CN114481103B - Chemical nickel solution and preparation method thereof - Google Patents
Chemical nickel solution and preparation method thereof Download PDFInfo
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- CN114481103B CN114481103B CN202111496605.0A CN202111496605A CN114481103B CN 114481103 B CN114481103 B CN 114481103B CN 202111496605 A CN202111496605 A CN 202111496605A CN 114481103 B CN114481103 B CN 114481103B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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Abstract
The application discloses a chemical nickel solution and a preparation method thereof, wherein each 1 liter of chemical nickel solution comprises the following components: nickel salt: the concentration of nickel ions is 4.6-5.0g/L; reducing agent: 16-20g/L; stabilizing agent: 15-35mg/L; complexing agent: 3-5g/L; buffering agent: 6-10.5g/L; plating promoter: 0.5-3.5g/L; and (2) a surfactant: 0.05-0.5ml/L; stress agent: 50-70mg/L; water in balance. The chemical nickel solution has good nickel plating effect and uniform nickel surface unit cells, and can not generate nickel corrosion, non-uniform nickel surface unit cells and crack caused by stress; the preparation method is simple to operate and low in cost, and the prepared chemical nickel solution has a good nickel plating effect.
Description
Technical Field
The application relates to the technical field of electroless plating, in particular to a chemical nickel solution and a preparation method thereof.
Background
Electroless plating, also known as electroless plating, may also be referred to as autocatalytic plating, and refers to a process in which metal ions in an aqueous solution are reduced by a reducing agent and deposited onto the surface of a solid substrate under certain conditions. Plating processes such as nickel plating, copper plating, gold plating and the like are common processes for manufacturing a PCB. Nickel plating is mainly carried out in two ways: nickel electroplating and chemical nickel plating cannot be performed on the whole surface of some workpieces with complex shapes, but the chemical plating can be performed on the workpieces with any shapes, and the chemical nickel plating layer is extremely uniform and almost can achieve the profiling effect. The chemical nickel plating layer has low coating pore, strong corrosion resistance and excellent protection effect on the matrix. In the PCB field, through forming the nickel layer between copper line layer and the metal layer of PCB board, can avoid the interdiffusion between copper and gold to cause the poor, the short defect of life of circuit board solderability, the mechanical strength of metal layer has also been improved to the nickel layer that forms simultaneously.
Electroless nickel is an important treatment technique and has been developed in china for only over twenty years. Chemical nickel liquid medicine suppliers in the market at present comprise village, japanese mine, hongda autumn, rogatha, an Meite, spilled electronics and the like, however, foreign chemical nickel liquid medicine is still superior to domestic chemical nickel liquid medicine, and when the existing chemical nickel solution is used for processing a PCB, the problems of serious nickel corrosion, uneven nickel surface cells on a hole ring and a copper layer, cracks caused by internal stress and the like exist.
Disclosure of Invention
The application provides a chemical nickel solution and a preparation method thereof, aiming at solving the problems of serious nickel corrosion, uneven nickel surface unit cells and easy generation of cracks on the nickel surface of the existing chemical nickel solution.
A electroless nickel solution characterized by: each 1 liter of electroless nickel solution comprises the following composition:
nickel salt: the concentration of nickel ions is 4.6-5.0g/L;
reducing agent: 16-20g/L;
stabilizing agent: 15-35mg/L;
complexing agent: 3-5g/L;
buffering agent: 6-10.5g/L;
plating promoter: 0.5-3.5g/L;
and (2) a surfactant: 0.05-0.5ml/L;
stress agent: 50-70mg/L;
water in balance;
the nickel salt is one or more of nickel sulfate, nickel chloride and nickel sulfamate.
Optionally, the reducing agent is a mixture of sodium hypophosphite and hydroxylamine sulfate, and the sodium hypophosphite is 12-15g/L: the mixing ratio of the sodium hypophosphite to the hydroxylamine sulfate is 3:1, and the hydroxylamine sulfate is 4-5 g/L.
Optionally, the stabilizer is a compound capable of providing zirconium ions.
Optionally, the complexing agent is a mixture of taurine and chlorogenic acid, and the taurine is 1.5-2.5g/L: chlorogenic acid is 1.5-2.5g/L, and the mixing ratio of taurine and chlorogenic acid is 1:1.
Optionally, the buffer is a mixture of sodium bicarbonate and potassium dihydrogen phosphate, wherein the sodium bicarbonate is 4-7g/L, the potassium dihydrogen phosphate is 2-3.5g/L, and the mixing ratio of the sodium bicarbonate to the potassium dihydrogen phosphate is 2:1.
Optionally, the plating promoter is benalagreen.
Optionally, the surfactant is a mixture of alkyl glycoside and polyvinyl alcohol, and the mixing ratio of the alkyl glycoside and the polyvinyl alcohol is 1:1.
Optionally, the stress agent comprises N, N methylene ethylenediamine.
A method for preparing a chemical nickel solution, comprising the following steps:
preparation of agent A: mixing nickel salt and water, uniformly stirring, and preparing an agent A;
preparing a preparation B: mixing a reducing agent, a buffering agent, a complexing agent, a stabilizing agent and water, uniformly stirring, and preparing a B agent;
preparing a C agent: mixing a plating starter, a surfactant, a stress agent and water, uniformly stirring, and preparing to obtain a C agent;
mixing the agent A, the agent B and the agent C according to the proportion of 1:1:1, mixing at normal temperature or under heating, uniformly stirring, and controlling the pH value of the mixed solution to be 4.8-5.4 to prepare the chemical nickel solution.
Alternatively, the heating temperature is 79-85 ℃, and the pH value is controlled by adding sodium hydroxide solution and sulfuric acid solution, wherein the concentration of the sodium hydroxide solution and the sulfuric acid solution is 1mol/L.
Compared with the prior art, the application has the beneficial effects that: the chemical nickel solution has good nickel plating effect and uniform nickel surface unit cells, and does not generate nickel corrosion, non-uniform nickel surface unit cells and cracks caused by stress; the preparation method is simple to operate and low in cost, and the prepared chemical nickel solution has a good nickel plating effect.
Drawings
FIG. 1 is an enlarged schematic view of a nickel layer formed by applying a chemical nickel solution according to an embodiment of the present application;
FIG. 2 is a second enlarged schematic view of a nickel layer formed by applying a chemical nickel solution according to an embodiment of the present application;
FIG. 3 is an enlarged schematic illustration of a nickel layer formed by prior art electroless nickel solution application;
FIG. 4 is a second enlarged schematic view of a nickel layer formed by prior art electroless nickel solution application.
Detailed Description
In order to describe the technical solution of the present application in detail, the technical solution of the embodiments of the present application will be clearly and completely described below. In order to describe the technical solution of the present application in detail, the following description will be made clearly and completely by referring to the drawings of the embodiments of the present application. It will be apparent that the described embodiments are some, but not all, embodiments of the application. All other embodiments, which can be made by a person skilled in the art without creative efforts, based on the described embodiments of the present application fall within the protection scope of the present application.
A electroless nickel solution, example 1:
a electroless nickel solution comprising the following composition per 1 liter of electroless nickel solution: nickel salt: nickel ion concentration 4.6g/L; reducing agent: 17g/L; stabilizing agent: 25mg/L; complexing agent: 5g/L; buffering agent: 10.5g/L; plating promoter: 1.5g/L; and (2) a surfactant: 0.5ml/L; stress agent: 60mg/L; water in balance.
The nickel salt is one or more of nickel sulfate, nickel chloride and nickel sulfamate.
The reducing agent is a mixture of sodium hypophosphite and hydroxylamine sulfate, and the sodium hypophosphite is 12g/L: the mixing ratio of the sodium hypophosphite to the hydroxylamine sulfate is 3:1, wherein the hydroxylamine sulfate is 4 g/L.
The stabilizer is a compound capable of providing zirconium ions. In some embodiments, the stabilizer is zirconium chloride, which can prevent precipitation of nickel ions at high temperatures by automatic reduction.
The complexing agent is a mixture of taurine and chlorogenic acid, and the taurine is 1.5g/L: chlorogenic acid is 1.5g/L, and the mixing ratio of taurine and chlorogenic acid is 1:1.
The buffer is a mixture of sodium bicarbonate and potassium dihydrogen phosphate, wherein the sodium bicarbonate is 4g/L, the potassium dihydrogen phosphate is 2g/L, and the mixing ratio of the sodium bicarbonate to the potassium dihydrogen phosphate is 2:1.
The plating promoter is Jianna green, and before the chemical nickel solution is adopted to carry out nickel plating on the PCB, the PCB is subjected to activation treatment, wherein the activation treatment means that palladium ions react with copper surfaces on the PCB to generate palladium atoms, the plating promoter can accelerate the rapid nucleation of the nickel ions on the palladium, the nickel plating speed and effect are improved, and the compound for providing the palladium ions is the conventional compound.
The surfactant is a mixture of alkyl glycoside and polyvinyl alcohol, the mixing ratio of the alkyl glycoside and the polyvinyl alcohol is 1:1, and the mixture of the alkyl glycoside and the polyvinyl alcohol can remove impurities on the surface of the PCB to be plated, accelerate the distribution of nickel ions and enable nickel layer cells at the edge of holes on the PCB and at the bonding pad to be uniformly dispersed. In some embodiments, the stress agent comprises N, N methylene ethylenediamine.
Example 2:
a electroless nickel solution comprising the following composition per 1 liter of electroless nickel solution: nickel salt: nickel ion concentration 5.0g/L; reducing agent: 16g/L; stabilizing agent: 35mg/L; complexing agent: 3g/L; buffering agent: 8g/L; plating promoter: 3.5g/L; and (2) a surfactant: 0.05ml/L; stress agent: 58mg/L; water in balance.
The nickel salt is one or more of nickel sulfate, nickel chloride and nickel sulfamate.
The reducing agent is a mixture of sodium hypophosphite and hydroxylamine sulfate, and the sodium hypophosphite is 15g/L: the mixing ratio of the sodium hypophosphite to the hydroxylamine sulfate is 3:1, and the hydroxylamine sulfate is 5 g/L.
The stabilizer is a compound capable of providing zirconium ions. In some embodiments, the stabilizer is zirconium chloride, which can prevent precipitation of nickel ions at high temperatures by automatic reduction.
The complexing agent is a mixture of taurine and chlorogenic acid, and the taurine is 2.5g/L: chlorogenic acid is 2.5g/L, and the mixing ratio of taurine and chlorogenic acid is 1:1.
The buffer is a mixture of sodium bicarbonate and potassium dihydrogen phosphate, wherein the sodium bicarbonate is 7g/L, the potassium dihydrogen phosphate is 3.5g/L, and the mixing ratio of the sodium bicarbonate to the potassium dihydrogen phosphate is 2:1.
The plating promoter is Jianna green, and before the chemical nickel solution is adopted to carry out nickel plating on the PCB, the PCB is subjected to activation treatment, wherein the activation treatment means that palladium ions react with copper surfaces on the PCB to generate palladium atoms, the plating promoter can accelerate the rapid nucleation of the nickel ions on the palladium, the nickel plating speed and effect are improved, and the compound for providing the palladium ions is the conventional compound.
The surfactant is a mixture of alkyl glycoside and polyvinyl alcohol, the mixing ratio of the alkyl glycoside and the polyvinyl alcohol is 1:1, and the mixture of the alkyl glycoside and the polyvinyl alcohol can remove impurities on the surface of the PCB to be plated, accelerate the distribution of nickel ions and enable nickel layer cells at the edge of holes on the PCB and at the bonding pad to be uniformly dispersed. In some embodiments, the stress agent comprises N, N methylene ethylenediamine.
Example 3:
a electroless nickel solution comprising the following composition per 1 liter of electroless nickel solution: nickel salt: nickel ion concentration 4.7g/L; reducing agent: 20g/L; stabilizing agent: 15mg/L; complexing agent: 4g/L; buffering agent: 6g/L; plating promoter: 0.5g/L; and (2) a surfactant: 0.2ml/L; stress agent: 50mg/L; water in balance.
The nickel salt is one or more of nickel sulfate, nickel chloride and nickel sulfamate.
The reducing agent is a mixture of sodium hypophosphite and hydroxylamine sulfate, and the sodium hypophosphite is 13g/L: the mixing ratio of the sodium hypophosphite to the hydroxylamine sulfate is 3:1, wherein the hydroxylamine sulfate is 4.5 g/L.
The stabilizer is a compound capable of providing zirconium ions. In some embodiments, the stabilizer is zirconium chloride, which can prevent precipitation of nickel ions at high temperatures by automatic reduction.
The complexing agent is a mixture of taurine and chlorogenic acid, and the taurine is 1.8g/L: chlorogenic acid is 2.3g/L, and the mixing ratio of taurine and chlorogenic acid is 1:1.
The buffer is a mixture of sodium bicarbonate and potassium dihydrogen phosphate, wherein the sodium bicarbonate is 5g/L, the potassium dihydrogen phosphate is 3.0g/L, and the mixing ratio of the sodium bicarbonate to the potassium dihydrogen phosphate is 2:1.
The plating promoter is Jianna green, and before the chemical nickel solution is adopted to carry out nickel plating on the PCB, the PCB is subjected to activation treatment, wherein the activation treatment means that palladium ions react with copper surfaces on the PCB to generate palladium atoms, the plating promoter can accelerate the rapid nucleation of the nickel ions on the palladium, the nickel plating speed and effect are improved, and the compound for providing the palladium ions is the conventional compound.
The surfactant is a mixture of alkyl glycoside and polyvinyl alcohol, the mixing ratio of the alkyl glycoside and the polyvinyl alcohol is 1:1, and the mixture of the alkyl glycoside and the polyvinyl alcohol can remove impurities on the surface of the PCB to be plated, accelerate the distribution of nickel ions and enable nickel layer cells at the edge of holes on the PCB and at the bonding pad to be uniformly dispersed. In some embodiments, the stress agent comprises N, N methylene ethylenediamine.
Example 4:
a electroless nickel solution comprising the following composition per 1 liter of electroless nickel solution: nickel salt: nickel ion concentration 4.8g/L; reducing agent: 18g/L; stabilizing agent: 30mg/L; complexing agent: 4.5g/L; buffering agent: 9.5g/L; plating promoter: 2.0g/L; and (2) a surfactant: 0.3ml/L; stress agent: 70mg/L; water in balance.
The nickel salt is one or more of nickel sulfate, nickel chloride and nickel sulfamate.
The reducing agent is a mixture of sodium hypophosphite and hydroxylamine sulfate, and the sodium hypophosphite is 14g/L: the mixing ratio of the sodium hypophosphite to the hydroxylamine sulfate is 3:1, wherein the hydroxylamine sulfate is 4.8 g/L.
The stabilizer is a compound capable of providing zirconium ions. In some embodiments, the stabilizer is zirconium chloride, which can prevent precipitation of nickel ions at high temperatures by automatic reduction.
The complexing agent is a mixture of taurine and chlorogenic acid, and the taurine is 2.0g/L: chlorogenic acid is 2.0g/L, and the mixing ratio of taurine and chlorogenic acid is 1:1.
The buffer is a mixture of sodium bicarbonate and potassium dihydrogen phosphate, wherein the sodium bicarbonate is 6g/L, the potassium dihydrogen phosphate is 2.5g/L, and the mixing ratio of the sodium bicarbonate to the potassium dihydrogen phosphate is 2:1.
The plating promoter is Jianna green, and before the chemical nickel solution is adopted to carry out nickel plating on the PCB, the PCB is subjected to activation treatment, wherein the activation treatment means that palladium ions react with copper surfaces on the PCB to generate palladium atoms, the plating promoter can accelerate the rapid nucleation of the nickel ions on the palladium, the nickel plating speed and effect are improved, and the compound for providing the palladium ions is the conventional compound.
The surfactant is a mixture of alkyl glycoside and polyvinyl alcohol, the mixing ratio of the alkyl glycoside and the polyvinyl alcohol is 1:1, and the mixture of the alkyl glycoside and the polyvinyl alcohol can remove impurities on the surface of the PCB to be plated, accelerate the distribution of nickel ions and enable nickel layer cells at the edge of holes on the PCB and at the bonding pad to be uniformly dispersed. In some embodiments, the stress agent comprises N, N methylene ethylenediamine.
A method for preparing a electroless nickel solution, example 1:
a method for preparing a chemical nickel solution, comprising the following steps:
preparation of agent A: mixing nickel salt and water, uniformly stirring, and preparing an agent A;
preparing a preparation B: mixing a reducing agent, a buffering agent, a complexing agent, a stabilizing agent and water, uniformly stirring, and preparing a B agent;
preparing a C agent: mixing a plating starter, a surfactant, a stress agent and water, uniformly stirring, and preparing to obtain a C agent;
mixing the agent A, the agent B and the agent C according to the proportion of 1:1:1, mixing at normal temperature or under heating, uniformly stirring, and controlling the pH value of the mixed solution to be 4.8 to prepare the chemical nickel solution. In some embodiments, the heating temperature is 79℃and the pH is controlled by adding sodium hydroxide solution and sulfuric acid solution, both at a concentration of 1mol/L.
Example 2:
a method for preparing a chemical nickel solution, comprising the following steps:
preparation of agent A: mixing nickel salt and water, uniformly stirring, and preparing an agent A;
preparing a preparation B: mixing a reducing agent, a buffering agent, a complexing agent, a stabilizing agent and water, uniformly stirring, and preparing a B agent;
preparing a C agent: mixing a plating starter, a surfactant, a stress agent and water, uniformly stirring, and preparing to obtain a C agent;
mixing the agent A, the agent B and the agent C according to the proportion of 1:1:1, mixing at normal temperature or under heating, uniformly stirring, and controlling the pH value of the mixed solution to 5.4 to prepare the chemical nickel solution. In some embodiments, the heating temperature is 85 ℃, and the PH is controlled by adding sodium hydroxide solution and sulfuric acid solution, each having a concentration of 1mol/L.
Example 3:
a method for preparing a chemical nickel solution, comprising the following steps:
preparation of agent A: mixing nickel salt and water, uniformly stirring, and preparing an agent A;
preparing a preparation B: mixing a reducing agent, a buffering agent, a complexing agent, a stabilizing agent and water, uniformly stirring, and preparing a B agent;
preparing a C agent: mixing a plating starter, a surfactant, a stress agent and water, uniformly stirring, and preparing to obtain a C agent;
mixing the agent A, the agent B and the agent C according to the proportion of 1:1:1, mixing at normal temperature or under heating, uniformly stirring, and controlling the pH value of the mixed solution to 5.2 to prepare the chemical nickel solution. In some embodiments, the heating temperature is 83℃and the pH is controlled by adding sodium hydroxide solution and sulfuric acid solution, both at a concentration of 1mol/L.
Example 4:
a method for preparing a chemical nickel solution, comprising the following steps:
preparation of agent A: mixing nickel salt and water, uniformly stirring, and preparing an agent A;
preparing a preparation B: mixing a reducing agent, a buffering agent, a complexing agent, a stabilizing agent and water, uniformly stirring, and preparing a B agent;
preparing a C agent: mixing a plating starter, a surfactant, a stress agent and water, uniformly stirring, and preparing to obtain a C agent;
mixing the agent A, the agent B and the agent C according to the proportion of 1:1:1, mixing at normal temperature or under heating, uniformly stirring, and controlling the pH value of the mixed solution to 5.0 to prepare the chemical nickel solution. In some embodiments, the heating temperature is 80℃and the pH is controlled by adding sodium hydroxide solution and sulfuric acid solution, both at a concentration of 1mol/L.
After nickel plating by using the nickel solution of the application as shown in fig. 1-2, the nickel layer is uniform and has no cracks, and after nickel plating by using the nickel solution on the existing market as shown in fig. 3-4, the nickel layer has corrosion holes, cracks and uneven cells.
The chemical nickel solution has good nickel plating effect and uniform nickel surface unit cells, and does not generate nickel corrosion, non-uniform nickel surface unit cells and cracks caused by stress; the preparation method is simple to operate and low in cost, and the prepared chemical nickel solution has a good nickel plating effect.
The foregoing description is only a preferred embodiment of the present application, and is not intended to limit the present application, but the present application is described in detail with reference to the foregoing embodiments, and it will be apparent to those skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments, or that equivalents may be substituted for part of the technical features thereof. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present embodiment are included in the protection scope of the present application.
Claims (6)
1. A electroless nickel solution, comprising per 1 liter of electroless nickel solution the following composition:
the nickel salt is one or more of nickel sulfate, nickel chloride and nickel sulfamate;
the stabilizer is a compound capable of providing zirconium ions;
the complexing agent is a mixture of taurine and chlorogenic acid, and the taurine is 1.5-2.5g/L; chlorogenic acid is 1.5-2.5g/L, and the mixing ratio of taurine and chlorogenic acid is 1:1;
the plating promoter is benalagreen;
the stress agent is N, N methylene ethylenediamine.
2. A electroless nickel solution according to claim 1, wherein: the reducing agent is a mixture of sodium hypophosphite and hydroxylamine sulfate, and the sodium hypophosphite is 12-15g/L; the mixing ratio of the sodium hypophosphite to the hydroxylamine sulfate is 3:1, and the hydroxylamine sulfate is 4-5 g/L.
3. A electroless nickel solution according to claim 1, wherein: the buffer is a mixture of sodium bicarbonate and potassium dihydrogen phosphate, wherein the sodium bicarbonate is 4-7g/L, the potassium dihydrogen phosphate is 2-3.5g/L, and the mixing ratio of the sodium bicarbonate to the potassium dihydrogen phosphate is 2:1.
4. A electroless nickel solution according to claim 1, wherein: the surfactant is a mixture of alkyl glycoside and polyvinyl alcohol, and the mixing ratio of the alkyl glycoside and the polyvinyl alcohol is 1:1.
5. A method for preparing a electroless nickel solution according to any one of claims 1-4, comprising the steps of:
1. preparation of agent A: mixing nickel salt and water, uniformly stirring, and preparing an agent A;
2. preparing a preparation B: mixing a reducing agent, a buffering agent, a complexing agent, a stabilizing agent and water, uniformly stirring, and preparing a B agent;
3. preparing a C agent: mixing a plating starter, a surfactant, a stress agent and water, uniformly stirring, and preparing to obtain a C agent;
mixing the agent A, the agent B and the agent C according to the proportion of 1:1:1, mixing at normal temperature or under heating, uniformly stirring, and controlling the pH value of the mixed solution to be 4.8-5.4 to prepare the chemical nickel solution.
6. The method for preparing a chemical nickel solution according to claim 5, wherein: the heating temperature is 79-85 ℃, and the pH value is controlled by adding sodium hydroxide solution and sulfuric acid solution, wherein the concentration of the sodium hydroxide solution and the sulfuric acid solution is 1mol/L.
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| JP2002016333A (en) * | 2000-06-27 | 2002-01-18 | Sony Corp | Printed wiring board and its manufacturing method |
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| KR20120066303A (en) * | 2010-12-14 | 2012-06-22 | 성열섭 | Phosphorus-free electroless nickel plating solution and nickle-alloy plating solution and electroless plating method using the same |
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| US20170028184A1 (en) * | 2015-07-27 | 2017-02-02 | Catura Corporation | Device and method of skin care and treatment via microneedles having inherent anode and cathode properties, with or without cosmetic or pharmacological compositions |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002016333A (en) * | 2000-06-27 | 2002-01-18 | Sony Corp | Printed wiring board and its manufacturing method |
| CN101889333A (en) * | 2007-12-17 | 2010-11-17 | 日矿金属株式会社 | Substrate and method for manufacturing the same |
| KR20120066303A (en) * | 2010-12-14 | 2012-06-22 | 성열섭 | Phosphorus-free electroless nickel plating solution and nickle-alloy plating solution and electroless plating method using the same |
Non-Patent Citations (1)
| Title |
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| 纳米氧化锆复合陶瓷粉体的制备及应用研究进展;王焕英;张萍;国占生;邢广恩;秦丽娟;韩志敏;;人工晶体学报(01);全文 * |
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