CN114512266A - Conductive ink, RFID radio frequency antenna and preparation method thereof - Google Patents
Conductive ink, RFID radio frequency antenna and preparation method thereof Download PDFInfo
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- CN114512266A CN114512266A CN202210112351.6A CN202210112351A CN114512266A CN 114512266 A CN114512266 A CN 114512266A CN 202210112351 A CN202210112351 A CN 202210112351A CN 114512266 A CN114512266 A CN 114512266A
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- 238000002360 preparation method Methods 0.000 title abstract description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000001035 drying Methods 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 8
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 239000002270 dispersing agent Substances 0.000 claims abstract description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 21
- 238000010329 laser etching Methods 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- 238000005096 rolling process Methods 0.000 claims description 9
- 239000011259 mixed solution Substances 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 8
- 229920000767 polyaniline Polymers 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- 229920000123 polythiophene Polymers 0.000 claims description 5
- 229940116411 terpineol Drugs 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 229920000128 polypyrrole Polymers 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 3
- 238000003486 chemical etching Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 229920002799 BoPET Polymers 0.000 description 15
- 239000002135 nanosheet Substances 0.000 description 9
- 230000035945 sensitivity Effects 0.000 description 8
- 241001602730 Monza Species 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000012858 packaging process Methods 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000002894 chemical waste Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002064 nanoplatelet Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Details Of Aerials (AREA)
Abstract
The invention discloses conductive ink, an RFID (radio frequency identification) radio-frequency antenna and a preparation method thereof, and relates to the technical field of radio-frequency antennas, wherein the conductive ink comprises the following raw materials in percentage by weight: 5-10% of conductive material, 90-95% of solvent and 0.5-2% of dispersant, wherein the conductive material comprises at least one of graphene, reduced graphene oxide, graphene derivatives, carbon nanotubes and conductive carbon black. An RFID radio frequency antenna comprises a conductive film and a substrate, wherein the conductive film is formed by drying conductive ink. Compared with the traditional metal etching method, the method for preparing the RFID radio-frequency antenna avoids environmental pollution caused by the use and discharge of a large amount of chemical etching liquid in the metal etching process; on the other hand, the conductive film has high conductivity and good bonding force with the base material, so that the obtained RFID radio-frequency antenna has good reading performance and good stability, and meanwhile, the preparation method of the RFID radio-frequency antenna has the effect of low cost.
Description
Technical Field
The invention relates to the technical field of radio frequency antennas, in particular to conductive ink, an RFID radio frequency antenna and a preparation method thereof.
Background
The RFID technology is a non-contact data automatic acquisition technology, and automatically identifies a target object through a radio frequency wireless signal and acquires related data. The technology has the advantages of high information acquisition speed, high information acquisition accuracy, no need of mechanical or optical contact and the like. The RFID technology has been widely applied to various fields such as logistics management, book management, anti-counterfeiting identification and the like.
At present, the RFID radio frequency antenna is mainly made of metal materials such as copper and aluminum through processes such as chemical etching, the RFID radio frequency antenna is generally prepared by using an aluminum etching technology, and a large amount of chemical waste liquid is generated in the process, so that the environment is greatly polluted.
Disclosure of Invention
The invention provides conductive ink, an RFID radio frequency antenna and a preparation method thereof, and at least solves the technical problems in the prior art.
The invention provides a conductive ink which comprises the following raw materials in percentage by weight: 5-10% of conductive material, 90-95% of solvent and 0.5-2% of dispersant, wherein the conductive material comprises at least one of graphene, reduced graphene oxide, graphene derivatives, carbon nanotubes and conductive carbon black.
In one embodiment, the dispersant is at least one of polyurethane, acrylate, epoxy resin, polyethylene glycol, polyaniline, polypyrrole, and polythiophene.
In one embodiment, the solvent is water or a water/alcohol mixed solution.
In one embodiment, the solvent is at least one of ethyl acetate, N-dimethylformamide, acetone, terpineol, and N-methylpyrrolidone.
The invention also provides an RFID radio frequency antenna, which comprises a conductive film and a substrate, wherein the conductive film is formed by drying the conductive ink.
In an embodiment, the conductive ink is further sprayed on the surface of the conductive film.
The invention also provides a preparation method of the RFID radio frequency antenna, which comprises the following steps:
coating the prepared conductive ink on the surface of a base material, and drying to obtain a conductive film, wherein the thickness of the conductive film is 10-25 microns;
rolling and transferring the conductive film onto the surface of the substrate with the adhesive;
and performing laser etching or mechanical cutting on the surface of the conductive film according to the designed antenna pattern to obtain the RFID radio frequency antenna.
In one embodiment, after roll transferring the conductive film to the surface of the substrate with glue, the method further comprises:
and spraying the conductive ink on the surface of the conductive film for repairing.
In an embodiment, the process conditions of the laser etching are as follows: the laser frequency is 30-60 KHz, the power is 30-50%, and the processing speed is 1500-2000 mm/s.
In the scheme of the invention, the conductive ink prepared by the method has high conductivity and flexibility, and is easy to carry out laser and mechanical cutting processing, and the RFID radio frequency antenna is realized by the conductive ink in a coating and transferring mode. On the other hand, the conductive film has high conductivity and good bonding force with the base material, so that the obtained RFID radio-frequency antenna has good reading performance and good stability, and meanwhile, the preparation method of the RFID radio-frequency antenna has the effect of low cost.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing an RFID radio frequency antenna according to embodiment 1 of the present invention;
FIG. 2 shows an optical picture of an RFID radio frequency antenna prepared in example 1 of the present invention;
FIG. 3(a) shows the sensitivity versus frequency curve of an RFID radio frequency antenna prepared in example 1 of the present invention; (b) a plot of read distance versus frequency for the RFID rf antenna prepared in example 1 of the present invention is shown.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides conductive ink which comprises the following raw materials in percentage by weight: 5-10% of conductive material, 90-95% of solvent and 0.5-2% of dispersant, wherein the conductive material comprises at least one of graphene, reduced graphene oxide, graphene derivatives, carbon nanotubes and conductive carbon black.
The dispersing agent is at least one of polyurethane, acrylate, epoxy resin, polyethylene glycol, polyaniline, polypyrrole and polythiophene.
Wherein the solvent is water or a water/alcohol mixed solution.
Wherein the solvent is at least one of ethyl acetate, N-dimethylformamide, acetone, terpineol and N-methylpyrrolidone.
The invention also provides an RFID radio frequency antenna, which comprises a conductive film and a substrate, wherein the conductive film is formed by drying the conductive ink.
The base material is paper, fiber, cloth fabric, PET, PI, PP, PVC, etc., and the invention does not limit the base material specifically.
The conductive ink is further sprayed on the surface of the conductive film.
The invention also provides a preparation method of the RFID radio frequency antenna, which comprises the following steps:
coating the prepared conductive ink on the surface of a base material, and drying to obtain a conductive film, wherein the thickness of the conductive film is 10-25 microns;
rolling and transferring the conductive film onto the surface of the substrate with the adhesive;
and performing laser etching or mechanical cutting on the surface of the conductive film according to the designed antenna pattern to obtain the RFID radio frequency antenna.
Wherein, after the conductive film is roll-transferred to the surface of the substrate with the adhesive, the method further comprises the following steps:
and spraying the conductive ink on the surface of the conductive film for repairing.
Wherein the laser etching process conditions are as follows: the laser frequency is 30-60 KHz, the power is 30-50%, and the processing speed is 1500-2000 mm/s.
The invention also provides an RFID radio frequency tag, wherein the RFID radio frequency antenna is bound with an RFID radio frequency chip to obtain the RFID radio frequency tag.
The present invention will be described in detail with reference to specific examples.
Example 1
The conductive ink comprises 5% of graphene nanosheets, 0.5% of polyurethane and 94.5% of a water/ethanol mixed solution in percentage by weight, wherein the volume ratio of water to ethanol is 1: 1.
The preparation method of the conductive ink comprises the following steps: mixing 5% of graphene nanosheets, 0.5% of polyurethane and 94.5% of water/ethanol (volume ratio is 1:1), and then uniformly dispersing; and grinding the dispersed mixture at the rotating speed of 3000rpm/min for 3h, and homogenizing to obtain the conductive ink. The homogenization treatment is to make the conductive ink disperse more uniformly by utilizing a homogenizing emulsifying machine through mechanical force high-speed shearing.
An RFID radio frequency antenna comprises a conductive film and a base material, wherein the conductive film is formed by drying conductive ink, and the base material is a PET film.
The preparation method of the RFID radio frequency antenna comprises the following steps:
step S11, coating the conductive ink on the surface of a PET film with the thickness of 100 mu m, and drying at 80 ℃ to obtain a conductive film;
step S12, transferring the conductive film to the PET film with the adhesive in a rolling way, and then spraying conductive ink on the surface of the conductive film for repairing; wherein the thickness of the PET film is 100 μm, the glue on the PET film is silica gel, the thickness of the transferred conductive film is 15 μm, and the sheet resistance is 1 omega;
step S13, designing an RFID radio frequency antenna pattern, and preparing the RFID radio frequency antenna by a roll-to-roll laser etching machine according to the designed antenna pattern, wherein the laser etching process conditions are as follows: the laser frequency is 50KHz, the power is 35%, and the laser processing speed is 1800 mm/s.
An optical picture of an RFID radio frequency antenna is shown in fig. 2.
An RFID radio frequency tag is obtained by binding a Monza R6p chip and an RFID radio frequency antenna by using ACA conductive adhesive through a reverse packaging process.
Performance test
First, testing the binding force between the conductive film and the substrate
The binding force passes the 3M adhesive tape test, no peeling is found between the conductive film and the base material, which shows that the binding force between the conductive film and the base material is good.
Secondly, testing the relation between the sensitivity and the frequency of the RFID radio frequency antenna;
and testing the relation between the reading distance and the frequency of the RFID radio frequency antenna.
FIG. 3(a) shows a sensitivity-frequency relationship curve of the RFID antenna, wherein the operating frequency range of the RFID tag is 860-960MHz, and the sensitivity at 915MHz is-10.6 dbm; as shown in fig. 3(b), the reading distance of the RFID rf antenna is plotted against the frequency, and the reading distance of the RFID rf tag is 5.5 meters.
Example 2
A conductive ink comprises 6 wt% of graphene nanosheets, 0.5 wt% of polyaniline and 93.5 wt% of a water/ethanol mixed solution, wherein the volume ratio of water to ethanol is 1: 1.
The preparation method of the conductive ink comprises the following steps: mixing 6% of graphene nanosheets, 0.5% of polyaniline and 93.5% of water/ethanol mixed solution, uniformly dispersing, grinding the dispersed mixture at the rotating speed of 3000rpm/min for 3h, and homogenizing to obtain the conductive ink.
An RFID radio frequency antenna comprises a conductive film and a base material, wherein the conductive film is formed by drying conductive ink, and the base material is a PET film.
The preparation method of the RFID radio frequency antenna comprises the following steps:
step S21, coating the graphene conductive ink on the surface of a PET film with the thickness of 75 microns, and drying at 80 ℃ to obtain a conductive film;
step 22, rolling and transferring the conductive film to the PET film with the adhesive, and spraying graphene conductive ink on the surface of the conductive film for repairing; wherein the thickness of the PET film material object is 75 μm, the glue on the PET film is acrylate glue, the thickness of the transferred conductive film is 15 μm, and the sheet resistance is 0.8 omega;
step S23, designing an RFID radio frequency antenna pattern, and manufacturing the RFID radio frequency antenna by a roll-to-roll laser etching machine according to the designed antenna pattern, wherein the laser etching process conditions are as follows: the laser frequency is 60KHz, the power is 35%, and the laser processing speed is 1600 mm/s.
An RFID radio frequency tag is obtained by binding a Monza R6p chip and an RFID radio frequency antenna by using ACA conductive adhesive through a reverse packaging process, wherein the working frequency range is 860-960MHz, the sensitivity at 915MHz is-11.2 dbm, and the reading distance is 6.8 meters.
Example 3
A conductive ink comprises 8% of graphene nanoplatelets, 0.5% of polyaniline and 92.5% of N-methylpyrrolidone (NMP) in percentage by weight.
The preparation method of the conductive ink comprises the following steps: mixing 8% of graphene nanosheets, 0.5% of polyaniline and 92.5% of NMP, dispersing uniformly, grinding the dispersed mixture at the rotating speed of 3000rpm/min for 4 hours, and homogenizing to obtain the conductive ink.
An RFID radio frequency antenna comprises a conductive film and a base material, wherein the conductive film is formed by drying conductive ink, and the base material is a PET film.
The preparation method of the RFID radio frequency antenna comprises the following steps:
step S31, coating the graphene conductive ink on the surface of a PET film with the thickness of 100 microns, and drying at 80 ℃ to obtain a conductive film;
s32, transferring the conductive film onto the PET film with the adhesive in a rolling way, and spraying graphene conductive ink on the surface of the conductive film for repairing; wherein the thickness of the PET film is 100 μm, the glue on the PET film is polyurethane glue, the thickness of the transferred conductive film is 15 μm, and the sheet resistance is 0.5 omega;
step S33, designing an RFID radio frequency antenna pattern, and manufacturing the RFID radio frequency antenna by a roll-to-roll laser etching machine according to the designed antenna pattern, wherein the laser etching process conditions are as follows: the laser frequency is 50KHz, the power is 35%, and the laser processing speed is 1800 mm/s.
An RFID radio frequency tag is obtained by binding a Monza R6p chip and an RFID radio frequency antenna by using ACA conductive adhesive through a reverse packaging process, wherein the working frequency range is 860-960MHz, the sensitivity at 915MHz is-12.0 dbm, and the reading distance is 7.2 meters.
Example 4
The conductive ink comprises 8% of carbon nanotubes, 2% of polythiophene and 90% of N, N-dimethylformamide in percentage by weight.
The preparation method of the conductive ink comprises the following steps: mixing 8% of carbon nano tube, 2% of polythiophene and 93.5% of N, N-dimethylformamide, uniformly dispersing, grinding the dispersed mixture at the rotating speed of 3500rpm/min for 3h, and homogenizing to obtain the conductive ink.
An RFID radio frequency antenna comprises a conductive film and a substrate, wherein the conductive film is formed by drying conductive ink, and the substrate is a PI film.
The preparation method of the RFID radio frequency antenna comprises the following steps:
step S21, coating conductive ink on the surface of a PI film with the thickness of 75 microns, and drying at 80 ℃ to obtain a conductive film;
step 22, rolling and transferring the conductive film to the PI film with the adhesive; wherein the thickness of the PI film is 75 μm, the glue on the PI film is acrylate glue, the thickness of the transferred conductive film is 15 μm, and the sheet resistance is 0.8 omega;
step S23, designing an RFID radio frequency antenna pattern, and manufacturing the RFID radio frequency antenna by a roll-to-roll laser etching machine according to the designed antenna pattern, wherein the laser etching process conditions are as follows: the laser frequency is 60KHz, the power is 35%, and the laser processing speed is 1600 mm/s.
An RFID radio frequency tag is obtained by binding a Monza R6p chip and an RFID radio frequency antenna by an ACA conductive adhesive through a reverse packaging process, wherein the working frequency range is 860-960MHz, the sensitivity at 915MHz is-10.2 dbm, and the reading distance is 6.5 meters.
Example 5
A conductive ink comprises 5% of graphene nanosheets, 4% of carbon black, 1% of polyethylene glycol and 90% of a water/ethanol mixed solution in percentage by weight, wherein the volume ratio of water to ethanol is 1: 1.
The preparation method of the conductive ink comprises the following steps: mixing 5% of graphene nanosheets, 4% of carbon black, 1% of polyethylene glycol and 90% of water/ethanol mixed solution, uniformly dispersing, grinding the dispersed mixture at a rotating speed of 2000rpm/min for 3 hours, and homogenizing to obtain the conductive ink.
An RFID radio frequency antenna comprises a conductive film and a base material, wherein the conductive film is formed by drying conductive ink, and the base material is paper.
The preparation method of the RFID radio frequency antenna comprises the following steps:
step S21, coating the graphene conductive ink on the surface of paper with the thickness of 100 microns, and drying at 80 ℃ to obtain a conductive film;
step 22, rolling and transferring the conductive film to the paper with the adhesive, and spraying conductive ink on the surface of the conductive film for repairing; wherein the thickness of the paper material object is 100 μm, the glue on the paper is acrylate glue, the thickness of the transferred conductive film is 18 μm, and the sheet resistance is 0.8 Ω;
step S23, designing an RFID radio frequency antenna pattern, and manufacturing the RFID radio frequency antenna by a roll-to-roll laser etching machine according to the designed antenna pattern, wherein the process conditions of the laser etching are as follows: the laser frequency is 50KHz, the power is 45 percent, and the laser processing speed is 1800 mm/s.
An RFID radio frequency tag is obtained by binding a Monza R6p chip and an RFID radio frequency antenna by using ACA conductive adhesive through a reverse packaging process, wherein the working frequency range is 860-960MHz, the sensitivity at 915MHz is-11.4 dbm, and the reading distance is 7.3 meters.
Example 6
A conductive ink comprises, by weight, 5% of reduced graphene oxide nanosheets, 3% of carbon nanotubes, 1.5% of epoxy resin and 90.5% of terpineol;
the preparation method of the conductive ink comprises the following steps: mixing 5% of reduced graphene oxide nanosheets, 3% of carbon nanotubes, 1.5% of epoxy resin and 90.5% of terpineol, uniformly dispersing, grinding the dispersed mixture at the rotating speed of 3000rpm/min for 3 hours, and homogenizing to obtain the conductive ink.
An RFID radio frequency antenna comprises a conductive film and a base material, wherein the conductive film is formed by drying conductive ink, and the base material is a PP film.
The preparation method of the RFID radio frequency antenna comprises the following steps:
step S21, coating conductive ink on the surface of a PP film with the thickness of 80 mu m, and drying at 80 ℃ to obtain a conductive film;
step 22, rolling and transferring the conductive film to the glued PP film, and spraying graphene conductive ink on the surface of the conductive film for repairing; wherein the thickness of the PP film material object is 80 μm, the glue on the PP film is silica gel, the thickness of the transferred conductive film is 10 μm, and the square resistance is 1 omega;
step S23, designing an RFID radio frequency antenna pattern, and manufacturing the RFID radio frequency antenna by a roll-to-roll laser etching machine according to the designed antenna pattern, wherein the laser etching process conditions are as follows: the laser frequency is 60KHz, the power is 35%, and the laser processing speed is 1500 mm/s.
An RFID radio frequency tag is obtained by binding a Monza R6p chip and an RFID radio frequency antenna by using ACA conductive adhesive through a reverse packaging process, wherein the working frequency range is 860-960MHz, the sensitivity at 915MHz is-10.7 dbm, and the reading distance is 6.0 m.
The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.
The words such as "including," "comprising," "having," and the like, referred to in this application are open-ended words that mean "including, but not limited to," and are used interchangeably herein. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".
It is further noted that in the methods of the present application, the steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.
Claims (9)
1. The conductive ink is characterized by comprising the following raw materials in percentage by weight: 5-10% of conductive material, 90-95% of solvent and 0.5-2% of dispersant, wherein the conductive material comprises at least one of graphene, reduced graphene oxide, graphene derivatives, carbon nanotubes and conductive carbon black.
2. The conductive ink of claim 1, wherein the dispersant is at least one of polyurethane, acrylate, epoxy, polyethylene glycol, polyaniline, polypyrrole, and polythiophene.
3. The conductive ink according to claim 1, wherein the solvent is water or a water/alcohol mixed solution.
4. The conductive ink of claim 1, wherein the solvent is at least one of ethyl acetate, N-dimethylformamide, acetone, terpineol, N-methylpyrrolidone.
5. An RFID radio-frequency antenna, characterized in that the radio-frequency antenna comprises a conductive film and a substrate, wherein the conductive film is formed by drying the conductive ink of any one of claims 1-4.
6. The RFID radio frequency antenna according to claim 5, wherein the conductive ink according to any one of claims 1 to 4 is further sprayed on the surface of the conductive film.
7. A method for preparing an RFID radio-frequency antenna according to claim 5, characterized in that the method comprises:
coating the conductive ink of any one of claims 1 to 4 on the surface of a substrate, and drying to obtain a conductive film, wherein the thickness of the conductive film is 10-25 μm;
rolling and transferring the conductive film onto the surface of the substrate with the adhesive;
and performing laser etching or mechanical cutting on the surface of the conductive film according to the designed antenna pattern to obtain the RFID radio frequency antenna.
8. The method of claim 7, wherein after roll transferring the conductive film to the surface of the substrate with glue, the method further comprises:
spraying the conductive ink of any one of claims 1 to 4 on the surface of the conductive film for repairing.
9. The method for preparing the RFID radio-frequency antenna according to claim 7, wherein the laser etching process conditions are as follows: the laser frequency is 30-60 KHz, the power is 30-50%, and the processing speed is 1500-2000 mm/s.
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