CN114440396A - Control method of semiconductor dehumidifier and semiconductor dehumidifier - Google Patents
Control method of semiconductor dehumidifier and semiconductor dehumidifier Download PDFInfo
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- CN114440396A CN114440396A CN202210272857.3A CN202210272857A CN114440396A CN 114440396 A CN114440396 A CN 114440396A CN 202210272857 A CN202210272857 A CN 202210272857A CN 114440396 A CN114440396 A CN 114440396A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/30—Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
- F24F11/32—Responding to malfunctions or emergencies
- F24F11/38—Failure diagnosis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/65—Electronic processing for selecting an operating mode
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
- F24F11/72—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure
- F24F11/74—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling air flow rate or air velocity
- F24F11/77—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling air flow rate or air velocity by controlling the speed of ventilators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/10—Temperature
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/20—Humidity
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Abstract
The invention belongs to the technical field of semiconductor dehumidification, and particularly relates to a control method of a semiconductor dehumidifier and the semiconductor dehumidifier, wherein the control method of the semiconductor dehumidifier comprises the following steps: and adjusting the operating voltage of the semiconductor refrigerating sheet and the rotating speed of the cooling fan according to the indoor environment temperature and the indoor environment humidity. The invention can adjust the working voltage of the semiconductor refrigeration sheet and the rotating speed of the cooling fan according to the environmental temperature and the environmental humidity, and carry out double closed-loop control, thereby leading the system to run more efficiently.
Description
Technical Field
The invention belongs to the field of semiconductor dehumidification, and particularly relates to a control method of a semiconductor dehumidifier and the semiconductor dehumidifier.
Background
The semiconductor dehumidification technology is a technology for condensing and dehumidifying by using a refrigeration aluminum sheet and utilizing a thermoelectric refrigeration effect (Peltier effect). The control mode of the semiconductor dehumidifier in the current market is simple, and the working mode can not be adjusted to achieve the optimal running state or even the problem of incapability of working according to different environmental conditions.
The present invention has been made in view of this situation.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the defects of the prior art, and provide a control method of a semiconductor dehumidifier, which is characterized by comprising the following steps:
and in the operation process of the dehumidifier, the operation voltage of the semiconductor refrigerating sheet and the rotating speed of the cooling fan are adjusted according to the indoor environment temperature and the indoor environment humidity.
Further optionally, adjusting the operating voltage of the semiconductor chilling plate and the rotating speed of the cooling fan according to the indoor environment temperature and the indoor environment humidity comprises
Adjusting the operating voltage of the semiconductor refrigerating sheet according to the indoor environment temperature;
and adjusting the rotating speed of the cooling fan according to the indoor environment humidity.
Further optionally, the adjusting the operating voltage of the semiconductor chilling plate according to the obtained indoor environment temperature comprises
Obtaining indoor ambient temperature TRing (C)；
Comparing indoor ambient temperature TRing (C)The magnitude of the first set temperature T1 and the second set temperature T2;
when the following conditions are satisfied: t isRing (C)When the voltage is more than T1, the semiconductor chilling plate is controlled to operate at the voltage of U1;
when the following conditions are satisfied: t1 ≤ TRing (C)When the voltage is less than or equal to T2, the semiconductor chilling plate is controlled to operate at the voltage of U2;
when the following conditions are satisfied: t isRing (C)When the voltage is less than T2, the semiconductor chilling plate is controlled to operate at the voltage of U3;
wherein: u1 > U2 > U3.
Further optionally, adjusting the rotation speed of the cooling fan according to the humidity of the indoor environment comprises
Obtaining indoor environment humidity HRing (C)；
Comparing indoor ambient humidity HRing (C)The set humidity H1;
when the following conditions are satisfied: hRing (C)When the speed is higher than H1, the cooling fan is controlled to operate at the rotating speed of n 1;
when the following conditions are satisfied: hRing (C)When the speed is less than or equal to H1, controlling the cooling fan to operate at the speed of n 2;
wherein: n1 > n 2.
Further optionally, the control method further includes:
determining cold side heat sink temperature TCold；
Obtaining indoor ambient temperature TRing(s)Humidity H of indoor environmentRing (C)According to the indoor ambient temperature TRing (C)Humidity H of indoor environmentRing (C)Determination of the condensation temperature point TDot；
Comparing cold side heat sink temperature TCooling by coolingAnd condensation temperature point TDotAnd adjusting the operating voltage of the semiconductor refrigerating sheet and the rotating speed of the cooling fan according to the comparison result.
Further optionally, the comparing cold side heat sink temperature TColdAnd condensation temperature point TDotAccording to the comparison result, adjusting the operating voltage U of the semiconductor chilling plate and the rotating speed n of the cooling fan comprises
Judging whether the following conditions are met: t isCold＞TDotIf yes, increasing the operation voltage U of the semiconductor chilling plate and reducing the rotating speed n of the cooling fan; if not, judging whether the following conditions are met: t isColdIf the voltage is less than 0, the operating voltage U of the semiconductor chilling plate is reduced and the rotating speed n of the cooling fan is increased.
Further optionally, when the cold side heat sink temperature satisfies TColdWhen the current time is less than 0, the control method further comprises the following steps: and controlling the semiconductor refrigerating sheet to circularly operate in a mode of long X time and long Y time.
Further optionally, the control method further comprises
Determining cold side heat sink temperature TCold；
Calculating the temperature change rate K of the cold-end radiator;
according to the rate of change of temperatureK. And cold side heat sink temperature TColdTo determine if the dehumidification system is in a fault condition; if the dehumidification system is in a fault state, recording the fault times Z, and judging whether the fault times Z are greater than the set fault times ZIs provided with(ii) a If yes, controlling the produced cooling system to stop; if not: and controlling the dehumidification system to enter a fault protection mode.
Further optionally, the rate of change according to temperature K, and cold end heat sink temperature TColdTo determine if the dehumidification system is in a failure state, including
Judging whether the temperature change rate K meets the following conditions: k is greater than or equal to a set change rate KIs provided withIf yes, judging that the dehumidification system is in a fault state; if not, judging the temperature T of the cold-end radiatorColdWhether or not: t isColdNot less than the set temperature TIs provided withAnd if so, judging that the dehumidification system is in a fault state.
Further optionally, the failsafe mode comprises: controlling the semiconductor refrigerating sheet to stop working for X1 time, judging whether the dehumidification system is in a fault state again, if the system is still in the fault state, recording the fault times Z, and determining whether to continue operating the fault protection mode according to the fault times Z; and if the system fault state is relieved, resetting the fault frequency and then operating according to the set mode of the dehumidification system.
Further optionally, the cold side heat sink temperature TColdThe determination of (1) comprises:
obtaining the operating voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor temperature TRing (C)And indoor humidity HRing (C)；
According to the pre-stored operating voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor temperature T in the dehumidifierRing (C)And indoor humidity HRing (C)Established cold side heat sink temperature TColdAnd TRing (C)、HRing (C)Functional relationship T of U and nCold＝f(TRing (C)，HRing (C)U, n) to calculate the current operating voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor environment temperature TRing (C)And indoor temperature and humidity HRing (C)Temperature T of cold-end radiator of lower semiconductor refrigeration sheetCold。
Further optionally, cold side heat sink temperature TColdOperating voltage U of semiconductor refrigerating sheet, rotating speed n of cooling fan and indoor temperature TRing (C)And indoor humidity HRing (C)The functional relationship of (A) is as follows:
wherein k is1、k2、k3、k4And k5 is a scaling factor.
Further optionally, the cold side heat sink temperature TColdThe determination of (1) comprises: by obtaining a temperature value detected by a temperature sensor disposed at the cold side heat sink.
The second object of the present invention also proposes a control device comprising one or more processors and a non-transitory computer-readable storage medium storing program instructions, the one or more processors being configured to implement the method of any one of the above when the program instructions are executed by the one or more processors.
The third object of the present invention is to provide a semiconductor dehumidifier, which adopts any one of the above methods, or includes the above control device.
After adopting the technical scheme, compared with the prior art, the invention has the following beneficial effects:
1) the control method can be used for fast condensation at high ambient temperature; the frosting can be effectively prevented at low ambient temperature;
2) the control method of the invention can condense more humid air under high ambient humidity; can be effectively condensed under low ambient humidity;
3) the control method of the invention not only identifies and controls the abnormal operation of the external conditions, but also can detect the fault of the system and rapidly carry out protection control.
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention, are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without limiting the invention to the right. It is obvious that the drawings in the following description are only some embodiments, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1: the structure diagram of the semiconductor dehumidifier of the embodiment of the invention;
FIG. 2: the working voltage of the semiconductor refrigerating sheet and the rotating speed control logic diagram of the cooling fan are adjusted.
FIG. 3: the invention relates to a fault detection logic diagram of a dehumidifier.
Wherein: 1-cold-end heat sink; 2-semiconductor refrigerating sheet; 3-hot end radiator; 4-a heat radiation fan.
It should be noted that the drawings and the description are not intended to limit the scope of the inventive concept in any way, but to illustrate it by a person skilled in the art with reference to specific embodiments.
Detailed Description
In the description of the present invention, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "contacting," and "communicating" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In order to solve the problem that the existing semiconductor dehumidifier has insufficient dehumidification capacity under different environmental temperatures and environmental humidities, the embodiment provides a control method of the semiconductor dehumidifier, and the control method of the embodiment comprises the following steps: and S1, adjusting the operation voltage of the semiconductor chilling plate 2 and the rotating speed of the cooling fan 4 according to the indoor environment temperature and the indoor environment humidity in the dehumidifier operation process.
The semiconductor dehumidifier of the present embodiment has a structure as shown in fig. 1, and the dehumidifier includes: cold junction radiator 1, semiconductor refrigeration piece 2, hot junction radiator 3, cooling fan 4, wherein, each environmental parameter and system temperature parameter carry out discernment record through the sensor, including ambient temperature, ambient humidity, cold junction radiator 1 temperature. When the dehumidifier of the embodiment is started, the dehumidifier operates according to a mode set by a user, and then the working voltage of the semiconductor refrigeration sheet 2 and the rotating speed of the cooling fan 4 are adjusted according to the ambient temperature and the ambient humidity to perform double closed-loop control, so that the system operates more efficiently.
Further optionally, the step S1 includes steps S11 to S12, wherein:
s11, adjusting the operating voltage of the semiconductor refrigeration piece according to the indoor environment temperature;
and S12, after the operation voltage of the semiconductor refrigerating sheet is adjusted, adjusting the rotating speed of the cooling fan according to the indoor environment humidity.
The voltage of the refrigeration system and the rotating speed of the cooling fan are adjusted according to the ambient temperature and the ambient humidity, so that the dehumidification system always works in the most efficient dehumidification state, and the energy consumption is lowest. The control method takes the temperature and the humidity as input quantities respectively to form two closed-loop controls, namely a temperature-voltage closed loop and a humidity-rotating speed closed loop. In addition, in the embodiment, the working voltage is adjusted according to the environment temperature, and then the rotating speed of the cooling fan is adjusted according to the environment humidity, so that the rapid condensation at high environment temperature is ensured; can effectively prevent frosting under low ambient temperature to and can condense more humid air under high ambient humidity, can effectively condense under low ambient humidity.
Further optionally, step S11 includes S111 to S112, where:
s111, acquiring indoor environment temperature TRing (C)；
S112, comparing the indoor environment temperature TRing (C)The magnitude of the first set temperature T1 and the second set temperature T2; when the following conditions are satisfied: t isRing (C)When the voltage is more than T1, the semiconductor chilling plate is controlled to operate at the voltage of U1; when the following conditions are satisfied: t1 ≤ TRing (C)When the voltage is less than or equal to T2, the semiconductor chilling plate is controlled to operate at the voltage of U2; when the following conditions are met: t is a unit ofRing (C)When the voltage is less than T2, the semiconductor chilling plate is controlled to operate at the voltage of U3; wherein: u1 > U2 > U3.
As shown in the control flow chart of FIG. 2, after the dehumidifier is operated, the system identifies the ambient temperature T through the temperature sensorRing (C)And carrying out intelligent operation: when T isRing(s)When the voltage is more than T1, the semiconductor chilling plate operates at the voltage of U1, so that the system can efficiently dehumidify, and the voltage of U1 can be selected as the maximum working voltage of the semiconductor chilling plate; when T isRing (C)When the voltage is less than T2, the semiconductor chilling plate operates at the voltage of U3 to prevent the system from frosting at low temperature, and the voltage of U3 can be selected as the lowest working voltage of the semiconductor chilling plate; when T is not less than T1 and not more than T2, the semiconductor chilling plate operates at the voltage of U2, so that the system works in the optimal state, energy consumption is reduced, and the voltage of U2 can be selected as the rated voltage of the semiconductor chilling plate. T1 and T2 are preset ambient temperature values, are optimal temperature control values calculated by combining the conditions of the semiconductor dehumidifier and a large amount of experimental data, and T2 is less than T1. U1, U2 and U3 are preset voltage values and are optimal voltage control values calculated by combining performance-voltage curves of the semiconductor chilling plates, and U3 is more than U2 and more than U1.
Further optionally, step S12 includes S121 to S122, where:
s121, acquiring indoor environment humidity HRing (C)；
S122, comparing the indoor environment humidity HRing (C)The set humidity H1; when the following conditions are satisfied: hRing(s)When the speed is more than H1, the cooling fan is controlled to operate at n1 rotation speed; when the following conditions are met: hRing(s)When the speed is less than or equal to H1, controlling the cooling fan to operate at the speed of n 2; wherein: n1 > n 2.
After the working voltage of the semiconductor refrigerating sheet is intelligently adjusted, as shown in figure 2, the system identifies the ambient temperature H through the humidity sensorRing (C)And carrying out intelligent operation: when H is presentRing (C)When the speed is higher than H1, the cooling fan operates at high speed n 1; when H is presentRing (C)When the speed is less than or equal to H1, the system runs at a low speed n2 so as to be capable of efficiently dehumidifying. H1 is a preset environment humidity value, n1 and n2 are preset rotating speed values of the cooling fan, and an optimal control value is calculated by combining the condition of the refrigeration system, the performance condition of the cooling fan and a large amount of experimental data, wherein n2 is less than n 1.
Further optionally, the control method of this embodiment further includes step S2, where:
s2, the dehumidifier operates according to the temperature T of the cold end radiatorColdAnd condensation temperature point TDotThe operation voltage of the semiconductor refrigerating sheet and the rotating speed of the cooling fan are adjusted.
This embodiment is through comparing cold junction temperature and condensing temperature, and the control complete machine mode of operation is discerned, prevents to get into freezing frosting and invalid dehumidification state, reduces the complete machine energy consumption.
Further optionally, step S2 includes S21 to S23, wherein:
s21, determining the temperature T of the cold end radiatorCold(ii) a Cold side radiator temperature TColdThere are two embodiments of the determination of (a), the first embodiment is: by obtaining the operating voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor temperature TRing (C)And indoor humidity HRing (C)(ii) a Then according to the pre-stored running voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor temperature T in the dehumidifier systemRing (C)And indoor humidity HRing (C)Established cold side heat sink temperature TColdAnd TRing (C)、HRing (C)Functional relationship T of U and nDot＝f(TRing (C)，HRing (C)U, n) to calculate the current operating voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor environment temperature TRing (C)And indoor temperature and humidity HRing (C)Temperature T of cold-end radiator of lower semiconductor refrigeration sheetCold. The other implementation mode is as follows: detecting by acquiring a temperature sensor disposed at a cold end heat sinkThe measured temperature value.
S22, obtaining the indoor environment temperature TRing (C)Humidity H of indoor environmentRing (C)According to the indoor ambient temperature TRing (C)Humidity H of indoor environmentRing (C)Determination of the condensation temperature point TDot(ii) a The system stores indoor ambient temperature TRing (C)Indoor environment humidity HRing (C)And a condensation temperature point TDotThe condensation temperature point T under the current temperature and humidity can be determined according to the mapping relation tableDot。
S23, comparing the temperature T of the cold end radiatorColdAnd condensation temperature point TDotAnd adjusting the operating voltage of the semiconductor refrigerating sheet and the rotating speed of the cooling fan according to the comparison result. The method specifically comprises the following steps: judging whether the following conditions are met: t isCold＞TDotIf yes, increasing the operation voltage U of the semiconductor chilling plate and reducing the rotating speed n of the cooling fan; if not, judging whether the following conditions are met: t is a unit ofColdIf the voltage is less than 0, the operating voltage U of the semiconductor chilling plate is reduced and the rotating speed n of the cooling fan is increased.
Referring to the control flow chart shown in fig. 2, the present embodiment is based on the operating state parameters (voltage U and rotation speed n) of the semiconductor dehumidifier and the ambient temperature and humidity parameters (temperature T)Ring (C)And temperature HRing(s)) Establishing a cold end temperature TColdOf a mathematical model, i.e. TColdAnd TRing (C)、HRing (C)Functional relationship T of U and nCold＝f(TRing (C)，HRing (C)U, n). The system identifies the ambient temperature T by a temperature sensorRing (C)And the ambient humidity HRing (C)And reading the operating parameters (voltage U and speed n) to derive the cold end temperature TCold. In one embodiment, TColdAnd TRing (C)、HRing (C)The functional relationship of U and n is:
wherein k is1、k2、k3、k4And k5 is a proportionality coefficient, and the specific value is determined according to the configuration (refrigeration chip selection, etc.) and the dehumidification amount of the whole machine.
Cold endTemperature TColdThe temperature sensor arranged on the side of the cold-end radiator can be directly adopted to directly acquire the cold-end temperature TCold. The cold end temperature T is preferably obtained as a functionColdAnd a sensor is not required to be arranged on the cold end radiator side, so that the cost of the dehumidifier is reduced. Meanwhile, the condensing temperature point T can be determined according to indoor temperature and humidity conditionsDotThen the current cold end temperature TColdAnd condensation temperature point TDotAnd (3) comparison: 1) when T isCooling by cooling＞TDotWhen the load is too large, the problem of incapability of dehumidification is avoided by increasing the operating voltage U of the semiconductor chilling plate and reducing the rotating speed n of the cooling fan, and in one embodiment, when T is greater than the set valueCooling by cooling＞TDotIn the process, the semiconductor refrigerating sheet operates at the maximum voltage U1 and the cooling fan operates at the low rotating speed n2, so that the phenomenon that the load is too large and the dehumidification effect is poor is prevented; 2) if TCold≤TDotWhen T is equal toColdWhen the voltage is less than 0, the load is too small, the frosting problem of the refrigerating sheet is avoided by reducing the operation voltage U of the semiconductor refrigerating sheet and increasing the rotating speed n of the cooling fan, and in one embodiment, when T is less than 0Cold≤TDotAnd T isColdWhen the temperature is less than 0, the semiconductor refrigerating sheet is controlled to operate at the lowest voltage U3 and the cooling fan operates at the high rotating speed n1, so that the phenomenon that the load is too small and the cold end frosts is prevented, and meanwhile, the semiconductor refrigerating sheet operates circularly in a mode of stopping operation for Y minutes within X hours (the cooling fan operates normally) so as to solve the problem of cold end frosting. X, Y the specific value depends on the configuration of the whole machine and the dehumidifying amount, for example, 300mL dehumidifying system X is 2 hours, Y is 10 minutes. 3) If TCold≤TDotWhen T is equal toCooling by coolingAnd when the current running state of the dehumidifier is more than or equal to 0, maintaining the current running state of the dehumidifier.
This embodiment compares the cold side heat sink temperature TColdAnd condensation temperature point TDotThe priority of the mode of adjusting the operating voltage and the rotating speed of the fan is higher than that of the mode of adjusting the operating voltage and the rotating speed of the fan according to the indoor environment temperature and the indoor environment humidity, so that the semiconductor dehumidifier is prevented from being in abnormal operation. The two modes have different judgment bases during adjustment, and the adjustment is carried out according to the indoor environment temperature and the indoor environment humidity during normal operationAlways compare the cold end radiator temperature Tcold with the condensation temperature point TDotIs adjusted.
Further optionally, the embodiment further provides a double fault detection and control method based on the cold end problem, which can quickly determine whether the system is in a fault state and perform effective control to prevent safety accidents. The control method further comprises steps P1-P3, wherein:
p1, determining cold side radiator temperature TCold. Calculating the temperature change rate K of the cold-end radiator; cold side radiator temperature TColdThere are two embodiments of the determination of (a), the first embodiment being: by obtaining the operating voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor temperature TRing (C)And indoor humidity HRing (C)(ii) a Then according to the pre-stored running voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor temperature T in the dehumidifier systemRing (C)And indoor humidity HRing (C)Established cold side heat sink temperature TColdAnd TRing (C)、HRing (C)Functional relationship T of U and nDot＝f(TRing (C)，HRing (C)U, n) to calculate the current operating voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor environment temperature TRing (C)And indoor temperature and humidity HRing(s)Temperature T of cold-end radiator of lower semiconductor refrigeration sheetCold. The other implementation mode is as follows: by obtaining a temperature value detected by a temperature sensor disposed at the cold end heat sink. The temperature change rate K is a temperature change in unit time, the unit time can be adjusted as required, and the unit time can be 1min or 30S optionally, in a specific embodiment, the temperature change rate K is a change rate of the cold end temperature tcool in 1 min.
P2 according to rate of change of temperature K and cold end heat sink temperature TColdTo determine if the dehumidification system is in a fault condition; the method specifically comprises the following steps: judging whether the temperature change rate K meets the following conditions: k is greater than or equal to a set change rate KIs provided withIf yes, judging that the dehumidification system is in a fault state; if not, judging the temperature T of the cold-end radiatorColdWhether or not: t isColdNot less than the set temperature TIs provided withIf yes, judgingThe dehumidification system is in a fault state. If the two judgment conditions are not met, the system is not in the fault state or the fault state is relieved.
P3, if the dehumidification system is in fault state, recording the fault times Z, and judging whether the fault times Z is larger than the set fault times ZIs provided with(ii) a If yes, controlling the produced cooling system to stop; if not: and controlling the dehumidification system to enter a fault protection mode. Controlling the semiconductor refrigeration piece to stop working for X1 time in the fault protection mode, judging whether the dehumidification system is in the fault state again, if the system is still in the fault state, recording the fault times Z, and determining whether to continue operating the fault protection mode according to the fault times Z; and if the system fault state is relieved, resetting the fault times and then recovering the set operation mode of the dehumidification system.
Because the semiconductor dehumidifier has special use environment and is in an unattended state for a long time, when the whole dehumidifier breaks down, the whole dehumidifier needs to be quickly identified and correspondingly protected so as to prevent water safety accidents. When the whole machine has a fault, if the air inlet and the air outlet are blocked, the cooling fan stops running due to a fault or the rotating speed is reduced to a lower rotating speed for running, and the like, the temperature of the cold end is increased. The cold end temperature is different under different environmental humiture; the cold end temperature difference of different fault types is large, and if the cold end temperature is higher than a certain set value for protection, the whole machine can be subjected to error protection or cannot be protected in time; therefore, according to the change characteristics of the cold end temperature when the complete machine fails, the fault protection mode is added, namely the change rate K of the cold end temperature is greater than the set value KIs provided withAnd if so, judging that the system has a fault and entering a fault protection mode.
As shown in the control flow diagram of FIG. 3, the system identifies the cold end temperature T via the cold end temperature sensorColdWhen the temperature of the cold end is T within a unit timeColdThe change rate K is more than or equal to KIs provided withJudging system faults and entering a protection mode; when K is less than KIs provided withAnd TCold≥TIs provided withAnd judging the system fault and entering a protection mode. After the system enters a fault protection mode, the semiconductor refrigerating sheet stops working for X1 minutes (a cooling fan)Continuous operation), recovering the work of the semiconductor refrigerating sheet after the time is up, detecting the fault, continuing the protection mode if the semiconductor refrigerating sheet is still in the fault state, and when the fault times Z are continuously detected to be more than ZIs provided withAnd then, the whole machine stops running and can be started again after being electrified again, and if the fault is relieved, the whole machine runs according to a set mode and clears the fault times. T isIs provided with、KIs provided withX1 and ZIs provided withThe specific value is determined according to the configuration (semiconductor refrigeration piece selection, etc.) and the dehumidification amount of the whole machine, for example, the T of a 300mL dehumidification system (adopting 03 semiconductor refrigeration pieces) is set to be 40 ℃, K is set to be 1.5 ℃/min, X1 is 35min, and Z is set to be 6 times.
The present embodiments also provide a control apparatus comprising one or more processors and a non-transitory computer-readable storage medium storing program instructions, the one or more processors being configured to implement the above-described method when the program instructions are executed by the one or more processors.
The embodiment also provides a semiconductor dehumidifier which adopts the method or comprises the control device.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (15)
1. A control method of a semiconductor dehumidifier is characterized by comprising the following steps:
and in the operation process of the dehumidifier, the operation voltage of the semiconductor refrigerating sheet and the rotating speed of the cooling fan are adjusted according to the indoor environment temperature and the indoor environment humidity.
2. The method as claimed in claim 1, wherein the adjusting of the operating voltage of the semiconductor cooling fin and the rotational speed of the cooling fan according to the ambient temperature and the ambient humidity comprises
Adjusting the operating voltage of the semiconductor refrigerating sheet according to the indoor environment temperature;
and adjusting the rotating speed of the cooling fan according to the indoor environment humidity.
3. The method as claimed in claim 2, wherein the step of adjusting the operating voltage of the semiconductor chilling plates according to the obtained indoor environment temperature comprises
Obtaining indoor ambient temperature TRing(s)；
Comparing indoor ambient temperature TRing (C)The magnitude of the first set temperature T1 and the second set temperature T2;
when the following conditions are satisfied: t is a unit ofRing(s)When the voltage is more than T1, the semiconductor chilling plate is controlled to operate at the voltage of U1;
when the following conditions are satisfied: t1 ≤ TRing (C)When the voltage is less than or equal to T2, the semiconductor chilling plate is controlled to operate at the voltage of U2;
when the following conditions are satisfied: t isRing (C)When the voltage is less than T2, the semiconductor chilling plate is controlled to operate at the voltage of U3;
wherein: u1 > U2 > U3.
4. The method as claimed in claim 2, wherein the adjusting the rotation speed of the heat dissipation fan according to the humidity of the indoor environment comprises
Obtaining indoor environment humidity HRing (C)；
Comparing indoor ambient humidity HRing (C)The set humidity H1;
when the following conditions are satisfied: hRing (C)When the speed is higher than H1, the cooling fan is controlled to operate at the rotating speed of n 1;
when the following conditions are satisfied: hRing (C)When the speed is less than or equal to H1, controlling the cooling fan to operate at the speed of n 2;
wherein: n1 > n 2.
5. The method as claimed in claim 1, further comprising:
determining cold side heat sink temperature TCold；
Obtaining indoor ambient temperature TRing (C)Humidity H of indoor environmentRing (C)According to the indoor ambient temperature TRing (C)Humidity H of indoor environmentRing (C)Determination of the condensation temperature point TDot；
Comparing cold side heat sink temperature TCooling by coolingAnd condensation temperature point TDotAnd adjusting the operating voltage of the semiconductor refrigerating sheet and the rotating speed of the cooling fan according to the comparison result.
6. The method of claim 5, wherein said comparing cold side heat sink temperature T is performed by comparing cold side heat sink temperature TColdAnd condensation temperature point TDotAccording to the comparison result, adjusting the operating voltage U of the semiconductor chilling plate and the rotating speed n of the cooling fan comprises
Judging whether the following conditions are met: t isCold＞TDotIf yes, increasing the operation voltage U of the semiconductor refrigerating sheet and reducing the rotating speed n of the cooling fan; if not, judging whether the following conditions are met: t isColdIf the output voltage is less than 0, the operation voltage U of the semiconductor chilling plate is reduced and the rotating speed n of the cooling fan is increased.
7. The method of claim 5, wherein when the cold side heat sink temperature satisfies TColdWhen < 0, the control method further includes: and controlling the semiconductor refrigerating sheet to circularly operate in a mode of long X time and long Y time.
8. The method as claimed in claim 5, further comprising controlling the semiconductor dehumidifier
Determining cold side heat sink temperature TCold；
Calculating the temperature change rate K of the cold-end radiator;
according to the temperature change rate K and the temperature T of the cold end radiatorColdTo determine if the dehumidification system is in a fault condition; if the dehumidification system is in a fault state, recording the fault times Z, and judging whether the fault times Z are larger than the set fault times ZIs provided with(ii) a If yes, controlling the produced cooling system to stop; if not: and controlling the dehumidification system to enter a fault protection mode.
9. The method as claimed in claim 8, wherein the temperature variation rate K is dependent on the temperature variation rate T, and the cold end heat sink temperature TColdTo determine if the dehumidification system is in a failure state, including
Judging whether the temperature change rate K meets the following conditions: k is greater than or equal to a set change rate KIs provided withIf yes, judging that the dehumidification system is in a fault state; if not, judging the temperature T of the cold-end radiatorColdWhether or not: t isCooling by coolingNot less than the set temperature TIs provided withAnd if so, judging that the dehumidification system is in a fault state.
10. The method as claimed in claim 9, wherein the fail-safe mode comprises: controlling the semiconductor chilling plates to stop working for X1 time, judging whether the dehumidification system is in a fault state again, if the system is still in the fault state, recording the fault times Z, and determining whether to continue to operate the fault protection mode according to the fault times Z; and if the system fault state is relieved, resetting the fault frequency and then operating according to the set mode of the dehumidification system.
11. The method as claimed in claim 5 or 8, wherein the cold side heat sink temperature T is lower than the cold side heat sink temperature TColdThe determination of (1) comprises:
obtaining the operating voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor temperature TRing (C)And indoor humidity HRing (C)；
According to pre-stored in dehumidifierOperating voltage U of semiconductor refrigerating sheet, rotating speed n of cooling fan and indoor temperature TRing (C)And indoor humidity HRing (C)Established cold side heat sink temperature TColdAnd TRing (C)、HRing (C)Functional relationship T of U and nCold＝f(TRing (C)，HRing (C)U, n) to calculate the current operating voltage U of the semiconductor refrigerating sheet, the rotating speed n of the cooling fan and the indoor environment temperature TRing(s)And indoor temperature and humidity HRing(s)Temperature T of cold-end radiator of lower semiconductor refrigeration sheetCold。
12. The method as claimed in claim 11, wherein the step of controlling the semiconductor dehumidifier,
cold side radiator temperature TColdOperating voltage U of semiconductor refrigerating sheet, rotating speed n of cooling fan and indoor temperature TRing (C)And indoor humidity HRing (C)The functional relationship of (1) is:
wherein k is1、k2、k3、k4And k5 is a scaling factor.
13. The method as claimed in claim 5 or 8, wherein the cold side heat sink temperature T is lower than the cold side heat sink temperature TColdThe determination of (1) comprises: by obtaining a temperature value detected by a temperature sensor disposed at the cold end heat sink.
14. A control apparatus, comprising one or more processors and a non-transitory computer-readable storage medium having program instructions stored thereon, the one or more processors being configured to implement the method of any one of claims 1-13 when the program instructions are executed by the one or more processors.
15. A semiconductor dehumidifier characterised by the use of a method as claimed in any one of claims 1 to 13 or comprising a control means as claimed in claim 14.
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| CN114440396B (en) | 2023-04-11 |
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