CN114455539A - Method for debonding temporary bonded slide structure - Google Patents
Method for debonding temporary bonded slide structure Download PDFInfo
- Publication number
- CN114455539A CN114455539A CN202111628989.7A CN202111628989A CN114455539A CN 114455539 A CN114455539 A CN 114455539A CN 202111628989 A CN202111628989 A CN 202111628989A CN 114455539 A CN114455539 A CN 114455539A
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- China
- Prior art keywords
- debonding
- slide glass
- slide
- solution
- magnetic stirrer
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Links
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000011521 glass Substances 0.000 claims abstract description 44
- 238000003756 stirring Methods 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 17
- 238000002791 soaking Methods 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 9
- -1 polytetrafluoroethylene Polymers 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 230000008569 process Effects 0.000 description 10
- 230000009471 action Effects 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
The invention discloses a method for debonding a temporary bonded slide structure, which comprises the following steps: forming a through hole in a preset area of a wafer of a slide glass structure; the slide glass structure is placed on the supporting piece in an inverted mode, so that a contact area between the supporting piece and the slide glass structure is located in the through hole, and the contact area is smaller than the area of the through hole; and soaking the slide glass structure and the support piece in the debonding solution, and stirring the debonding solution to dissolve the temporary bonding glue between the wafer of the slide glass structure and the slide glass. The invention improves the bonding-releasing speed of the temporary bonded slide structure.
Description
Technical Field
The invention relates to the technical field of micro-nano processing, in particular to a method for debonding a slide glass structure through temporary bonding.
Background
With the development of the micro-nano processing technology field, the integration level and performance of various devices are also higher and higher, so in order to meet the miniaturization requirement of the devices, the integration level of the chip or the corresponding electronic device can be improved by stacking the wafer and the wafer or the chip and the wafer layer by layer. Generally, a device needs to be thinned, but an ultrathin wafer has the characteristics of flexibility, fragility, easiness in warping and fluctuation and the like, so that subsequent process operation is inconvenient, a device wafer needs to be bonded onto a thicker carrier glass by using a temporary bonding material, the thin wafer is supported and transferred by using the carrier glass, meanwhile, the thin wafer can be prevented from being deformed, and the carrier glass is separated from the thin wafer after the back process of the wafer is completed.
The existing bonding removal method is that a whole wafer which is bonded is directly placed in chemical medicine for soaking, because the slide glass is tightly bonded with the wafer, chemical medicine solution is difficult to permeate into the wafer, the bonding removal time is long, and the surface of the wafer which is bonded is difficult to clean due to the fact that bonding glue solid residues are usually arranged on the surface of the wafer. The current process is not suitable for some fragile and cantilever beam type ultrathin devices in the chemical soaking process, and particularly for optical devices with high cleanliness requirements, a lot of good products are lost in the step, so that the yield is reduced.
Disclosure of Invention
In view of the defects in the prior art, the invention provides a method for debonding a temporarily bonded slide structure, which comprises the following steps:
forming a through hole in a preset area of a wafer of the slide glass structure;
the slide glass structure is placed on a support piece in an inverted mode, so that a contact area between the support piece and the slide glass structure is located in the through hole, and the contact area is smaller than the area of the through hole;
and soaking the slide glass structure and the support piece in a bonding solution, stirring the bonding solution, and dissolving the temporary bonding glue between the wafer and the slide glass of the slide glass structure.
Preferably, the method of immersing the slide structure and the support in a debonding solution and agitating the debonding solution comprises:
placing a magnetic stirrer in the stirring cylinder;
covering the magnetic stirrer by using a first cleaning flower basket;
placing the slide structure and the support member on the first cleaning basket;
covering the slide structure and the support member with a second cleaning basket;
pouring the bonding solution into the stirring cylinder to soak the slide glass structure and the support piece in the bonding solution;
and placing the stirring cylinder on a magnetic stirrer, and providing a rotary driving force for the magnetic stirrer through the magnetic stirrer.
Preferably, the support member includes a support plate and a positioning column disposed on the support plate, and a radial cross-sectional area of the positioning column is smaller than an area of the through hole.
Preferably, the carrier sheet is one of a silicon substrate, a glass substrate, and an SOI substrate.
Preferably, the temperature of the debonding solution is greater than 50 ℃.
Preferably, the rotation rate of the magnetic stirrer is greater than 80 rad/s.
Preferably, the first and second cleaning baskets are made of polytetrafluoroethylene.
Preferably, the stirring cylinder is made of quartz.
Compared with the prior art, the method for debonding the temporary bonding slide glass structure provided by the invention has the advantages that the through holes are formed in the preset area of the wafer of the slide glass structure, so that the contact area between the bonding glue and the debonding solution is increased, the debonding solution can easily infiltrate the bonding glue, and the speed of dissolving the bonding glue is increased. In the process of bonding release, the supporting piece passes through the through hole on the wafer to manufacture the whole slide glass structure, so that the wafer and the slide glass are separated and then fall on the supporting piece, and the slide glass is continuously supported by the supporting piece, thereby accelerating the dissolving speed of the residual bonding glue.
In addition, the dissolution speed of the bonding glue is increased by stirring the bonding solution, and meanwhile, the bonding glue particles are prevented from being deposited on the surface of the wafer by the flowing of the bonding solution, so that the cleanliness of the surface of the wafer is improved, and the follow-up process is facilitated.
Drawings
FIG. 1 is a flow chart of a method of debonding a temporarily bonded slide structure according to an embodiment of the present invention;
fig. 2 is an operational schematic diagram of a method of debonding a temporarily bonded slide structure according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the invention shown in the drawings and described in accordance with the drawings are exemplary only, and the invention is not limited to these embodiments.
It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the scheme according to the present invention are shown in the drawings, and other details not so relevant to the present invention are omitted.
In view of the problems in the prior art in the background art, the present embodiment provides the following specific solutions.
As shown in fig. 1, the present embodiment provides a method for debonding a temporarily bonded slide structure, the debonding method including:
step S1, forming through holes in the predetermined regions of the wafer of the slide structure.
Step S2, the slide glass structure is placed on a support piece in an inverted mode, so that a contact area between the support piece and the slide glass structure is located in the through hole, and the contact area is smaller than the area of the through hole.
Step S3, soaking the slide glass structure and the supporting piece in a debonding solution, stirring the debonding solution, and dissolving the temporary bonding glue between the wafer and the slide glass of the slide glass structure.
Compared with the prior art, the method for debonding the temporary bonded slide glass structure in the embodiment forms the through hole in the preset area of the wafer of the slide glass structure, so as to increase the contact area between the bonding glue and the debonding solution, so that the debonding solution can easily infiltrate the bonding glue, and the speed of dissolving the bonding glue is increased. In the process of bonding release, the supporting piece passes through the through hole on the wafer to manufacture the whole slide glass structure, so that the wafer and the slide glass are separated and then fall on the supporting piece, and the slide glass is continuously supported by the supporting piece, thereby accelerating the dissolving speed of the residual bonding glue. Moreover, the dissolution rate of the bonding glue is increased by stirring the bonding solution, and meanwhile, the bonding glue particles are prevented from being deposited on the surface of the wafer by the flowing of the bonding solution, so that the cleanliness of the surface of the wafer is improved, and the subsequent process is facilitated.
Preferably, referring to fig. 2, in this embodiment, the method of immersing the slide structure a and the support member B in the debonding solution and stirring the debonding solution includes:
step S31, placing a magnetic stirrer 2 in the stirring cylinder 1; wherein the stirring cylinder 1 is made of quartz.
Step S32, covering the magnetic stirrer 2 with a first cleaning flower basket 3 (not shown in the figures) to cover the through holes; wherein the first cleaning flower basket 3 is made of polytetrafluoroethylene.
Step S33, placing the slide structure a and the support member B on the first cleaning flower basket 3.
Step S34, covering the slide structure a and the support member B with a second cleaning flower basket 4 (not shown in the figures with a plurality of through holes); wherein the second cleaning flower basket 4 is made of polytetrafluoroethylene.
Step S35, pouring the debonding solution (not shown in the figure) into the stirring cylinder 1, so that the slide structure a and the support B are immersed in the debonding solution; wherein the temperature of the debonding solution is greater than 50 ℃.
Step S36, placing the stirring cylinder 1 on a magnetic stirrer (not shown in the figure), and providing a rotational driving force to the magnetic stirrer 2 through the magnetic stirrer; wherein the rotation speed of the magnetic stirrer 2 is more than 80 rad/s.
Specifically, the support member B of the present embodiment includes a support plate B1 and a positioning post B2 disposed on the support plate B1. When the slide glass structure A is inverted on the support B, the positioning column B2 is positioned in the through hole a of the wafer A1. The radial cross-sectional area of the positioning column B2 is smaller than the area of the through hole a. The slide sheet A2 of the slide sheet structure A is preferably one of a silicon substrate, a glass substrate and an SOI substrate.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A method of debonding a temporarily bonded slide structure, the debonding method comprising:
forming a through hole in a preset area of a wafer of the slide glass structure;
the slide glass structure is placed on a support piece in an inverted mode, so that a contact area between the support piece and the slide glass structure is located in the through hole, and the contact area is smaller than the area of the through hole;
and soaking the slide glass structure and the support piece in a bonding solution, stirring the bonding solution, and dissolving the temporary bonding glue between the wafer and the slide glass of the slide glass structure.
2. The debonding method of claim 1, wherein immersing the slide structure and the support in a debonding solution and agitating the debonding solution comprises:
placing a magnetic stirrer in the stirring cylinder;
covering the magnetic stirrer by using a first cleaning flower basket;
placing the slide structure and the support member on the first cleaning basket;
covering the slide structure and the support member with a second cleaning basket;
pouring the bonding solution into the stirring cylinder to soak the slide glass structure and the support piece in the bonding solution;
and placing the stirring cylinder on a magnetic stirrer, and providing a rotary driving force for the magnetic stirrer through the magnetic stirrer.
3. The method of claim 1 or 2, wherein the support comprises a support plate and positioning posts disposed on the support plate, the positioning posts having a radial cross-sectional area smaller than an area of the through holes.
4. The debonding method of claim 3, wherein the carrier sheet is one of a silicon substrate, a glass substrate, and an SOI substrate.
5. The debonding method of claim 4, wherein the temperature of the debonding solution is greater than 50 ℃.
6. The method of claim 2, wherein the rotation rate of the magnetic stirrer is greater than 80 rad/s.
7. The method of debonding according to claim 6, wherein the first cleaning basket and the second cleaning basket are made of polytetrafluoroethylene.
8. The method of claim 7, wherein the stir cylinder is made of quartz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111628989.7A CN114455539A (en) | 2021-12-28 | 2021-12-28 | Method for debonding temporary bonded slide structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111628989.7A CN114455539A (en) | 2021-12-28 | 2021-12-28 | Method for debonding temporary bonded slide structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114455539A true CN114455539A (en) | 2022-05-10 |
Family
ID=81407643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111628989.7A Pending CN114455539A (en) | 2021-12-28 | 2021-12-28 | Method for debonding temporary bonded slide structure |
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| Country | Link |
|---|---|
| CN (1) | CN114455539A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104064509A (en) * | 2014-07-09 | 2014-09-24 | 浙江中纳晶微电子科技有限公司 | Temporary bonding method and separation method of wafers |
| US20150283798A1 (en) * | 2014-04-03 | 2015-10-08 | International Business Machines Corporation | Methods for operating a debonder |
| CN105552017A (en) * | 2015-12-28 | 2016-05-04 | 深圳先进技术研究院 | Slide structure used for temporary bonding, and bonding and de-bonding method |
| CN106847718A (en) * | 2017-03-28 | 2017-06-13 | 深圳市化讯半导体材料有限公司 | A kind of interim bonding of device wafers with tear bonding technology open |
| CN111244015A (en) * | 2020-01-20 | 2020-06-05 | 杭州立昂东芯微电子有限公司 | Wafer de-bonding auxiliary carrying disc, de-bonding machine and de-bonding method |
| CN112289734A (en) * | 2020-11-25 | 2021-01-29 | 绍兴同芯成集成电路有限公司 | Process for dissociating glass carrier plate by organic solvent infiltration debonding bonding ultrathin wafer |
-
2021
- 2021-12-28 CN CN202111628989.7A patent/CN114455539A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150283798A1 (en) * | 2014-04-03 | 2015-10-08 | International Business Machines Corporation | Methods for operating a debonder |
| CN104064509A (en) * | 2014-07-09 | 2014-09-24 | 浙江中纳晶微电子科技有限公司 | Temporary bonding method and separation method of wafers |
| CN105552017A (en) * | 2015-12-28 | 2016-05-04 | 深圳先进技术研究院 | Slide structure used for temporary bonding, and bonding and de-bonding method |
| CN106847718A (en) * | 2017-03-28 | 2017-06-13 | 深圳市化讯半导体材料有限公司 | A kind of interim bonding of device wafers with tear bonding technology open |
| CN111244015A (en) * | 2020-01-20 | 2020-06-05 | 杭州立昂东芯微电子有限公司 | Wafer de-bonding auxiliary carrying disc, de-bonding machine and de-bonding method |
| CN112289734A (en) * | 2020-11-25 | 2021-01-29 | 绍兴同芯成集成电路有限公司 | Process for dissociating glass carrier plate by organic solvent infiltration debonding bonding ultrathin wafer |
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