the SBS rubber is 40%.
The petroleum resin is C5 petroleum resin, and the softening point of the petroleum tackifying resin is 100 ℃;
the softening point of the rosin resin is 100 ℃.
The crystalline wax is fischer tropsch wax; the melting point of the crystalline wax is 100 ℃.
The phenolic antioxidant is tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester;
the phosphite ester antioxidant is tris [2, 4-di-tert-butylphenyl ] phosphite.
The preparation method of the hot melt adhesive for bonding the high-temperature-resistant food bags comprises the following steps:
1) heating and uniformly stirring the petroleum resin and the rosin resin in the formula amount to obtain tackifying resin; the heating temperature is 135 ℃, and the stirring speed is 60 rpm;
2) heating a reaction kettle to 160 ℃, putting naphthenic oil, SIS rubber, SBS rubber, crystalline wax, a phenol antioxidant, a phosphite antioxidant and tackifying resin accounting for 50% of the total mass of the tackifying resin into the reaction kettle, stirring at a low speed, wherein the speed of stirring at the low speed is 30rpm, vacuumizing at the same time, the vacuum degree is-0.08 MPa, the stirring time is 1.5h, adding the rest tackifying resin after the materials are completely melted, vacuumizing for the second time, the vacuum degree is-0.08 MPa, keeping the vacuum degree for 50min, and discharging after the materials are free of bubbles.
Example 2
The hot melt adhesive for bonding the high-temperature-resistant food bag comprises the following components in percentage by weight:
the naphthenic oil has a viscosity of 120-160cps at 40 ℃.
The styrene content in the SIS rubber is 38%.
The styrene content in the SBS rubber is 38%.
The petroleum resin is DCPD resin, and the softening point of the petroleum tackifying resin is 100 ℃;
the softening point of the rosin resin is 100 ℃.
The crystalline wax is fischer tropsch wax; the melting point of the crystalline wax is 100 ℃.
The phenolic antioxidant is tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester;
the phosphite ester antioxidant is tris [2, 4-di-tert-butylphenyl ] phosphite.
The preparation method of the hot melt adhesive for bonding the high-temperature-resistant food bags comprises the following steps:
1) heating and uniformly stirring the petroleum resin and the rosin resin in the formula amount to obtain tackifying resin; the heating temperature is 140 ℃, and the stirring speed is 60 rpm;
2) heating a reaction kettle to 165 ℃, putting naphthenic oil, SIS rubber, SBS rubber, crystalline wax, a phenol antioxidant, a phosphite antioxidant and tackifying resin accounting for 50% of the total mass of the tackifying resin into the reaction kettle, stirring at a low speed, wherein the speed of stirring at the low speed is 30rpm, vacuumizing at the same time, the vacuum degree is-0.08 MPa, the stirring time is 1.5h, adding the rest tackifying resin after the materials are completely melted, vacuumizing for the second time, the vacuum degree is-0.08 MPa, keeping the vacuum degree for 50min, and discharging after the materials are free of bubbles.
Example 3
The hot melt adhesive for bonding the high-temperature-resistant food bag comprises the following components in percentage by weight:
the naphthenic oil has a viscosity of 120-160cps at 40 ℃.
The styrene content in the SIS rubber is 32%.
The styrene content in the SBS rubber is 40%.
The petroleum resin is C5/C9 copolymer resin, and the softening point of the petroleum tackifying resin is 100 ℃;
the softening point of the rosin resin is 100 ℃.
The crystalline wax is fischer tropsch wax; the melting point of the crystalline wax is 100 ℃.
The phenolic antioxidant is tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester;
the phosphite ester antioxidant is tris [2, 4-di-tert-butylphenyl ] phosphite.
The preparation method of the hot melt adhesive for bonding the high-temperature-resistant food bags comprises the following steps:
1) heating and uniformly stirring the petroleum resin and the rosin resin in the formula amount to obtain tackifying resin; the heating temperature is 130 ℃, and the stirring speed is 60 rpm;
2) heating a reaction kettle to 155 ℃, putting naphthenic oil, SIS rubber, SBS rubber, crystalline wax, a phenol antioxidant, a phosphite antioxidant and tackifying resin accounting for 50% of the total mass of the tackifying resin into the reaction kettle, stirring at a low speed, wherein the speed of stirring at the low speed is 30rpm, vacuumizing at the same time, the vacuum degree is-0.08 MPa, the stirring time is 2 hours, adding the balance of tackifying resin after the materials are completely melted, vacuumizing for the second time, the vacuum degree is-0.08 MPa, keeping the vacuum degree for 50 minutes, and discharging after the materials are free of bubbles.
Example 4
The hot melt adhesive for bonding the high-temperature-resistant food bag comprises the following components in percentage by weight:
the naphthenic oil has a viscosity of 120-160cps at 40 ℃.
The styrene content in the SIS rubber is 30%.
The styrene content in the SBS rubber is 40%.
The petroleum resin is C5 petroleum resin, and the softening point of the petroleum tackifying resin is 100 ℃;
the softening point of the rosin resin is 100 ℃.
The crystalline wax is fischer tropsch wax; the melting point of the crystalline wax is 100 ℃.
The phenolic antioxidant is tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester;
the phosphite ester antioxidant is tris [2, 4-di-tert-butylphenyl ] phosphite.
The preparation method of the hot melt adhesive for bonding the high-temperature-resistant food bags comprises the following steps:
1) heating and uniformly stirring the petroleum resin and the rosin resin in the formula amount to obtain tackifying resin; the heating temperature is 135 ℃, and the stirring speed is 60 rpm;
2) heating a reaction kettle to 160 ℃, putting naphthenic oil, SIS rubber, SBS rubber, crystalline wax, a phenol antioxidant, a phosphite antioxidant and tackifying resin accounting for 50% of the total mass of the tackifying resin into the reaction kettle, stirring at a low speed, wherein the speed of stirring at the low speed is 30rpm, vacuumizing at the same time, the vacuum degree is-0.08 MPa, the stirring time is 1.5h, adding the rest tackifying resin after the materials are completely melted, vacuumizing for the second time, the vacuum degree is-0.08 MPa, keeping the vacuum degree for 50min, and discharging after the materials are free of bubbles.
Comparative example 1
The comparative example provides a hot melt adhesive for bonding high-temperature-resistant food bags, which is different from the hot melt adhesive in example 1 only in that: comprises the following components in percentage by weight:
comparative example 2
The comparative example provides a hot melt adhesive for bonding high-temperature-resistant food bags, which is different from the hot melt adhesive in example 1 only in that: the styrene content in the SIS rubber is 15%.
Comparative example 3
The comparative example provides a hot melt adhesive for bonding high-temperature-resistant food bags, which is different from the hot melt adhesive in example 1 only in that: comprises the following components in percentage by weight:
performance test
Respectively carrying out a high-temperature bonding firmness test and a material breaking temperature test on the hot melt adhesive for bonding the high-temperature-resistant food bags in the examples 1-4 and the comparative examples 1-3; wherein the temperature for the high-temperature bonding firmness test is 70 ℃, and the high-temperature duration is 2 hours; the test results are shown in table 1.
TABLE 1
| High temperature bond firmness | Minimum crushing temperature/. degree.C | |
| Example 1 | Without glue failure | 0 |
| Example 2 | Without glue failure | 1 |
| Example 3 | Without glue failure | -1 |
| Example 4 | Without glue failure | 4 |
| Comparative example 1 | Glue-stripping | -5 |
| Comparative example 2 | Partially split glue | -3 |
| Comparative example 3 | Partially split glue | -2 |
As shown in Table 1, the hot melt adhesive for bonding the high temperature resistant food bags of the embodiments 1 to 4 of the invention has high temperature bonding firmness, no glue failure phenomenon, and the minimum material breaking temperature of-1 to 4 ℃, maintains excellent adhesive force performance at high temperature, has low temperature material breaking performance, and is safe and nontoxic. In the comparative example 1, no crystalline wax is added, the bonding performance is obviously reduced at high temperature, complete glue separation occurs after 2 hours at 70 ℃, and the lowest material breaking temperature is lower; in the comparative example 2, the styrene content in the SIS rubber is too low, the adhesive force of the obtained hot melt adhesive is reduced at high temperature, the phenomenon of local adhesive failure occurs, and the lowest material breaking temperature is lower; in comparative example 3, SBS rubber is not added, the bonding force at high temperature is reduced, the phenomenon of local glue failure is caused, and the lowest material breaking temperature is reduced to some extent.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. The hot melt adhesive for bonding the high-temperature-resistant food bag is characterized by comprising the following components in percentage by weight:
2. the hot melt adhesive for bonding the high-temperature resistant food bags according to claim 1, comprising the following components in percentage by weight:
3. the hot melt adhesive for bonding high-temperature resistant food bags according to claim 1 or 2, wherein: the naphthenic oil has a viscosity of 50 to 500cps at 40 ℃.
4. The hot melt adhesive for bonding the high-temperature resistant food bags according to claim 1 or 2, which comprises: the styrene content in the SIS rubber is 15-40%.
5. The hot melt adhesive for bonding the high-temperature resistant food bags according to claim 1 or 2, which comprises: the styrene content in the SBS rubber is 20-40%.
6. The hot melt adhesive for bonding high-temperature resistant food bags according to claim 1 or 2, wherein: the petroleum resin is any one of DCPD resin, C5 petroleum resin, C9 petroleum resin and C5/C9 copolymer resin or hydride thereof, and the softening point of the petroleum tackifying resin is 90-120 ℃;
the softening point of the rosin resin is 90-120 ℃.
7. The hot melt adhesive for bonding the high-temperature resistant food bags according to claim 1 or 2, which comprises: the crystalline wax is any one or more of PE wax, PP wax and Fischer-Tropsch wax; the melting point of the crystalline wax is 90-120 ℃.
8. The hot melt adhesive for bonding the high-temperature resistant food bags according to claim 1 or 2, which comprises: the phenolic antioxidant is any one or more of 2, 6-di-tert-butyl-p-cresol, tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester and beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid n-octadecyl ester;
the phosphite ester antioxidant is tris [2, 4-di-tert-butylphenyl ] phosphite.
9. The preparation method of the hot melt adhesive for bonding the high-temperature resistant food bags according to any one of claims 1 to 8, which is characterized by comprising the following steps:
1) heating and uniformly stirring the petroleum resin and the rosin resin in the formula amount to obtain tackifying resin;
2) heating a reaction kettle, putting naphthenic oil, SIS rubber, SBS rubber, crystalline wax, phenolic antioxidant, phosphite antioxidant and part of tackifying resin into the reaction kettle, stirring at low speed, simultaneously vacuumizing until the materials are completely melted, adding the rest tackifying resin, vacuumizing for the second time, and discharging until the materials have no bubbles.
10. The preparation method of the hot melt adhesive for bonding the high-temperature resistant food bag according to claim 9, wherein the hot melt adhesive comprises the following steps: in the step 1), the heating temperature is 130-140 ℃, and the stirring speed is 50-120 rpm;
in the step 2), the heating temperature is 150-.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210015159.5A CN114525094A (en) | 2022-01-07 | 2022-01-07 | Hot melt adhesive for bonding high-temperature-resistant food bags and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115806789A (en) * | 2022-09-26 | 2023-03-17 | 嘉好(太仓)新材料股份有限公司 | Hot melt adhesive for bonding ear straps of masks and preparation method thereof |
| CN115820174A (en) * | 2022-10-17 | 2023-03-21 | 嘉好(太仓)新材料股份有限公司 | Special hot-melt pressure-sensitive adhesive for destroying adhesive tape and application of adhesive tape |
-
2022
- 2022-01-07 CN CN202210015159.5A patent/CN114525094A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115806789A (en) * | 2022-09-26 | 2023-03-17 | 嘉好(太仓)新材料股份有限公司 | Hot melt adhesive for bonding ear straps of masks and preparation method thereof |
| CN115806789B (en) * | 2022-09-26 | 2024-05-14 | 嘉好(太仓)新材料股份有限公司 | Hot melt adhesive for bonding ear straps of mask and preparation method thereof |
| CN115820174A (en) * | 2022-10-17 | 2023-03-21 | 嘉好(太仓)新材料股份有限公司 | Special hot-melt pressure-sensitive adhesive for destroying adhesive tape and application of adhesive tape |
| CN115820174B (en) * | 2022-10-17 | 2024-05-28 | 嘉好(太仓)新材料股份有限公司 | Hot-melt pressure-sensitive adhesive special for destroying adhesive tape and application of adhesive tape |
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