CN114474895A - Flexible copper foil base material with multilayer composite structure and preparation method thereof - Google Patents

Flexible copper foil base material with multilayer composite structure and preparation method thereof Download PDF

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Publication number
CN114474895A
CN114474895A CN202011161130.5A CN202011161130A CN114474895A CN 114474895 A CN114474895 A CN 114474895A CN 202011161130 A CN202011161130 A CN 202011161130A CN 114474895 A CN114474895 A CN 114474895A
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copper foil
layer
polyimide
polyimide resin
resin
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Inventor
李韦志
林志铭
李建辉
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Yasen Electronic Materials Technology Dongtai Co ltd
Kunshan Aplus Tec Corp
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Yasen Electronic Materials Technology Dongtai Co ltd
Kunshan Aplus Tec Corp
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Priority to CN202011161130.5A priority Critical patent/CN114474895A/en
Priority to TW110123801A priority patent/TWI777638B/en
Publication of CN114474895A publication Critical patent/CN114474895A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a flexible copper foil substrate with a multilayer composite structure and a preparation method thereof, wherein the flexible copper foil substrate comprises a first copper foil layer, a first polyimide resin layer, a second polyimide resin layer, a bonding layer and a second copper foil layer; the first polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 15-40 ppm/K; the second polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 1-20 ppm/K; the thickness of the first polyimide resin layer is 1-13 mu m; the thickness of the second polyimide resin layer is 8-25 mu m; the thickness of the first copper foil layer is 7-70 mu m; the thickness of the second copper foil layer is 7-70 mu m; the thickness of the adhesive layer is 5 to 25 μm. The double-sided copper foil substrate with high heat resistance, high dimensional stability, high reliability, low rebound force and low cost is obtained by the method.

Description

Flexible copper foil base material with multilayer composite structure and preparation method thereof
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a flexible copper foil base material with a multilayer composite structure.
Background
At present, electronic systems are developed toward slimness, compactness, high heat resistance, multi-functionality, high density, high reliability and low cost, so that the selection of the copper foil substrate is an important factor for achieving the purpose.
At present, a copper foil substrate applied to a flexible copper foil circuit board is mainly formed by arranging Thermoplastic Polyimide (TPI) on thermosetting Polyimide (PI) and then pressing a copper foil at a high temperature by a special thermoplastic polyimide film prepared in a co-extrusion mode. The technology of the special thermoplastic polyimide film is limited by the relatively mature suppliers in the U.S. and Japan, the cost is high, and the high-temperature pressing method requires high production equipment and low yield in the process, so that the cost of the copper foil substrate manufactured by the method is high. In addition, the limitation of the thickness of the TPI arranged up and down also ensures that the copper foil roughness of the flexible copper foil substrate cannot be too high and the lamination is difficult, so the corresponding cost of the finally obtained flexible copper foil circuit board can be increased.
Another method for manufacturing copper foil substrate of flexible copper foil circuit board is to coat epoxy resin adhesive on polyimide film to make adhesive type single-sided copper foil or double-sided copper foil substrate. The method has the advantages of easy manufacture of a single panel, no need of using a high-temperature pressing method and corresponding equipment, low material cost, no limitation and the like, but the basic characteristics of the copper foil substrate manufactured by the method cannot well meet the existing requirements of the industry, and the copper foil substrate manufactured by matching a special thermoplastic polyimide film in the mainstream of the industry with the high-temperature pressing method is difficult to be looked at in terms of heat resistance, thinning, reliability, size stability and the like.
The taiwan patents TW M377823U1, TW M421878U1, TW M416963U1, TW M443362U1 disclose a composite double-sided copper foil substrate structure, which generally comprises coating polyimide varnish on a copper foil by a coating method, baking the coated copper foil, imidizing the coated copper foil to form a single-sided copper foil substrate, and then coating an adhesive agent, and then laminating a second-sided copper foil at a low temperature to form a double-sided copper foil substrate. However, the dimensional stability of the polyimide film is still different from that of the copper foil substrate made of the special thermoplastic polyimide film and the high temperature pressing method.
The invention finds that the dimensional stability of the copper foil substrate coated with the polyimide varnish is greatly influenced by the Coefficient of Thermal Expansion (CTE) of the polyimide varnish, the smaller the CTE is, the more excellent the dimensional stability is, and how to reduce the CTE of the coated polyimide varnish and not lose the combination properties of bonding force with the copper foil, mechanical strength, chemical resistance and the like becomes a bottleneck.
Disclosure of Invention
The invention mainly solves the technical problem of providing a flexible copper foil substrate with a multilayer composite structure and a preparation method thereof, wherein a part close to the copper side is coated with polyimide varnish with higher CTE, the middle part is coated with polyimide varnish with lower CTE, then the polyimide is formed into a semi-finished product by imide, and then adhesive is coated to attach a copper foil, so that the double-sided copper foil substrate with high heat resistance, high dimensional stability, high reliability, low rebound force and low cost is obtained.
In order to solve the technical problems, the invention adopts a technical scheme that: a flexible copper foil substrate with a multilayer composite structure sequentially comprises a first copper foil layer, a first polyimide resin layer, a second polyimide resin layer, a bonding layer and a second copper foil layer;
the first polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 15-40 ppm/K;
the second polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 1-20 ppm/K;
the thickness of the first polyimide resin layer is 1-13 mu m;
the thickness of the second polyimide resin layer is 8-25 mu m;
the thickness of the first copper foil layer is 7-70 mu m;
the thickness of the second copper foil layer is 7-70 mu m;
the thickness of the adhesive layer is 5 to 25 μm.
Further, the first polyimide resin layer and the first copper foil layer constitute a stacked structure having an adhesion force >0.7 kgf/cm.
Further, the polyimide varnish layer is a polyimide resin layer having an imide bond in a resin skeleton.
Further, the polyimide varnish layer is a polyimide resin layer having at least one of polyimide, polyimide imide, polyimide ester, and polybenzimidazole in a resin skeleton.
Further, the adhesive layer is a resin layer containing at least one of an epoxy resin, an acrylic resin, a urethane resin, a silicone rubber resin, a parylene resin, a bismaleimide resin, and a polyimide resin.
Further, the first copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
Further, the second copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
The invention adopts a further technical scheme for solving the technical problems that:
the preparation method of the flexible copper foil substrate with the multilayer composite structure comprises the following steps:
s1: coating the first polyimide resin layer and the second polyimide resin layer on one side of the first copper foil layer together, and drying to perform imidization to form a single-sided copper foil substrate;
s2: forming an adhesive layer on the polyimide surface of the single-sided copper clad laminate of S1 by a coating method or a transfer method so that the adhesive layer is in a semi-cured state;
s3: preparing a second copper foil layer, attaching the second copper foil layer to the adhesive layer of the finished product S2, pressing the second copper foil layer and the adhesive layer to tightly connect the second copper foil layer and the finished product S2, and then baking to completely cure the adhesive layer to obtain a double-sided copper foil substrate.
The invention has the following beneficial effects:
1. the composite copper foil substrate is prepared by coating the polyimide varnish on the copper foil, imidizing and coating the adhesive in a pressing mode, and compared with the technical scheme that the copper foil substrate is formed by adopting the thermoplastic polyimide and the copper foil in a high-temperature pressing mode, the production process does not need high-temperature pressing and corresponding equipment, so the production cost is low and the process yield is high;
2. the CTE of the first polyimide resin layer is 15-40 ppm/K; the CTE of the second polyimide resin layer is 1-20 ppm/K, a polyimide varnish layer with high CTE is coated on the part close to the copper side, and a polyimide varnish layer with low CTE is coated on the middle part, so that the heat resistance, the size stability and the reliability of the copper foil substrate are improved.
3. The rebound force of the integral structure of the invention is between 2.2g and 3.0g, and the invention has low rebound force;
4. the whole structure of the invention is repeatedly bent after etching a specified circuit, the bending times are 3888-4988 times, and the invention has better bending resistance;
5. the size stability of the whole structure of the invention reaches within ten thousand or even within three thousand, and the invention has better size stability.
Drawings
FIG. 1 is a schematic view of a composite copper foil substrate according to the present invention;
FIG. 2 is a schematic diagram of a prior art glueless substrate;
FIG. 3 is a schematic diagram of a composite substrate according to the prior art;
the parts in the drawings are marked as follows:
composite copper foil substrate 100
A first copper foil layer 101, a first polyimide layer 102, a second polyimide layer 103, an adhesive layer 104, and a second copper foil layer 105;
non-glue base material 200
A first copper foil layer 201, a special thermoplastic polyimide film 202, and a second copper foil layer 203;
composite substrate 300
A first copper foil layer 301, a polyimide layer 302, an adhesion layer 303, and a second copper foil layer 304.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Example (b): a flexible copper foil substrate having a multilayer composite structure, as shown in FIG. 1, comprises a first copper foil layer 101, a first polyimide resin layer 102, a second polyimide resin layer 103, a tie layer 104 and a second copper foil layer 105 in this order;
the first polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 15-40 ppm/K;
the second polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 1-20 ppm/K;
the thickness of the first polyimide resin layer is 1-13 mu m;
the thickness of the second polyimide resin layer is 8-25 mu m;
the thickness of the first copper foil layer is 7-70 mu m;
the thickness of the second copper foil layer is 7-70 mu m;
the thickness of the adhesive layer is 5 to 25 μm.
The first polyimide resin layer and the first copper foil layer constitute a stacked structure having an adhesion force >0.7 kgf/cm.
The polyimide varnish layer is a polyimide resin layer with an imide bond in a resin framework.
The polyimide varnish layer is a polyimide resin layer with at least one of polyimide, polyimide imide, polyimide ester and polybenzimidazole in a resin framework.
The adhesive layer is a resin layer containing at least one of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, poly-p-xylylene resin, bismaleimide resin, and polyimide resin. Preferably, the adhesive layer is a thermosetting polyimide resin layer, and the polyimide accounts for 40-95% of the adhesive layer.
The first copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
The second copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
The preparation method of the flexible copper foil substrate with the multilayer composite structure comprises the following steps:
s1: coating the first polyimide resin layer and the second polyimide resin layer on one side of the first copper foil layer together, and drying to perform imidization to form a single-sided copper foil substrate;
s2: forming an adhesive layer on the polyimide surface of the single-sided copper clad laminate of S1 by a coating method or a transfer method so that the adhesive layer is in a semi-cured state;
s3: preparing a second copper foil layer, attaching the second copper foil layer to the adhesive layer of the finished product S2, pressing the second copper foil layer and the adhesive layer to tightly connect the second copper foil layer and the finished product S2, and then baking to completely cure the adhesive layer to obtain a double-sided copper foil substrate.
Embodiments 1 to 4 are composite copper clad laminates 100 of the present invention, which have the following structures: a copper foil layer, a first polyimide layer, a second polyimide layer, an adhesion layer and a copper foil layer; comparative example 1 is a commercially available adhesive-free base material 200, as shown in fig. 2, which has the following structure: a first copper foil layer 201 (thickness of 12 μm, CTE of 18ppm/K), a special thermoplastic polyimide film 202 (thickness of 25 μm, CTE of 18ppm/K), and a second copper foil layer 203 (thickness of 12 μm, CTE of 18 ppm/K); comparative example 2 is a composite substrate 300 of the prior art, as shown in fig. 3, the structure thereof is sequentially as follows: copper foil layer 301, first polyimide layer 302, adhesion layer 303, and copper foil layer 304.
The copper foils of examples 1 to 4, comparative examples 1 and 2 were made of 1/3Oz (12 μm) Nikko electrolytic copper foil JXEFL-V2; the polyimide layer of comparative example 1 was a special thermoplastic polyimide film, which was NPI of KANEKA; the polyimide layer of comparative example 2 was a polyimide varnish layer containing imide bonds. Examples 1 to 4 and comparative example 2 each had a composition in which the adhesive layer was an adhesive resin layer mainly composed of a thermosetting polyimide resin, and the adhesive layer contained 70 weight percent of a polyimide resin, 15 weight percent of a flame retardant and 15 weight percent of an epoxy resin, based on the total weight of the respective layers.
Specific stacking structures of examples 1 to 4 and comparative example 2 are shown in table 1.
Table 1:
Figure BDA0002744358870000061
the basic performance of the inventive examples was compared to the prior art copper foil substrate as described in table 2 below:
table 2:
Figure BDA0002744358870000062
the MIT test of the present invention was performed by etching a line having a line width of 0.1mm, and shaking the line with a 12 μm dupont PI (model: KN) +15 μm epoxy adhesive coating film by 135 ° left and right using a jig having an R ═ 0.38. Other tests are detailed in the IPC-TM-650 test standard of the International electronic industry Association or the TPCA-F-002 test standard of the Taiwan Circuit Board Association, both of which are test standards and specifications of PCB and related industries, and thus are not described herein.
From the experimental results in table 2, it can be seen that the present invention has excellent mechanical properties, adhesion, flexibility, dimensional stability, reliability, and heat resistance, and compared with comparative example 1, the present invention has a similar dimensional stability grade up to within fifteen and even ten thousand, and has better bending properties, and compared with comparative example 2, the present invention has more excellent performance in dimensional stability.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.

Claims (8)

1. A flexible copper foil substrate having a multilayer composite structure, characterized in that: the laminated copper foil comprises a first copper foil layer, a first polyimide resin layer, a second polyimide resin layer, a bonding layer and a second copper foil layer in sequence;
the first polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 15-40 ppm/K;
the second polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 1-20 ppm/K;
the thickness of the first polyimide resin layer is 1-13 mu m;
the thickness of the second polyimide resin layer is 8-25 mu m;
the thickness of the first copper foil layer is 7-70 mu m;
the thickness of the second copper foil layer is 7-70 mu m;
the thickness of the adhesive layer is 5 to 25 μm.
2. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the first polyimide resin layer and the first copper foil layer constitute a stacked structure having an adhesion force >0.7 kgf/cm.
3. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the polyimide varnish layer is a polyimide resin layer with an imide bond in a resin framework.
4. The flexible copper foil substrate with a multilayer composite structure according to claim 3, characterized in that: the polyimide varnish layer is a polyimide resin layer with at least one of polyimide, polyimide imide, polyimide ester and polybenzimidazole in a resin framework.
5. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the adhesive layer is a resin layer containing at least one of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, poly-p-xylylene resin, bismaleimide resin, and polyimide resin.
6. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the first copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
7. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the second copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
8. The method for producing a flexible copper foil substrate having a multilayer composite structure according to claim 1, characterized in that: the method comprises the following steps:
s1: coating the first polyimide resin layer and the second polyimide resin layer on one side of the first copper foil layer together, and drying to perform imidization to form a single-sided copper foil substrate;
s2: forming an adhesive layer on the polyimide surface of the single-sided copper clad laminate of S1 by a coating method or a transfer method so that the adhesive layer is in a semi-cured state;
s3: preparing a second copper foil layer, attaching the second copper foil layer to the adhesive layer of the finished product S2, pressing the second copper foil layer and the adhesive layer to tightly connect the second copper foil layer and the finished product S2, and then baking to completely cure the adhesive layer to obtain a double-sided copper foil substrate.
CN202011161130.5A 2020-10-27 2020-10-27 Flexible copper foil base material with multilayer composite structure and preparation method thereof Pending CN114474895A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436467B1 (en) * 1998-06-29 2002-08-20 Sony Chemicals Corporation Flexible printed board and method of manufacturing same
CN101193495A (en) * 2006-11-30 2008-06-04 长春人造树脂厂股份有限公司 Polyimide compound soft board and its making method
CN101786354A (en) * 2009-12-24 2010-07-28 广东生益科技股份有限公司 Two-layer-process double-sided flexible copper-clad laminate (CCL) and manufacture method thereof
CN213648983U (en) * 2020-10-27 2021-07-09 昆山雅森电子材料科技有限公司 Flexible copper foil base material with multilayer composite structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684516B (en) * 2018-06-28 2020-02-11 亞洲電材股份有限公司 High-frequency composite circuit substrate and method for preparing the same
CN208675597U (en) * 2018-07-25 2019-03-29 昆山雅森电子材料科技有限公司 Has the LCP high frequency substrate of high Dk and low Df characteristic
CN110876230B (en) * 2018-09-03 2020-09-15 昆山雅森电子材料科技有限公司 Composite laminated LCP substrate and preparation method thereof
CN111559135A (en) * 2020-06-10 2020-08-21 浙江福斯特新材料研究院有限公司 Polyimide lamination, preparation method thereof and copper-clad plate comprising polyimide lamination

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436467B1 (en) * 1998-06-29 2002-08-20 Sony Chemicals Corporation Flexible printed board and method of manufacturing same
CN101193495A (en) * 2006-11-30 2008-06-04 长春人造树脂厂股份有限公司 Polyimide compound soft board and its making method
CN101786354A (en) * 2009-12-24 2010-07-28 广东生益科技股份有限公司 Two-layer-process double-sided flexible copper-clad laminate (CCL) and manufacture method thereof
CN213648983U (en) * 2020-10-27 2021-07-09 昆山雅森电子材料科技有限公司 Flexible copper foil base material with multilayer composite structure

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