CN114388383A - Liquid drainage device and liquid drainage method - Google Patents
Liquid drainage device and liquid drainage method Download PDFInfo
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- CN114388383A CN114388383A CN202011119580.8A CN202011119580A CN114388383A CN 114388383 A CN114388383 A CN 114388383A CN 202011119580 A CN202011119580 A CN 202011119580A CN 114388383 A CN114388383 A CN 114388383A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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Abstract
The invention discloses a liquid discharge device and a liquid discharge method, relates to the field of semiconductors, and aims to solve the problem of long liquid change time caused by long cooling time of high-temperature chemical liquid in a cleaning process. This drainage device includes: a chemical liquid tank, a liquid discharge pipeline and a liquid discharge tank; the chemical liquid tank is communicated with the liquid discharge tank through a liquid discharge pipeline; the liquid discharge device also comprises a cooling pipeline arranged on the liquid discharge pipeline; the cooling pipeline is used for cooling the liquid discharge pipeline and the chemical liquid in the liquid discharge pipeline when the temperature of the chemical liquid in the liquid discharge pipeline is higher than a temperature threshold value. The liquid discharge method comprises the technical scheme. The liquid discharge device and the liquid discharge method provided by the invention are used for quickly cooling and replacing the high-temperature chemical liquid.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a liquid drainage device and a liquid drainage method.
Background
In the manufacturing process of an integrated circuit, a cleaning process always runs through the whole process flow, usually accounts for more than 20% of the steps of the whole process flow, along with the continuous reduction of the critical dimension, the contamination control on the surface of a silicon wafer is stricter, even the cleaning process accounts for more than 40% of the steps of the total process flow in some process flows, in many processes, cleaning equipment needs to adopt high-temperature chemical liquid to clean the wafer, the high-temperature chemical liquid has fixed service time, and when the service time is up, or when the cross contamination caused by different batches is avoided, or when other chemical liquids are needed for cleaning, the high-temperature chemical liquid is frequently replaced.
In the related art, in order to prevent the high-temperature chemical liquid from damaging the pipeline, the high-temperature chemical liquid is discharged from the chemical liquid tank to the liquid discharge tank, a large amount of cooling water or nitrogen gas is required to be injected into the liquid discharge tank or the chemical liquid is cooled naturally, so that the high-temperature chemical liquid can be reduced to a preset temperature in the liquid discharge tank for a long time and is finally discharged from the liquid discharge tank. The traditional method has long cooling time and long liquid discharge time which is generally more than 90 minutes, so that the whole time for replacing the chemical liquid is long, thereby affecting the cleaning efficiency and the productivity.
Disclosure of Invention
The invention aims to provide a liquid discharge device and a liquid discharge method, which are used for quickly cooling high-temperature chemical liquid and shortening liquid discharge time.
In a first aspect, the present invention provides a drainage arrangement comprising: a chemical liquid tank, a liquid discharge pipeline and a liquid discharge tank; the chemical liquid tank is communicated with the liquid discharge tank through the liquid discharge pipeline; the liquid discharge device also comprises a cooling pipeline arranged on the liquid discharge pipeline;
the cooling pipeline is used for cooling the liquid drainage pipeline and the chemical liquid in the liquid drainage pipeline when the temperature of the chemical liquid in the liquid drainage pipeline is higher than a temperature threshold value.
Compared with the prior art, in the liquid discharge device provided by the invention, the chemical liquid tank is communicated with the liquid discharge tank through the liquid discharge pipeline, and the liquid discharge pipeline is provided with the cooling pipeline. Based on this, when the temperature of chemical liquid was higher than the temperature threshold value in the flowing back pipeline, cooling line opened, cooled down the flowing back pipeline for the high temperature chemical liquid rapid cooling in the flowing back pipeline, thereby shortened chemical liquid flowing back time, improve equipment productivity.
In a second aspect, the present invention further provides a liquid discharging method, in which the liquid discharging apparatus according to the above technical solution is applied, the liquid discharging method including:
acquiring the temperature of chemical liquid in a liquid discharge pipeline;
and when the temperature of the chemical liquid in the liquid discharge pipeline is higher than a temperature threshold value, controlling a cooling pipeline to cool the liquid discharge pipeline and the chemical liquid in the liquid discharge pipeline.
Compared with the prior art, the liquid discharge method provided by the invention has the same beneficial effects as the liquid discharge device in the technical scheme, and the details are not repeated herein.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic flow chart of a semiconductor cleaning process in the related art;
FIG. 2 is a schematic view of a drainage apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a cooling line disposed on a drain pipe according to an embodiment of the present invention;
FIG. 4 is a schematic view of a connection of a drain line provided in an embodiment of the present invention;
fig. 5 is a schematic flow chart of a liquid discharging method according to an embodiment of the present invention.
Detailed Description
In order to facilitate clear description of technical solutions of the embodiments of the present invention, in the embodiments of the present invention, terms such as "first" and "second" are used to distinguish the same items or similar items having substantially the same functions and actions. For example, the first threshold and the second threshold are only used for distinguishing different thresholds, and the sequence order of the thresholds is not limited. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.
It is to be understood that the terms "exemplary" or "such as" are used herein to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.
In the present invention, "at least one" means one or more, "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a and b combination, a and c combination, b and c combination, or a, b and c combination, wherein a, b and c can be single or multiple.
Fig. 1 is a schematic flow chart illustrating a semiconductor cleaning process in the related art, and as shown in fig. 1, there are many cleaning steps in the whole flow chart. The cleaning machine is generally classified as a single-wafer type cleaning or a tank type cleaning, i.e., a multi-wafer type cleaning. Specifically, the cleaning step includes: the wafers are fed into a cleaning machine, namely, a material is fed, and then the wafers are fed into a buffer area, so that each batch of wafers are queued for cleaning operation. When a certain batch of wafers need to be cleaned, the wafers are put into diluted hydrofluoric acid for cleaning. And after cleaning, putting the wafer into a quick drainage device for flushing and cleaning after hydrofluoric acid. After the flushing is finished, the wafer is put into a chemical liquid tank for cleaning, the number of the chemical liquid tanks is related according to the process, and two chemical liquid tanks are exemplified herein, but not limited to two. And taking the wafer out of the chemical liquid tank and putting the wafer into a flushing tank, wherein the flushing tank is flushed with the chemical liquid after being cleaned. And (3) soaking and washing the wafer in water before drying, drying the wafer after washing by using isopropanol, and taking out the wafer in the last step, namely discharging. In practical application, the cleaning process is not limited to the schematic diagram.
In the related art, the chemical liquid tank needs to be frequently replaced with the existing high-temperature chemical liquid for cleaning, and after the high-temperature chemical liquid is discharged from the chemical liquid tank to the liquid discharge tank, a large amount of cooling water or nitrogen gas is injected into the liquid discharge tank or the chemical liquid is naturally cooled to cool and then discharged. The high-temperature chemical liquid can be reduced to below the preset temperature generally below 50 ℃ after being placed in the liquid discharge tank for a long time, so that the whole time for replacing the chemical liquid is long, and the time for replacing the high-temperature chemical liquid is more than 90 minutes currently.
In view of the above problems, an embodiment of the present invention provides a liquid discharge apparatus, which is suitable for the field of wet etching used in manufacturing semiconductor devices, dynamic random access memories, phase change memories, magnetic random access memories, and the like.
Fig. 2 illustrates a schematic view of a drainage arrangement provided by an embodiment of the invention. As shown in fig. 2, a liquid discharge apparatus provided in an embodiment of the present invention includes: a chemical liquid tank 101, a liquid discharge line 103, and a liquid discharge tank 102; the chemical liquid tank 101 is communicated with a liquid discharge tank 102 through a liquid discharge pipeline 103; the drain further comprises a cooling line 104 arranged on the drain line 103; the cooling line 104 is used for cooling the liquid discharge pipe 103 and the chemical liquid in the liquid discharge pipe when the temperature of the chemical liquid in the liquid discharge pipe 103 is higher than a temperature threshold value.
In practical application, the liquid discharge pipeline can be made of polytetrafluoroethylene, is an acid-base resistant material and can be prevented from being corroded by chemical liquid. The cooling line may be made of stainless steel, and the materials of the drain line and the cooling line are not limited thereto. The chemical liquid comprises: at least one of phosphoric acid, sulfuric acid and sulfuric acid hydrogen peroxide mixed liquid at normal temperature or higher than a second preset temperature.
And a cooling pipeline is arranged outside the liquid discharge pipeline between the chemical liquid tank and the liquid discharge tank, and whether the temperature of the chemical liquid in the liquid discharge pipeline is higher than a temperature threshold value is judged. If the temperature of the chemical liquid in the liquid discharge pipeline is judged to be lower than or equal to the temperature threshold value, the cooling pipeline does not work, the liquid discharge pipeline is not cooled, if the temperature of the chemical liquid in the liquid discharge pipeline is judged to be higher than the temperature threshold value, the cooling pipeline is controlled to cool the liquid discharge pipeline, and the high-temperature chemical liquid passing through the liquid discharge pipeline is indirectly cooled.
As is known to those skilled in the art, the cooling lines are typically filled with a cooling medium to keep the cooling lines at a low temperature. The refrigerant may be cooling water, a fluorine-based refrigerant, or the like. Fig. 3 illustrates a schematic structural diagram of the cooling line disposed on the liquid discharge pipe according to an embodiment of the present invention, as shown in fig. 3, the controller adjusts the pressure control device 1041 to supply an appropriate amount of refrigerant gas into the cooling line 104 according to the temperature of the chemical liquid, for example: the pressure range of the refrigerant gas is 2kg/cm2-3kg/cm2. The cooling pipeline 104 surrounds the liquid discharge pipeline 103, the temperature of the cooling pipeline 104 is reduced by a proper amount of refrigerant gas, the liquid discharge pipeline 103 is cooled by the cooling pipeline 104 in work under the action of temperature conduction, and the refrigerant gas in the cooling pipeline 104 is increased in temperature due to heat conduction and is finally discharged from the other end.
Of course, the cooling pipeline can also be used for cooling the liquid discharge pipeline when the temperature of the chemical liquid in the liquid discharge groove is higher than a temperature threshold value. It can be understood that when the temperature of the chemical liquid in the liquid discharge pipeline or the temperature of the chemical liquid in the liquid discharge groove is higher than the temperature threshold value, the cooling pipeline starts to work to cool the liquid discharge pipeline. For example: the temperature of the chemical liquid in the liquid discharge pipeline is lower than a temperature threshold, but the temperature of the chemical liquid in the liquid discharge groove is higher than the temperature threshold, and the cooling pipeline cools the liquid discharge pipeline and the chemical liquid in the liquid discharge pipeline.
In order to realize intelligent liquid drainage, the liquid drainage device further comprises a controller, wherein the controller is used for controlling the cooling pipeline to cool the liquid drainage pipeline when the temperature of the chemical liquid discharged by the liquid drainage pipeline is higher than a temperature threshold value; the liquid discharge pipeline also comprises a first temperature sensor, and the first temperature sensor is used for detecting the temperature of the chemical liquid in the liquid discharge pipeline.
The controller is also used for controlling the cooling pipeline to cool the liquid discharge pipeline when the temperature of the chemical liquid in the liquid discharge groove is higher than a temperature threshold value; the liquid discharge groove also comprises a second temperature sensor, and the second temperature sensor is used for detecting the temperature of the chemical liquid in the liquid discharge groove. In response to the acquisition of the temperature of the chemical liquid in the liquid discharge pipe or the temperature of the chemical liquid in the liquid discharge tank, it is necessary to provide a first temperature sensor or a second temperature sensor in the liquid discharge pipe or the liquid discharge tank.
In practical applications, the temperature of the chemical liquid is used to determine when the cooling line is in operation, and a controller is required to do this determination. If the temperature of the chemical liquid in the liquid discharge pipeline is higher than the temperature threshold value, the cooling pipeline is triggered to work, for example: the temperature of the high-temperature chemical liquid may be 70 to 163 degrees, and if the temperature threshold is 70 degrees, the controller controls the cooling pipeline to cool the high-temperature chemical liquid when the temperature of the chemical liquid is higher than 70 degrees, and controls the cooled chemical liquid to be 25 to 50 degrees. Meanwhile, the controller also controls the pressure device of the cooling pipeline according to the temperature of the chemical liquid, and controls the pressure of the refrigerant gas filled into the cooling pipeline to be in a certain temperature range, so that the liquid discharge pipeline is cooled.
In order to intelligently control the liquid discharge of the liquid discharge groove, the liquid discharge groove further comprises a liquid level sensor. The liquid level sensor is used for detecting the height of the chemical liquid in the liquid discharge tank. The controller is also used for controlling the chemical liquid in the liquid discharge groove to be discharged when the height of the chemical liquid in the liquid discharge groove is higher than a preset liquid discharge liquid level threshold value and the temperature of the chemical liquid in the liquid discharge groove is lower than a temperature threshold value.
In practical application, the cooling pipeline can be controlled to cool the liquid discharge pipeline through the temperature of the chemical liquid, so that the time for replacing the high-temperature chemical liquid can be shortened within 20 minutes. However, two factors need to be considered for discharging the cooled chemical liquid, one is whether the cooled chemical liquid is lower than a temperature threshold value, and the other is whether the liquid level of the cooled chemical liquid is higher than a preset liquid drainage liquid level threshold value. For example: in one case, the chemical liquid in the drain tank is exhausted, but the temperature of the chemical liquid is satisfactory, but the chemical liquid is not discharged, and the discharge is stopped.
In one example, the drain line includes a first drain pipe, a second drain pipe, a third drain pipe, and a fourth drain pipe; the cooling pipelines are arranged on the first liquid discharge pipe, the second liquid discharge pipe, the third liquid discharge pipe and the fourth liquid discharge pipe.
The above-mentioned drain device further includes: a filter, a heater, and a pump. The chemical liquid tank is communicated with the inlet of the filter through a first liquid discharge pipe, the first outlet of the filter is communicated with the liquid discharge tank through a second liquid discharge pipe, the second outlet of the filter is communicated with the heater through a third liquid discharge pipe, and the heater is also communicated with a fourth liquid discharge pipe and the pump; the pump is communicated with the chemical liquid tank and the liquid discharge tank.
Fig. 4 illustrates a schematic connection diagram of a drain pipe provided by an embodiment of the present invention. As shown in fig. 4, the chemical tank 101 may be divided into an inner tank and an outer tank according to different process requirements, the chemical liquid in the inner tank is mainly discharged in two paths, the first path is that the inner tank is communicated with the inlet of the filter 105, the first outlet of the filter 105 is communicated with the heater 106, the heater 105 is further communicated with the first valve a, and the first valve a is further connected to the valve D. The second way is that the second outlet of the filter 105 communicates with the second valve B and finally to the valve D.
As shown in fig. 4, the chemical liquid in the outer tank is discharged in a third path, and the outer tank is communicated with the pump 107 through a third valve C, and then the pump 107 is communicated with a valve D; wherein the first and second conduits share a filter 105; the valve D is connected to the drain tank 102 for discharging the chemical liquid of the drain line. The heater 106 is also in communication with a pump 107; the pump 107 communicates with the chemical liquid tank, and the pump 107 also communicates with the liquid discharge tank 102.
As shown in fig. 4, when the chemical liquid in the chemical liquid tank is higher than the temperature threshold, the chemical liquid passes through the first filter 105, the filter 105 filters out some impurities, particles, insoluble substances, etc. in the chemical liquid, the filtered substances may be washed, or particles, pollutants, etc. in human or environment may fall into the chemical liquid tank, have been washed, and may be re-adsorbed to other wafers or affect the cleaning effect of the next batch of subsequent wafers due to the floating chemical liquid in suspension, so the filter 105 is required to keep the chemical liquid clean all the time. The chemical liquid is filtered by the filter 105 and reaches the heater 106, the heater 106 is not heated in a liquid discharge state, so that the filtered chemical liquid directly flows into the liquid discharge tank 102, if the chemical liquid tank does not discharge liquid in a normal process, the chemical liquid in the chemical liquid tank 101 is heated to a specified process temperature and then returns to the chemical liquid tank 101 for cleaning, the heater 106 works, a cooling pipeline does not work, the first path of the heater 106 is communicated with the third path of the pump 107, and the heated chemical liquid is pumped up by the pump 107 and enters an inner tank of the chemical liquid through the fourth valve E.
As shown in fig. 4, the second path is that the chemical liquid in the filter 105 directly enters the liquid discharge tank 102, which is a separate discharge line for the filter 105, and there always remains a greater or lesser amount of chemical liquid in the filter 105, and the chemical liquid in the chemical liquid tank 101 is discharged together, which is not clean, so a separate discharge line needs to be added. The valves in fig. 4 are the second valve B and the valve D which are white, that is, the second valve B and the valve D are open, that is, the second path of liquid discharge, and none of the other paths of liquid discharge, and similarly, the open and close states of the valves during liquid discharge of the other paths can be obtained. The third way is that the outer tank is directly discharged to the drain tank 102 by the pump 107, and the liquid level sensor 108 and the temperature sensor 109 are disposed in the drain tank 102. The inner and outer tanks may be used only one, or both, depending on the process cleaning flow. The connection structure of the liquid discharge pipe in the embodiment of the present invention is only for illustrating the liquid discharge process, and in practical applications, the connection structure of the liquid discharge pipe or the included components are not limited thereto.
In the liquid discharge device provided by the invention, the liquid discharge device comprises a chemical liquid tank, a liquid discharge pipeline and a liquid discharge tank; the chemical liquid tank is communicated with the liquid discharge tank through a liquid discharge pipeline; according to the invention, the liquid discharge pipeline is provided with the cooling pipeline, and when the temperature of the chemical liquid in the liquid discharge pipeline is higher than the temperature threshold value, the cooling pipeline is opened to cool the liquid discharge pipeline. It is known to those skilled in the art that the cooling line may be cooled by adding a cooling medium to the cooling line. The liquid discharge device provided by the invention has the advantages that the cooling pipeline is controlled to rapidly cool the high-temperature chemical liquid, the liquid discharge time of the chemical liquid is shortened, and the equipment capacity is improved.
Based on the above liquid discharge device, fig. 5 illustrates a schematic flow chart of a liquid discharge method according to an embodiment of the present invention. The liquid discharge method comprises the following steps:
step 101: acquiring the temperature of the chemical liquid in the liquid discharge pipeline through a first temperature sensor;
step 102: when the temperature of the chemical liquid in the liquid discharge pipeline is higher than the temperature threshold value, the controller controls the cooling pipeline to cool the liquid discharge pipeline.
As an achievable approach, the liquid discharge method further comprises:
acquiring the temperature of the chemical liquid in the liquid discharge groove through a second temperature sensor;
when the temperature of the chemical liquid in the liquid discharge groove is higher than the temperature threshold value, the controller controls the cooling pipeline to cool the liquid discharge pipeline.
In an alternative mode, after the controller controls the cooling pipeline to cool the drainage pipeline, the drainage method further includes: acquire the liquid level of chemical liquid in the fluid-discharge tank through level sensor, highly being higher than predetermined flowing back liquid level threshold value as chemical liquid in the fluid-discharge tank, when chemical liquid temperature is less than temperature threshold value in the fluid-discharge tank, the chemical liquid discharge of controller control fluid-discharge tank.
While the invention has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
While the invention has been described in conjunction with specific features and embodiments thereof, it will be evident that various modifications and combinations can be made thereto without departing from the spirit and scope of the invention. Accordingly, the specification and figures are merely exemplary of the invention as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A liquid discharge device, characterized by comprising: a chemical liquid tank, a liquid discharge pipeline and a liquid discharge tank; the chemical liquid tank is communicated with the liquid discharge tank through the liquid discharge pipeline; the liquid discharge device also comprises a cooling pipeline arranged on the liquid discharge pipeline;
the cooling pipeline is used for cooling the liquid drainage pipeline and the chemical liquid in the liquid drainage pipeline when the temperature of the chemical liquid in the liquid drainage pipeline is higher than a temperature threshold value.
2. The drain of claim 1, wherein the cooling line is further configured to cool the drain conduit and the chemical therein when the temperature of the chemical in the drain tank is above a temperature threshold.
3. The drain of claim 1, further comprising a controller configured to control the cooling line to cool the drain and the chemical therein when the temperature of the chemical discharged from the drain is higher than a temperature threshold;
the liquid discharge pipeline also comprises a first temperature sensor, and the first temperature sensor is used for detecting the temperature of the chemical liquid in the liquid discharge pipeline.
4. The drain of claim 3, wherein the controller is further configured to control the cooling line to cool the drain conduit and the chemical therein when the temperature of the chemical in the drain tank is higher than the temperature threshold;
the liquid discharge groove further comprises a second temperature sensor, and the second temperature sensor is used for detecting the temperature of the chemical liquid in the liquid discharge groove.
5. The drain of claim 4, wherein the drain tank further comprises a level sensor for detecting a level of the chemical liquid within the drain tank; the controller is also used for controlling the chemical liquid in the liquid discharge groove to be discharged when the height of the chemical liquid in the liquid discharge groove is higher than a preset liquid discharge liquid level threshold value and the temperature of the chemical liquid in the liquid discharge groove is lower than a temperature threshold value.
6. The drain of claims 1-5, wherein the drain conduit comprises a first drain tube, a second drain tube, a third drain tube, and a fourth drain tube; cooling pipelines are arranged on the first liquid discharge pipe, the second liquid discharge pipe, the third liquid discharge pipe and the fourth liquid discharge pipe;
the liquid discharge apparatus further includes: a filter, a heater and a pump; the chemical liquid tank is communicated with an inlet of the filter through a first liquid discharge pipe, a first outlet of the filter is communicated with the liquid discharge tank through a second liquid discharge pipe, a second outlet of the filter is communicated with the heater through a third liquid discharge pipe, and the heater is also communicated with the fourth liquid discharge pipe and the pump; the pump is communicated with the chemical liquid tank and the liquid discharge tank.
7. A liquid discharge method using the liquid discharge device according to any one of claims 1 to 6, the liquid discharge method comprising:
acquiring the temperature of chemical liquid in a liquid discharge pipeline;
and when the temperature of the chemical liquid in the liquid discharge pipeline is higher than a temperature threshold value, controlling a cooling pipeline to cool the liquid discharge pipeline.
8. The liquid discharge method according to claim 7, further comprising:
acquiring the temperature of the chemical liquid in the liquid discharge groove;
when the temperature of the chemical liquid in the liquid discharge groove is higher than a temperature threshold value, controlling a cooling pipeline to cool the liquid discharge pipeline and the chemical liquid in the liquid discharge pipeline; the temperature of the cooled chemical liquid is 25-50 ℃, wherein the pressure range of refrigerant gas in the cooling pipeline is 2kg/cm2-3kg/cm2。
9. The liquid discharge method according to claim 8, wherein after controlling the cooling line to cool down the liquid discharge pipeline, the liquid discharge method further comprises: the method comprises the steps of obtaining the liquid level of the chemical liquid in the liquid discharge groove, and controlling the chemical liquid in the liquid discharge groove to be discharged when the height of the chemical liquid in the liquid discharge groove is higher than a preset liquid discharge liquid level threshold value and the temperature of the chemical liquid in the liquid discharge groove is lower than a temperature threshold value.
10. The liquid discharge method according to claim 7, wherein the chemical liquid includes:
at least one of phosphoric acid, sulfuric acid and sulfuric acid hydrogen peroxide mixed liquid at normal temperature or higher than a second preset temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011119580.8A CN114388383A (en) | 2020-10-19 | 2020-10-19 | Liquid drainage device and liquid drainage method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011119580.8A CN114388383A (en) | 2020-10-19 | 2020-10-19 | Liquid drainage device and liquid drainage method |
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| Publication Number | Publication Date |
|---|---|
| CN114388383A true CN114388383A (en) | 2022-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011119580.8A Pending CN114388383A (en) | 2020-10-19 | 2020-10-19 | Liquid drainage device and liquid drainage method |
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| CN (1) | CN114388383A (en) |
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2020
- 2020-10-19 CN CN202011119580.8A patent/CN114388383A/en active Pending
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