CN114423220A - Double-sided water-cooling heat dissipation module for domain controller of super computing platform - Google Patents
Double-sided water-cooling heat dissipation module for domain controller of super computing platform Download PDFInfo
- Publication number
- CN114423220A CN114423220A CN202111512076.9A CN202111512076A CN114423220A CN 114423220 A CN114423220 A CN 114423220A CN 202111512076 A CN202111512076 A CN 202111512076A CN 114423220 A CN114423220 A CN 114423220A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- substrate
- water
- domain controller
- pcba
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a double-sided water-cooling heat dissipation module for a domain controller of a supercomputing platform, and relates to the technical field of heat dissipation water channels of controllers. The domain controller comprises an upper cover, a first PCBA, a first substrate, a second PCBA and a lower cover; the water-cooling heat dissipation module comprises a first substrate and a second substrate; the water-cooling heat dissipation module is of a closed integrated structure; a heat dissipation flow channel for conducting heat dissipation for the first PCBA and the second PCBA is arranged between the first substrate and the second substrate; the first PCBA, the first substrate, the second substrate and the second PCBA are assembled between the upper cover and the lower cover respectively. The invention realizes the effective improvement of the heat dissipation effect to a certain extent through the action of the water-cooling heat dissipation module and the heat dissipation flow channel which are of a closed integrated structure, namely the advantage of improving the heat dissipation capacity and the heat dissipation efficiency.
Description
Technical Field
The invention belongs to the technical field of controller heat dissipation water channels, and particularly relates to a double-sided water-cooling heat dissipation module for a domain controller of a super computing platform.
Background
At present, the intelligent technology of the automobile is rapidly developed, and an intelligent driving super-computing platform is gradually miniaturized and integrated. With the continuous improvement of intelligent driving level, reasonable heat control technology must be adopted to ensure the normal operation of electrical components and parts and have higher reliability and service life. At present, most of heat dissipation systems of intelligent driving super-computing platforms rely on forced air cooling for heat dissipation, the heat dissipation efficiency is low, and the existing natural cooling/forced air cooling heat dissipation systems can not meet the use requirements gradually. Meanwhile, the size of a non-integrated controller system is large, and the arrangement of products on the whole vehicle is not facilitated. Therefore, the problems of insufficient heat dissipation and insufficient heat dissipation efficiency exist on the highly integrated super computing platform.
Disclosure of Invention
The invention aims to provide a double-sided water-cooling heat dissipation module for a domain controller of a super computing platform, which effectively improves the heat dissipation effect to a certain extent through the action of a water-cooling heat dissipation module and a heat dissipation flow channel which are of a closed integrated structure, namely, improves the heat dissipation capacity and the heat dissipation efficiency; the problems that the existing heat dissipation is not enough and the heat dissipation efficiency is not high enough are solved.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a double-sided water-cooling heat dissipation module for a domain controller of a super computing platform, wherein the domain controller comprises an upper cover, a first PCBA, a first substrate, a second PCBA and a lower cover; the water-cooling heat dissipation module comprises a first substrate and a second substrate; the water-cooling heat dissipation module is of a closed integrated structure; a heat dissipation flow channel for conducting heat dissipation for the first PCBA and the second PCBA is arranged between the first substrate and the second substrate; a first PCBA, a first substrate, a second substrate and a second PCBA are assembled between the upper cover and the lower cover respectively; the water-cooling heat dissipation module is provided with a water inlet joint and a water outlet joint respectively; the water inlet joint and the water outlet joint are respectively communicated with a heat dissipation system of the domain controller, so that the water inlet joint and the water outlet joint are respectively communicated with the heat dissipation system of the whole vehicle, and the circulation operation of the heat dissipation system of the whole vehicle is guaranteed; the first substrate and the second substrate are cold plates of a first PCBA and a second PCBA, respectively.
The water-cooling heat dissipation module integrates the cold plates of the two circuit templates into a whole, adopts a closed integrated structure, has good sealing performance, and ensures the stable operation of equipment.
As a preferable technical scheme of the invention, heat dissipation bosses for contact heat transfer are uniformly arrayed on one opposite inner side surfaces of the first substrate and the second substrate.
As a preferred technical scheme of the invention, heat conducting gaskets are arranged on the contact surfaces between the heat dissipation boss and the first substrate and between the heat dissipation boss and the second substrate, so that the heat dissipation boss and the heating device can be well contacted, and the heat dissipation effect is kept stable; the radiating bosses are distributed in an S shape.
As a preferred technical scheme of the invention, the heat dissipation boss adopts a meshed in-line fin structure; the cross section of the meshed type in-line rib structure is of a trapezoidal structure.
As a preferred technical solution of the present invention, the heat dissipation bosses on the first substrate and the heat dissipation bosses on the second substrate are staggered and engaged with each other; smooth flow channels are formed between every two groups of staggered heat dissipation bosses.
The cold drawing of two circuit templates is first base plate and second base plate respectively, and the heat dissipation boss on first base plate and the second base plate is "S" type distribution to and its intermeshing forms great heat dissipation contact surface, better messenger 'S coolant liquid and the heat dissipation take place the heat convection between the runner, and trapezoidal cross-section' S heat dissipation boss can not cause great pressure loss simultaneously, and its simple structure, the processing of being convenient for.
As a preferred technical scheme of the invention, the heat dissipation boss adopts a sectional structure, and a partition groove is formed on the heat dissipation boss; the heat dissipation bosses are disconnected after being spaced by a certain distance, belong to a sectional structure, can improve the turbulence intensity of the fins, generate more turbulence and take away more heat.
As a preferred technical scheme of the invention, at least two layers of flow dividing partition plates are suspended and fixed in the partition groove; the purpose of the flow dividing partition plate is to guide the cooling liquid in the middle area in the heat dissipation flow channel to the inner top surface and the inner bottom surface respectively, so that the flow rate of the relative inner side surface area of the first substrate and the second substrate is quicker, the advantage of taking away more heat is achieved, and the heat dissipation effect is effectively improved to a certain degree.
The invention has the following beneficial effects:
1. the invention realizes the effective improvement of the heat dissipation effect to a certain extent through the action of the water-cooling heat dissipation module and the heat dissipation flow channel which are of a closed integrated structure, namely the advantage of improving the heat dissipation capacity and the heat dissipation efficiency.
2. The heat dissipation runner adopts the double-sided water-cooled heat dissipation water channel structure in which the opposite inner side surfaces of the first substrate and the second substrate can be subjected to water cooling, so that the heat dissipation runner has the advantages of high heat transfer speed, high heat conduction efficiency and high integration, can realize the rapid heat dissipation of a plurality of chips on two circuit modules simultaneously, is convenient for the miniaturization and integration design of a control system, effectively relieves the rapid heat dissipation problem of a super computing platform after the high integration, improves the heat dissipation efficiency of the system, and is convenient for the arrangement of the whole vehicle.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is an exploded view of an assembly structure of a double-sided water-cooling heat dissipation module for a domain controller of a supercomputing platform according to the present invention;
FIG. 2 is a schematic cross-sectional view of a double-sided water-cooled heat dissipation module for a domain controller of a supercomputing platform according to the present invention from a top view;
FIG. 3 is a schematic cross-sectional view of a double-sided water-cooling heat dissipation module for a domain controller of a supercomputing platform according to the present invention;
FIG. 4 is a schematic structural diagram of a first substrate;
FIG. 5 is a schematic structural diagram of a second substrate;
fig. 6 is a schematic cross-sectional view of a double-sided water-cooling heat dissipation module for a domain controller of a supercomputing platform according to a fifth embodiment of the present invention from a top view;
FIG. 7 is a cross-sectional side view of a diverter baffle;
in the drawings, the components represented by the respective reference numerals are listed below:
1-an upper cover, 2-a first PCBA, 3-a first substrate, 4-a second substrate, 5-a second PCBA, 6-a lower cover, 7-a heat dissipation flow channel, 8-a heat dissipation boss, 9-a partition groove, 10-a flow division partition plate, 11-a water inlet joint and 12-a water outlet joint.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "opening," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like are used in an orientation or positional relationship that is merely for convenience in describing and simplifying the description, and do not indicate or imply that the referenced component or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present invention.
Example one
Referring to fig. 1, the present invention is a double-sided water-cooling heat dissipation module for a domain controller of a supercomputing platform, the domain controller includes an upper cover 1, a first PCBA2, a first substrate 3, a second substrate 4, a second PCBA5 and a lower cover 6; the water-cooling heat dissipation module comprises a first substrate 3 and a second substrate 4; the water-cooling heat dissipation module is of a closed integrated structure; the first substrate 3 and the second substrate 4 are welded into a whole through friction stir welding to form a closed space, and a heat dissipation flow channel 7 is arranged in the middle of the closed space; the heat dissipation flow channel 7 is a flow channel for conducting and dissipating heat for the first PCBA2 and the second PCBA 5; the first PCBA2, the first substrate 3, the second substrate 4 and the second PCBA5 are respectively assembled between the upper cover 1 and the lower cover 6 from top to bottom, and the upper cover 1 and the lower cover 6 are used for protecting the first PCBA2 and the second PCBA 5; wherein, the water cooling module is respectively provided with a water inlet joint 11 and a water outlet joint 12; the water inlet joint 11 and the water outlet joint 12 are respectively communicated with a heat dissipation system of the domain controller, so that the water inlet joint 11 and the water outlet joint 12 are respectively communicated with a heat dissipation system of the whole vehicle, and the circulation operation of the heat dissipation system of the whole vehicle is guaranteed; the first substrate 3 and the second substrate 4 are respectively cold plates of a first PCBA2 and a second PCBA5, the water-cooling heat dissipation module combines the cold plates of the two circuit templates into a whole, and a closed integrated structure is adopted, so that the sealing performance is good, and the stable operation of equipment is guaranteed; heat dissipation bosses 8 for contact heat transfer are uniformly arrayed on one opposite inner side surfaces of the first substrate 3 and the second substrate 4; heat conducting gaskets are arranged on the contact surfaces between the heat radiating boss 8 and the first substrate 3 and between the heat radiating boss 8 and the second substrate 4, the heat radiating boss 8 is in close contact with the heating device and conducts heat, and the heat conducting gaskets are arranged on the contact surfaces to ensure that the heating device and the heat radiating boss 8 can be in good contact, so that the heat radiating effect is kept stable; the radiating bosses 8 are distributed in an S shape.
Example two
In a preferred technical solution based on the first embodiment, please refer to fig. 2, the heat dissipation boss 8 is of a meshed in-line fin structure; the cross section of the meshed type in-line rib structure is of a trapezoidal structure.
EXAMPLE III
On the basis of the second embodiment, referring to fig. 3, the heat dissipating bosses 8 on the first substrate 3 and the heat dissipating bosses 8 on the second substrate 4 are engaged with each other in a staggered manner; a smooth flow channel is formed between each group of staggered heat dissipation bosses 8; the mutual engagement of the heat dissipation bosses forms a larger heat dissipation contact surface, so that the convection heat transfer between the cooling liquid and the heat dissipation flow channel 7 is better realized, meanwhile, the heat dissipation boss 8 with the trapezoidal section cannot cause larger pressure loss, and the heat dissipation boss is simple in structure and convenient to process.
Example four
On the basis of the third embodiment, referring to fig. 4-5, a heat dissipation boss 8 is of a sectional structure, and a partition groove 9 is formed in the heat dissipation boss 8; the heat dissipation bosses 8 are disconnected after being spaced by a distance, belong to a sectional structure, can improve the turbulence intensity of the fins, generate more turbulence and take away more heat.
EXAMPLE five
On the basis of the fourth embodiment, referring to fig. 6-7, at least two layers of flow dividing partitions 10 are suspended and fixed in the partition groove 9; the purpose of the flow dividing partition plate 10 is to guide the cooling liquid in the middle area of the heat dissipation channel 7 to the inner top surface and the inner bottom surface, so that the flow rate of the inner side surface area of the first substrate 3 and the second substrate 4 is faster, the advantage of taking away more heat is achieved, and the heat dissipation effect is effectively improved to a certain degree.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (10)
1. A double-sided water-cooling heat dissipation module for a domain controller of a super computing platform comprises an upper cover (1), a first PCBA (2), a first substrate (3), a second substrate (4), a second PCBA (5) and a lower cover (6); the method is characterized in that:
the water-cooling heat dissipation module comprises a first substrate (3) and a second substrate (4); the water-cooling heat dissipation module is of a closed integrated structure;
a heat dissipation flow channel (7) for conducting and dissipating heat for the first PCBA (2) and the second PCBA (5) is arranged between the first substrate (3) and the second substrate (4);
a first PCBA (2), a first substrate (3), a second substrate (4) and a second PCBA (5) are respectively assembled between the upper cover (1) and the lower cover (6).
2. The double-sided water-cooling heat dissipation module for the domain controller of the supercomputer platform as claimed in claim 1, wherein the heat dissipation bosses (8) for contact heat transfer are uniformly arrayed on one opposite inner side surfaces of the first substrate (3) and the second substrate (4).
3. The double-sided water-cooling heat dissipation module for the domain controller of the supercomputing platform according to claim 2, wherein heat conducting gaskets are arranged on the contact surfaces between the heat dissipation boss (8) and the first substrate (3) and the second substrate (4); the radiating bosses (8) are distributed in an S shape.
4. The double-sided water-cooling heat dissipation module for the domain controller of the supercomputing platform according to claim 2 or 3, characterized in that the heat dissipation boss (8) adopts a meshed in-line fin structure; the cross section of the meshed type in-line rib structure is of a trapezoidal structure.
5. The double-sided water-cooling heat dissipation module for the domain controller of the supercomputing platform according to claim 4, wherein the heat dissipation bosses (8) on the first substrate (3) and the heat dissipation bosses (8) on the second substrate (4) are mutually staggered and meshed.
6. The double-sided water-cooling heat dissipation module for the domain controller of the supercomputing platform according to claim 5, wherein the heat dissipation boss (8) is of a sectional structure, and the heat dissipation boss (8) is provided with a partition groove (9).
7. The double-sided water-cooling heat dissipation module for the domain controller of the supercomputing platform according to claim 6, wherein at least two layers of flow dividing partition boards (10) are suspended and fixed in the partition groove (9).
8. The double-sided water-cooling heat dissipation module for the domain controller of the supercomputing platform as claimed in claim 7, wherein the shunting partition (10) is fixed on the heat dissipation boss (8).
9. The double-sided water-cooling heat dissipation module for the domain controller of the supercomputing platform according to claim 1, wherein a water inlet joint (11) and a water outlet joint (12) are respectively arranged on the water-cooling heat dissipation module; the water inlet joint (11) and the water outlet joint (12) are respectively communicated with a heat dissipation system of the domain controller.
10. The double-sided water-cooling heat dissipation module for the domain controller of the supercomputing platform is characterized in that the first substrate (3) and the second substrate (4) are cold plates of a first PCBA (2) and a second PCBA (5) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111512076.9A CN114423220A (en) | 2021-12-07 | 2021-12-07 | Double-sided water-cooling heat dissipation module for domain controller of super computing platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111512076.9A CN114423220A (en) | 2021-12-07 | 2021-12-07 | Double-sided water-cooling heat dissipation module for domain controller of super computing platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114423220A true CN114423220A (en) | 2022-04-29 |
Family
ID=81265557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111512076.9A Pending CN114423220A (en) | 2021-12-07 | 2021-12-07 | Double-sided water-cooling heat dissipation module for domain controller of super computing platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114423220A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115915723A (en) * | 2022-11-23 | 2023-04-04 | 江苏联成开拓集团有限公司 | Heat radiation structure of intelligence driving area controller |
-
2021
- 2021-12-07 CN CN202111512076.9A patent/CN114423220A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115915723A (en) * | 2022-11-23 | 2023-04-04 | 江苏联成开拓集团有限公司 | Heat radiation structure of intelligence driving area controller |
| CN115915723B (en) * | 2022-11-23 | 2024-02-02 | 江苏联成开拓集团有限公司 | Heat radiation structure of intelligent driving area controller |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5239200A (en) | Apparatus for cooling integrated circuit chips | |
| CN107787160B (en) | Water-cooling heat dissipation structure of motor controller | |
| WO2021080217A1 (en) | High performance uniform temperature cold plate | |
| CN211831654U (en) | Efficient liquid cooling plate and equipment | |
| CN108141989A (en) | For cooling down the heat exchanger of electric device | |
| JP2023535803A (en) | Liquid cooling heat dissipation structure and transmission case | |
| CN114423220A (en) | Double-sided water-cooling heat dissipation module for domain controller of super computing platform | |
| CN209882439U (en) | Double-sided heat dissipation high-performance water-cooling radiator and electrical equipment | |
| CN111799238B (en) | Double-sided water-cooling IGBT radiator and radiating installation structure thereof | |
| CN212695143U (en) | Micro-channel heat sink with vein-shaped flow dividing structure | |
| CN113035805A (en) | Liquid cooling plate and power module | |
| US11004766B2 (en) | Cooler | |
| CN100378976C (en) | Water cooling method and device of electric transmission power electron power inverter | |
| CN113840516B (en) | Liquid cooling cold plate and plate-level liquid cooling system | |
| CN104752374A (en) | Radiator and radiator group | |
| US20230292463A1 (en) | Devices of drawing out surface heat of electronic components | |
| CN114144034B (en) | Cobweb-like split-flow type micro-channel liquid cooling device | |
| CN215187996U (en) | Liquid cooling plate and heat dissipation equipment | |
| CN115279111A (en) | Liquid cooling plate and heat dissipation equipment | |
| CN218471256U (en) | Cooling device | |
| TWI832729B (en) | Separator type liquid cooling radiator | |
| CN220629163U (en) | Heat radiation structure of power module | |
| CN219205104U (en) | Heat dissipation water course structure and equipment | |
| CN219591498U (en) | Battery box with double-layer liquid cooling heat dissipation structure | |
| CN219834738U (en) | Power conversion device and power conversion module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |