CN114390183A - Imaging device and electronic apparatus - Google Patents
Imaging device and electronic apparatus Download PDFInfo
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- CN114390183A CN114390183A CN202210146251.5A CN202210146251A CN114390183A CN 114390183 A CN114390183 A CN 114390183A CN 202210146251 A CN202210146251 A CN 202210146251A CN 114390183 A CN114390183 A CN 114390183A
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- 238000003384 imaging method Methods 0.000 title description 2
- 230000009471 action Effects 0.000 claims abstract description 6
- 238000006073 displacement reaction Methods 0.000 description 26
- 230000008602 contraction Effects 0.000 description 18
- 206010070834 Sensitisation Diseases 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000008313 sensitization Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
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- Studio Devices (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
The application discloses a camera module and electronic equipment, the camera module comprises a flexible circuit board, an elastic circuit board and a photosensitive chip assembly, the flexible circuit board is provided with a through hole, the photosensitive chip assembly is arranged in the through hole through the elastic circuit board, the photosensitive chip assembly is electrically connected with the flexible circuit board through the elastic circuit board, a coil is arranged on a first side face of the elastic circuit board, and the first side face is a side face of the elastic circuit board, which is parallel to a photosensitive surface of the photosensitive chip assembly; under the action of a magnetic field of the camera module, the coil which is electrified with current drives the elastic circuit board to drive the photosensitive chip component to move relative to the flexible circuit board.
Description
Technical Field
The application belongs to the technical field of electronic products, and particularly relates to a camera device and electronic equipment.
Background
In a conventional anti-shake scheme for shooting, the lens is generally controlled to move to compensate for the influence of shake of the electronic device, so as to achieve the purpose of improving the shooting effect. However, since the mass of the lens is large, a large driving part is required to realize the movement of the lens, thereby realizing the anti-shake compensation of the lens.
Therefore, the shooting anti-shake scheme in the related art has the problem of large occupied space.
Disclosure of Invention
The application aims at providing a camera device and electronic equipment, and the problem that the space occupation is large in the shooting anti-shake scheme in the related art can be solved.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the application provides a camera module, which includes a flexible circuit board, an elastic circuit board and a photosensitive chip assembly, wherein the flexible circuit board is provided with a through hole, the photosensitive chip assembly is arranged in the through hole through the elastic circuit board, the photosensitive chip assembly is electrically connected with the flexible circuit board through the elastic circuit board, a first side face of the elastic circuit board is provided with a coil, and the first side face is a side face of the elastic circuit board, which is parallel to a photosensitive surface of the photosensitive chip assembly;
under the action of a magnetic field of the camera module, the coil which is electrified with current drives the elastic circuit board to drive the photosensitive chip component to move relative to the flexible circuit board.
In a second aspect, an embodiment of the present application provides an electronic device, including the camera module of the first aspect.
In the embodiment of this application, under the effect in the magnetic field of the module of making a video recording, the lorentz magnetic force that the coil that leads to there is the electric current produced can drive the relative flexible circuit board motion of elastic circuit board drive sensitization chip subassembly, realizes the displacement adjustment of the relative camera lens subassembly of sensitization chip subassembly promptly, and then realizes the anti-shake compensation of the module of making a video recording. Moreover, because the quality of sensitization chip subassembly is less than the quality of camera lens subassembly, consequently for the mode realization anti-shake compensation of the drive camera lens motion that adopts among the prior art, adopt the module of making a video recording that this application embodiment provided, can effectively reduce drive component's drive power to and effectively reduce the required installation space of drive component, and then reach the space that the anti-shake scheme of shooting among the improvement prior art exists and occupy big purpose.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a camera module provided in an embodiment of the present application;
fig. 2 is an exploded schematic view of a camera module according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an elastic circuit board provided in an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a photosensitive chip assembly provided in an embodiment of the present application;
fig. 5 is a schematic structural diagram of a board-to-board connector according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
As shown in fig. 1 to 5, an embodiment of the present application provides a camera module, which includes a flexible circuit board 10, an elastic circuit board 20, and a photosensitive chip assembly 30, wherein the flexible circuit board 10 is provided with a through hole 11, the photosensitive chip assembly 30 is disposed in the through hole 11 through the elastic circuit board 20, the photosensitive chip assembly 30 is electrically connected to the flexible circuit board 10 through the elastic circuit board 20, a first side surface of the elastic circuit board 20 is provided with a coil 21, and the first side surface is a side surface of the elastic circuit board 20 parallel to a photosensitive surface of the photosensitive chip assembly 30;
under the action of the magnetic field of the camera module, the coil 21 with current drives the elastic circuit board 20 to drive the photosensitive chip assembly 30 to move relative to the flexible circuit board 10.
It can be understood that the camera module further includes a lens assembly 40, and in a case that the camera module is applied to an electronic device such as a mobile phone, the photosensitive chip assembly 30 can be electrically connected to a main board of the electronic device through the flexible circuit board 10 to implement a shooting function of the camera module.
Wherein the magnetic field provided by the camera module may be a magnetic field provided by a magnetic component in the lens assembly 40, such as a magnetic field provided by a magnetic component of a voice coil motor in the lens assembly 40; the voice coil motor can drive the lens of the lens assembly 40 to move along the direction perpendicular to the light-sensitive surface of the light-sensitive chip assembly 30, so as to realize the focusing movement of the lens.
In this embodiment, under the effect of the magnetic field of the camera module, the lorentz magnetic force generated by the coil 21 with current can drive the elastic circuit board 20 to drive the photosensitive chip assembly 30 to move relative to the flexible circuit board 10, i.e., the displacement adjustment of the photosensitive chip assembly 30 relative to the lens assembly 40 is realized, and then the anti-shake compensation of the camera module is realized. Moreover, because the quality of photosensitive chip subassembly 30 is less than the quality of lens subassembly 40, consequently for the mode realization anti-shake compensation of the drive lens motion that adopts among the prior art, adopt the module of making a video recording that this application embodiment provided, can effectively reduce drive component's drive power to and effectively reduce the required installation space of drive component, and then reach the space that the anti-shake scheme of shooting exists among the improvement prior art and occupy big purpose.
In practical applications, the photosensitive chip assembly 30 can be driven to move in the non-conducting direction by applying a current in the non-conducting direction to the coil 21; meanwhile, the moving distance of the photosensitive chip assembly 30 can be controlled by controlling the current, and the anti-shake compensation purpose of the camera module is achieved.
It should be noted that the outlet terminal of the coil 21 can be electrically connected to the flexible circuit board 10, so as to apply current to the coil 21 through the flexible circuit board 10; the outlet terminal of the coil 21 can also be electrically connected to the photosensitive chip assembly 30 so that current can be applied to the coil 21 through the photosensitive chip assembly 30.
In some embodiments, the elastic circuit board 20 may be a strip-shaped plate-shaped structure having elasticity, and the coil 21 may be disposed on an end surface of the plate-shaped structure; under the action of the magnetic field of the camera module, the coil 21 with current can generate Lorentz magnetic force for driving the elastic circuit board 20 to rotate, and the rotating elastic circuit board 20 can drive the photosensitive chip assembly 30 to rotate relative to the flexible circuit board 10, so that the angular displacement adjustment of the photosensitive chip assembly 30 relative to the lens assembly 40 is realized.
Optionally, the second side of the elastic circuit board 20 is provided with connection traces (not shown), the second side and the first side are two opposite sides of the elastic circuit board 20, and the photosensitive chip assembly 30 is electrically connected to the flexible circuit board 10 through the connection traces.
In this embodiment, the connection traces may be disposed on the elastic circuit board 20 to electrically connect the photosensitive chip assembly 30 and the flexible circuit board 10; moreover, the manufacturing cost of the elastic circuit board 20 can be effectively reduced by adopting the mode of arranging the connecting wires.
Wherein, in the initial state of the elastic circuit board 20, the first side surface may be a side surface parallel to the light sensing surface of the light sensing chip assembly 30, so as to increase the magnetic induction area of the coil 21 disposed on the elastic circuit board 20.
Because the elastic circuit board 20 has certain elasticity, after the elastic circuit board 20 deforms, the elastic circuit board can restore to the initial state by means of the elastic restoring force of the elastic circuit board 20, the reset structure for resetting the elastic circuit board 20 is prevented from being independently arranged, and the installation space required by the anti-shake design of the camera module is further improved.
In some embodiments, the first side surface may be disposed in the same direction as the light-sensing surface of the light-sensing chip assembly 30 to improve the magnetic induction effect of the coil 21 disposed on the flexible circuit board 20.
Optionally, the camera module further includes a lens holder 50 and an electrostrictive member 60, the flexible circuit board 10 is mounted on the lens holder 50 through the electrostrictive member 60, and the electrostrictive member 60 is electrically connected to the flexible circuit board 10;
under the condition that the electrostrictive element 60 is electrified, the flexible circuit board 10 is driven to move by the deformation of the electrostrictive element 60, and the flexible circuit board 10 drives the photosensitive chip assembly 30 to move relative to the lens holder 50.
In this embodiment, through set up electrostrictive member 60 in the module of making a video recording to utilize electrostrictive member 60 to circular telegram the performance of deformation, with the relative lens holder 50 motion of drive sensitization chip subassembly 30, so that the module of making a video recording can realize the position adjustment in more positions, even the module of making a video recording can realize the anti-shake compensation in more positions, and then reach the purpose that improves the anti-shake effect of the module of making a video recording.
In some embodiments, the end of the electrostrictive member 60 electrically connected to the flexible circuit board 10 may be electrically connected to the flexible circuit board 10 by surface mount technology or laser welding technology.
In practical applications, the position adjustment of the photosensitive chip assembly 30 with different orientations and different displacements can be realized by applying currents with different directions or magnitudes to the electrostrictive member 60.
The lens holder 50 is a peripheral holder of the camera module, and is used for bearing the lens assembly 40, and the lens assembly 40 can be fixedly mounted on the lens holder 50. Since the lens assembly 40 is fixedly mounted on the lens holder 50, the flexible circuit board 10 driving the photosensitive chip assembly 30 to move relative to the lens holder 50 can be understood as the flexible circuit board 10 driving the photosensitive chip assembly 30 to move relative to the lens assembly 40.
In some embodiments, the plurality of elastic circuit boards may be uniformly distributed in the circumferential direction of the photosensitive chip assembly 30, and when it is required to control the photosensitive chip assembly 30 to generate the target angular displacement, the target current may be applied to the coil on the target elastic circuit board of the plurality of elastic circuit boards.
Optionally, as shown in fig. 1 and fig. 2, the camera module includes a plurality of elastic circuit boards 20, and the plurality of elastic circuit boards 20 includes a first elastic circuit board 201, a second elastic circuit board 202, a third elastic circuit board 203, and a fourth elastic circuit board 204 that are uniformly distributed along a circumferential edge of the photosensitive chip assembly 30;
the first elastic circuit board 201 and the third elastic circuit board 203 are symmetrically arranged, and the first elastic circuit board 201 and the third elastic circuit board 203 are used for driving the photosensitive chip assembly 30 to rotate around a first axis; the second elastic circuit board 202 and the fourth elastic circuit board 204 are symmetrically arranged, and the second elastic circuit board 202 and the fourth elastic circuit board 204 are used for driving the photosensitive chip assembly 30 to rotate around a second axis;
the first axis and the second axis are perpendicular to each other, and the plane where the first axis and the second axis are located is parallel to the light-sensing surface of the light-sensing chip assembly 30.
In this embodiment, the plurality of elastic circuit boards 20 may drive the photosensitive chip assembly 30 to rotate around the first axis or the second axis, so as to satisfy the angular displacement adjustment around the first axis or the second axis of the photosensitive chip assembly 30 relative to the lens assembly 40, that is, to realize the anti-shake compensation around the first axis or the second axis of the photosensitive chip assembly 30 relative to the lens assembly 40.
Specifically, when the first elastic circuit board 201, the second elastic circuit board 202, the third elastic circuit board 203 and the fourth elastic circuit board 204 are subjected to currents with different time or different directions, the lorentz force generated by the coils on the respective elastic circuit boards can drive the photosensitive chip assembly 30 to rotate around the first axis or the second axis by a certain angle.
For example, when the currents with the same magnitude and the same direction are applied to the first elastic circuit board 201 and the third elastic circuit board 203, the first elastic circuit board 201 and the third elastic circuit board 203 generate a lorentz magnetic force inclining downwards under the action of the magnetic field of the camera module, and the force can drive the photosensitive chip assembly 30 to rotate around the first axis. The magnitude of the lorentz magnetic force is positively correlated with the magnitude of the applied current, the magnetic field strength and the length of the winding coil, that is, the rotation of the photosensitive chip assembly 30 in different degrees can be realized by controlling the magnitude of the current and the like.
Accordingly, the second elastic circuit board 202 and the fourth elastic circuit board 204 can be applied with currents having the same magnitude and the same direction to drive the photosensitive chip assembly 30 to rotate around the second axis.
Alternatively, as shown in fig. 1, the camera module includes a plurality of electrostrictive members 60, and the plurality of electrostrictive members 60 are configured to drive the flexible circuit board 10 to move along the first axis or move along the second axis or rotate around a third axis, where the third axis is perpendicular to the light sensing surface, when at least one of the plurality of electrostrictive members 60 is energized with an electric current.
In this embodiment, can be through setting up a plurality of electrostrictive members 60 to drive the displacement adjustment of flexible circuit board 10 in three position, and then drive the displacement adjustment of sensitization chip subassembly 30 in three position through flexible circuit board 10, realize the removal of sensitization chip subassembly 30 in the primary shaft, the removal of secondary shaft and the rotation of third axle promptly, and realize the purpose of the anti-shake compensation of module in more positions of making a video recording.
Thus, by arranging the elastic circuit board 20 and the coil 21 on the elastic circuit board 20, the compensation of the rotary displacement of the photosensitive chip assembly 30 on the first axis and the compensation of the rotary displacement of the second axis can be realized; through setting up electrostriction piece 60, can realize sensitization chip subassembly 30 at the epaxial displacement compensation of first removal, the epaxial displacement compensation of second removal and the epaxial rotation displacement compensation of third, and then can realize the 5 anti-shake demands of the module of making a video recording, the effectual anti-shake effect that improves the module of making a video recording. Moreover, by driving the photosensitive chip assembly 30 to move relative to the lens assembly 40, the required installation space of the anti-shake driving component can be effectively reduced, and the purpose of improving the large occupied space of the shooting anti-shake scheme in the prior art is achieved.
Alternatively, the flexible circuit board 10 includes a circuit board body 12 and a flexible connection portion 13 formed by extending from one side edge of the circuit board body 12, the through hole 11 is provided on the circuit board body 12, and the circuit board body 12 is mounted on the lens holder 50 through the electrostrictive member 60.
In this embodiment, the flexible connecting portion 13 may be electrically connected to a main board of the electronic device on which the camera module is installed, so as to electrically connect the flexible circuit board 10 to the main board.
Wherein the flexible connecting portion 13 can be electrically connected to the motherboard by a board-to-board connector 70 as shown in fig. 5.
Optionally, the photosensitive chip assembly 30 includes a photosensitive circuit board 31 and a photosensitive chip 32 disposed on the photosensitive circuit board 31, and the photosensitive circuit board 31 is disposed in the through hole 11 through an elastic circuit board.
In this embodiment, the photosensitive chip 32 is configured to convert the light image incident on the photosensitive surface through the lens assembly into an electrical signal in a corresponding proportional relationship with the light image, so as to implement a shooting function of the camera module.
As shown in fig. 1, the camera module includes a first electrostrictive member 61, a second electrostrictive member 62, a third electrostrictive member 63, and a fourth electrostrictive member 64, and the first electrostrictive member 61, the second electrostrictive member 62, the third electrostrictive member 63, and the fourth electrostrictive member 64 are sequentially distributed along the circumferential edge of the circuit board body 12 of the flexible circuit board 10. The circuit board body 12 is mounted on the lens holder 50 through the first electrostrictive member 61, the second electrostrictive member 62, the third electrostrictive member 63, and the fourth electrostrictive member 64, and the first electrostrictive member 61, the second electrostrictive member 62, the third electrostrictive member 63, and the fourth electrostrictive member 64 are all electrically connected to the circuit board body 12, that is, the circuit board body 12 can provide corresponding currents for the first electrostrictive member 61, the second electrostrictive member 62, the third electrostrictive member 63, and the fourth electrostrictive member 64, so that one or more of the first electrostrictive member 61, the second electrostrictive member 62, the third electrostrictive member 63, and the fourth electrostrictive member 64 is/are deformed to drive the flexible circuit board 10 to generate corresponding displacement.
The first situation is as follows: under the condition that the same magnitude of current is applied to the first electrostrictive member 61 and the fourth electrostrictive member 64, and no current is applied to the second electrostrictive member 62 and the third electrostrictive member 63, the first electrostrictive member 61 and the fourth electrostrictive member 64 generate the same magnitude of contraction force, and the contraction force can drive the flexible circuit board 10 to move along the first direction of the first axis, that is, displacement adjustment of the photosensitive chip assembly 30 in the first direction of the first axis is realized.
Case two: under the condition that the currents with the same magnitude are applied to the second electrostrictive member 62 and the third electrostrictive member 63, and the currents are not applied to the first electrostrictive member 61 and the fourth electrostrictive member 64, the second electrostrictive member 62 and the third electrostrictive member 63 generate the contraction force with the same magnitude, and the contraction force can drive the flexible circuit board 10 to move along the second direction of the first axis, namely, the displacement adjustment of the photosensitive chip assembly 30 in the second direction of the first axis is realized.
Case three: under the condition that the same magnitude of current is applied to the first electrostrictive member 61 and the fourth electrostrictive member 64, and the opposite directions of current are applied to the second electrostrictive member 62 and the third electrostrictive member 63, the second electrostrictive member 62 and the third electrostrictive member 63 can generate the same magnitude of tensile force, the tensile force and the first electrostrictive member 61 and the fourth electrostrictive member 64 generate the same magnitude of contraction force in the same direction, so that the resultant force of the tensile force and the contraction force can drive the flexible circuit board 10 to move along the first direction of the first shaft, and the flexible circuit board 10 can generate larger displacement adjustment, namely, the displacement adjustment of the photosensitive chip assembly 30 in the first direction of the first shaft is realized.
Case four: under the condition that the currents with the same magnitude are applied to the second electrostrictive member 62 and the third electrostrictive member 63, and the currents with opposite directions are applied to the first electrostrictive member 61 and the fourth electrostrictive member 64, the first electrostrictive member 61 and the fourth electrostrictive member 64 can generate the tensile force with the same magnitude, the tensile force and the second electrostrictive member 62 and the third electrostrictive member 63 generate the contraction force with the same magnitude in the same direction, so that the resultant force of the tensile force and the contraction force can drive the flexible circuit board 10 to move along the second direction of the first shaft, and the flexible circuit board 10 can generate larger displacement adjustment, namely, the displacement adjustment of the photosensitive chip assembly 30 in the second direction of the first shaft is realized.
Case five: under the condition that the same magnitude of current is applied to the first electrostrictive member 61 and the second electrostrictive member 62, and no current is applied to the third electrostrictive member 63 and the fourth electrostrictive member 64, the first electrostrictive member 61 and the second electrostrictive member 62 generate the same magnitude of contraction force, and the contraction force can drive the flexible circuit board 10 to move along the third direction of the second shaft, that is, the displacement adjustment of the photosensitive chip assembly 30 in the third direction of the second shaft is realized.
Case six: under the condition that the current with the same magnitude is applied to the third electrostrictive member 63 and the fourth electrostrictive member 64, and the current is not applied to the first electrostrictive member 61 and the second electrostrictive member 63, the third electrostrictive member 63 and the fourth electrostrictive member 64 generate the contraction force with the same magnitude, and the contraction force can drive the flexible circuit board 10 to move along the second direction of the second shaft, that is, the displacement adjustment of the photosensitive chip assembly 30 in the fourth direction of the second shaft is realized.
Case seven: under the condition that the currents with the same magnitude are applied to the first electrostrictive member 61 and the second electrostrictive member 62, and the currents with opposite directions are applied to the third electrostrictive member 63 and the fourth electrostrictive member 64, the third electrostrictive member 63 and the fourth electrostrictive member 64 can generate the tensile force with the same magnitude, the tensile force and the contraction force of the first electrostrictive member 61 and the second electrostrictive member 62 generate the contraction force with the same magnitude in the same direction, so that the resultant force of the tensile force and the contraction force can drive the flexible circuit board 10 to move along the third direction of the second shaft, and the flexible circuit board 10 can generate larger displacement adjustment, namely, the displacement adjustment of the photosensitive chip assembly 30 in the third direction of the second shaft is realized.
Case eight: under the condition that the currents with the same magnitude are applied to the third electrostrictive member 63 and the fourth electrostrictive member 64, and the currents with opposite directions are applied to the first electrostrictive member 61 and the second electrostrictive member 62, the first electrostrictive member 61 and the second electrostrictive member 62 can generate the tensile force with the same magnitude, the tensile force and the contraction force of the third electrostrictive member 63 and the fourth electrostrictive member 64 generate the contraction force with the same magnitude in the same direction, so that the resultant force of the tensile force and the contraction force can drive the flexible circuit board 10 to move along the fourth direction of the second shaft, and the flexible circuit board 10 can generate larger displacement adjustment, namely, the displacement adjustment of the photosensitive chip assembly 30 in the fourth direction of the second shaft is realized.
Case nine: the flexible circuit board 10 may be driven to rotate about the third axis by controlling the magnitude and direction of the current of the first electrostrictive member 61, the second electrostrictive member 62, the third electrostrictive member 63, and the fourth electrostrictive member 64. For example, a current with the same current direction but a smaller current magnitude than that of the second electrostrictive member 62 is applied to the third electrostrictive member 63, at this time, the first tensile force generated by the second electrostrictive member 62 is larger than the second tensile force generated by the third electrostrictive member 63, and based on the force resultant principle, a resultant force of the first tensile force and the second tensile force will have a certain included angle with the first axis, and the resultant force can drive the flexible circuit board 10 to rotate, thereby driving the flexible circuit board 10 to rotate around the third axis.
The embodiment of the application further provides an electronic device, which comprises the camera module.
It should be noted that the implementation manner of the above-mentioned embodiment of the camera module is also applicable to the embodiment of the electronic device, and can achieve the same technical effect, and is not described herein again.
The electronic device may be a mobile phone, a tablet Computer, a notebook Computer, a palm top Computer, a vehicle-mounted electronic device, a wearable device, an Ultra-mobile Personal Computer (UMPC), a netbook, or a Personal Digital Assistant (PDA), etc.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A camera module is characterized by comprising a flexible circuit board, an elastic circuit board and a photosensitive chip assembly, wherein the flexible circuit board is provided with a through hole, the photosensitive chip assembly is arranged in the through hole through the elastic circuit board, the photosensitive chip assembly is electrically connected with the flexible circuit board through the elastic circuit board, a coil is arranged on a first side face of the elastic circuit board, and the first side face is a side face of the elastic circuit board, which is parallel to a photosensitive surface of the photosensitive chip assembly;
under the action of a magnetic field of the camera module, the coil which is electrified with current drives the elastic circuit board to drive the photosensitive chip component to move relative to the flexible circuit board.
2. The camera module according to claim 1, further comprising a lens holder and an electrostrictive member, wherein the flexible circuit board is mounted on the lens holder through the electrostrictive joint, and the electrostrictive member is electrically connected to the flexible circuit board;
under the condition that the electrostriction piece is electrified with current, the flexible circuit board is driven by the deformation of the electrostriction piece to move, and the flexible circuit board drives the photosensitive chip component to move relative to the lens support.
3. The camera module according to claim 2, wherein the camera module comprises a plurality of the elastic circuit boards, and the plurality of elastic circuit boards comprise a first elastic circuit board, a second elastic circuit board, a third elastic circuit board and a fourth elastic circuit board which are uniformly distributed along a circumferential edge of the photosensitive chip assembly in sequence;
the first elastic circuit board and the third elastic circuit board are symmetrically arranged and used for driving the photosensitive chip assembly to rotate around a first shaft; the second elastic circuit board and the fourth elastic circuit board are symmetrically arranged and used for driving the photosensitive chip assembly to rotate around a second shaft;
the first shaft and the second shaft are perpendicular to each other, and the plane where the first shaft and the second shaft are located is parallel to the photosensitive surface of the photosensitive chip component.
4. The camera module according to claim 3, wherein a second side surface of the elastic circuit board is provided with connecting traces, the second side surface and the first side surface are two back surfaces of the elastic circuit board, and the photosensitive chip assembly is electrically connected to the flexible circuit board through the connecting traces.
5. The camera module of claim 4, wherein the first side surface is disposed in a same direction as a light-sensing surface of the light-sensing chip assembly.
6. The camera module of claim 3, wherein the camera module comprises a plurality of electrostrictive members, and wherein the electrostrictive members are configured to drive the flexible circuit board to move along the first axis or to move along the second axis or to rotate around a third axis, and the third axis is perpendicular to the photosensitive surface when at least one of the electrostrictive members is energized.
7. The camera module of claim 2, wherein the flexible printed circuit board includes a printed circuit board body and a flexible connecting portion extending from an edge of one side of the printed circuit board body, the through hole is formed in the printed circuit board body, and the printed circuit board body is mounted on the lens holder through the electrostrictive member.
8. The camera module of claim 1, wherein the coil is electrically connected to the flexible circuit board or the photo sensor chip assembly.
9. The camera module according to any one of claims 1 to 8, wherein the photosensitive chip assembly comprises a photosensitive circuit board and a photosensitive chip disposed on the photosensitive circuit board, and the photosensitive circuit board is disposed in the through hole through the elastic circuit board.
10. An electronic apparatus, characterized by comprising the camera module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210146251.5A CN114390183A (en) | 2022-02-17 | 2022-02-17 | Imaging device and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210146251.5A CN114390183A (en) | 2022-02-17 | 2022-02-17 | Imaging device and electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114390183A true CN114390183A (en) | 2022-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210146251.5A Pending CN114390183A (en) | 2022-02-17 | 2022-02-17 | Imaging device and electronic apparatus |
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|---|---|
| CN (1) | CN114390183A (en) |
Citations (12)
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