CN114396818A - VC soaking plate cover plate heat dissipation module - Google Patents
VC soaking plate cover plate heat dissipation module Download PDFInfo
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- CN114396818A CN114396818A CN202210124075.5A CN202210124075A CN114396818A CN 114396818 A CN114396818 A CN 114396818A CN 202210124075 A CN202210124075 A CN 202210124075A CN 114396818 A CN114396818 A CN 114396818A
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- 238000002791 soaking Methods 0.000 title claims abstract description 70
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 56
- 230000005855 radiation Effects 0.000 claims abstract description 3
- 230000008093 supporting effect Effects 0.000 claims description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 238000003860 storage Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000010992 reflux Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 52
- 230000000694 effects Effects 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000001179 sorption measurement Methods 0.000 description 10
- 238000003466 welding Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 230000002153 concerted effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000008542 thermal sensitivity Effects 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of heat dissipation. Aims to provide a VC soaking plate cover plate heat dissipation module which comprises a first soaking plate; the first soaking plate comprises an upper cover plate and a lower cover plate; the internal surface of apron has set gradually support mesh board and main part capillary layer down along the direction of keeping away from the upper cover plate, evenly is provided with a plurality of rows of support columns between the face of upper cover plate and apron down, the both ends of support column contact with the internal surface of upper cover plate and the support mesh board in the apron down respectively, the surface of support column is provided with column table capillary layer. The invention can provide a more convenient path for the reflux of the working medium, shorten the reflux stroke of part of the working medium and further effectively ensure the heat radiation performance of the soaking plate.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a VC soaking plate cover plate heat dissipation module.
Background
In recent years, with the rapid development of the related industries of electronic information technology, various electronic devices with high integration level and high power are continuously applied to intelligent devices such as mobile phones and flat panels, and meanwhile, the requirements on a heat dissipation module are higher and higher in order to ensure the stable working condition of the device and the performance of the device. The vapor chamber is a heat dissipation device widely applied to mobile phones and flat plates, and has the advantages of good heat dissipation effect, strong product adaptability and the like.
The traditional soaking plate generally comprises an upper cover plate and a lower cover plate which are made of copper, wherein the upper cover plate and the upper cover plate are welded and sealed to form a vacuum chamber, and a capillary structure is arranged on the lower cover plate; during production, the interior of the cavity is vacuumized through a degassing port (also a water injection port) reserved on the upper cover plate and the lower cover plate, pure water is injected, and then the degassing port is sealed. When the vapor chamber is used, the vapor chamber is attached to a heat source, and after heat is absorbed by pure water, the pure water is gasified and phase-changed to absorb a large amount of heat; then condensing on the upper cover plate, and then converging under the action of gravity; by means of the capillary structure on the lower cover plate, condensed pure water is re-adsorbed to the position where the evaporation heat source is located, and enters the next heat dissipation cycle. Although the vapor chamber technology is widely applied to heat dissipation of various high-end electronic devices, the inventors of the present invention have found through long-term research on vapor chambers that the existing vapor chambers have the following defects:
1. the working medium (namely pure water) of the traditional vapor chamber reflows and completely depends on the capillary structure arranged on the lower cover plate to perform reflowing adsorption through the capillary effect, namely the working process of the working medium comprises the steps of evaporating near a heat source, condensing on the upper cover plate, flowing to a low position along the upper cover plate under the action of gravity to converge, and adsorbing and reflowing near the heat source under the action of the capillary structure; to a certain extent, the whole working stroke of the working medium determines the heat dissipation efficiency of the soaking plate,
when the device runs at high power and high frequency, if the working medium on the upper cover plate still needs to be gathered to the lowest position along the upper cover plate, and then forms adsorption reflux through the capillary structure, the heat dissipation efficiency of the soaking plate is affected due to the overlong stroke. Under some extreme conditions, even partial dry burning occurs, which causes severe heat and scald of the equipment and influences normal use. Therefore, if multiple paths are provided for the condensed working medium to return to the heat source under the limited space condition, the heat dissipation cycle stroke length of the working medium can be effectively shortened.
2. The capillary structure of the traditional vapor chamber is generally an extremely thin capillary copper mesh, the pores of all parts of the capillary copper mesh are uniform, namely, the capillary adsorption force of all the positions of the whole capillary copper mesh is basically consistent, and under the condition of general use, the capillary copper mesh can basically meet the use requirement. However, for a part of equipment with high heat dissipation density requirement and a plurality of heat source points, in a part of using states, the working medium cannot be guaranteed to stably reach each heat source position because the convergence position of the working medium is far away. For example: when equipment is used vertically and obliquely, the gathering position of the working medium is positioned at the bottom of the soaking plate, and when the soaking plate is used for ensuring the heat dissipation of the upper heat source point and the lower heat source point, the working medium cannot stably reach the upper heat source point, so that local dry burning is caused, and the normal use of the equipment is influenced. Therefore, how to ensure that the working medium flows back in the whole capillary copper mesh stably and efficiently, the occurrence of backflow dead angles is avoided, and the heat dissipation performance of the soaking plate can be effectively improved.
3. Traditional vapor chamber independent utility, its one side (lower apron) and heat source laminating usually, another side (upper cover) and the heat dissipation backplate laminating of equipment, vapor chamber conduct the heat behind the heat dissipation backplate, lid behind rethread heat dissipation backplate diffusion to equipment, and then realize the heat dissipation. However, since the vapor chamber is generally small in size, the contact area between the upper cover plate and the heat dissipation back plate is limited, when the device operates at high power and high frequency, the small contact area between the upper cover plate and the heat dissipation back plate cannot ensure rapid heat transfer, so that local heat deposition of the heat dissipation back plate is caused, local heating of the device is caused, condensation of a working medium in the vapor chamber at the upper cover plate is also influenced, and thus vicious circle of heat dissipation is caused. Therefore, how to improve the heat exchange between the upper cover plate of the soaking plate and the equipment heat dissipation back plate is also a key link for improving the heat dissipation performance of the soaking plate.
Disclosure of Invention
The invention aims to provide a VC soaking plate cover plate heat dissipation module capable of shortening the return stroke of a working medium.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows: a VC soaking plate cover plate heat radiation module comprises a first soaking plate;
the first soaking plate comprises an upper cover plate and a lower cover plate; the internal surface of apron has set gradually support mesh board and main part capillary layer down along the direction of keeping away from the upper cover plate, evenly is provided with a plurality of rows of support columns between the face of upper cover plate and apron down, the both ends of support column contact with the internal surface of upper cover plate and the support mesh board in the apron down respectively, the surface of support column is provided with column table capillary layer.
Preferably, the column surface capillary layer is formed from copper powder sintered to the outer surface of the support pillars.
Preferably, a plurality of inwards concave intercepting water storage areas are arranged on the circumferential surface of the supporting column.
Preferably, the cross section of the support column is X-shaped, and four concave parts of the X-shape form four intercepting water storage areas.
Preferably, the supporting column is formed by abutting two column plates with semicircular cross sections back to back.
Preferably, the two column plates are respectively arranged on the upper cover plate and the support mesh plate.
Preferably, the outer surface of the column plate is provided with a diversion trench extending along the length direction of the column plate.
Preferably, the four corners of the lower cover plate are provided with triangular supporting steps, the edges of the supporting mesh plates are abutted against the supporting steps, and the plate surfaces of the supporting mesh plates are pressed against the main capillary layer.
Preferably, the supporting step is further provided with a positioning concave portion, the supporting mesh plate is provided with a positioning protrusion matched with the positioning concave portion, and the positioning protrusion is located in the positioning concave portion.
Preferably, two adjacent rows of support posts are staggered.
The beneficial effects of the invention are concentrated and expressed as follows: can provide more convenient route for the backward flow of working medium, shorten the backward flow stroke of part working medium, and then the heat dispersion of effectual assurance vapor chamber. Specifically, in the using process, a heat source is contacted with the lower cover plate, and heat generated by the heat source is conducted into the first soaking plate through the lower cover plate; the working medium absorbs a large amount of heat and generates gasification phase change, and the gaseous working medium is condensed at the upper cover plate and emits heat to be transmitted to a subsequent low-temperature region through the upper cover plate; the condensed liquid working medium slides down along the upper cover plate under the action of gravity, and in the sliding process, part of the liquid working medium is blocked by the supporting column and is attracted by the column surface capillary layer on the supporting column, and directly flows back to the corresponding area of the main capillary layer along the supporting column or is directly absorbed by the column surface capillary layer and temporarily stored in the column surface capillary layer. Compared with the traditional mode of only carrying out adsorption reflux through the main capillary layer, the invention widens the reflux path of the working medium, shortens the reflux stroke of the working medium and can effectively improve the heat dissipation effect of the soaking plate. Meanwhile, the column surface capillary layer can be used as a temporary storage space of a liquid working medium, can reduce the occurrence of dry burning phenomenon, and is particularly suitable for heat dissipation of electronic devices with high heat density.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a view from direction A-A of the structure shown in FIG. 1;
FIG. 3 is a top view of the lower cover plate;
FIG. 4 is an enlarged view of portion B of FIG. 3;
fig. 5 is a schematic structural view of the structure shown in fig. 3 after installation of the main capillary layer;
FIG. 6 is a schematic view of the structure shown in FIG. 5 with the support mesh panels installed;
FIG. 7 is a schematic structural view of the opposite side of the back plate and the upper cover plate;
FIG. 8 is a schematic structural view of a support column;
fig. 9 is a schematic structural view of the column plate.
Detailed Description
As shown in fig. 1-9, the soaking plate heat dissipation module is mainly applied to intelligent electronic devices, such as: the heat dissipation device is used for dissipating heat and cooling core electronic devices with high heating density such as a display card and a CPU (central processing unit) in equipment such as a mobile phone, a tablet personal computer and a notebook computer, so that the working stability of the equipment is improved, and the comprehensive performance of the equipment is improved.
Compared with the traditional soaking plate, the invention mainly comprises the following three aspects of performance optimization:
1. a new path is provided for the backflow of the working medium in the soaking plate, the backflow stroke of part of the working medium is shortened, the working medium can be more efficiently participated in the heat dissipation cycle, and the overall heat dissipation effect of the soaking plate heat dissipation module is improved;
2. the capillary structure in the soaking plate is optimized, and particularly the partition arrangement of the main capillary layer enables the working medium to flow back to each position of the main capillary layer more stably and efficiently, so that the risk of occurrence of capillary backflow dead corners is reduced;
3. when the heat source to high heat density dispels the heat, adopt the heat dissipation form of double-deck soaking board, that is to say first soaking board and second soaking board concerted movement, and a apron is shared to two-layer soaking board, can effectually avoid the heat siltation, realize thermal dispersion, derive.
The improvement and optimization of the three aspects of the invention can be independently applied to the heat dissipation module of the soaking plate, or can be combined in pairs or all in combination to be applied to the heat dissipation module of the soaking plate.
The core technical scheme of the invention is explained in the following three specific improvements:
viewed from a first aspect, as shown in fig. 1 and 2, the present invention comprises a first soaking plate 1, said first soaking plate 1 comprising an upper cover plate 2 and a lower cover plate 3, the upper cover plate 2 and the lower cover plate 3 being generally copper plates, which are of the same size, facilitating the welding of the two; however, in the case of the double-layered soaking plate, the size of the upper cover plate 2 is much larger than that of the lower cover plate 3, which will be described in detail below and will not be described in detail in this embodiment. The upper and lower cover plates are defined according to the position close to the heat source 0 in the normal use process, the lower cover plate 3 is the cover plate close to the heat source 0, the upper cover plate 2 is the cover plate far away from the heat source 0 relative to the lower cover plate 3, and the heat source 0 is tightly attached to the outer surface of the lower cover plate 3 in use and can be bonded through heat conduction grease generally in order to ensure the stability of heat conduction.
As shown in fig. 2, the inner surface of the lower cover plate 3 is sequentially provided with a supporting mesh plate 4 and a main capillary layer 5 along a direction away from the upper cover plate 2, the main capillary layer 5, that is, a core component in the soaking plate, which has a capillary adsorption effect, has a good capillary effect, and can be generally formed by sintering copper powder, directly formed by a porous capillary copper mesh, or formed by other methods. Evenly be provided with a plurality of rows of support columns 6 between the face of upper cover plate 2 and lower apron 3, the both ends of support column 6 contact with the internal surface of upper cover plate 2 and the support mesh board 4 in the apron 3 down respectively, and the effect of support column 6 mainly lies in forming the support to upper cover plate 2 and lower apron 3, avoids collapsing to the reliability of the space support between the apron about guaranteeing. The two adjacent rows of support columns 6 may be opposite to each other, so that the support columns 6 are arranged in a matrix as a whole, and of course, as shown in fig. 6 and 7, the two adjacent rows of support columns 6 may also be staggered with each other.
According to the invention, the outer surface of the supporting column 6 is provided with the column surface capillary layer 7, and the column surface capillary layer 7 is the capillary layer arranged on the surface of the supporting column 6, and can absorb and transfer the working medium condensed on the upper cover plate 2 back to the main capillary layer 5 to perform a second evaporation and condensation cycle. The capillary layer 7 is also formed in many ways, for example: the copper powder is sintered on the outer surface of the supporting post 6, or the supporting post 6 is coated with a porous layer structure. However, for most of the use cases, the pillar surface capillary layer 7 is formed in a sintered form of copper powder in most cases because the heat dissipation module has a small overall volume and the pillar 6 has a smaller volume and is inconvenient to coat.
In the using process of the invention, a heat source 0 is contacted with a lower cover plate 3, and the heat generated by the heat source is conducted into a first soaking plate 1 through the lower cover plate 3; the working medium absorbs a large amount of heat and generates gasification phase change, the gaseous working medium is condensed at the upper cover plate 2 and emits heat, and the heat is transmitted to a subsequent low-temperature region through the upper cover plate 2; the condensed liquid working medium slides down along the upper cover plate 2 under the action of gravity, and in the sliding process, part of the liquid working medium is blocked by the supporting column 6 and is attracted by the column surface capillary layer 7 on the supporting column 6, and directly flows back to the region corresponding to the main capillary layer 5 along the supporting column 6, or is directly absorbed by the column surface capillary layer 7 and temporarily stored in the column surface capillary layer 7. In addition, in order to improve the smoothness of the movement of the working medium, the column plate 9 may be provided with a guide groove 10 extending in the longitudinal direction of the column plate 9 on the outer surface thereof, and the guide groove 10 is generally formed by etching. Compared with the traditional mode of only carrying out adsorption reflux through the main capillary layer 5, the invention widens the reflux path of the working medium, shortens the reflux stroke of the working medium and can effectively improve the heat dissipation effect of the soaking plate. Meanwhile, the column surface capillary layer 7 can be used as a temporary storage space of a liquid working medium, can reduce the occurrence of dry burning phenomenon, and is particularly suitable for heat dissipation of electronic devices with high heat density.
The support column 6 of the present invention has many specific forms, for example: the shapes of a cylinder, a square column and the like can be adopted, but the shapes have limited temporary storage capacity of the working medium due to no concave part on the peripheral surface, and theoretically, only the saturated adsorption capacity of the capillary layer 7 on the column surface can be achieved; in order to further improve the overall heat dissipation efficiency, the present invention may further be better that a plurality of concave intercepting water storage areas 8 are disposed on the circumferential surface of the supporting column 6. The water storage area 8 that dams that form on the support column 6 is the depressed area that dams, the working medium of condensation receives the hindrance of support column 6 when flowing back along upper cover plate 2, moves along support column 6 to can assemble to a certain extent in the water storage area 8 that dams. For example: when the supporting column 6 is cylindrical, the intercepting water storage area 8 can be an arc-shaped groove arranged on the side surface of the supporting column 6.
Because the invention is attached to intelligent electronic equipment for use, for example, when equipment such as a mobile phone and the like is used, the holding direction of the invention is not completely fixed, in order to realize effective interception and temporary storage of working media at various angles, as shown in fig. 8, the cross section of the support column 6 is in an X shape, and four X-shaped concave parts form four interception water storage areas 8, so that the interception water storage areas 8 have better effects at various use angles. In general, the supporting pillars 6 may be directly disposed on the upper cover plate 2 by sintering, welding, or the like, but in order to further improve the supporting effect, and ensure the stability of the installation of the upper and lower cover plates and the stability of the whole first vapor chamber 1, the supporting pillars 6 are formed by splicing and abutting. As shown in fig. 8 and 9, that is, the supporting column 6 of the present invention is formed by two column plates 9 with semicircular cross sections abutting back to back, and the two column plates 9 are respectively arranged on the upper cover plate 2 and the supporting mesh plate 4. Not only can form complete support column 6 like this, simultaneously, through supporting leaning on of mainboard 9 on the upper cover plate 3 and the column plate 9 on supporting mesh board 4, can also realize the location to upper cover plate 2, supporting mesh board 4 and lower apron 3 for first soaking board 1 keeps good structural stability and structural strength.
Of course, in order to ensure the stability of the installation of the supporting mesh plate 4 in the lower cover plate 3, as shown in fig. 3 and 4, the four corners of the lower cover plate 3 are provided with triangular supporting steps 11, the edges of the supporting mesh plate 4 are abutted against the supporting steps 11, and the plate surface of the supporting mesh plate 4 is pressed against the main capillary layer 5. Furthermore, a positioning concave part 12 can be further arranged on the supporting step 11, and a positioning protrusion matched with the positioning concave part 12 is arranged on the supporting mesh plate 4 and is positioned in the positioning concave part 12.
From a second aspect, the invention further improves the capillary structure of the main capillary layer 5, so that the working medium can be better adsorbed on the main capillary layer 5, and the risk of a backflow dead zone where the working medium cannot flow back due to insufficient adsorption force of the main capillary layer 5 is reduced. As shown in fig. 5, the main body capillary layer 5 of the present invention includes a central coarse capillary zone 13 located in the middle and edge fine capillary zones 14 located on both sides, and both the central coarse capillary zone 13 and the edge fine capillary zones 14 extend along the length direction of the main body capillary layer 5. The thickness of the central thick capillary region 13 and the thickness of the edge thin capillary region 14 are different from each other, that is, the theoretical capillary adsorption forces of the central thick capillary region and the edge thin capillary region are different from each other, that is, the capillary force of the edge region is greater than that of the central region, and under the same conditions, the reflux adsorption effect of the edge region on the working medium is better than that of the central region. For example: when the main capillary layer 5 is a capillary copper mesh, the specific form of the main capillary layer shows that the pore density of the capillary copper mesh in the central coarse capillary region 13 is smaller than that of the edge fine capillary region 14, and the edge fine capillary region 14 has a better capillary effect, and can adsorb a working medium to a higher region in a vertical working state as shown in fig. 5.
On this basis, in order to further ensure the above effect, a partition plate 15 is disposed between the junction of the central thick capillary region 13 and the edge thin capillary region 14, the partition plate 15 extends from the middle of the main capillary layer 5 to one end of the main capillary layer 5, a cross-flow section 16 is formed between the partition plate 15 and the other end of the main capillary layer 5, generally, the length of the cross-flow section 16 is between 1/5 and 1/2 of the length of the main capillary layer 5, and the length is in a specific range, so that a designer can perform adaptive design according to the position of the heat source 0, the number of the heat sources, and the like, and as a blank area at a dashed line frame in fig. 5 indicates the position of the heat source 0. In this case, the main capillary layer 5 is generally formed by splicing a central coarse capillary region 13 with sparse pores in the center and edge fine capillary regions 14 with dense pores on both sides, wherein a separation plate 15 is arranged between the lower sections of the two, and the upper sections are directly and tightly spliced. Of course, in order to improve the stability of the whole capillary layer 5, a frame may be added on the outside.
In the use process, the working medium needed in the heat dissipation of the section (the section with the lower spatial position) close to the lower part of the main capillary layer 5 is directly adsorbed mainly by the central thick capillary region 13, and the working medium needed in the heat dissipation of the section (the section with the higher spatial position) close to the upper part of the main capillary layer 5 is adsorbed mainly by the edge thin capillary region 14 and then is adsorbed by the central thick capillary region 13 through the transverse flow section 16.
In addition, in order to further improve the smoothness of the working medium flowing along the main capillary layer 5, as shown in fig. 2 and 3, the inner surface of the lower cover plate 3 of the present invention is provided with a flow guide rib 17 extending along the length direction of the lower cover plate 3, and the main capillary layer 5 is pressed against the top of the flow guide rib 17. On the basis, a drainage groove 18 extending along the length direction of the flow guide rib 17 can be further arranged at the rib top of the flow guide rib 17. The drainage grooves 18 and the flow guide ribs 17 are formed by etching the lower cover plate 3. Through the design of the flow guide ribs 17 and the flow guide grooves 18, a plurality of longitudinal channels which play the roles of flow guide and flow guide are formed on the surface of the lower cover plate 3, which is in contact with the capillary layer 5 of the main body, so that the working medium flows more smoothly.
From the third aspect, in order to adapt to the heat dissipation of the electronic device with ultrahigh heat density and solve the problem of heat stagnation caused by unsmooth heat conduction between the traditional single-layer soaking plate (which can be regarded as the first soaking plate 1) and the heat dissipation back plate of the equipment, the invention also adopts a double-layer soaking plate mode to dissipate heat. Specifically, as shown in fig. 7, the size of the upper cover plate 2 (outer layer square frame) is larger than the size of the lower cover plate 3 (inner layer square frame corresponding size), and in combination with fig. 1 and 2, a back plate 19 is further provided on the side of the upper cover plate 2 away from the lower cover plate 3, and the back plate 19 is welded with the upper cover plate 2 to form a second soaking plate 20. The lower cover plate 3 of the first soaking plate 1 is in contact with the heat source 0.
In the use process, the lower cover plate 3 and the upper cover plate 2 jointly form a first soaking plate 1 which is mainly used for preliminarily dispersing high-density heat generated by a heat source, and the upper cover plate 3 and the back plate 19 jointly form a second soaking plate 20 which is mainly used for quickly dispersing the dispersed heat outwards; the upper cover plate 2 of the first soaking plate 1 and the lower cover plate of the second soaking plate 20 are shared, the heat conduction effect is good, the heat dispersion spreading area is larger, and the heat dissipation performance is effectively guaranteed. As for the capillary structure, the supporting column structure, and the like inside the second soaking plate 20, it may be the same as the first soaking plate 1, and it may also adopt a conventional soaking plate structure.
Considering that the first soaking plate 1 and the second soaking plate 20 have a large difference in heat density when heat is dissipated, the working medium inside the first soaking plate 1 is pure water, and the working medium inside the second soaking plate 20 is R245 fa. Pure water is used as a working medium of the first soaking plate, and the pure water has high specific heat and can ensure the absorptivity of heat emitted by a heat source 0; r245fa is used as a working medium of the second soaking plate 20, has excellent thermal sensitivity and can ensure that the dispersed low-density heat can be efficiently absorbed; the two components have synergistic effect, so that the invention has better and excellent performance compared with the traditional soaking plate.
Regarding the welding form of the upper cover plate 2 and the lower cover plate 3, as shown in fig. 2, the opposite edge of the upper cover plate 2 and the lower cover plate 3 may be provided with a welding seam 21 having a semicircular cross section, and half of the welding seam 21 is located on the upper cover plate 2 and the other half is located on the lower cover plate 3. Furthermore, a ring of annular wrapping sheets 22 are arranged outside the welding seam 21, and the welding seam 21 is shielded by the wrapping sheets 22. It is conceivable that the welding between the back plate 19 and the upper cover plate 2, or between the upper cover plate 2 and the lower cover plate 3, is also used, i.e. the edge of the upper cover plate 2 opposite to the back plate 19 is also provided with a welding seam 21 and a wrapping sheet 22.
Claims (10)
1. A VC soaking plate cover plate heat radiation module comprises a first soaking plate (1);
the method is characterized in that: the first soaking plate (1) comprises an upper cover plate (2) and a lower cover plate (3); the internal surface of apron (3) has set gradually support mesh board (4) and main part capillary layer (5) along the direction of keeping away from upper cover plate (2) down, evenly is provided with a plurality of rows of support columns (6) between the face of upper cover plate (2) and apron (3) down, the both ends of support column (6) contact with the internal surface of upper cover plate (2) and support mesh board (4) in apron (3) down respectively, the surface of support column (6) is provided with column table capillary layer (7).
2. The VC soaking plate cover plate heat dissipation module of claim 1, wherein: the column surface capillary layer (7) is formed by copper powder sintered on the outer surface of the support column (6).
3. A VC soaking plate cover plate heat dissipation module as in claim 2, wherein: the peripheral surface of the supporting column (6) is provided with a plurality of inwards concave intercepting water storage areas (8).
4. A VC soaking plate cover plate heat dissipation module as in claim 3, wherein: the cross section of the support column (6) is X-shaped, and four X-shaped concave parts form four intercepting water storage areas (8).
5. A VC soaking plate cover plate heat dissipation module of claim 4, wherein: the supporting column (6) is formed by two column plates (9) with semicircular cross sections in back-to-back abutting connection.
6. A VC soaking plate cover plate heat dissipation module of claim 5, wherein: the two column plates (9) are respectively arranged on the upper cover plate (2) and the supporting mesh plate (4).
7. A VC soaking plate cover plate heat dissipation module of claim 6, wherein: the outer surface of the column plate (9) is provided with a diversion trench (10) extending along the length direction of the column plate (9).
8. A VC soaking plate cover plate heat dissipation module of claim 7, wherein: and triangular supporting steps (11) are arranged at four corners of the lower cover plate (3), the edges of the supporting mesh plates (4) are abutted against the supporting steps (11), and the plate surfaces of the supporting mesh plates (4) are pressed against the main capillary layer (5).
9. A VC soaking plate cover plate heat dissipation module as in claim 8, wherein: the supporting step (11) is further provided with a positioning concave part (12), the supporting mesh plate (4) is provided with a positioning bulge matched with the positioning concave part (12), and the positioning bulge is positioned in the positioning concave part (12).
10. A VC soaking plate cover plate heat dissipation module as in claim 9, wherein: two adjacent rows of supporting columns (6) are mutually staggered.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210124075.5A CN114396818B (en) | 2022-02-10 | 2022-02-10 | VC vapor chamber apron heat dissipation module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210124075.5A CN114396818B (en) | 2022-02-10 | 2022-02-10 | VC vapor chamber apron heat dissipation module |
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| CN114396818A true CN114396818A (en) | 2022-04-26 |
| CN114396818B CN114396818B (en) | 2024-06-18 |
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| CN202210124075.5A Active CN114396818B (en) | 2022-02-10 | 2022-02-10 | VC vapor chamber apron heat dissipation module |
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| WO2021203825A1 (en) * | 2020-04-08 | 2021-10-14 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus |
| CN215421313U (en) * | 2021-04-25 | 2022-01-04 | 江西展耀微电子有限公司 | Vapor chamber and electronic apparatus |
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| Publication number | Publication date |
|---|---|
| CN114396818B (en) | 2024-06-18 |
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