CN114437885A - 芯片塑封料溢料软化剂 - Google Patents
芯片塑封料溢料软化剂 Download PDFInfo
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- 239000004033 plastic Substances 0.000 title claims abstract description 22
- 229920003023 plastic Polymers 0.000 title claims abstract description 22
- 239000000463 material Substances 0.000 title claims abstract description 14
- 239000004902 Softening Agent Substances 0.000 title abstract description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 64
- -1 alcohol amine Chemical class 0.000 claims abstract description 24
- 239000002904 solvent Substances 0.000 claims abstract description 20
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 150000001408 amides Chemical class 0.000 claims abstract description 12
- 150000001412 amines Chemical class 0.000 claims abstract description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims abstract description 12
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims abstract description 11
- 239000004698 Polyethylene Substances 0.000 claims abstract description 9
- 229920000573 polyethylene Polymers 0.000 claims abstract description 9
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims description 34
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 20
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical group CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 7
- OTYYBJNSLLBAGE-UHFFFAOYSA-N CN1C(CCC1)=O.[N] Chemical compound CN1C(CCC1)=O.[N] OTYYBJNSLLBAGE-UHFFFAOYSA-N 0.000 claims description 6
- 229960002887 deanol Drugs 0.000 claims description 6
- 239000012972 dimethylethanolamine Substances 0.000 claims description 6
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 5
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 5
- 238000002791 soaking Methods 0.000 claims description 5
- 150000007530 organic bases Chemical class 0.000 claims description 4
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 3
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 claims description 3
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 claims description 3
- 229940043276 diisopropanolamine Drugs 0.000 claims description 3
- 229940102253 isopropanolamine Drugs 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 claims 3
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 claims 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 abstract description 29
- 229920000647 polyepoxide Polymers 0.000 abstract description 29
- 239000003513 alkali Substances 0.000 abstract 1
- 239000001993 wax Substances 0.000 description 28
- 235000019441 ethanol Nutrition 0.000 description 20
- 230000000694 effects Effects 0.000 description 15
- 229940031098 ethanolamine Drugs 0.000 description 9
- 229940043237 diethanolamine Drugs 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000011259 mixed solution Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 150000007529 inorganic bases Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 229960004418 trolamine Drugs 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229940069428 antacid Drugs 0.000 description 1
- 239000003159 antacid agent Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000005826 halohydrocarbons Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012621 metal-organic framework Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000575 pesticide Substances 0.000 description 1
- XIPFMBOWZXULIA-UHFFFAOYSA-N pivalamide Chemical compound CC(C)(C)C(N)=O XIPFMBOWZXULIA-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/001—Softening compositions
- C11D3/0015—Softening compositions liquid
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- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
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- C11D7/266—Esters or carbonates
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- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
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Abstract
本发明公开了一种芯片塑封料溢料软化剂，主要成分包含：醇胺类有机碱、酰胺类和氮甲基吡咯烷酮类溶剂、醇胺醚类溶纤剂、二元醇醚醋酸酯类除蜡剂。本发明有在低温条件下对环氧树脂溢料有良好软化去除作用，同时在60℃±10℃低温条件下还能将溢出的环氧树脂塑封料中的巴蜡或聚乙烯蜡溶解的双重功能。
Description
技术领域
本发明涉及一种塑封料溢料的处理技术。
背景技术
芯片塑封料通常以环氧树脂为主要成分。现有的芯片塑封料的化学软化都是100℃以上的高温工艺，由于工作温度高，对封装的塑封材料及封装的芯片产品的性能都会有很大的不利影响。然而，环氧树脂塑封料的助溶剂巴蜡和聚乙烯蜡的软化温度很高，巴蜡软化点86℃，聚乙烯蜡软化点115℃，很难在低于蜡的软化点以下温度将它清除。
申请号 201810202983 .5的发明公开了一种软化剂，用于液晶盒框胶的软化，包括体积百分数为5％〜10％的乙醇、体积百分数为10％〜20％的乙酸乙酯以及体积百分数为70％〜85％的三氯甲烷。上述软化剂，可以快速有效地软化已固化的环氧树脂胶，但不能除蜡。
申请号 201910499086 .X本发明公开了一种便于蜡质分离的浓缩除蜡水及其制备方法，涉及金属洗涤剂领域。其技术要点是：一种便于蜡质分离的浓缩除蜡水，包括如下重量份数的组分：改性MOFs 1〜3份；壬基酚聚氧乙烯醚7.5〜8份；椰子油脂肪酸二乙醇酰胺15〜16份；甘油2.5〜3份；聚乙二醇0.5〜1份；二乙烯三胺9〜10份；无水乙醇40〜50份。该发明不能软化环氧树脂。
《浙江化工》2018年49卷第2期刊登的论文“44 环氧树脂乙二醇胺水性化研究”，采用二乙醇胺对44环氧树脂进行改性，制备了水性系列环氧树脂，研究了改性剂用量、反应温度和时间对水性环氧树脂稳定性的影响，确立了最佳的原料配比和反应条件。结果表明：当二乙醇胺用量增加时，改性环氧树脂亲水性加强，水性环氧树脂粒径减小，固化性能变差。表明二乙醇胺对环氧树脂具有某种影响。
甲酰胺无色透明液体，具有活泼的反应性和特殊的溶解能力，可用作纸张处理剂，纤维工业的柔软剂，动物胶的软化剂，也是优良的有机溶剂。乙酰胺、乙酸中的羟基被氨基取代而生成的化合物，具有微弱碱性，广泛用作有机物和无机物的溶剂、抗酸剂。
N-甲基吡咯烷酮，无色透明油状液体，微有胺的气味。能与水、醇、醚、酯、酮、卤代烃、芳烃互溶，是一种优良的抽提溶剂，广泛用作芳烃抽提、乙炔提浓、丁二烯分离和合成气的脱硫等过程中的萃取剂，同时也是农药、工程塑料、涂料、合成纤维、集成电路等生产中的溶剂。
发明内容
发明目的：
本发明提供一种能在较低温度下即将环氧树脂溢料（飞边）软化，又同时将高软化点蜡清除，符合封装工艺要求的芯片塑封料溢料软化剂。
技术方案：
本发明的软化剂是用于对铜框架、铁镍合金框架、铜表面镀镍钯金框架、铁镍合金镀镍钯金框架的半导体环氧树脂塑封产品的塑封完成后，对其溢料进行软化处理及溶解溢出的巴蜡或聚乙烯蜡，便于框架进行后续的电镀工序。
为实现上述目的，本发明使用醇胺类有机碱，包括乙醇胺、二乙醇胺、三乙醇胺、二甲基乙醇胺、异丙醇胺、二异丙醇胺、三异丙醇胺在加热的条件下有机碱可渗透到固化后环氧树脂的体型结构中，使得环氧树脂溶胀软化，之后通过机械外力将其去除。但如果有机碱过多过强将破坏溢料之外的塑封体，所以配合酰胺类包括二甲基甲酰胺、二甲基乙酰胺、二甲基丙酰胺或氮甲基吡咯烷酮溶剂达到适中的效果。所述的醇胺类物质占总重量的30%〜50%，所述的溶剂占总重量的40%〜60%，或有其它助剂（如分散剂、其它溶剂、助溶剂等）补足100%。这种情况在100℃以上高温的情况下效果明显，在60℃左右的较低温度下效果不好。
所以针对以上低温效果不好的情况，本发明加入醇胺醚类溶纤剂（醇胺醚类分子中的氢原子或氧原子、氮原子分别可以与环氧树脂的环氧基团中的氧原子或氢原子形成氢键或配位键，有助于环氧树脂溢料的软化溶解剥离；但是没有无机碱的极性基团与环氧树脂产生过度的化学反应）包括乙醇胺醚、二乙醇胺醚、三乙醇胺醚、二甲基乙醇胺醚、异丙醇安醚、二异丙醇胺醚、三异丙醇胺醚，在既有碱性又有溶纤剂的作用的物质作用下，使得在60℃〜70℃较低的温度下即软化了环氧树脂塑封料的溢料又对环氧树脂塑封体没有伤害，做到了产品各项性能不被破坏，保证了产品的可靠性。而且，醇胺类与醇胺醚类物质基本相同或相似的官能团，相似相容，不产生排斥现象或者副反应，优选采用具有相同基团的醇胺类和醇胺醚类物质，如乙醇胺和乙醇胺醚，或者二乙醇胺和二乙醇胺醚，或者二甲基乙醇胺与二甲基乙醇胺醚。
在解决塑封料溢出的熔点较高（70℃〜120℃）的巴蜡或聚乙烯蜡的问题，本发明加入了二元醇醚醋酸酯类物质，结合上述溶剂的使用，使得在60℃±10℃左右的低温条件下将巴蜡及聚乙烯蜡清洗干净，使得在后续电镀工序中不会出现漏镀现象发生。所述的醇胺类物质占总重量的15%〜25%，所述的醇胺醚类占总重量的20%〜30%，所述的溶剂占总重量的25%〜35%，所述的二元醇醚醋酸酯类占总重量的20%〜30%。
由于酰胺分子间氢键缔合能力较强，液体酰胺不但可以溶解有机化合物，而且也可以溶解许多无机化合物，是良好的溶剂。尤其N,N-二甲基甲酰胺和N,N-二甲基乙酰胺可与水和大多数有机溶剂以及许多无机液体以任意比例混合，是很好的非质子极性溶剂；它们与氮甲基吡咯烷酮类具有相似相容的结构，两类溶剂的配合能进一步增加溶解性，功能互补，降低软化温度。酰胺分子与醇胺或醇胺醚之间能产生氢键，缔合能力较强，占2/3左右；氮甲基吡咯烷酮类成本较高，占溶剂的1/3左右。
本发明中，进一步优选，软化剂的主要成分：二甲基乙醇胺、二甲基乙醇胺醚、N,N-二甲基乙酰胺、氮甲基吡咯烷酮类溶剂、乙二醇***醋酸酯，具有共同的基团二甲基或者乙基，完全没有副反应；而且还具有下列优点：相互溶解性更好，进一步提高了软化和除蜡效果；这些原料的成本低廉，熔点较低常温为液体，在浸泡温度不易挥发；所以，处理环氧树脂塑封件溢料所需要的浸泡温度可以低至50℃。
配套的芯片环氧树脂塑封体量产使用流程如下：
本发明的软化剂浸泡软化----高压水打击（机械方式）----电镀处理。
软化浸泡条件：温度70℃±10℃，时间60min±10min；接着在40°〜60°的250〜400Kg高压水击打冲洗，电镀处理液处理。
有益效果：
本发明是一种化学软化剂，是对半导体集成电路封装生产的注塑过程中产生的环氧树脂塑封料的溢料有软化作用一种化学药品。它有在低温条件下对环氧树脂溢料有软化作用达到去除溢料的作用，但相比于同类软化剂，他的一大亮点是具有低温条件下还能将溢出的环氧树脂塑封料中的巴蜡、聚乙烯蜡溶解的功能。
本发明的低温60℃±10℃的条件满足了化学软化对产品塑封不伤害，同时工艺温度低也保证了产品的各项性能不被破坏，保证了产品的可靠性。
作为有效成分含有：醇胺类、胺醚类、酰胺类、氮甲基吡咯烷酮、二元醇醚醋酸酯类物质，这些成分都不属于环境有害物质管控内的范畴，是环保型软化剂。
具体实施方式
配料实施例：
实验样1号为本发明例，取作为醇胺类物质的乙醇胺20g，取作为醇胺醚类物质的乙醇胺醚25g，取作为酰胺类物质的二甲基乙酰胺20g，取作为氮甲基吡咯烷酮物质的N-甲基吡咯烷酮10g，取作为二元醇醚醋酸酯类物质的乙二醇***醋酸酯25g，配置成混合液。
实验样2号为不含有二元醇醚醋酸酯类物质的比较例，取作为醇胺类物质的乙醇胺20g，取作为醇胺醚类物质的乙醇胺醚25g，取作为酰胺类物质的二甲基乙酰胺20g，取作为氮甲基吡咯烷酮物质的N-甲基吡咯烷酮10g，配置成混合液。
实验样3号为不含有醇胺类物质的比较例，取作为醇胺醚类物质的乙醇胺醚25g，取作为酰胺类物质的二甲基乙酰胺20g，取作为氮甲基吡咯烷酮物质的N-甲基吡咯烷酮10g，取作为二元醇醚醋酸酯类物质的乙二醇***醋酸酯25g，配置成混合液。
实验样4号为使用无机碱的比较例，取20g 30%氢氧化钾溶液，取作为酰胺类物质的二甲基乙酰胺20g，取作为氮甲基吡咯烷酮物质的N-甲基吡咯烷酮10g，取作为二元醇醚醋酸酯类物质的乙二醇***醋酸酯25g，配置成混合液。
实施例1：
使用TO-220实验假片（环氧树脂塑封芯片，连接在铜引线框架上）进行测试，实验条件设定为65℃浸泡30分钟，其实验结果如下表所示。
参照上表结果，表明醇胺类物质对软化溢料有比较明显的作用，而二元醇醚醋酸酯类物质则对蜡有较好的溶解效果。
实施例2：
取比例1：1的巴蜡、聚乙烯蜡混合物，分别取3g，置于10g实验样中，在70℃下浸泡半小时，单独调查蜡的溶解情况。其实验结果如下表所示。
通过本实施例，可直观的观察各实验样对蜡的溶解能力。
实施例3：
使用TO-220产品进行测试，实验条件设定为70℃浸泡30分钟、60分钟，而后进行可靠性测试
参照上表结果，采用醇胺类有机碱作为碱性组分的1，2，3样品对塑封体的可靠性较好，优于4号的无机碱型样品
试验结论：
由上述实施例1，2，3可见，在60℃〜70℃温度下：
采用1、2、4号样品，对溢料软化效果好，2号除蜡效果不好，3号软化效果不好。采用二元醇醚醋酸酯类溶剂的1，3，4号样品除蜡效果好，无漏镀现象，优于不含二元醇醚醋酸酯类溶剂的2号。这表明二元醇醚醋酸酯类物质则对蜡有较好的溶解效果。采用1、2、3号试样，对塑封体没有分层的不利结果，4号有分层影响塑封体质量。
本发明的软化剂对环氧树脂溢料有软化作用，可达到机械去除（如高压水击打）溢料的同时，具备溶解环氧树脂塑封料表面的巴蜡或聚乙烯蜡等蜡状物的功能，便于后续的对塑封体引线框架的电镀处理。
Claims (4)
1.一种芯片塑封料溢料软化剂，能将芯片环氧树脂塑封料的溢料软化，然后通过机械方式去除，其特征在于：软化剂的主要成分包含：醇胺类有机碱、酰胺类或氮甲基吡咯烷酮类溶剂，所述的醇胺类物质占总重量的30%〜50%，所述的溶剂占总重量的40%〜60%；在100℃以上进行浸泡处理。
2.根据权利要求1所述的芯片塑封料溢料软化剂，其特征在于：成分中还包含醇胺醚类溶纤剂：乙醇胺醚、二乙醇胺醚、三乙醇胺醚、二甲基乙醇胺醚、异丙醇安醚、二异丙醇胺醚、三异丙醇胺醚中的一种或及几种；在60℃〜70℃进行浸泡处理。
3.根据权利要求1或2所述的芯片塑封料溢料软化剂，其特征在于：成分中还有二元醇醚醋酸酯类除蜡剂：乙二醇甲醚醋酸酯、乙二醇***醋酸酯、二乙二醇甲醚醋酸酯、二乙二醇***醋酸酯、二丙二醇甲醚醋酸酯醚中的一种或几种；在60℃±10℃的温度浸泡，能将塑封料中溢出的巴蜡或聚乙烯蜡清洗干净；所述的醇胺类物质占总重量的15%〜25%，所述的醇胺醚类占总重量的20%〜30%，所述的溶剂占总重量的25%〜35%，所述的二元醇醚醋酸酯类占总重量的20%〜30%。
4.根据权利要求1或2所述的芯片塑封料溢料软化剂，其特征在于：酰胺类溶剂为N,N-二甲基甲酰胺或者N,N-二甲基乙酰胺，同时含有氮甲基吡咯烷酮类溶剂，氮甲基吡咯烷酮类占溶剂的1/3左右。
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