CN114497254A - Latticed connection adhesive film for photovoltaic module and photovoltaic module - Google Patents
Latticed connection adhesive film for photovoltaic module and photovoltaic module Download PDFInfo
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- CN114497254A CN114497254A CN202210096656.2A CN202210096656A CN114497254A CN 114497254 A CN114497254 A CN 114497254A CN 202210096656 A CN202210096656 A CN 202210096656A CN 114497254 A CN114497254 A CN 114497254A
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- Prior art keywords
- adhesive film
- wires
- grid
- film body
- latticed
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 237
- 230000000149 penetrating effect Effects 0.000 claims abstract description 69
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 19
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 claims description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 8
- 239000011796 hollow space material Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 2
- 238000003466 welding Methods 0.000 abstract description 20
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 13
- 238000005336 cracking Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 26
- 239000000203 mixture Substances 0.000 description 23
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 238000005266 casting Methods 0.000 description 15
- 238000005096 rolling process Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
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- 238000006243 chemical reaction Methods 0.000 description 7
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- 239000004698 Polyethylene Substances 0.000 description 5
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- 239000012790 adhesive layer Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 2
- OXGOEZHUKDEEKS-UHFFFAOYSA-N 3-tert-butylperoxy-1,1,5-trimethylcyclohexane Chemical compound CC1CC(OOC(C)(C)C)CC(C)(C)C1 OXGOEZHUKDEEKS-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 2
- 210000000887 face Anatomy 0.000 description 2
- NZYMWGXNIUZYRC-UHFFFAOYSA-N hexadecyl 3,5-ditert-butyl-4-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NZYMWGXNIUZYRC-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940035437 1,3-propanediol Drugs 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- CSGAUKGQUCHWDP-UHFFFAOYSA-N 1-hydroxy-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1O CSGAUKGQUCHWDP-UHFFFAOYSA-N 0.000 description 1
- OTCWVYFQGYOYJO-UHFFFAOYSA-N 1-o-methyl 10-o-(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound COC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 OTCWVYFQGYOYJO-UHFFFAOYSA-N 0.000 description 1
- BRQMAAFGEXNUOL-UHFFFAOYSA-N 2-ethylhexyl (2-methylpropan-2-yl)oxy carbonate Chemical compound CCCCC(CC)COC(=O)OOC(C)(C)C BRQMAAFGEXNUOL-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 210000004087 cornea Anatomy 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
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- 238000004021 metal welding Methods 0.000 description 1
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- 238000013082 photovoltaic technology Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
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- 238000010248 power generation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention provides a latticed connection adhesive film for a photovoltaic module and the photovoltaic module. The latticed connection adhesive film comprises an adhesive film body and at least one conducting wire, wherein the adhesive film body is provided with a latticed hollow structure, hollow spaces in part of the latticed hollow structure are penetrating holes, and the penetrating holes are positioned at 1/2 +/-10% of the length of the adhesive film body; each lead wire extends along the length direction of the adhesive film body, the lead wires correspondingly penetrate through the penetrating holes at the length of 1/2 +/-10% one by one, so that one part of each lead wire is arranged on one side of the adhesive film body, the other part of each lead wire is arranged on the other side of the adhesive film body, and each lead wire is embedded into the adhesive film body, wherein the embedding depth is 1/3-2/3 of the diameter of each lead wire. The latticed connection adhesive film is adopted to replace a welding technology, so that the hidden cracking risk of the battery piece generated by high-temperature welding is reduced; particularly, the penetrating holes are adopted to enable the lead to penetrate through the film body of the adhesive film and then be compounded with the film body in a more fitting mode, and therefore the problem of hidden cracking of the battery piece is effectively solved.
Description
Technical Field
The invention relates to the technical field of photovoltaics, in particular to a latticed connecting adhesive film for a photovoltaic module and the photovoltaic module.
Background
Photovoltaic power generation is a green clean energy, and through years of development, high efficiency and low cost are decisive factors for survival and development of photovoltaic technology, and further reduction of cost of a photovoltaic module and guarantee of reliability are the most important challenges of the photovoltaic industry. The high-efficiency crystalline silicon cells produced in mass production at present are mainly HJT (Hetero-junction with Intrinsic Thin layer) technology, IBC (indirect back contact, full back contact crystalline silicon solar cell) technology, shingled assembly technology, etc., all of which make a trade-off between assembly reliability and cost, wherein the trade-off is mainly made between interconnection materials such as silver paste, adhesive or solder alloy. However, these welding techniques usually require high temperature (>200 ℃), and the problems of the hidden cracking and breaking of the battery cell are easily caused by thermal stress when the temperature is uneven, and the problems caused by the welding of the battery cell are more prominent under the trend of thinning of the silicon wafer. And the series resistance of the traditional tin-coated solder strip can cause energy loss and the photoelectric efficiency of the battery is reduced due to shading of the solder strip.
Chinese patent CN101425546B discloses an electrode for photovoltaic cell, wherein the lead is embedded into the adhesive layer, the adhesive layer is compounded on the transparent layer, although the thickness of the adhesive layer is lower than that of the lead, it cannot be guaranteed that the adhesive layer does not flow and penetrate into the gap between the lead and the cell when the photovoltaic module is laminated and packaged at high temperature, so that the problem of insufficient soldering between the lead and the cell is easily caused.
Chinese patent CN103199127B/CN111816723 discloses a transparent conductive film, which solves the problem of the reduction of photoelectric conversion efficiency caused by the light shielding of the main grid line silver paste, but uses polymer materials with low light transmittance such as polyethylene, which can reduce the absorption of the cell to light energy.
Chinese patent CN104716061B discloses an ultrasonic welding method for realizing the welding of metal wires on the surface of a photovoltaic cell, which greatly reduces the use of transparent films, adhesive colloids, flux and silver paste, but the cost of the ultrasonic welding equipment used in the method is expensive, and the ultrasonic welding technology used in the method is prone to high-frequency vibration, which can cause subfissure or even breakage of brittle cells, and the ultrasonic welding equipment has high cost and poor stability.
Disclosure of Invention
The invention mainly aims to provide a latticed connecting adhesive film for a photovoltaic module and the photovoltaic module, so as to solve the problem that a cell is easily split due to an interconnection material in the photovoltaic module in the prior art.
In order to achieve the above object, according to one aspect of the present invention, there is provided a grid connection adhesive film for a photovoltaic module, the grid connection adhesive film comprising: the adhesive film body is provided with a grid-shaped hollow structure, the hollow spaces in part of the grid-shaped hollow structure are penetrating holes, and the penetrating holes are positioned at 1/2 +/-10% of the length of the adhesive film body; the conducting wires extend along the length direction of the adhesive film body, the conducting wires penetrate through the penetrating holes in a one-to-one correspondence mode at the length position of 1/2 +/-10% so that one part of each conducting wire is arranged on one side of the adhesive film body, the other part of each conducting wire is arranged on the other side of the adhesive film body, and each conducting wire is embedded into the adhesive film body, and the embedding depth is 1/3-2/3 of the diameter of each conducting wire.
Further, the adhesive film body has a gram weight of 20 to 100g/m2The adhesive film body is an adhesive film with Raschig lattice flow value of 1-30 mm.
Furthermore, the penetrating holes are located on a straight line, and an included angle between the straight line where the penetrating holes are located and the lead is 90 degrees +/-5 degrees.
Furthermore, the cross section of the hollow space parallel to the extension surface of the adhesive film is any one or more of rectangle, triangle, circle and hexagon.
Furthermore, the cross-sectional area of the hollow space parallel to the extension surface of the adhesive film is 1mm2～100mm2。
Further, the wire is selected from any one of a copper nickel alloy wire, a copper zinc alloy wire, a copper tin alloy wire, a copper wire, an aluminum wire, a silver wire and a gold wire.
Further, the diameter of the wire is 0.02mm to 0.5 mm.
Furthermore, the number of the conducting wires is 3-20.
Further, the adhesive film body is a laminated adhesive film of any one or more of an EVA adhesive film, a POE adhesive film, a PVB adhesive film, a PA adhesive film, a PE adhesive film, a PP adhesive film, an EMA adhesive film, an EMMA adhesive film, an EAA adhesive film and an EMAA adhesive film.
According to another aspect of the present invention, there is provided a photovoltaic module comprising: the battery piece unit comprises a plurality of battery pieces distributed in an array manner, and the battery pieces are provided with secondary grid lines; any one of the latticed connection adhesive films, wherein the surface of the latticed connection adhesive film, which is provided with the conducting wires, is provided with a battery piece, and the conducting wires are connected with the auxiliary grid lines; the bus bar is connected with the lead of the latticed connection adhesive film; the front layer adhesive film and the back layer adhesive film are respectively arranged on the surface of the latticed connecting adhesive film, which is not provided with the conducting wires; the front layer of glass is arranged on the surface of the front layer of adhesive film, which is far away from the battery piece; the back layer supporting plate is arranged on the surface of the back layer adhesive film, which is far away from the battery piece.
By applying the technical scheme of the invention, the grid-shaped connecting adhesive film is adopted to replace the conventional battery piece welding technology, the hidden crack risk of the battery piece generated by high-temperature welding is reduced, the production process is simplified, and the production efficiency is improved; meanwhile, silver paste is omitted, and cost is reduced; particularly, the penetrating holes are adopted to enable the lead to penetrate through the film body of the adhesive film and then be compounded with the film body in a more fitting mode, and therefore the problem of hidden cracking of the battery piece is effectively solved. The grid hollow-out shape with the same area can save more adhesive films to reduce the product cost, improve the light transmittance and reduce the false welding between the metal lead and the photovoltaic cell. The latticed connection adhesive film effectively utilizes the advantage that no main grid assembly is required to be accurately aligned when being connected in series, can be compatible with high-density assembly technologies such as splicing sheets and the like, and reduces the internal resistance of an interconnection structure by arranging a plurality of wires, so that the loss caused by the resistance of the interconnection structure can be greatly reduced. In addition, the conducting wire is adopted, sunlight incident to the conducting wire can be reflected to the surface of the solar cell panel again, the utilization rate of light of the solar cell panel is improved, the adverse effect caused by shading of the external electric connection part by the traditional grid line is reduced, the conversion efficiency is improved, the process steps and equipment investment are reduced, materials are saved, the cost is reduced, and the production efficiency is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 shows a schematic top view of a latticed bond adhesive film in accordance with one embodiment of the invention;
FIG. 2 is a schematic cross-sectional view of a grid-shaped adhesive connection film according to an embodiment of the present invention;
FIG. 3 shows a schematic cross-sectional structure of a photovoltaic module according to an embodiment of the invention;
FIG. 4 shows a top view of a photovoltaic module according to an embodiment of the present invention (wherein the back support plate and front glass are not shown); and
fig. 5 shows the results of the cold joint test according to examples 1 to 11 and comparative examples 1 to 4 of the present invention.
Wherein the figures include the following reference numerals:
10. a glue film body; 11. hollowing out the blank space; 20. a wire;
01. a back layer support plate; 02. a back layer glue film; 03. connecting the adhesive film in a grid shape; 04. a battery piece; 05. a front layer adhesive film; 06. a front layer of glass; 07. a bus bar.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As analyzed by the background of the present application, prior art interconnect materials are prone to subfissure of the cell sheet. In order to solve the problem, the application provides a latticed connection adhesive film for a photovoltaic module and the photovoltaic module.
In an exemplary embodiment of the present application, a grid-shaped connection adhesive film for a photovoltaic module is provided, as shown in fig. 1 and 2, the grid-shaped connection adhesive film includes an adhesive film body 10 and at least one conducting wire 20, the adhesive film body 10 has a grid-shaped hollow structure, the hollow grids 11 in a part of the grid-shaped hollow structure are through holes, and the through holes are located at 1/2 ± 10% of the length of the adhesive film body 10; each lead 20 extends along the length direction of the adhesive film body 10, each lead 20 correspondingly penetrates through the penetrating hole at 1/2 +/-10% of the length, so that one part of each lead 20 is arranged on one side of the adhesive film body 10, the other part of each lead is arranged on the other side of the adhesive film body 10, each lead 20 is embedded into the adhesive film body 10, and the embedding depth is 1/3-2/3 of the diameter of each lead 20.
The latticed connection adhesive film replaces the conventional battery piece welding technology, the hidden cracking risk of the battery piece generated by high-temperature welding is reduced, the production process is simplified, and the production efficiency is improved; meanwhile, silver paste is omitted, and cost is reduced; particularly, the lead 20 is combined with the film body in a more fitting manner after penetrating through the adhesive film body 10 by adopting the penetrating holes, so that the problem of hidden cracking of the battery piece is further effectively relieved. By adopting the grid hollow-out shape with the same area, more adhesive films can be saved so as to reduce the product cost, and meanwhile, the light transmittance is improved, and the insufficient soldering between the metal wire 20 and the photovoltaic cell can be reduced. The latticed connection adhesive film effectively utilizes the advantage that no main grid assembly is required to be accurately aligned when being connected in series, can be compatible with high-density assembly technologies such as splicing sheets and the like, and reduces the internal resistance of an interconnection structure by arranging a plurality of wires 20, so that the loss caused by the resistance of the interconnection structure can be greatly reduced. In addition, the conducting wire 20 is adopted, sunlight incident to the conducting wire 20 can be reflected to the surface of the solar cell panel again, the utilization rate of light of the solar cell panel is improved, the adverse effect caused by shading of the external electric connection part by the traditional grid line is reduced, the conversion efficiency is improved, the process steps and equipment investment are reduced, materials are saved, the cost is reduced, and the production efficiency is improved.
In some embodiments, the adhesive film body preferably has a gram weight of 20 to 100g/m2The adhesive film body is an adhesive film with Raschig flow value of 1-30 mm, and the gram weight is selected to be 20-100 g/m2And the Raschig flow value is 1-30 mm, and the film is used as a film body. The problems that the film cannot be effectively formed due to the fact that the strength of the adhesive film body is too low due to too low gram weight and the adhesive film body is embedded into the bottom of a lead to cause cold welding when lamination exists are avoided; and the problem that the cost is increased due to the fact that the gram weight is too large is avoided, and meanwhile, the photoelectric conversion efficiency of the battery piece is reduced due to the fact that the light transmittance is reduced. Meanwhile, the adhesive film body with the Raschig lattice flow value avoids the hidden crack of the battery piece caused by the over-low Raschig lattice flow value and avoids the over-high Raschig lattice flow valueThe glue film body penetrates into the gap between the lead and the battery piece to cause cold joint.
The hollow grids serving as the through holes in the latticed connection adhesive film can be arranged in the hollow grid rows of the latticed hollow grids and can also be arranged in a staggered mode with the hollow grid rows (as shown in fig. 1), when the hollow grids 11 serving as the through holes can be arranged in the hollow grid rows of the latticed hollow grids, the lead can cover the hollow grids 11, and the part of the lead corresponding to the positions of the hollow grids 11 is exposed; when the lead wire is arranged in a staggered way with the hollow space row, the lead wire only needs to penetrate through the adhesive film body through the penetrating hole, and the lead wire is not exposed due to the arrangement of the hollow space 11.
The relative position relation of each hollowed-out cell 11 of the latticed hollowed-out structure has multiple kinds, and a person skilled in the art can design surface patterns of a compression roller for co-extrusion of the adhesive film to form the corresponding latticed hollowed-out structure. In order to reduce the protrusion caused by excessive bending of the wire 20 penetrating through the penetrating hole of the adhesive film body 10, it is preferable that the penetrating holes are located on a straight line, and an included angle between the straight line of the penetrating holes and the wire 20 is 90 ° ± 5 °.
The cross-sectional shape of the hollow 11 may be various, for example, the cross-section of the hollow 11 parallel to the extension surface of the adhesive film is any one or more of rectangle, triangle, circle and hexagon. Preferably rectangular, circular or hexagonal, to facilitate subsequent passage of the wire 20.
In order to bond the packaging cornea and the cell sheet in the photovoltaic module as much as possible and reduce the wrapping of the lead 20 on the basis of ensuring the support of the lead 20, the cross-sectional area of the hollow space 11 parallel to the extension surface of the adhesive film is preferably 1mm2～100mm2。
The wires 20 used in the present application may be wires 20 commonly used for interconnection in photovoltaic modules, for example, the wires 20 are selected from any one of copper-nickel alloy wires, copper-zinc alloy wires, copper-tin alloy wires, copper wires, aluminum wires, silver wires, and gold wires. Thereby facilitating subsequent interconnection with the interconnect strip.
The smaller the diameter of the lead wire 20, the less the battery piece is shielded, but the larger the resistance is, the easier the battery piece is to be shielded by the adhesive film body 10, and in order to improve the light receiving efficiency, the photoelectric conversion efficiency, and the stability of film adhesion of the photovoltaic module, the diameter of the lead wire 20 is preferably 0.02mm to 0.5 mm. In view of the above, the number of the wires 20 is preferably 3 to 20.
The length of the lead 20 may be equal to or greater than the length of the adhesive film body 10 for facilitating the confluence. In some embodiments of the present disclosure, the adhesive film is a laminated adhesive film of any one or more of an EVA adhesive film, a POE adhesive film, a PVB adhesive film, a PA adhesive film, a PE adhesive film, a PP adhesive film, an EMA adhesive film, an EMMA adhesive film, an EAA adhesive film, and an EMAA adhesive film. The EVA (ethylene-vinyl acetate copolymer), POE (polyolefin elastomer), PVB (polyvinyl butyral), PA (polyamide), PE (polyethylene), PP (polypropylene), EMA (ethylene-methyl acrylate copolymer), EMMA (ethylene-methacrylic acid copolymer) EAA (ethylene-acrylic acid copolymer), and EMAA (ethylene-methacrylic acid copolymer) are all high light transmittance materials.
In another exemplary embodiment of the present application, there is provided a photovoltaic module, as shown in fig. 3, the photovoltaic module includes a cell unit, any one of the above-mentioned grid-shaped connection adhesive films 03, a bus bar 07, a front adhesive film 05 and a back adhesive film 02, a front glass 06, and a back support plate 01, the cell unit includes a plurality of cells 04 distributed in an array, and the cells 04 have secondary grid lines; a battery piece 04 is arranged on the surface, provided with the conducting wire 20, of the latticed connection adhesive film 03, and the conducting wire 20 is connected with the auxiliary grid line; the bus bar 07 is connected with a lead 20 of the latticed connection adhesive film 03; the front layer adhesive film 05 and the back layer adhesive film 02 are respectively arranged on the surface of the latticed connecting adhesive film 03 which is not provided with the conducting wires 20; the front layer of glass 06 is arranged on the surface of the front layer of adhesive film 05 far away from the battery piece 04; the back layer support plate 01 is disposed on the surface of the back layer adhesive film 02 away from the cell sheet 04.
The latticed connection adhesive film replaces the conventional battery piece welding technology, the hidden cracking risk of the battery piece generated by high-temperature welding is reduced, the production process is simplified, and the production efficiency is improved; meanwhile, silver paste is omitted, and cost is reduced; particularly, the lead 20 is combined with the film body in a more fitting manner after penetrating through the adhesive film body 10 by adopting the penetrating holes, so that the problem of hidden cracking of the battery piece is further effectively relieved. By adopting the grid hollow-out shape with the same area, more adhesive films can be saved so as to reduce the product cost, and meanwhile, the light transmittance is improved, and the insufficient soldering between the metal wire 20 and the photovoltaic cell can be reduced. The latticed connection adhesive film effectively utilizes the advantage that no main grid assembly is required to be accurately aligned when being connected in series, can be compatible with high-density assembly technologies such as splicing sheets and the like, and reduces the internal resistance of an interconnection structure by arranging the plurality of wires 20, so that the loss caused by the resistance of the interconnection structure can be greatly reduced. In addition, the conducting wire 20 is adopted, sunlight incident to the conducting wire 20 can be reflected to the surface of the solar cell piece again, the utilization rate of light of the solar cell piece is improved, the adverse effect of shading of the external electric connection part caused by the traditional grid line is reduced, the conversion efficiency is improved, the process steps and equipment investment are reduced, materials are saved, the cost is reduced, and the production efficiency is improved.
The advantageous effects of the present application will be further described below with reference to examples and comparative examples.
The adhesive film materials for the following examples and comparative examples were as follows:
example 5 from CN110016170A, consisting of: 60 parts of a polyolefin elastomer having a melt index of 5g/10min, designated 8200(Dow), 40 parts of a vinyl pentene copolymer modified resin having 1.0% of hydroxyl group, 2.0 parts of 1, 5-pentanediol, 0.1 part of 2-ethylhexyl tert-butylperoxycarbonate, 0.02 part of pentaerythritol tetraacrylate, 0.8 part of vinyltriacetoxysilane, 0.5 part of a molecular sieve, and 0.02 part of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate, were uniformly mixed to obtain a resin mixture 1.
From CN108517188A example 3, the composition is as follows: 100 parts by mass of an ethylene-methyl methacrylate copolymer, 5 parts by mass of polydiene diethylene glycol diacrylate carbonate, 1 part by mass of 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, 5 parts by mass of ethoxylated pentaerythritol tetraacrylate, 0.5 part by mass of KH570, 0.5 part by mass of KH550, 0.1 part by mass of 2-hydroxy-4-n-octyloxybenzophenone, and 0.1 part by mass of bis-2, 2,6, 6-tetramethylpiperidinol sebacate were added and mixed uniformly to obtain a resin mixture.
The first encapsulant film from CN113698877A example 5 had the following composition: 100 parts by weight of an ethylene-methyl methacrylate copolymer (3 g/10 min), 1.5 parts by weight of 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, 0.01 part by weight of trimethylolpropane trimethacrylate, 0.5 part by weight of vinyltrimethoxysilane, 0.05 part by weight of bis (1,2,2,6, 6-pentamethyl-4-piperidyl) sebacate, and 0.05 part by weight of methyl-1, 2,2,6, 6-pentamethyl-4-piperidyl sebacate were uniformly mixed to obtain a resin mixture 3.
Example 3 from CN110016170A, with the following composition: 80 parts of a polyolefin elastomer having a melt index of 30g/10min, designated by the trade name C30070D (SABIC Innovative Plastics), 20 parts of an ethylene-butene copolymer modified resin having 2.0% of isocyanate groups, 0.22 part of 1, 3-propanediol, 0.65 part of 1, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, 0.6 part of triallyl isocyanurate, 0.5 part of vinyltriethoxysilane, 0.02 part of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol and 0.2 part of magnesium sulfate, and uniformly mixed to obtain a resin mixture 4.
Example 4 from CN110016170A, consisting of: 60 parts of a polyolefin elastomer having a melt index of 0.5g/10min, designated 8150(Dow), 40 parts of a modified resin of a copolymer of ethylene and hexene containing 0.2% of isocyanate groups, 0.30 part of 1, 4-succinic acid, 0.35 part of 1, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, 0.3 part of trimethylolpropane triacrylate, 0.5 part of vinyltrimethoxysilane, 0.005 part of hexadecyl 3, 5-di-t-butyl-4-hydroxy-benzoate, 0.2 part of calcium chloride, and mixing them uniformly to obtain a resin mixture 5.
Example 1
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, wherein the gram weight of the grid adhesive film is controlled to be 70g/m2The Raschig lattice flow value is 12mm, the area of a single hollow lattice is 5mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And (3) using 10 copper-zinc alloy wires with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 90 degrees, and hot-pressing the perforated grid adhesive film for 3s at 150 ℃ to form the connecting adhesive film.
Example 2
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, and controlling the extrusion speed to ensure that the gram weight of the grid adhesive film is 20g/m2The Raschig lattice flow value is 12mm, the area of a single hollow lattice is 100mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And (3) using 10 copper-zinc alloy wires with the diameter of 0.5mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 90 degrees, and hot-pressing the perforated grid adhesive film for 3s at 150 ℃ to form the connecting adhesive film.
Example 3
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, and controlling the extrusion speed to ensure that the gram weight of the grid adhesive film is 70g/m2The Raschig lattice flow value is 12mm, the area of a single hollow lattice is 5mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And (3) using 10 copper-zinc alloy wires with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 85 degrees, and hot-pressing the perforated grid adhesive film for 3s at 150 ℃ to form the connecting adhesive film.
Example 4
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, and controlling the extrusion speed to ensure that the gram weight of the grid adhesive film is 70g/m2The Raschig lattice flow value is 12mm, the area of a single hollow lattice is 5mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And (3) using 10 copper-zinc alloy wires with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 90 degrees, and hot-pressing the perforated grid adhesive film for 3s at 155 ℃ to form the connecting adhesive film.
Example 5
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, and controlling the extrusion speed to ensure that the gram weight of the grid adhesive film is 70g/m2Raschig flowThe dynamic value is 12mm, and the area of a single hollow grid is 5mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And (3) using 10 copper-zinc alloy wires with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 90 degrees, and hot-pressing the perforated grid adhesive film for 3 seconds at 160 ℃ to form the connecting adhesive film.
Example 6
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, and controlling the extrusion speed to ensure that the gram weight of the grid adhesive film is 70g/m2The Raschig lattice flow value is 12mm, the area of a single hollow lattice is 5mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And (3) using 20 copper-zinc alloy wires with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 90 degrees, and hot-pressing the perforated grid adhesive film for 3s at 150 ℃ to form the connecting adhesive film.
Example 7
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, and controlling the extrusion speed to ensure that the gram weight of the grid adhesive film is 70g/m2The Raschig lattice flow value is 12mm, the area of a single hollow lattice is 5mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And 3 copper-zinc alloy wires with the diameter of 0.1mm are used, the copper-zinc alloy wires penetrate through the penetrating holes, the included angle between the wires and the straight lines of the penetrating holes is 90 degrees, and the perforated grid adhesive film is hot-pressed for 3s at 150 ℃ to form the connecting adhesive film.
Example 8
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, and controlling the extrusion speed to ensure that the gram weight of the grid adhesive film is 100g/m2The Raschig lattice flow value is 12mm, the area of a single hollow lattice is 1mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. Using 20 copper-zinc alloy wires with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 90 degrees, and the penetrating gridsThe adhesive film is hot-pressed for 3s at 150 ℃ to form a connecting adhesive film.
Example 9
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, and controlling the extrusion speed to ensure that the gram weight of the grid adhesive film is 70g/m2The Raschig lattice flow value is 12mm, the area of a single hollow lattice is 5mm2The hollow grids are circular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And (3) using 10 copper-zinc alloy wires with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 60 degrees, and hot-pressing the perforated grid adhesive film for 3s at 150 ℃ to form the connecting adhesive film.
Example 10
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 2 to obtain a grid adhesive film, and controlling the gram weight of the grid adhesive film to be 70g/m2The flow value of the Raschig lattice is 1mm, and the area of a single hollow lattice is 5mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And (3) using 10 copper-zinc alloy wires with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 90 degrees, and hot-pressing the perforated grid adhesive film for 3s at 150 ℃ to form the connecting adhesive film.
Example 11
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 3 to obtain a grid adhesive film, wherein the gram weight of the grid adhesive film is controlled to be 70g/m2The Raschig lattice flow value is 30mm, and the area of a single hollow lattice is 5mm2The hollow grids are rectangular, and the hollow grids positioned at the position 1/2 the length of the adhesive film body are through holes. And (3) using 10 copper-zinc alloy wires with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires and the straight lines of the penetrating holes is 90 degrees, and hot-pressing the perforated grid adhesive film for 3s at 150 ℃ to form the connecting adhesive film.
Comparative example 1
Extruding, casting, hollowing, drawing and rolling the resin mixture 1 to obtain an adhesive film with through holes, and controlling the gram weight of the adhesive film to be 200g/m2Raschig flow value of 12mm, onlyThe area of each penetrating hole is 5mm2The penetrating hole is rectangular and is positioned at the length 1/2 of the adhesive film body. And (3) using 10 copper-zinc alloy wires 20 with the diameter of 0.1mm, penetrating through the penetrating holes, wherein the included angle between the wires 20 and the straight lines of the penetrating holes is 90 degrees, and punching the grid adhesive film for hot pressing for 3s at 150 ℃ to form the connecting adhesive film.
Comparative example 2
Extruding, casting, hollowing, drawing and rolling the resin mixture 4 to obtain an adhesive film with through holes, and controlling the gram weight of the adhesive film to be 70g/m2The Raschig flow value is 100mm, and the area of a single penetrating hole is 5mm2The penetrating hole is rectangular and is positioned at the length 1/2 of the adhesive film body. Using 10 copper-zinc alloy wires 20 with the diameter of 0.1mm to penetrate through the penetrating holes, wherein the included angle between the wires 20 and the straight lines of the penetrating holes is 90 degrees, and performing hot pressing on the perforated grid adhesive film for 3s at 150 ℃ to form a connecting adhesive film
Comparative example 3
Extruding, casting, hollowing, drawing and rolling the resin mixture 5 to obtain an adhesive film with through holes, wherein the gram weight of the adhesive film is controlled to be 70g/m2The Raschig flow value is 0.2mm, and the area of a single penetration hole is 5mm2The penetrating hole is rectangular and is positioned at the length 1/2 of the adhesive film body. Using 10 copper-zinc alloy wires 20 with the diameter of 0.1mm to penetrate through the penetrating holes, wherein the included angle between the wires 20 and the straight lines of the penetrating holes is 90 degrees, and performing hot pressing on the perforated grid adhesive film for 3s at 150 ℃ to form a connecting adhesive film
Laying and preparing the photovoltaic module by the connecting films according to the following modes:
in fig. 4, a back layer support plate 01 (foster BEC-301 back plate), a back layer adhesive film 02POE (foster TF4 adhesive film), an example grid-shaped connection adhesive film 03 (lead wires 20 facing the cell), 4 pieces of non-master grid cell sheet 04 with 157mm length and 157mm thickness and 180 μmHJT, an example grid-shaped connection adhesive film 03 (lead wires 20 facing the cell), a front layer adhesive film 05POE (foster TF4 adhesive film), and a front glass 06 were sequentially laid, and an edge lead wire 20 was welded by a bus bar 07, laminated at 150 ℃ for 18min, and power and EL tests were performed.
And (3) testing light transmittance: the connecting film samples (without wire 20) were laminated at 150 ℃ for 18min and tested according to GB/T29848. The test results are reported in table 1.
Comparative example 4
Extruding, casting, embossing, grid hollowing, drawing and rolling the resin mixture 1 to obtain a grid adhesive film, wherein the gram weight of the grid adhesive film is controlled to be 70g/m2The thickness is 0.2mm, the Raschig lattice flow value is 12mm, and the area of a single hollow lattice is 5mm2The shape of the hollow space is rectangular.
Cutting 4 pieces of 150 mm-150 mm grid adhesive films, laying 5 copper-zinc alloy wires 20 with the diameter of 0.1mm and the length of 145mm on each adhesive film at intervals of 2.5cm, laminating the grid adhesive films with one piece of grid film wire facing upwards and the other piece of wire facing downwards by 3mm, interconnecting the wires on the two grid films by using low-temperature alloy plating layers (the melting point is 120-160 ℃), laying 157 mm-157 mm HJT non-main grid cell pieces with the thickness of 180μm on the side of the wires (as shown in a patent CN 209822661U picture 7), and manufacturing the same laminated grid adhesive film wires and cell pieces in parallel.
The back layer support plate (Foster BEC-301 back plate), the back layer adhesive film POE (Foster TF4 adhesive film), the connecting film of the embodiment or the comparison example (lead wire 20 faces to the cell piece), the 157mm 80mm semi-sheet crystalline silicon cell piece, the connecting film of the embodiment or the comparison example (lead wire 20 faces to the cell piece), the front layer adhesive film POE (Foster TF4 adhesive film) and the front layer glass are sequentially laid, the edge lead wire 20 is led out by welding of a confluence strip, and the lamination is carried out at 150 ℃ for 18 min. Power and EL subfissure tests were then performed. Wherein the cold solder joint test results are shown in fig. 5.
TABLE 1
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects:
the latticed connecting adhesive film is adopted to replace the conventional battery piece welding technology, the hidden cracking risk of the battery piece generated by high-temperature welding is reduced, the production process is simplified, and the production efficiency is improved; meanwhile, silver paste is omitted, and cost is reduced; particularly, the penetrating holes are adopted to enable the lead to penetrate through the film body of the adhesive film and then be compounded with the film body in a more fitting mode, and therefore the problem of hidden cracking of the battery piece is effectively solved. The grid hollow-out shape with the same area can save more adhesive films to reduce the product cost, improve the light transmittance and reduce the false welding between the metal lead and the photovoltaic cell. The latticed connection adhesive film effectively utilizes the advantage that no main grid assembly is required to be accurately aligned when being connected in series, can be compatible with high-density assembly technologies such as splicing sheets and the like, and reduces the internal resistance of an interconnection structure by arranging a plurality of wires, so that the loss caused by the resistance of the interconnection structure can be greatly reduced. In addition, the conducting wire is adopted, sunlight incident to the conducting wire can be reflected to the surface of the solar cell panel again, the utilization rate of light of the solar cell panel is improved, the adverse effect caused by shading of the external electric connection part by the traditional grid line is reduced, the conversion efficiency is improved, the process steps and equipment investment are reduced, materials are saved, the cost is reduced, and the production efficiency is improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A latticed connection glued membrane for photovoltaic module, its characterized in that, latticed connection glued membrane includes:
the adhesive film body is provided with a grid-shaped hollow structure, part of hollow spaces in the grid-shaped hollow structure are penetrating holes, and the penetrating holes are positioned at 1/2 +/-10% of the length of the adhesive film body;
the conducting wires extend along the length direction of the adhesive film body, the conducting wires correspondingly penetrate through the penetrating holes at the length of 1/2 +/-10% in a one-to-one mode, one part of each conducting wire is arranged on one side of the adhesive film body, the other part of each conducting wire is arranged on the other side of the adhesive film body, and each conducting wire is embedded into the adhesive film body, wherein the embedding depth is 1/3-2/3 of the diameter of the conducting wire.
2. The latticed connection rubber film according to claim 1, wherein the rubber film body has a gram weight of 20-100 g/m2The adhesive film body is an adhesive film with Raschig flow value of 1-30 mm.
3. The adhesive film as claimed in claim 1, wherein the through holes are aligned in a line, and the line of the through holes forms an angle of 90 ° ± 5 ° with the conductive wires.
4. The adhesive film of claim 1, wherein the cross section of the hollow space parallel to the extension plane of the adhesive film is one or more of rectangular, triangular, circular and hexagonal.
5. The adhesive film of any one of claims 1 to 4, wherein the cross-sectional area of the hollow space parallel to the extension surface of the adhesive film is 1mm2～100mm2。
6. The adhesive film for grid connection according to claim 1, wherein the wires are selected from any one of copper-nickel alloy wires, copper-zinc alloy wires, copper-tin alloy wires, copper wires, aluminum wires, silver wires, and gold wires.
7. The adhesive film for grid connection of claim 1, wherein the diameter of the wires is 0.02mm to 0.5 mm.
8. The adhesive film for grid connection of claim 1, wherein the number of the wires is 3-20.
9. The adhesive film of claim 1, wherein the adhesive film body is a laminated adhesive film selected from one or more of an EVA adhesive film, a POE adhesive film, a PVB adhesive film, a PA adhesive film, a PE adhesive film, a PP adhesive film, an EMA adhesive film, an EMMA adhesive film, an EAA adhesive film, and an EMAA adhesive film.
10. A photovoltaic module, comprising:
the battery piece unit comprises a plurality of battery pieces distributed in an array, and the battery pieces are provided with secondary grid lines;
the adhesive film of any one of claims 1 to 9, wherein a battery piece is disposed on a surface of the adhesive film having a conductive line, and the conductive line is connected to the sub-grid line;
the bus bar is connected with the lead of the latticed connection adhesive film;
the front layer adhesive film and the back layer adhesive film are respectively arranged on the surface of the latticed connecting adhesive film, which is not provided with the conducting wires;
the front layer of glass is arranged on the surface, far away from the battery piece, of the front layer of adhesive film;
the back layer supporting plate is arranged on the surface, far away from the battery piece, of the back layer adhesive film.
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