CN114401479A - Bone voiceprint sensor and electronic equipment - Google Patents
Bone voiceprint sensor and electronic equipment Download PDFInfo
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- CN114401479A CN114401479A CN202111623974.1A CN202111623974A CN114401479A CN 114401479 A CN114401479 A CN 114401479A CN 202111623974 A CN202111623974 A CN 202111623974A CN 114401479 A CN114401479 A CN 114401479A
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- 239000000758 substrate Substances 0.000 claims abstract description 62
- 230000001755 vocal effect Effects 0.000 claims abstract description 6
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- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 4
- 230000035945 sensitivity Effects 0.000 abstract description 15
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- 230000009467 reduction Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
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- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
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Abstract
The application discloses bone vocal print sensor and electronic equipment, bone vocal print sensor includes: a substrate; the shell is arranged on the substrate, and the shell and the substrate surround to form an accommodating cavity; the vibration pickup assembly is arranged on the substrate and is positioned in the accommodating cavity; the MEMS chip is arranged on the vibration pickup assembly and is positioned in the accommodating cavity, and the MEMS chip, the vibration pickup assembly and the substrate surround the vibration pickup cavity; the supporting plate is arranged on the substrate, is positioned in the accommodating cavity, and is partially positioned above the MEMS chip; and the ASIC chip is arranged on the supporting plate and is positioned in the accommodating cavity, and the ASIC chip corresponds to the MEMS chip. This application stacks the upper and lower of MEMS chip and ASIC chip and arranges, has greatly reduced bone voiceprint sensor's size, can also improve the sensitivity of MEMS chip by at utmost simultaneously, promotes the wholeness ability of product.
Description
Technical Field
The present application relates to the field of sensor manufacturing technologies, and in particular, to a bone voiceprint sensor and an electronic device having the bone voiceprint sensor.
Background
Along with the miniaturization and high-precision development of the whole machine, especially a true wireless earphone, the limitation on the assembly space of the bone voiceprint sensor is stricter. The trend of miniaturization of sensors is a great direction of product development.
Currently, in the existing bone voiceprint sensors, especially built-in sensors, the MEMS chip and the ASIC chip are arranged side by side and are both located above the vibration pickup assembly. According to the arrangement form, on one hand, the MEMS chip and the ASIC chip are arranged side by side, so that the occupied space is large, and the size of the bone voiceprint sensor is increased. On the other hand, the effective vibration area of the MEMS chip corresponding to the vibration pickup assembly is relatively limited, so that the sensitivity of the MEMS chip is reduced, and the product performance is influenced.
Disclosure of Invention
An object of this application is to provide a new technical scheme of bone vocal print sensor, can solve the big, and not high scheduling problem of sensitivity of bone vocal print sensor size among the prior art at least.
According to a first aspect of the present application, there is provided a bone voiceprint sensor comprising: a substrate; the shell is arranged on the substrate, and the shell and the substrate enclose a containing cavity; the vibration pickup assembly is arranged on the substrate and is positioned in the accommodating cavity; the MEMS chip is arranged on the vibration pickup assembly and is positioned in the accommodating cavity, and the MEMS chip, the vibration pickup assembly and the substrate surround a vibration pickup cavity; the supporting plate is arranged on the substrate, is positioned in the accommodating cavity, and is partially positioned above the MEMS chip; the ASIC chip is arranged on the supporting plate and located in the accommodating cavity, and the ASIC chip corresponds to the MEMS chip.
Optionally, the support plate comprises: the first plate body is vertically arranged on the base plate, the second plate body is connected with the first plate body, the second plate body is oppositely arranged with the base plate, and the ASIC chip is arranged on the second plate body.
Optionally, the position of the ASIC chip on the support plate is opposite to the vibration pickup cavity.
Optionally, the support plate is a metal material or a plastic piece.
Optionally, the support plate is bonded or soldered to the substrate.
Optionally, the vibration pickup assembly comprises: the two vibrating rings are arranged on the substrate at intervals, and two ends of the MEMS chip are respectively arranged on the two vibrating rings; the two ends of the vibrating diaphragm are respectively connected with the two vibrating rings, the vibrating diaphragm divides the vibration pickup cavity into a first cavity and a second cavity, the first cavity faces the MEMS chip, the second cavity faces the substrate, and the MEMS chip is opposite to the vibrating diaphragm; the mass block is arranged on one side, facing the second cavity, of the diaphragm.
Optionally, a groove recessed away from the MEMS chip is formed at a position of the substrate corresponding to the vibration pickup cavity.
Optionally, a side of the housing opposite to the substrate is provided with a relief hole communicated with the accommodating cavity.
Optionally, the MEMS chip and the ASIC chip are connected by a first metal lead, and the ASIC chip is connected to the substrate by a second metal lead.
According to a second aspect of the present application, there is provided an electronic device comprising the bone voiceprint sensor described in the above embodiments.
According to the bone voiceprint sensor provided by the embodiment of the invention, the supporting plate is arranged between the MEMS chip and the ASIC chip, so that the MEMS chip and the ASIC chip are stacked up and down, the size of the bone voiceprint sensor is greatly reduced, and the assembly space of the whole machine is saved. Simultaneously, the MEMS chip is arranged on the vibration pickup assembly, the effective vibration area of the vibration pickup assembly can correspond to the MEMS chip, so that the MEMS chip can receive vibration signals of the vibration pickup assembly to the maximum extent, the bone voiceprint sensor is guaranteed to improve the sensitivity of the MEMS chip to the maximum extent while the size is reduced, and the overall performance of a product is improved.
Further features of the present application and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which is to be read in connection with the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
Fig. 1 is a schematic structural diagram of a bone voiceprint sensor of the present invention.
Reference numerals:
a bone voiceprint sensor 100;
a substrate 10; a groove 11;
a housing 20; the accommodation chamber 21; a gas release hole 22;
a vibration pick-up assembly 30; a vibrating ring 31; a diaphragm 32; a mass 33; a first chamber 34; a second chamber 35;
a MEMS chip 41; an ASIC chip 42;
a support plate 50; a first plate body 51; a second plate body 52;
a first metal lead 61; a second metal lead 62.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The bone voiceprint sensor 100 according to an embodiment of the present invention is described in detail below with reference to the accompanying drawings.
As shown in fig. 1, a bone voiceprint sensor 100 according to an embodiment of the present invention includes a substrate 10, a housing 20, a vibration pickup assembly 30, a MEMS chip 41, a support plate 50, and an ASIC chip 42.
Specifically, the housing 20 is provided on the substrate 10, and the housing 20 and the substrate 10 enclose the accommodating chamber 21. The vibration pickup assembly 30 is disposed on the substrate 10, and the vibration pickup assembly 30 is located in the accommodating cavity 21. The MEMS chip 41 is disposed on the vibration pickup assembly 30, the MEMS chip 41 is located in the accommodating cavity 21, and the MEMS chip 41, the vibration pickup assembly 30 and the substrate 10 enclose a vibration pickup cavity. The support plate 50 is disposed on the substrate 10, the support plate 50 is located in the accommodating cavity 21, and a portion of the support plate 50 is located above the MEMS chip 41. The ASIC chip 42 is provided on the support plate 50, the ASIC chip 42 is located in the accommodation chamber 21, and the ASIC chip 42 corresponds to the MEMS chip 41.
In other words, referring to fig. 1, the bone voiceprint sensor 100 according to the embodiment of the present invention is mainly composed of a substrate 10, a housing 20, a vibration pickup assembly 30, a MEMS chip 41, a support plate 50, and an ASIC chip 42. The bone voiceprint sensor 100 is a sensor that uses the vibration of the diaphragm 32 to drive the air flow, and thus detects the flow signal. The substrate 10 may be a Circuit Board, such as a PCB (Printed Circuit Board, which is a support for electronic components). The housing 20 is disposed on the substrate 10, the housing 20 may be a metal shell, and the housing 20 may protect components on the substrate 10 and may also isolate environmental noise. The housing 20 and the substrate 10 enclose a receiving cavity 21 for receiving each component.
The vibration pickup assembly 30 is disposed on the substrate 10. A MEMS chip 41 (MEMS: micro electro Mechanical Systems) is disposed on the vibration pickup assembly 30, and the vibration pickup assembly 30 and the MEMS chip 41 are both located in the accommodating chamber 21. The MEMS chip 41, the vibration pickup assembly 30 and the substrate 10 enclose a vibration pickup cavity. The MEMS chip 41 and the vibration pickup assembly 30 are directly opposite to each other, so that the effective vibration area of the vibration pickup assembly 30 can be ensured to be right opposite to the cavity of the MEMS chip 41, and the cavity between the two is minimized. This greatly encourages the airflow to flow and acts on the MEMS chip 41 to the maximum extent, causing its signal to rise accordingly.
The support plate 50 is disposed on the base plate 10, and the support plate 50 is located in the accommodation chamber 21. And a portion of the support plate 50 may extend from the substrate 10 over the MEMS chip 41. An ASIC chip 42(ASIC, i.e., application specific integrated circuit, refers to an integrated circuit designed and manufactured according to the requirements of a specific user and the requirements of a specific electronic system) is disposed on the supporting plate 50, and the ASIC chip 42 is located in the accommodating cavity 21. Through setting up backup pad 50, can realize that ASIC chip 42 and MEMS chip 41 stack from top to bottom in holding chamber 21 and arrange, greatly reduced bone voiceprint and go out the size of sensor, satisfy bone voiceprint sensor 100's miniaturized design demand, promote user and use experience.
In the present application, the MEMS chip 41 serves as an acoustic signal pickup chip, and the ASIC chip 42 serves as a signal processing chip. The vibration pickup assembly 30 can generate strong vibration after sensing external vibration signals, and the vibration of the vibration pickup assembly 30 drives the air inside the accommodating cavity 21 to vibrate and generate vibration airflow. The acoustic signal pickup chip (MEMS chip 41) can receive the gas flow caused by the vibration of the vibration pickup assembly 30, and realize signal conversion and processing through the signal processing chip (ASIC chip 42). And finally, the signal output is realized by the substrate 10 (PCB).
It should be noted that, for those skilled in the art, the vibration amplitude of the vibration pickup assembly 30 and the space between the vibration pickup assembly and the MEMS chip 41 will greatly affect the sensitivity, frequency response curve, etc. of the bone voiceprint sensor 100. Wherein, the larger the effective vibration area of the vibration pickup assembly 30 is, the larger the vibration amplitude is, the larger the airflow signal received by the MEMS chip 41 is, and the higher the sensitivity is. Therefore, the effect of the reduced effective area of the vibration pickup assembly 30 on the performance of the product should be considered when the product is designed in a miniaturized manner and the size of the device is reduced. How to satisfy both small size and high device performance is a major technical problem solved by the present application.
According to the bone voiceprint sensor 100, the arrangement mode of the MEMS chip 41 and the ASIC chip 42 is changed, the MEMS chip 41 and the ASIC chip 42 are stacked up and down through the structure of the supporting piece, the size of the bone voiceprint sensor 100 is greatly reduced, and the assembly space of the whole machine is saved. Meanwhile, since the size of the bone voiceprint sensor 100 is reduced, the size of the vibration pickup assembly 30 is also reduced correspondingly, and the air flow driven by the vibration pickup assembly 30 is reduced under the same vibration signal, so that the detection signal of the MEMS chip 41 is weakened. Therefore, the MEMS chip 41 is directly arranged on the vibration pickup assembly 30, the effective vibration area of the vibration pickup assembly 30 can be completely corresponding to the MEMS chip 41, so that the MEMS chip 41 can receive the airflow signal of the vibration pickup assembly 30 to the maximum extent, the bone voiceprint sensor 100 can be ensured to reduce the space, the sensitivity of the MEMS chip 41 can be improved to the maximum extent, and the overall performance of the product is improved.
Therefore, according to the bone voiceprint sensor 100 provided by the embodiment of the invention, the supporting plate 50 is arranged between the MEMS chip 41 and the ASIC chip 42, so that the MEMS chip 41 and the ASIC chip 42 are stacked up and down, the size of the bone voiceprint sensor 100 is greatly reduced, and the assembly space of the whole machine is saved. Simultaneously, according to the bone voiceprint sensor 100, the MEMS chip 41 is arranged on the vibration pickup assembly 30, the effective vibration area of the vibration pickup assembly 30 can correspond to the MEMS chip 41, so that the MEMS chip 41 can receive the vibration signal of the vibration pickup assembly 30 to the maximum extent, the bone voiceprint sensor 100 can improve the sensitivity of the MEMS chip 41 to the maximum extent while the size is reduced, and the overall performance of a product is improved.
According to one embodiment of the present invention, the support plate 50 includes: the first board body 51 is vertically arranged on the substrate 10, the second board body 52 is connected with the first board body 51, the second board body 52 is arranged opposite to the substrate 10, and the ASIC chip 42 is arranged on the second board body 52.
That is, as shown in fig. 1, the supporting plate 50 is mainly composed of a first plate body 51 and a second plate body 52, wherein the first plate body 51 is vertically disposed on the substrate 10, and the first plate body 51 is located at one side of the vibration pickup assembly 30 and the MEMS chip 41. The second plate body 52 is connected to the first plate body 51, and the second plate body 52 is disposed opposite to the base plate 10 such that the cross-section of the support plate 50 forms an inverted L-shape. The ASIC chip 42 is disposed on the second board 52, and the MEMS chip 41 and the ASIC chip 42 are stacked on top of each other, so that the size of the bone voiceprint sensor 100 is greatly reduced. Simultaneously with MEMS chip 41 setting on picking up the subassembly 30 that shakes, make the effective vibration area of picking up the subassembly 30 that shakes all can correspond with MEMS chip 41, MEMS chip 41 can receive the vibration signal of picking up the subassembly 30 that shakes to the at utmost, when guaranteeing that bone voiceprint sensor 100 reduces in the space, can also improve MEMS chip 41's sensitivity by the at utmost, promote the wholeness ability of product.
According to one embodiment of the present invention, the ASIC chip 42 is located on the support plate 50 opposite the vibration pickup cavity.
That is, as shown in fig. 1, the position of the ASIC chip 42 on the supporting plate 50 is opposite to the positions of the MEMS chip 41 and the vibration pickup assembly 30, so as to further reduce the occupied space of the ASIC chip 42, the MEMS chip 41 and the vibration pickup assembly 30 in the accommodating cavity 21, which is beneficial to meet the requirement of miniaturization design of the bone voiceprint sensor 100. Meanwhile, the ASIC chip 42, the MEMS chip 41 and the vibration pickup assembly 30 are arranged oppositely, signal transmission among the ASIC chip, the MEMS chip 41 and the vibration pickup assembly 30 is facilitated, the MEMS chip 41 can receive vibration signals of the vibration pickup assembly 30 to the maximum degree, the bone voiceprint sensor 100 is guaranteed to be reduced in size, the sensitivity of the MEMS chip 41 can be improved to the maximum degree, and the overall performance of a product is improved.
In some embodiments of the present invention, the supporting plate 50 is a metal material or a plastic material. The support plate 50 is bonded or soldered to the base plate 10.
In other words, the material of the supporting plate 50 includes, but is not limited to, metal or plastic, the supporting plate 50 and the base plate 10 can be designed into an integral structure, so as to ensure the stability of the connection between the supporting plate 50 and the base plate 10, and at the same time, the assembling difficulty of the supporting plate 50 and the base plate 10 can be reduced, so as to ensure that the overall assembling process of the bone voiceprint sensor 100 is simpler. The supporting plate 50 and the substrate 10 may also be connected by bonding, and two or three sides of the supporting plate 50 may be connected by bonding or welding with the substrate 10. The ASIC chip 42 can be bonded to the supporting plate 50 by an adhesive, and by providing the supporting plate 50, the ASIC chip 42 and the MEMS chip 41 are stacked up and down on the supporting plate 50, so that the size of the bone voiceprint sensor 100 can be greatly reduced, and the assembly of the internal space of a small-sized device is facilitated.
Meanwhile, because of the size reduction of the bone voiceprint sensor 100, the effective vibration area of the vibration pickup assembly 30 is reduced, and in order to avoid the sensitivity reduction of the MEMS chip 41, the size design of the vibration pickup assembly 30 is matched with the acoustic signal pickup chip (MEMS chip 41), so that the effective vibration area of the vibration pickup assembly 30 is right opposite to the cavity of the acoustic signal pickup chip, and the cavity between the two is minimized, thus the airflow flow can be greatly driven, and the maximum degree of the airflow acts on the acoustic signal pickup chip, so that the signal response of the acoustic signal pickup chip is improved.
According to one embodiment of the present invention, the vibration pickup assembly 30 includes two vibrating rings 31, a diaphragm 32, and a mass 33.
Specifically, two vibration rings 31 are disposed on the substrate 10 at intervals, and both ends of the MEMS chip 41 are disposed on the two vibration rings 31, respectively. The two ends of the diaphragm 32 are respectively connected with the two vibrating rings 31, the diaphragm 32 divides the vibration pickup cavity into a first cavity 34 and a second cavity 35, the first cavity 34 faces the MEMS chip 41, the second cavity 35 faces the substrate 10, and the MEMS chip 41 faces the diaphragm 32. The mass 33 is arranged on the side of the diaphragm 32 facing the second chamber 35.
That is, referring to fig. 1, the vibration pickup assembly 30 is mainly composed of two vibration rings 31, a diaphragm 32, and a mass 33. Wherein, two vibration rings 31 are arranged on the substrate 10 at intervals, and the vibration rings 31 are hollow structures. Two ends of the diaphragm 32 are respectively connected to the two vibration rings 31, and the vibration rings 31 can provide a supporting function for the diaphragm 32. The MEMS chip 41 is disposed on the two vibrating rings 31, and the vibrating diaphragm 32 is located between the MEMS chip 41 and the substrate 10. The diaphragm 32 divides the vibration pickup cavity into a first cavity 34 and a second cavity 35, wherein the first cavity 34 faces the MEMS chip 41, and the second cavity 35 faces the substrate 10. The MEMS chip 41 faces the diaphragm 32, and when the diaphragm 32 senses an external vibration signal, the diaphragm 32 can vibrate up and down between the first chamber 34 and the second chamber 35 to form a vibrating airflow. The mass 33 may be arranged on the side of the diaphragm 32 facing the second chamber 35. The mass 33 and the diaphragm 32 may be fixed by using a patch adhesive. The mass 33 is located at the center of the diaphragm 32. When the vibrating diaphragm 32 vibrates, because the existence of quality piece 33, can show the vibration amplitude of promotion vibrating diaphragm 32 under equal vibration signal to produce bigger vibration air current, effectively promote bone vocal print sensor 100's sensitivity.
In this application, the effective area that vibrating diaphragm 32 vibrates and MEMS chip 41 adaptation guarantee that the effective vibration area of vibrating diaphragm 32 can just to MEMS chip 41. The vibrating airflow generated after the vibrating diaphragm 32 vibrates can act on the MEMS chip 41 to the utmost extent, so that the sensitivity of the MEMS chip 41 is effectively improved, the output signal of the bone voiceprint sensor 100 is improved, the bone voiceprint sensor 100 can be ensured to have size and performance taken into account, and the user experience is improved.
In some embodiments of the invention, the substrate 10 is formed with a recess 11 recessed away from the MEMS chip 41 at a location corresponding to the vibration pickup cavity.
That is to say, as shown in fig. 1, the substrate 10 is provided with the groove 11, the groove 11 corresponds to the position of the vibration pickup cavity, and by providing the groove 11, the space of the vibration pickup cavity can be further increased, so that it is convenient to design the mass block 33 and the diaphragm 32 with larger vibration amplitude, and the performance of the bone voiceprint sensor 100 is further improved.
According to one embodiment of the present invention, the side of the housing 20 opposite to the substrate 10 is provided with a relief hole 22 communicating with the receiving cavity 21.
In other words, as shown in fig. 1, the top of the housing 20 may be provided with a release hole 22 communicating with the accommodating cavity 21, and the release hole 22 may effectively balance the internal and external air pressures of the device, thereby preventing the pressure inside the accommodating cavity 21 from being uneven and reducing the potential safety hazard.
According to one embodiment of the present invention, the MEMS chip 41 and the ASIC chip 42 are connected by a first metal lead 61, and the ASIC chip 42 is connected to the substrate 10 by a second metal lead 62.
That is, referring to fig. 1, the MEMS chip 41 and the ASIC chip 42 may be connected by a first metal wire 61. The ASIC chip 42 may be connected to the substrate 10 through a second metal lead 62 to realize signal transmission. The MEMS chip 41 and the ASIC chip 42 are connected by a first metal lead 61, the MEMS chip 41 can transmit the induced signal to the ASIC chip 42, and the ASIC chip 42 is connected to the substrate 10 by a second metal lead 62. The signal generated by the MEMS chip 41 is processed by the ASIC chip 42, transmitted to the substrate 10 through the second metal lead 62, and finally transmitted to an external signal processing device for signal analysis.
The materials of the first metal lead 61 and the second metal lead 62 may be the same or different, for example, gold wires may be used for both the first metal lead 61 and the second metal lead 62, which has good wiring and conducting functions.
In summary, according to the bone voiceprint sensor 100 of the embodiment of the invention, the supporting plate 50 is arranged between the MEMS chip 41 and the ASIC chip 42, so that the MEMS chip 41 and the ASIC chip 42 are stacked up and down, the size of the bone voiceprint sensor 100 is greatly reduced, and the assembly space of the whole machine is saved. Simultaneously, according to the bone voiceprint sensor 100, the MEMS chip 41 is arranged on the vibration pickup assembly 30, the effective vibration area of the vibration pickup assembly 30 can correspond to the MEMS chip 41, so that the MEMS chip 41 can receive the vibration signal of the vibration pickup assembly 30 to the maximum extent, the bone voiceprint sensor 100 can improve the sensitivity of the MEMS chip 41 to the maximum extent while the size is reduced, and the overall performance of a product is improved.
According to a second aspect of the present application, there is provided an electronic device comprising the bone voiceprint sensor 100 of the above-described embodiments. The electronic device of the present application may be, but is not limited to, a headset, an earphone, a smart watch, a smart bracelet, a vehicle noise reduction device, a vibration sensing device, and other electronic devices known to those skilled in the art. Since the bone voiceprint sensor 100 according to the embodiment of the present invention has the above technical effects, the electronic device according to the embodiment of the present invention should also have corresponding technical effects, that is, by using the bone voiceprint sensor 100 in the above embodiment, the size of the bone voiceprint sensor 100 is greatly reduced, and the assembly space of the electronic device is saved. Simultaneously, according to the bone voiceprint sensor 100, the MEMS chip 41 is arranged on the vibration pickup assembly 30, the effective vibration area of the vibration pickup assembly 30 can correspond to the MEMS chip 41, so that the MEMS chip 41 can receive the vibration signal of the vibration pickup assembly 30 to the maximum extent, the bone voiceprint sensor 100 can improve the sensitivity of the MEMS chip 41 to the maximum extent while the size is reduced, and the overall performance of a product is improved.
Of course, other configurations and operating principles of the electronics and bone voiceprint sensor 100 will be understood and can be implemented by those skilled in the art, and will not be described in detail in this application.
Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.
Claims (10)
1. A bone voiceprint sensor (100), comprising:
a substrate (10);
the shell (20), the shell (20) is arranged on the substrate (10), and the shell (20) and the substrate (10) enclose a containing cavity (21);
the vibration pickup assembly (30), the vibration pickup assembly (30) is arranged on the substrate (10), and the vibration pickup assembly (30) is positioned in the accommodating cavity (21);
the MEMS chip (41) is arranged on the vibration pickup assembly (30), the MEMS chip (41) is positioned in the accommodating cavity (21), and the MEMS chip (41), the vibration pickup assembly (30) and the substrate (10) enclose a vibration pickup cavity;
a support plate (50), wherein the support plate (50) is arranged on the substrate (10), the support plate (50) is positioned in the accommodating cavity (21), and a part of the support plate (50) is positioned above the MEMS chip (41);
an ASIC chip (42), the ASIC chip (42) is arranged on the supporting plate (50), the ASIC chip (42) is positioned in the accommodating cavity (21), and the ASIC chip (42) corresponds to the MEMS chip (41).
2. The bone voiceprint sensor (100) of claim 1, wherein the support plate (50) comprises: first plate body (51) and second plate body (52), first plate body (51) is vertical to be set up on base plate (10), second plate body (52) with first plate body (51) are connected, just second plate body (52) with base plate (10) mutual disposition, establish ASIC chip (42) on second plate body (52).
3. The bone voiceprint sensor (100) of claim 1 wherein the location of said ASIC chip (42) on said support plate (50) is directly opposite said vibration pickup cavity.
4. The bone voiceprint sensor (100) of claim 1, wherein said support plate (50) is a piece of metallic or plastic material.
5. The bone voiceprint sensor (100) of claim 1, wherein the support plate (50) is adhesively or solder-connected to the base plate (10).
6. The bone voiceprint sensor (100) of claim 1, wherein the vibration pickup assembly (30) comprises:
the two vibration rings (31) are arranged on the substrate (10) at intervals, and two ends of the MEMS chip (41) are respectively arranged on the two vibration rings (31);
the two ends of the diaphragm (32) are respectively connected with the two vibration rings (31), the diaphragm (32) divides the vibration pickup cavity into a first cavity (34) and a second cavity (35), the first cavity (34) faces the MEMS chip (41), the second cavity (35) faces the substrate (10), and the MEMS chip (41) faces the diaphragm (32);
a mass (33), the mass (33) being arranged on a side of the diaphragm (32) facing the second chamber (35).
7. The bone voiceprint sensor (100) of claim 1, wherein a recess (11) recessed away from the MEMS chip (41) is formed at a location of the substrate (10) corresponding to the vibration pickup cavity.
8. The bone vocal print sensor (100) according to claim 1, wherein a side of the housing (20) opposite to the substrate (10) is provided with a relief hole (22) communicating with the receiving cavity (21).
9. The bone voiceprint sensor (100) according to claim 1, characterised in that said MEMS chip (41) and said ASIC chip (42) are connected by a first metal lead (61), said ASIC chip (42) being connected to said substrate (10) by a second metal lead (62).
10. An electronic device, characterized in that it comprises a bone voiceprint sensor (100) according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111623974.1A CN114401479A (en) | 2021-12-28 | 2021-12-28 | Bone voiceprint sensor and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111623974.1A CN114401479A (en) | 2021-12-28 | 2021-12-28 | Bone voiceprint sensor and electronic equipment |
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| CN114401479A true CN114401479A (en) | 2022-04-26 |
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| CN202111623974.1A Pending CN114401479A (en) | 2021-12-28 | 2021-12-28 | Bone voiceprint sensor and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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