CN114488587B

CN114488587B - Glue filling method

Info

Publication number: CN114488587B
Application number: CN202210166230.XA
Authority: CN
Inventors: 杜蕊; 蔡良伟; 谢文
Original assignee: Yueda Photoelectric Technology Zhejiang Co ltd
Current assignee: Yueda Photoelectric Technology Zhejiang Co ltd
Priority date: 2022-02-21
Filing date: 2022-02-21
Publication date: 2023-04-21
Anticipated expiration: 2042-02-21
Also published as: CN114488587A

Abstract

A glue filling method, comprising the steps of: step 10, providing a cover plate and a module frame; step 20, fixing the cover plate and the module frame combination piece; step 30, injecting glue into the non-display area through the glue injection hole; step 40, injecting glue into the non-display area which is not injected with glue through the corresponding glue injecting hole; and 50, sealing the glue filling hole and the vent hole when the inner side of the module frame is filled with glue. According to the glue pouring method, the glue pouring holes are utilized for glue pouring, so that the efficiency is high; through separating and setting up multiple region, separate the display area that will easily receive the bubble bad to form the intercommunication ware between non-display area and the display area, through non-display area encapsulating water in proper order, make the display area can be steady be filled up by the glue, and can not be because of both sides glue gathers and produce the bubble in the display area, thereby reduce bubble defective rate.

Description

Glue filling method

[ field of technology ]

The invention relates to the technical field of full-lamination production, in particular to a glue filling method.

[ background Art ]

Products are displayed in larger and larger sizes and in ever more varied shapes. For small-sized products (21.5 inches or less), OCA is often used for full lamination of the product. Compared with the OCR material adopted for full lamination, the OCA lamination is high in cost, and lamination bubbles are easy to occur when the OCA lamination is slightly large in size.

The bonding process is divided into a face glue process and a glue filling process by adopting the OCR material, and the glue filling process can correspond to the full bonding process of the planar product and the irregular curved surface product. However, in order to avoid the generation of bubbles, the initial speed of glue filling and the direction and position … … of the glue needle need to be controlled, and the generation of bubbles cannot be completely avoided. For the glue filling of the large-size fully-attached product, a plurality of glue needles are used for simultaneously filling glue so as to reduce the time required in the glue filling process, and closed bubbles are easier to be caused when different glue needles are used for converging glue, so that the bubbles cannot be discharged to cause poor products.

[ invention ]

The invention aims to provide a glue filling method which can not generate closed bubbles under the condition of not influencing glue filling efficiency.

The invention aims at realizing the following technical scheme:

a glue filling method, comprising the steps of:

step 10, providing a cover plate and a module frame, wherein the inner side of the module frame is divided into a display area and a plurality of non-display areas, the bottoms of the display area and the non-display areas are communicated, an exhaust hole and a plurality of glue filling holes are formed in the module frame, and the exhaust hole and the glue filling holes are correspondingly communicated with the display area and the non-display areas respectively;

step 20, fixing the cover plate and the module frame combination piece;

step 30, injecting glue into the non-display areas through the glue injection holes, wherein at least one of the non-display areas is not injected with glue through the corresponding glue injection hole;

step 40, injecting glue into the non-display area which is not injected with the glue through the corresponding glue injection hole when the glue floods the bottom communication part of the display area and the non-display area;

and 50, sealing the glue filling hole and the vent hole when the inner side of the module frame is filled with glue.

In one embodiment, in the step 10:

and a barrier is arranged on the inner side of the module frame and separates the inner side area of the module frame into a display area and a non-display area.

In one embodiment, the barrier is vertically arranged, a gap is reserved between the top of the barrier and the module frame, between the bottom of the barrier and the module frame, and the display area and the non-display area are communicated through the gap.

In one embodiment, the barrier has a pair of barrier ribs that separate the area inside the module frame into a central display area and two non-display areas on both sides.

In one embodiment, the two non-display areas are the same in area.

In one embodiment, in the step 10: the exhaust hole is arranged on the central axis of the display area.

In one embodiment, in the step 30: the non-display areas without glue are at least half the number of all the non-display areas.

In one embodiment, in the step 30: the extruded gas can be discharged through the exhaust hole and the glue filling hole after glue is injected.

Compared with the prior art, the invention has the following beneficial effects: according to the glue pouring method, the glue pouring holes are utilized for glue pouring, so that the efficiency is high; through separating and setting up multiple region, separate the display area that will easily receive the bubble bad to form the intercommunication ware between non-display area and the display area, through non-display area encapsulating water in proper order, make the display area can be steady be filled up by the glue, and can not be because of both sides glue gathers and produce the bubble in the display area, thereby reduce bubble defective rate.

[ description of the drawings ]

FIG. 1 is a schematic view of a frame of a molding method of the present invention;

FIG. 2 is a schematic diagram showing the working state of the glue filling method according to the present invention;

FIG. 3 is a second schematic diagram of the working state of the glue-pouring method according to the present invention;

fig. 4 is a flow chart of the glue filling method of the invention.

[ detailed description ] of the invention

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description created in this application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application can be understood by those of ordinary skill in the art in a specific context.

FIG. 1 is a schematic view of a frame of a molding method of the present invention; FIG. 2 is a schematic diagram showing the working state of the glue filling method according to the present invention; FIG. 3 is a second schematic diagram of the working state of the glue-pouring method according to the present invention; fig. 4 is a flow chart of the glue filling method of the invention.

Referring to fig. 1 and 4, a method for filling glue should be used for filling glue of a large-sized fully-adhered product, and at this time, a plurality of glue needles are simultaneously used for filling glue to reduce the time required for the glue filling process, and the method includes the following steps 10-50.

Step 10: a cover plate and a module rim 1 are provided. The module frame 1 is used for limiting a module, and the module can comprise a liquid crystal module, a touch module and the like. The cover plate is used for being fixed with the die set frame 1 in a combined mode, and a glue filling space is formed inside the combined mode. The inner side of the module frame 1 is divided into a display area 3 and a plurality of non-display areas 2, wherein the bottom of the display area 3 is communicated with the display area, the display area 3 corresponds to a display function area of a product, and the area of the product cannot be influenced by bubbles generated by glue filling. The module frame 1 is provided with an exhaust hole 4 for exhausting and a plurality of glue filling holes 5 for filling glue, and the glue filling holes 5 can also be used for exhausting. The air vent 4 and the glue filling hole 5 are correspondingly communicated with the display area 3 and the non-display area 2 respectively, specifically, the air vent 4 is formed in the module frame 1 at the top of the display area 3, and the glue filling hole 5 is formed in the module frame 1 of the non-display area 2.

Step 20: and (3) combining and fixing the cover plate and the module frame 1, and forming a glue filling space inside after combining to prepare glue filling action.

Step 30: referring to fig. 2, glue is injected into the non-display area 2 through the glue injection hole 5. After traditional module frame 1 closes the piece with the apron, glue filling is carried out from both sides glue filling hole 5, and glue goes out to glue and becomes irregular convex, and when left and right sides glue assembled, very easily forms the bubble, because the bubble receives buoyancy effect, and part can come up, but exists the bubble and can not come up to glue surface condition, causes the glue filling bubble bad. In order to further displace the bubbles, at least one of the non-display areas 2 is not filled with glue through the corresponding glue filling hole 5, and the air vent 4 is configured to exhaust air, and the glue filling hole 5 not filled with glue can assist in exhausting air, so that the glue can be stably filled into the bottom of the display area 3, and the glue can be prevented from being simultaneously filled into the two sides to form bubbles.

In step 40, please refer to fig. 3, as the glue gradually enters, when the glue floods the bottom communicating portion of the display area 3 and the non-display area 2, the glue is injected into the non-display area 2 not yet injected with the glue through the corresponding glue injection hole 5. Namely, the glue filling operation is started by firstly opening the glue needle at one side, after the glue submerges the lowest point, the glue needle at the other side is simultaneously opened for glue filling, and air bubbles formed by glue aggregation can be blocked outside the display area 3. The same height liquid pressure is equal, so as the glue on two sides increases, the display area 3 can be filled with the glue smoothly, and bubbles can not be generated in the display area 3 due to the convergence of the glue on two sides, so that the bubble reject ratio is reduced.

And 50, sealing the glue filling hole 5 and the air exhaust hole 4 by using sealant after the inner side of the module frame 1 is filled with glue and the glue injection is completed.

In one embodiment, in step 10: the inner side of the module frame 1 is provided with a barrier or a baffle plate for separating the inner side area of the module frame 1 so that the glue between the separated areas is communicated only through the bottom. The inner side area of the frame 1 of the barrier separation module is a display area 3 and a non-display area 2, and preferably, the display area 3 is centered and the non-display area 2 is distributed on two sides of the display area 3.

In one embodiment, the barrier is vertically arranged, the top of the barrier is fixed with the module frame 1, a gap is reserved between the bottom of the barrier and the module frame 1, the display area 3 and the non-display area 2 are communicated through the gap, and the top of the barrier is communicated to the outside through the glue filling hole 5 and the air exhaust hole 4, so that a communicating vessel is formed between the areas.

In one embodiment, the barrier has a pair, and the inner area of the barrier separation module frame 1 is a central display area 3 and two non-display areas 2 on two sides. Preferably, the two non-display areas 2 are the same area.

In one embodiment, in step 10: the exhaust hole 4 is arranged on the central axis of the display area 3, and the gas is uniformly discharged, so that bubbles are prevented from being generated due to uneven glue on any side.

In one embodiment, in step 30: the non-display area 2 without glue is at least half of the number of all the non-display areas 2, so that the exhaust and glue filling in the initial stage of glue injection are more stable, and the bubble generation of the display area 3 is reduced.

In one embodiment, in step 30: the glue filling hole 5 has the function of the air vent 4, and the extruded air can be discharged through the air vent 4 and the glue filling hole 5 after glue is injected.

With the above-described preferred embodiments according to the present application as a teaching, the related workers can make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.

Claims

1. The glue filling method is characterized by comprising the following steps of:

step 10, providing a cover plate and a module frame, wherein a pair of barriers are vertically arranged in the module frame, the barriers divide an inner side area of the module frame into a central display area and two non-display areas on two sides, a gap is reserved between the top of each barrier and the module frame, the bottom of each barrier is fixed with the module frame, the display areas are communicated with the non-display areas through the gaps, an exhaust hole and a plurality of glue filling holes are formed in the module frame, and the exhaust hole and the glue filling holes are correspondingly communicated with the display areas and the non-display areas respectively;

step 20, fixing the cover plate and the module frame combination piece;

2. The glue-pouring method according to claim 1, wherein the areas of the two non-display areas are the same.

3. The glue-pouring method according to claim 1, wherein in step 10: the exhaust hole is arranged on the central axis of the display area.

4. The glue-pouring method according to claim 1, wherein in the step 30: the extruded gas can be discharged through the exhaust hole and the glue filling hole after glue is injected.