CN114389064B - Display module - Google Patents
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- CN114389064B CN114389064B CN202210012857.XA CN202210012857A CN114389064B CN 114389064 B CN114389064 B CN 114389064B CN 202210012857 A CN202210012857 A CN 202210012857A CN 114389064 B CN114389064 B CN 114389064B
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- terminal
- binding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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Abstract
The embodiment of the application discloses a display module, which comprises a display panel and a flexible circuit board, wherein the display panel comprises a first binding terminal and a first marking terminal in a binding area, the flexible circuit board comprises a second binding terminal and a second marking terminal, the second binding terminal is correspondingly abutted with the first binding terminal to form a binding terminal group, and the second marking terminal and the first marking terminal are oppositely arranged to form a positioning terminal group; the thickness of the alignment terminal group is smaller than that of the binding terminal group, so that uneven stress in the edge area is improved, stress of the alignment terminal group on the display panel is reduced, and the display panel at the position of the marking terminal group is prevented from being broken.
Description
Technical Field
The application relates to the technical field of flexible display, in particular to a display module.
Background
At present, the main flow of connection between a driving chip of a flexible product and a display panel in the industry is a flexible binding technology, a high-temperature and high-pressure environment is needed in a flexible circuit board binding process of a display module, the stress of a marking terminal group in the edge areas of two sides of the flexible circuit board is large during binding, the area of the marking terminal group is small, the break difference is large, and the distance from the binding terminal group is far, so that the stress of the marking terminal group is uneven, and the display panel at the corresponding position of the marking terminal group is extremely easy to break, so that the reliability of the product is influenced.
Therefore, the existing display module has the technical problem that the display panel at the marked terminal group is easy to break.
Disclosure of Invention
The embodiment of the application provides a display module assembly, can alleviate the easy cracked technical problem of display panel of current display module assembly existence mark terminal group department.
The embodiment of the application provides a display module assembly, including binding the district, bind the district including central region, be located the marginal area of central region both sides includes:
the display panel comprises a first binding terminal and a first marking terminal;
the flexible circuit board is in binding connection with the display panel and comprises a second binding terminal and a second marking terminal, wherein the second binding terminal is correspondingly abutted with the first binding terminal to form a binding terminal group, and the second marking terminal and the first marking terminal are arranged in alignment to form a positioning terminal group;
the binding terminal group is arranged in the central area, the alignment terminal group is arranged in the edge area, and the thickness of any alignment terminal group is smaller than that of the binding terminal group.
Optionally, in some embodiments of the present application, the thickness of the second flag terminal is less than the thickness of the second binding terminal.
Optionally, in some embodiments of the present application, the second binding terminal is a stacked structure of a conductive layer and a protective layer, and the second marking terminal is a single-layer structure of the conductive layer.
Optionally, in some embodiments of the present application, the second flag terminal and the second bonding terminal are both a stacked structure of a conductive layer and a protective layer, where the conductive layer includes a first conductive portion corresponding to the second bonding terminal and a second conductive portion corresponding to the second flag terminal, and a thickness of the first conductive portion is greater than a thickness of the second conductive portion.
Optionally, in some embodiments of the present application, the conductive layer is made of copper, and the thickness of the second conductive portion ranges from 5 micrometers to 6 micrometers.
Optionally, in some embodiments of the present application, the second flag terminal includes a plurality of fillets, wherein at least one of the fillets is a rounded corner.
Optionally, in some embodiments of the present application, the second flag terminals of the edge regions located on different sides are symmetrically disposed about the central region.
Optionally, in some embodiments of the present application, a compensation terminal is further disposed at the edge region, and a width of the compensation terminal is greater than or equal to 50 micrometers.
Optionally, in some embodiments of the present application, the compensation terminal includes a first compensation terminal, the first compensation terminal is disposed on a side of the second flag terminal near the second binding terminal, and a minimum distance between the first compensation terminal and the second binding terminal is greater than or equal to 50 micrometers.
Optionally, in some embodiments of the present application, the compensation terminal further includes a second compensation terminal, the second compensation terminal is disposed on a side of the second flag terminal away from the second binding terminal, a minimum distance between the second compensation terminal and the second flag terminal is greater than or equal to 50 micrometers, and a minimum distance between the second compensation terminal and a side of the edge region is greater than 500 micrometers.
The beneficial effects are that: according to the display module, the thickness of the alignment terminal group is smaller than that of the binding terminal group, uneven stress of the alignment terminal group in the edge area is improved, stress of the alignment terminal group on the display panel is reduced, and the technical problem that the display panel at the position of the marking terminal group of the existing display module is easy to break is solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of a display module provided in the present application;
FIG. 2 is a schematic cross-sectional view of a binding area A-A of a display module provided in the present application;
FIG. 3 is a first perspective schematic view of a flexible circuit board of a binding region of a display module provided by the present application;
FIG. 4 is a schematic cross-sectional view of a first type of display module provided herein at a flexible circuit board B-B;
FIG. 5 is a schematic diagram of a second cross-section of a display module provided herein at a flexible circuit board B-B;
FIG. 6 is a schematic diagram of a third cross-section at a flexible circuit board B-B of a display module provided herein;
FIG. 7 is a fourth cross-sectional schematic view of a display module provided herein at a flexible circuit board B-B;
fig. 8 is a second perspective schematic view of a flexible circuit board of a binding region of a display module provided in the present application;
FIG. 9 is a schematic perspective view of a display panel of a binding region of a display module provided in the present application;
fig. 10 is a schematic cross-sectional view of a display module provided herein at a flexible circuit board C-C.
Reference numerals illustrate:
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
In the existing display module, a high-temperature and high-pressure environment is needed in the flexible circuit board binding process, the distance between the marking terminals of the binding area and the binding terminals is far, the area of the marking terminals is small, the breaking difference is large, the stress on the marking terminal groups in the edge areas on two sides is large, and the position of the display panel corresponding to the marking terminal groups is easy to break due to uneven stress.
Therefore, a display module is needed to alleviate the technical problem that the marked terminal group is easy to break due to uneven stress.
Referring to fig. 1 and 2, the present application provides a display module 1, the display module 1 includes a display panel 40 and a flexible circuit board 80, the display panel 40 includes a first binding terminal 102 and a first marking terminal 103, the flexible circuit board 80 is bound and connected with the display panel 40, the flexible circuit board 80 includes a second binding terminal 202 and a second marking terminal 203, the second binding terminal 202 is correspondingly abutted to the first binding terminal 102 to form a binding terminal group 100, a second marking terminal 203 is aligned with the first marking terminal 103 to form an alignment terminal group 110, wherein the display module 1 includes a binding region 2, the binding region 2 includes a central region 4 and edge regions 5 located at two sides of the central region 4, the alignment terminal group 110 is disposed in the edge regions 5, and a thickness of any one of the alignment terminal groups 110 is smaller than a thickness of the binding terminal group 100.
The display module 1 further includes a cover plate 10, an optical adhesive 20, a polarizer 30, a back plate 50, a heat dissipation layer 60, a supporting layer 70, and a driving chip 90.
Wherein the back plate 50 comprises a first back plate 501 and a second back plate 502.
The display panel 40 further includes a first substrate 101, and the first bonding terminal 102 and the first marking terminal 103 are disposed on the surface of the first substrate 101.
The flexible circuit board 80 includes a second substrate 201, and the second binding terminal 202 and the second marking terminal 203 are disposed on the surface of the second substrate 201.
In this embodiment, the thickness of the alignment terminal set 110 is smaller than that of the binding terminal set 100, so as to improve uneven stress at the alignment terminal set 110 in the edge area 5, reduce stress generated by the alignment terminal set 110 on the display panel 40, and alleviate the technical problem that the display panel 40 at the marking terminal set of the existing display module 1 is easy to break.
It is understood that the thickness of any of the alignment terminal groups 110 is smaller than the thickness of the bonding terminal group 100, and the thickness of the first flag terminal 103 may be smaller than the thickness of the first bonding terminal 102; the thickness of the second marking terminal 203 may be smaller than that of the second binding terminal 202; it is also possible that the thickness of the first flag terminal 103 is smaller than the thickness of the first binding terminal 102 and the thickness of the second flag terminal 203 is smaller than the thickness of the second binding terminal 202.
Referring to fig. 2 to 10, the technical solution of the present application will now be described with reference to specific embodiments.
The display module 1 provided by the application comprises a binding area 2, wherein the binding area 2 comprises a central area 4 and edge areas 5 positioned on two sides of the central area 4.
Referring to fig. 2, the binding area 2 is an area where the flexible circuit board 80 and the display panel 40 are bound.
Wherein, the display panel 40 is provided with a first binding terminal 102 and a first marking terminal 103, and the flexible circuit board 80 is provided with a second binding terminal 202 and a second marking terminal 203.
Wherein, the thickness of the alignment terminal group 110 may be smaller than the thickness of the bonding terminal group 100 by reducing the thickness of at least one of the first and second flag terminals 103, 203.
Referring to fig. 3-8, in some embodiments, the flexible circuit board 80 includes a second binding terminal 202 located in the central region 4, a second marking terminal 203 located in the edge region 5; the thickness of the second flag terminal 203 in the flexible circuit board 80 is smaller than the thickness of the second bonding terminal 202 is described as an example.
Wherein the second binding terminal 202 may be rectangular or parallelogram.
Wherein the second tag terminal 203 is trapezoidal or "T" shaped.
In one embodiment, referring to fig. 3, the surface area of any one of the second flag terminals 203 is larger than the surface area of any one of the second binding terminals 202.
In this embodiment, by increasing the surface area of the second flag terminal 203, after binding with the display panel 40, the pressure of the second flag terminal 203 on the display panel 40 is reduced, thereby further alleviating the technical problem that the display panel 40 is easily broken at the flag terminal group.
In one embodiment, the second flag terminal 203 is disposed at a density greater than the second bonding terminal 202.
In the present embodiment, by increasing the arrangement density of the second marking terminals 203 in the edge area 5, after binding with the display panel 40, the pressure of the second marking terminals 203 on the display panel 40 is reduced, thereby further alleviating the technical problem that the display panel 40 is easily broken at the marking terminal group.
In one embodiment, the thickness of the second flag terminal 203 is less than the thickness of the second binding terminal 202.
Referring to fig. 4, in one embodiment, the second bonding terminal 202 is a stacked structure of a conductive layer and a protective layer, and the second marking terminal 203 is a single-layer structure of the conductive layer.
Wherein the second flag terminal 203 is provided with only a conductive layer.
Wherein, the preparation material of the conductive layer can be copper.
Wherein the sum of the thickness of the second flag terminal 203 and the thickness of the protective layer is equal to the thickness of the second binding terminal 202.
Wherein the preparation material of the protective layer comprises at least one of nickel or gold, and the thickness of the protective layer ranges from 2 micrometers to 6 micrometers.
It will be appreciated that the conductive layer at the second bonding terminal 202 and the conductive layer at the second marking terminal 203 may be prepared by the same process, so that the thicknesses of the two are the same, and the thickness of the second marking terminal 203 is reduced by making the second marking terminal 203 not provided with a protective layer.
It is understood that the protective layer protects the conductive layer, and the protective effect includes at least one of blocking water vapor, preventing oxidation, and preventing scratch; providing the protective layer at the second binding terminal 202 can avoid failure or breakage of the conductive layer of the second binding terminal 202.
It should be noted that the second flag terminal 203 does not need to perform a conductive function, and the second flag terminal 203 is used for aligning with the first flag terminal 103 when being bound with the display panel 40, so as to improve the alignment precision of binding the flexible circuit board 80 with the display panel 40. It is thus possible to remove the protective layer at the second flag terminal 203 or to not provide the protective layer at the second flag terminal 203, so that the thickness of the second flag terminal 203 is smaller than the thickness of the second binding terminal 202, and the function of the second flag terminal 203 is not affected.
In the present embodiment, no protective layer is provided only at the second flag terminal 203, so that the thickness of the second flag terminal 203 is smaller than that of the second binding terminal 202, and the manufacturing process is simple and the cost is low.
Referring to fig. 5 to fig. 7, in an embodiment, the second marking terminal 203 and the second bonding terminal 202 are both a stacked structure of a conductive layer and a protective layer, the conductive layer includes a first conductive portion 301 corresponding to the second bonding terminal 202 and a second conductive portion 302 corresponding to the second marking terminal 203, wherein a thickness of the first conductive portion 301 is greater than a thickness of the second conductive portion 302.
Wherein the protection layer includes a second protection portion 304 corresponding to the second flag terminal 203, and a first protection portion 303 corresponding to the second binding terminal 202.
Wherein the thickness of the second protection portion 304 is less than or equal to the thickness of the first protection portion 303.
Wherein, the cross sections of the second binding terminal 202 and the second marking terminal 203 may be rectangular.
It will be appreciated that the thickness of the second protection portion 304 can be smaller than the thickness of the first protection portion 303, and the thickness of the second conductive portion 302 can be smaller than the thickness of the first conductive portion 301 by controlling the difference between the etching rate at the second flag terminal 203 and the etching rate at the second bonding terminal 202.
In this embodiment, the process is not changed, only the etching rates of different regions are changed, so that the thickness of the second marking terminal 203 is smaller than that of the second binding terminal 202, and the change is small on the basis of the existing process, and the cost is low.
In one embodiment, the conductive layer is made of copper, and the second conductive portion 302 has a thickness ranging from 5 micrometers to 6 micrometers.
Referring to fig. 6 and 7, in one embodiment, the second tag terminal 203 includes a plurality of chamfers 3, wherein at least one chamfer 3 is rounded.
Wherein the rounded corners create less pressure against the display panel 40.
It will be appreciated that when the second flag terminal 203 is rectangular in cross-section, it may have four chamfers 3, at least one chamfer 3 being rounded and including: one chamfer 3 is the fillet, or, adjacent two chamfers 3 are the fillet, or, opposite two chamfers 3 are the fillet, or, three chamfers 3 are the fillet, or, four chamfers 3 are the fillet.
In this embodiment, by making the chamfer 3 of the second marking terminal 203 be a rounded corner, the pressure or impact force of the chamfer 3 of the second marking terminal 203 on the display panel 40 is reduced, and the technical problem that the display panel 40 is easy to break at the alignment terminal group 110 is further alleviated.
In one embodiment, the second marking terminals 203 of the edge regions 5 located at different sides are symmetrically arranged with respect to the central region 4.
It can be appreciated that the second tag terminals 203 symmetrically disposed can be manufactured by a photomask having a symmetrical structure, and the opening of the photomask is simpler and the cost can be reduced.
In this embodiment, by means of symmetrical structural design, the uniformity of stress distribution is improved, and meanwhile, the process of the process is simplified, and the complexity of the process is reduced.
Referring to fig. 8, in some embodiments, a compensation terminal is further disposed in the edge region 5, and the width of the compensation terminal is greater than or equal to 50 micrometers.
In one embodiment, the compensation terminal includes a first compensation terminal 401, the first compensation terminal 401 is disposed on a side of the second flag terminal 203 near the second binding terminal 202, and a minimum distance d2 of the first compensation terminal 401 from the second binding terminal 202 is greater than or equal to 50 micrometers.
Wherein the width d1 of the first compensation terminal 401 is greater than 50 micrometers, and the minimum distance d3 of the second flag terminal 203 from the second bonding terminal 202 is greater than 100 micrometers.
In one embodiment, the compensation terminal further includes a second compensation terminal 402, the second compensation terminal 402 is disposed on a side of the second flag terminal 203 away from the second bonding terminal 202, a minimum distance d5 of the second compensation terminal 402 from the second flag terminal 203 is greater than or equal to 50 micrometers, and a minimum distance d6 of the second compensation terminal 402 from a side of the edge region 5 is greater than 500 micrometers.
Wherein the minimum distance d7 of the second marking terminal 203 from the side edge of the edge region 5 is greater than 600 micrometers.
Referring to fig. 9 to 10, in some embodiments, the display panel 40 includes a first bonding terminal 102 located at the central region 4 and a first marking terminal 103 located at the edge region 5 within the bonding region 2; the thickness of the first flag terminal 103 in the display panel 40 is smaller than that of the first bonding terminal 102 will be described as an example.
The first flag terminal 103 is aligned with the second flag terminal 203, and the first binding terminal 102 is aligned with the second binding terminal 202.
It is understood that the setting position of the first flag terminal 103 corresponds to the setting position of the second flag terminal 203, and the setting position of the first bonding terminal 102 corresponds to the second bonding terminal 202.
Referring to fig. 10, in one embodiment, the thickness of the first flag terminal 103 is smaller than the thickness of the first bonding terminal 102.
Referring to fig. 10, in one embodiment, the first binding terminal 102 has a stacked structure, and the first flag terminal 103 has a single-layer structure.
In one embodiment, the first flag terminal 103 and the first binding terminal 102 are both in a laminated structure, and the first flag terminal 103 and the first binding terminal 102 each include a conductive film layer and a protective film layer.
In one embodiment, the conductive film layer is made of copper, and the thickness of the conductive film layer ranges from 5 micrometers to 6 micrometers.
In one embodiment, the first flag terminal 103 includes a plurality of chamfers 3, wherein at least one of the chamfers 3 is rounded.
In one embodiment, the first flag terminals 103 of the edge regions 5 located on different sides are symmetrically disposed about the central region 4.
In one embodiment, compensation terminals are also provided in the edge region 5, the width of which is greater than or equal to 50 micrometers.
In one embodiment, the compensation terminal includes a third compensation terminal disposed on a side of the first flag terminal 103 near the first bonding terminal 102, and the minimum distance between the third compensation terminal and the first bonding terminal 102 is greater than or equal to 50 micrometers.
Wherein the width of the third compensation terminal is greater than or equal to 50 micrometers.
In one embodiment, the compensation terminal further includes a fourth compensation terminal, the fourth compensation terminal is disposed on a side of the first flag terminal 103 away from the first bonding terminal 102, a minimum distance between the fourth compensation terminal and the first flag terminal 103 is greater than or equal to 50 micrometers, and a minimum distance between the first compensation terminal 401 and a side of the edge region 5 is greater than 500 micrometers.
Wherein the width of the fourth compensation terminal is greater than or equal to 50 micrometers.
In some embodiments, the thickness of the first flag terminal 103 in the display panel 40 is smaller than the thickness of the first bonding terminal 102, and the thickness of the second flag terminal 203 in the flexible circuit board 80 is smaller than the thickness of the second bonding terminal 202, and the arrangement of the first flag terminal 103 and the second flag terminal 203 may refer to the first flag terminal 103 and the second flag terminal 203 in any of the above embodiments, which will not be described herein.
The application also provides a display device, which comprises the display module. The display module includes a binding area, which is not described herein.
The display module provided by the embodiment comprises a display panel and a flexible circuit board, wherein the display panel comprises a first binding terminal and a first marking terminal, the flexible circuit board is in binding connection with the display panel, the flexible circuit board comprises a second binding terminal and a second marking terminal, the second binding terminal and the first binding terminal are correspondingly abutted to form a binding terminal group, the second marking terminal and the first marking terminal are oppositely arranged to form a pair of alignment terminal groups, the display module comprises a binding region, the binding region comprises a central region and edge regions positioned at two sides of the central region, the binding terminal groups are arranged in the central region, the alignment terminal groups are arranged in the edge regions, and the thickness of any alignment terminal group is smaller than that of the binding terminal groups; the thickness of the alignment terminal group is smaller than that of the binding terminal group, so that uneven stress at the alignment terminal group in the edge area is improved, the stress of the alignment terminal group on the display panel is reduced, and the technical problem that the display panel at the position of the marking terminal group of the existing display module is easy to break is solved.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The foregoing has described in detail a display module provided by an embodiment of the present application, and specific examples have been applied herein to illustrate the principles and embodiments of the present application, where the foregoing description of the embodiments is only for aiding in understanding the method and core idea of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (10)
1. The utility model provides a display module assembly, includes the binding area, the binding area includes central region, is located the marginal area of central region both sides, its characterized in that includes:
the display panel comprises a first binding terminal and a first marking terminal;
the flexible circuit board is in binding connection with the display panel and comprises a second binding terminal and a second marking terminal, wherein the second binding terminal is correspondingly abutted with the first binding terminal to form a binding terminal group, and the second marking terminal and the first marking terminal are arranged in alignment to form a positioning terminal group;
the binding terminal group is arranged in the central area, the alignment terminal group is arranged in the edge area, and the thickness of any alignment terminal group is smaller than that of the binding terminal group.
2. The display module of claim 1, wherein a thickness of the second flag terminal is less than a thickness of the second binding terminal.
3. The display module of claim 2, wherein the second bonding terminal has a laminated structure of a conductive layer and a protective layer, and the second marking terminal has a single-layer structure of the conductive layer.
4. The display module of claim 2, wherein the second flag terminal and the second bonding terminal are each a stacked structure of a conductive layer and a protective layer, the conductive layer including a first conductive portion corresponding to the second bonding terminal and a second conductive portion corresponding to the second flag terminal, wherein a thickness of the first conductive portion is greater than a thickness of the second conductive portion.
5. The display module of claim 4, wherein the conductive layer is made of copper, and the second conductive portion has a thickness ranging from 5 micrometers to 6 micrometers.
6. The display module assembly of claim 2, wherein the second flag terminal includes a plurality of fillets, wherein at least one of the fillets is a rounded corner.
7. The display module of claim 2, wherein the second flag terminals of the edge regions on different sides are symmetrically disposed about the central region.
8. The display module of claim 2, wherein compensation terminals are further provided at the edge regions, the compensation terminals having a width of greater than or equal to 50 microns.
9. The display module assembly of claim 8, wherein the compensation terminal comprises a first compensation terminal disposed on a side of the second flag terminal proximate to the second binding terminal, the first compensation terminal having a minimum distance from the second binding terminal of greater than or equal to 50 microns.
10. The display module of claim 9, wherein the compensation terminal further comprises a second compensation terminal disposed on a side of the second flag terminal away from the second binding terminal, the second compensation terminal having a minimum distance from the second flag terminal of greater than or equal to 50 microns, the second compensation terminal having a minimum distance from a side of the edge region of greater than 500 microns.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210012857.XA CN114389064B (en) | 2022-01-07 | 2022-01-07 | Display module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210012857.XA CN114389064B (en) | 2022-01-07 | 2022-01-07 | Display module |
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| CN114389064A CN114389064A (en) | 2022-04-22 |
| CN114389064B true CN114389064B (en) | 2023-06-02 |
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| CN114973946B (en) * | 2022-05-18 | 2023-08-22 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
| CN114973953B (en) * | 2022-05-25 | 2024-01-26 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110061037A (en) * | 2019-04-25 | 2019-07-26 | 京东方科技集团股份有限公司 | Flexible base board and display device |
| CN111883039A (en) * | 2020-07-31 | 2020-11-03 | 厦门天马微电子有限公司 | Drive chip and display device |
| CN215341900U (en) * | 2020-12-01 | 2021-12-28 | 深圳柔宇显示技术有限公司 | Display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114967260B (en) * | 2022-05-30 | 2023-10-13 | 京东方科技集团股份有限公司 | Array substrate and display device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110061037A (en) * | 2019-04-25 | 2019-07-26 | 京东方科技集团股份有限公司 | Flexible base board and display device |
| CN111883039A (en) * | 2020-07-31 | 2020-11-03 | 厦门天马微电子有限公司 | Drive chip and display device |
| CN215341900U (en) * | 2020-12-01 | 2021-12-28 | 深圳柔宇显示技术有限公司 | Display device |
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