CN114420452A - Structure of thin film capacitor and heat dissipation method - Google Patents
Structure of thin film capacitor and heat dissipation method Download PDFInfo
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- CN114420452A CN114420452A CN202210124433.2A CN202210124433A CN114420452A CN 114420452 A CN114420452 A CN 114420452A CN 202210124433 A CN202210124433 A CN 202210124433A CN 114420452 A CN114420452 A CN 114420452A
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- motor controller
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- 239000003990 capacitor Substances 0.000 title claims abstract description 184
- 239000010409 thin film Substances 0.000 title claims abstract description 128
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000010408 film Substances 0.000 claims abstract description 63
- 239000004065 semiconductor Substances 0.000 claims abstract description 51
- 238000005057 refrigeration Methods 0.000 claims abstract description 29
- 238000006243 chemical reaction Methods 0.000 claims description 41
- 238000001816 cooling Methods 0.000 claims description 13
- 239000003381 stabilizer Substances 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inverter Devices (AREA)
Abstract
The invention relates to the field of thin film capacitors, and discloses a structure and a heat dissipation method of a thin film capacitor. The invention provides a structure and a heat dissipation method of a film capacitor, which realize the adjustment of the heat dissipation power of a semiconductor refrigeration piece so as to reduce the working temperature of the film capacitor, optimize the energy consumption of the semiconductor refrigeration piece and improve the reliability of the film capacitor by arranging components such as a film capacitor heat management module, the semiconductor refrigeration piece, a temperature sensor and the like in the film capacitor.
Description
Technical Field
The invention relates to the field of film capacitors, in particular to a structure of a film capacitor and a heat dissipation method.
Background
In recent years, new energy automobiles develop rapidly in the automobile industry, and the film capacitor gradually replaces the original electrolytic capacitor to become the mainstream choice of the supporting capacitor of the motor controller due to the characteristics of no polarity, self-healing capability, high reliability, good frequency characteristic and the like.
When the motor controller works, the power device and the thin film capacitor of the motor controller generate certain heating conditions, so that the temperature inside the motor controller is obviously raised, particularly, third-generation semiconductor power devices such as Sic and the like are gradually applied to the motor controller in recent years, because the Sic controller is generally higher in power density and limited in heat dissipation conditions, the Sic-based device is higher than the operating temperature endured by the Sic-based device, the working environment temperature of the thin film capacitor and the temperature of the thin film capacitor are gradually raised, but the performance and the service life of the thin film capacitor are influenced due to aging of the thin film capacitor caused by the overhigh operating temperature, the heat dissipation structure of the thin film capacitor needs to be optimized to prolong the service life and the reliability of the thin film capacitor.
Disclosure of Invention
The invention provides a structure of a film capacitor and a heat dissipation method, aiming at solving the problem that the performance and the reliability of the film capacitor are reduced due to the influence of the working temperature in the prior art.
The technical content of the invention is as follows:
the structure of the film capacitor comprises a film capacitor, wherein a film capacitor core, a film capacitor heat management module, a temperature sensor and a semiconductor refrigeration piece are arranged in the film capacitor, the film capacitor core is connected with the temperature sensor, the temperature sensor is connected with the film capacitor heat management module, the film capacitor heat management module is connected with the semiconductor refrigeration piece, and the semiconductor refrigeration piece is connected with the film capacitor core.
Further, the thin film capacitor thermal management module comprises a voltage conversion chip, a voltage stabilizer and a single chip microcomputer, wherein the voltage conversion chip, the voltage stabilizer and the single chip microcomputer are sequentially connected, the voltage conversion chip is connected with the single chip microcomputer, the voltage conversion chip is connected with the semiconductor refrigeration piece, and the single chip microcomputer is connected with the temperature sensor.
Furthermore, the thin film capacitor is connected with a motor controller main control board, the thin film capacitor is connected with the motor controller main control board through a thin film capacitor heat management module, the thin film capacitor heat management module is in communication connection with the motor controller main control board so as to acquire information outside the thin film capacitor, and the thin film capacitor heat management module provides a redundant power supply for the motor controller main control board.
Furthermore, the thin film capacitor heat management module is connected with the motor controller main control board through the voltage conversion chip to provide a redundant power supply for the motor controller main control board, and the thin film capacitor heat management module is in communication connection with the motor controller main control board through a single chip microcomputer.
Furthermore, the thin film capacitor is connected with a high-voltage port, the thin film capacitor core body is connected with the high-voltage port, the thin film capacitor thermal management module is connected with the high-voltage port, and the high-voltage port supplies high-voltage power to the thin film capacitor.
Further, the thin film capacitor is connected with a motor controller power component, the motor controller power component is connected to the high-voltage port, and the thin film capacitor is connected with the motor controller power component through the high-voltage port.
Furthermore, the semiconductor refrigeration piece is connected with a water-cooling bottom plate, and the water-cooling bottom plate is arranged at the lower end of the thin film capacitor.
Further, the voltage conversion chip is an isolated flyback converter of the LT 8315.
A heat dissipation method of a film capacitor comprises the structure of the film capacitor, and comprises the following steps:
judging whether the output voltage of the voltage conversion chip is regulated or not according to the temperature of the thin film capacitor core body detected by the thin film capacitor heat management module through the temperature sensor;
when the thin film capacitor heat management module detects that the temperature of the thin film capacitor core is too high or the temperature rise rate is too fast, the thin film capacitor heat management module adjusts a high-voltage power supply mode into a low-voltage power supply mode through a voltage conversion chip, and therefore the heat dissipation power of the semiconductor refrigeration piece is adjusted.
Further, the thin film capacitor thermal management module adjusts the heat dissipation power of the semiconductor chilling plate through the following steps:
after the high-voltage port is normally powered on, the thin film capacitor is applied with high voltage, a voltage conversion chip in the thin film capacitor thermal management module starts to work, a voltage stabilizer connected with the voltage conversion chip starts to supply power to the single chip microcomputer, and the single chip microcomputer starts to work;
when the thin film capacitor thermal management module detects that the temperature of the thin film capacitor core is too high or the temperature rise rate is too fast, the output voltage is adjusted through the voltage conversion chip, and therefore the heat dissipation power of the semiconductor refrigerating sheet is adjusted.
Further, the heat dissipation power of the semiconductor chilling plate is adjusted by the following steps:
the single chip microcomputer collects the temperature of a film capacitor core body through a temperature sensor in the film capacitor or is in communication connection with the motor controller main control board to obtain information such as external direct current voltage, direct current, switching frequency, output torque, temperature of the water-cooling radiating bottom plate and the like, the radiating capacity required by the film capacitor is calculated through the obtained information, and the radiating power of the semiconductor refrigerating sheet is adjusted by adjusting the output voltage of the voltage conversion chip.
The beneficial effects of the invention at least comprise: the invention provides a structure and a heat dissipation method of a film capacitor, wherein components such as a film capacitor heat management module, a semiconductor refrigerating sheet, a temperature sensor and the like are arranged in the film capacitor, so that the heat dissipation power of the semiconductor refrigerating sheet is adjusted to reduce the working temperature of the film capacitor, the energy consumption of the semiconductor refrigerating sheet is optimized, the reliability of the film capacitor is improved, the film capacitor heat management module has the functions of low-voltage power supply redundancy backup and auxiliary active discharge, and the safety of a motor controller can be further enhanced.
Drawings
Fig. 1 is a schematic structural diagram of a thin film capacitor structure according to the present invention.
Fig. 2 is a schematic structural diagram of the thin film capacitor thermal management module according to the present invention.
Wherein:
1-a thin film capacitive thermal management module;
101-a voltage conversion chip; 102-a voltage regulator; 103-a single chip microcomputer;
2-a temperature sensor;
3-semiconductor refrigerating sheet;
4-a thin film capacitive core;
5-thin film capacitance;
6-a motor controller main control board;
7-high pressure port;
8-motor controller power components;
9-water cooling heat dissipation bottom plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention discloses a structure of a thin film capacitor 5, which is shown by combining a figure 1-2 and comprises a thin film capacitor 5, wherein a thin film capacitor 5 core 4, a thin film capacitor 5 heat management module 1, a temperature sensor 2 and a semiconductor refrigerating sheet 3 are arranged in the thin film capacitor 5, the thin film capacitor 5 core 4 is connected with the temperature sensor 2, the temperature sensor 2 is connected with the thin film capacitor 5 heat management module 1, the thin film capacitor 5 heat management module 1 is connected with the semiconductor refrigerating sheet 3, and the semiconductor refrigerating sheet 3 is connected with the thin film capacitor 5 core 4.
Further, the thin film capacitor 5 thermal management module 1 comprises a voltage conversion chip 101, a voltage stabilizer 102 and a single chip microcomputer 103, wherein the voltage conversion chip 101, the voltage stabilizer 102 and the single chip microcomputer 103 are sequentially connected, the voltage conversion chip 101 is connected with the single chip microcomputer 103, the voltage conversion chip 101 is connected with the semiconductor refrigeration piece 3, and the single chip microcomputer 103 is connected with the temperature sensor 2.
Further, the thin film capacitor 5 is connected with a motor controller main control board 6, the thin film capacitor 5 is connected with the motor controller main control board 6 through a thin film capacitor 5 heat management module 1, the thin film capacitor 5 heat management module 1 is in communication connection with the motor controller main control board 6 so as to acquire information outside the thin film capacitor 5, and the thin film capacitor 5 heat management module 1 provides a redundant power supply for the motor controller main control board 6.
Further, the thin film capacitor 5 thermal management module 1 is connected with the motor controller main control board 6 through the voltage conversion chip 101 to provide a redundant power supply for the motor controller main control board 6, and the thin film capacitor 5 thermal management module 1 is in communication connection with the motor controller main control board 6 through the single chip microcomputer 103.
Further, the thin film capacitor 5 is connected with a high-voltage port 7, the core 4 of the thin film capacitor 5 is connected with the high-voltage port 7, the thermal management module 1 of the thin film capacitor 5 is connected with the high-voltage port 7, and the high-voltage port 7 provides high-voltage power supply for the thin film capacitor 5.
Further, the thin film capacitor 5 is connected with a motor controller power component 8, the motor controller power component 8 is connected to the high-voltage port 7, and the thin film capacitor 5 is connected with the motor controller power component 8 through the high-voltage port 7.
Further, the semiconductor refrigeration piece 3 is connected with a water-cooling bottom plate 9, and the water-cooling bottom plate 9 is arranged at the lower end of the thin film capacitor 5.
Further, the voltage conversion chip 101 is an isolated flyback converter of LT 8315.
The working voltage of the semiconductor refrigerating sheet 3 is directly output by the thin-film capacitor 5 heat management module 1, the system reliability reduction caused by the fact that a low-voltage power supply wire bundle is connected to the outside is avoided, the power supply voltage of the semiconductor refrigerating sheet 3 is adjustable, and the functional energy consumption of the semiconductor refrigerating sheet 3 is optimized.
In order to ensure the reliability of the heat dissipation of the thin film capacitor 5, the high voltage input into the thin film capacitor 5 is converted into the low voltage with adjustable voltage through the voltage conversion chip 101 arranged in the heat management module 1 of the thin film capacitor 5, and the adjustable voltage can be adjusted according to the heat dissipation requirement, so that the effect of refrigeration power consumption is achieved.
Fig. 2 is a schematic diagram showing the operation of the thin film capacitor 5 thermal management module 1. When the high-voltage port 7 is normally powered on, high voltage is applied to the thin-film capacitor 5, the voltage conversion chip 101 starts to work at the moment, power is supplied to the single chip microcomputer 103 of the thin-film thermal management module through the voltage stabilizer 102, and the single chip microcomputer 103 starts to work.
After the single chip microcomputer 103 works, the output voltage of the voltage conversion chip 101 CAN be adjusted, so that the heat dissipation power of the semiconductor refrigeration chip 3 is adjusted, the single chip microcomputer 103 collects the temperature of the thin film capacitor 5 through the temperature sensor 2 in the thin film capacitor 5, and CAN also communicate with the motor controller main control board 6 in a CAN bus mode and the like to obtain information such as external direct current voltage, direct current, switching frequency, output torque, temperature of the water-cooling heat dissipation bottom board 9 and the like, the current heat dissipation amount required by the thin film capacitor 5 CAN be estimated according to the collected information, the output voltage of the voltage conversion chip 101 is adjusted in a multi-objective optimization mode and the like by combining the heat dissipation power of the semiconductor refrigeration chip 3, and the external voltage output CAN be turned off through a switch when refrigeration is not required, so that the purpose of energy conservation is further achieved.
The reason why the temperature sensor 2 is provided in the thin-film capacitor 5 and is selected not to be provided in the thin-film capacitor 5 thermal management module 1 is that: the purpose of reducing the number of embedded sensors is to reduce the size of the thin film capacitor 5 and to reduce costs.
The low-voltage power supply output by the thin film capacitor 5 heat management module 1 can be further processed and then provided for the main control board 6 of the motor controller, so that when the power supply of the motor controller control system is abnormal, the thin film capacitor 5 heat management module 1 provides a redundant power supply for the outside, the normal work of the motor controller is ensured, and the functional safety requirement of the motor controller is met; when the motor controller needs to perform active or passive discharge, the voltage conversion chip 101 can also implement an auxiliary high-voltage discharge function, thereby further accelerating the active discharge speed.
According to the thin film capacitor 5 device, the built-in thin film capacitor 5 heat management module 1 and the semiconductor refrigerating sheet 3 are adopted, so that the working temperature of the thin film capacitor 5 can be fully ensured, the thin film capacitor 5 device has the advantages of compact structure, good heat dissipation performance, low energy consumption and high reliability, and the safety of a motor controller can be further enhanced through the low-voltage power supply redundancy backup and auxiliary active discharge functions of the thin film capacitor 5 heat management module 1; the heat dissipation method of the invention can enable the thin film capacitor 5 to work at higher ambient temperature, thereby fully exerting the performance of the SIC power device.
A heat dissipation method of a thin film capacitor 5 device comprises the structure of the thin film capacitor 5 device, and comprises the following steps:
judging whether to adjust the output voltage of the voltage conversion chip 101 according to the temperature of the core 4 of the thin-film capacitor 5 detected by the thin-film capacitor 5 thermal management module 1 through the temperature sensor 2;
when the thin film capacitor 5 thermal management module 1 detects that the temperature of the core 4 of the thin film capacitor 5 is too high or the temperature rise rate is too fast, the thin film capacitor 5 thermal management module 1 adjusts the high-voltage power supply mode to the low-voltage power supply mode through the voltage conversion chip 101, so that the heat dissipation power of the semiconductor refrigeration piece 3 is adjusted.
Further, the thin film capacitor 5 thermal management module 1 adjusts the heat dissipation power of the semiconductor chilling plate 3 by the following steps:
after the high-voltage port 7 is normally powered on, the thin film capacitor 5 is applied with high voltage, the voltage conversion chip 101 in the thermal management module 1 of the thin film capacitor 5 starts to work, the voltage stabilizer 102 connected with the voltage conversion chip 101 starts to supply power to the singlechip 103, and the singlechip 103 starts to work;
when the film capacitor 5 thermal management module 1 detects that the temperature of the core 4 of the film capacitor 5 is too high or the temperature rise rate is too fast, the output voltage is adjusted through the voltage conversion chip 101, and therefore the heat dissipation power of the semiconductor refrigeration piece 3 is adjusted.
Further, the heat dissipation power of the semiconductor chilling plate 3 is adjusted by:
the single chip microcomputer 103 collects the temperature of a core 4 of the thin film capacitor 5 through the temperature sensor 2 in the thin film capacitor 5 or is in communication connection with the motor controller main control board 6 to acquire information such as external direct current voltage, direct current, switching frequency, output torque, the temperature of the water-cooling heat dissipation bottom board 9 and the like, calculates the heat dissipation capacity required by the thin film capacitor 5 through the acquired information, and adjusts the heat dissipation power of the semiconductor refrigeration piece 3 through adjusting the output voltage of the voltage conversion chip 101.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A structure of a film capacitor comprises a film capacitor, and is characterized in that: the film capacitor is characterized in that a film capacitor core, a film capacitor heat management module, a temperature sensor and a semiconductor refrigerating piece are arranged in the film capacitor, the film capacitor core is connected with the temperature sensor, the temperature sensor is connected with the film capacitor heat management module, the film capacitor heat management module is connected with the semiconductor refrigerating piece, and the semiconductor refrigerating piece is connected with the film capacitor core.
2. The structure of a film capacitor as claimed in claim 1, wherein: the thin film capacitor thermal management module comprises a voltage conversion chip, a voltage stabilizer and a single chip microcomputer, wherein the voltage conversion chip, the voltage stabilizer and the single chip microcomputer are sequentially connected, the voltage conversion chip is connected with the single chip microcomputer, the voltage conversion chip is connected with the semiconductor refrigeration piece, and the single chip microcomputer is connected with the temperature sensor.
3. The structure of a film capacitor as claimed in claim 2, wherein: the thin film capacitor is connected with a motor controller main control board, the thin film capacitor is connected with the motor controller main control board through a thin film capacitor heat management module, the thin film capacitor heat management module is in communication connection with the motor controller main control board so as to acquire information outside the thin film capacitor, and the thin film capacitor heat management module provides a redundant power supply for the motor controller main control board.
4. The structure of a film capacitor as claimed in claim 3, wherein: the thin film capacitor heat management module is connected with the motor controller main control board through the voltage conversion chip to provide a redundant power supply for the motor controller main control board, and the thin film capacitor heat management module is in communication connection with the motor controller main control board through a single chip microcomputer to acquire information outside the thin film capacitor.
5. The structure of a film capacitor as claimed in claim 1, wherein: the thin film capacitor is connected with a high-voltage port, the thin film capacitor core body is connected with the high-voltage port, the thin film capacitor thermal management module is connected with the high-voltage port, and the high-voltage port provides high-voltage power supply for the thin film capacitor.
6. The structure of a film capacitor as claimed in claim 5, wherein: the thin film capacitor is connected with a motor controller power component, the motor controller power component is connected to the high-voltage port, and the thin film capacitor is connected with the motor controller power component through the high-voltage port.
7. The structure of a film capacitor as claimed in claim 1, wherein: the semiconductor refrigeration piece is connected with a water-cooling heat dissipation bottom plate, and the water-cooling heat dissipation bottom plate is arranged at the lower end of the thin film capacitor.
8. A heat dissipation method of a film capacitor comprises the structure of the film capacitor, and is characterized in that: the method comprises the following steps:
judging whether the output voltage of the voltage conversion chip is regulated or not according to the temperature of the thin film capacitor core body detected by the thin film capacitor heat management module through the temperature sensor;
when the thin film capacitor heat management module detects that the temperature of the thin film capacitor core is too high or the temperature rise rate is too fast, the thin film capacitor heat management module adjusts a high-voltage power supply mode into a low-voltage power supply mode through a voltage conversion chip, and therefore the heat dissipation power of the semiconductor refrigeration piece is adjusted.
9. The method for dissipating heat of a film capacitor as claimed in claim 8, wherein: the thin film capacitor thermal management module adjusts the heat dissipation power of the semiconductor chilling plate through the following steps:
after the high-voltage port is normally powered on, the thin film capacitor is applied with high voltage, a voltage conversion chip in the thin film capacitor thermal management module starts to work, a voltage stabilizer connected with the voltage conversion chip starts to supply power to the single chip microcomputer, and the single chip microcomputer starts to work;
when the thin film capacitor thermal management module detects that the temperature of the thin film capacitor core is too high or the temperature rise rate is too fast, the output voltage is adjusted through the voltage conversion chip, and therefore the heat dissipation power of the semiconductor refrigerating sheet is adjusted.
10. The method for dissipating heat of a film capacitor as claimed in claim 9, wherein: the heat dissipation power of the semiconductor refrigeration piece is adjusted through the following steps:
the single chip microcomputer collects the temperature of a film capacitor core body through a temperature sensor in the film capacitor or is in communication connection with the motor controller main control board to obtain information such as external direct current voltage, direct current, switching frequency, output torque, temperature of the water-cooling radiating bottom plate and the like, the radiating capacity required by the film capacitor is calculated through the obtained information, and the radiating power of the semiconductor refrigerating sheet is adjusted by adjusting the output voltage of the voltage conversion chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210124433.2A CN114420452B (en) | 2022-02-10 | 2022-02-10 | Structure of thin film capacitor and heat dissipation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210124433.2A CN114420452B (en) | 2022-02-10 | 2022-02-10 | Structure of thin film capacitor and heat dissipation method |
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| Publication Number | Publication Date |
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| CN114420452A true CN114420452A (en) | 2022-04-29 |
| CN114420452B CN114420452B (en) | 2023-10-31 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103825430A (en) * | 2014-03-10 | 2014-05-28 | 台州富凌电气有限公司 | Frequency converter capable of radiating by semiconductor refrigerating plates |
| CN108550475A (en) * | 2018-06-27 | 2018-09-18 | 安徽盛美金属科技有限公司 | A kind of circulating refrigerating device of thin film capacitor production radiator |
| CN110289168A (en) * | 2019-08-02 | 2019-09-27 | 北斗航天汽车（北京）有限公司 | Water cooling thin-film capacitor and electric machine controller |
| US20200126934A1 (en) * | 2017-05-17 | 2020-04-23 | Noda Screen Co., Ltd. | Thin-film capacitor structure and semiconductor device including the thin-film capacitor structure |
| CN214152715U (en) * | 2021-02-22 | 2021-09-07 | 郑州伟华电子科技有限公司 | Film capacitor heat abstractor |
| CN113827183A (en) * | 2020-06-23 | 2021-12-24 | 福州数据技术研究院有限公司 | Device and method for photoacoustic probe light-emitting protection based on transparent capacitor film |
-
2022
- 2022-02-10 CN CN202210124433.2A patent/CN114420452B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103825430A (en) * | 2014-03-10 | 2014-05-28 | 台州富凌电气有限公司 | Frequency converter capable of radiating by semiconductor refrigerating plates |
| US20200126934A1 (en) * | 2017-05-17 | 2020-04-23 | Noda Screen Co., Ltd. | Thin-film capacitor structure and semiconductor device including the thin-film capacitor structure |
| CN108550475A (en) * | 2018-06-27 | 2018-09-18 | 安徽盛美金属科技有限公司 | A kind of circulating refrigerating device of thin film capacitor production radiator |
| CN110289168A (en) * | 2019-08-02 | 2019-09-27 | 北斗航天汽车（北京）有限公司 | Water cooling thin-film capacitor and electric machine controller |
| CN113827183A (en) * | 2020-06-23 | 2021-12-24 | 福州数据技术研究院有限公司 | Device and method for photoacoustic probe light-emitting protection based on transparent capacitor film |
| CN214152715U (en) * | 2021-02-22 | 2021-09-07 | 郑州伟华电子科技有限公司 | Film capacitor heat abstractor |
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| CN114420452B (en) | 2023-10-31 |
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